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NEWS TAGGED FOWLP
Thursday 7 December 2023
Pentagon-funded silicon interposer project closer to reshore US advanced packaging capability
The Industrial Base Analysis and Sustainment (IBAS) office, funded by the US Department of Defense to establish high-priority domestic capabilities to safeguard the US defense industrial...
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Friday 4 August 2023
South Korea initiates major R&D project to boost chips packaging competitiveness
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Monday 10 July 2023
FOPLP technology seen an alternative to FOWLP for automotive chipmakers
The ongoing trend of automotive electrification, intelligentization and connectivity are driving a significant increase in the quantity and cost of chips used in vehicles. The cost...
Tuesday 16 May 2023
Backend firms see slow adoption of FC packaging among handset APs
The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.
Wednesday 10 May 2023
Samsung reportedly to move FOWLP to volume production in 4Q23
Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...
Tuesday 11 April 2023
After recruiting TSMC veteran, Samsung is rumored to enter FOWLP mass production in 4Q23
Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter...
Monday 7 November 2022
US foundry SkyWater announces progress in reshoring advanced packaging capability
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...