Winbond obtains NT$8 billion in funding for 12-inch fab

Hans Wu, Taipei; Jack Lu, DIGITIMES Asia 0

Winbond Electronics on January 24 signed a five-year, NT$8 billion syndicated loan provided by 23 banks to fund the construction of its 12-inch fab in Taichung, central Taiwan.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.