中文網
Taipei
Sun, Jun 26, 2022
11:04
clear
31°C
CONNECT WITH US

Winbond cautious for 2005; 0.11-micron on 8-inch wafers faces bottlenecks

Josephine Lien and Hans Wu, Taipei; Jack Lu, DIGITIMES 0

Winbond Electronics is not optimistic about the company’s key market segments in 2005, and the company stated that its DRAM production using 0.11-micron technology on 8-inch wafers is less efficient compared to production on 12-inch wafers.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories