Bits + chips
Foxconn-TSMC collaboration in US not impossible, say sources
Ninelu Tu, Taipei; Willis Ke, DIGITIMES

It would not be a surprise if Foxconn Technology Group collaborated with TSMC to jointly develop their operations in the US by 2024, given the firm's deployments in fan-out panel-level packaging and SiP (system in package) technologies, according to...

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