Apart from its leadership in the foundry sector, TSMC has been making a lot of efforts developing packaging technologies with which it can offer value-added services to customers. It has recently seen an "unexpected" rise in orders demanding its CoWoS packaging services for chips that support stay-at-home needs triggered by widespread lockdowns in the wake of the coronavirus pandemic. The lockdowns have also propelled demand for notebooks that users need for working and learning from home. ODMs expect significant notebook shipment growth in second-quarter 2020. The pandemic has also sent demand soaring for healthcare and disinfection applications and devices. Many LED makers are now running at full capacity to meet strong demand for UV-C products.
TSMC sees CoWoS packaging capacity utilization ramp up: TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines at full utilization, according to industry sources.
ODMs to see notebook shipments grow in 2Q20, but desktops may drop: With rapidly rising demand for notebooks, Taiwan-based ODMs have primarily focused their capacities on producing notebooks and are expected to enjoy double-digit sequential growths in second-quarter notebook shipments, but shipments of desktops and all-in-one (AIO) PCs may slip sequentially.
UV-C LED devices in tight supply: Demand for UV-C LED products for disinfection applications has drastically increased in the wake of the coronavirus pandemic, stretching the production lead times at makers of such devices, according to industry sources.
