中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
SEMICON 2025
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
Home
Research
Research insights
Toppan expands production for advanced process photomask market; Samsung, LG, SK Hynix’ 2H22 procurement spendings fluctuate; CATL to build second plant in Europe
Tom Lo, DIGITIMES Research, Taipei
Friday 26 August 2022
0
The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please
sign in
if you wish to continue.
Introduction
Related stories
Toppan relocates CIS components production from Japan to China
Volkswagen to float Porsche soon amid tough economic conditions
Japanese semiconductor materials vendors keen on capacity expansions
Show more
Tags
Asia enterprises
CATL
Europe
LG
photomask
plant
Samsung
Toppan
Share this article
Other links
Print
BIZ FOCUS
Sep 9, 12:48
Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Friday 12 September 2025
OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
Friday 12 September 2025
WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
MOST-READ
7 DAYS NEWS
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's YMTC moves into DRAM, teams with CXMT to target HBM market
Samsung to debut tri-fold phone as early as October, 50K units to hit Korea and China first
Huawei, Cambricon AI chip production set to top one million units by 2026
SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
SEMICON Taiwan 2025: 15 Kyushu chip suppliers eye Taiwan market as TSMC spurs Japan-Taiwan investment links
Intel to continue semiconductor glass substrate commercialization despite market rumors
Full list
Join our mailing list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first