Bits + chips
Highlights of the day: TSMC advancing packaging technology
DIGITIMES staff

For TSMC, Moore's Law is far from being dead. While it has been keen to grow chip density on the transistor level, advancing packaging technology is one of the possible ways TSMC is embracing to improve density by stacking multiple layers of transistors into what it calls monolithic 3D ICs. It remains debatable whether Moore's Law is approaching its limits. But in the display industry, panel makers seem to have already accepted the fact that fab generations have reached its ceiling at 10.5G. At any rate, building higher-generation fabs would make little sense for an already oversupplied market. But the good news for lesser TV makers is that they can buy cheaper panels to produce large-size sets.

TSMC advancing 3D IC integration technology: TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly connected."

China tier-2 TV brands ramping up shipments: China's second-tier TV brands are ramping up shipments of over 60-inch TVs globally as the availability of less expensive panels from BOE Technology has helped improve their competitiveness, according to industry sources.

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