Bits + chips
Highlights of the day: TSMC to continue making chips for Intel
DIGITIMES staff

Third-party foundries will continue to play an important role in Intel's freshly unveiled IDM 2.0 strategy. TSMC is currently a major contract chipmaker for the US chip giant, and is expected to remain so in the foreseeable future. Chip shortages are worsening, spreading across many different market segments. Sercomm has disclosed networking chip lead times have now extended to a year. In Taiwan, some major companies, such as Compal and Asustek, are eyeing smart pole business opportunities. They have formed an alliance aiming to set smart pole standards for the worldwide market.

TSMC to remain major foundry partner of Intel: TSMC has been a major foundry partner of Intel and will remain so in the foreseeable future, despite the ambitious foundry plan that the US chip vendor has just unveiled, according to industry sources.

Delivery lead times for networking chips extend to 50 weeks, says Sercomm: Global chips shortages have spread to the networking segment from notebook and automotive sectors, with delivery lead times for networking chips from vendors already extended to as long as 50 weeks due to extremely tight foundry capacity, according to James Wang, president at Sercomm, a Taiwan-based broadband networking solutions provider.

Alliance formed in Taiwan to promote 5G smart pole standards: A total of 25 companies have newly formed a 5G Smart Pole Standard Promotion Alliance, aiming to draft technological standards and tap huge smart-city business opportunities worldwide.

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