Amazon is in discussions to secure special access to OpenAI's technology as it considers a multibillion-dollar equity investment in the AI company, according to a report by The Information. The talks highlight how major cloud providers are seeking closer relationships with leading AI model developers as competition in consumer and enterprise AI accelerates.
Skyworks Solutions devoted much of its earnings call Q&A to outlining why broad markets remain a key growth driver, with management highlighting sustained demand across Wi-Fi, automotive connectivity, and data center infrastructure.
EMS provider Flex reported fiscal third-quarter 2026 results that exceeded its guidance and raised its full-year forecast, citing continued strength across its diversified businesses.
At its first quarter fiscal year 2026 earnings call, Skyworks Solutions addressed investor concerns around mobile content stability, pricing risk, and visibility into upcoming handset cycles, emphasizing defensiveness over aggressive growth assumptions.
Nvidia chief executive Jensen Huang said the world has entered a decisive moment of reindustrialization, marked by what he described as the largest wave of industrial infrastructure construction in human history. Investment is expected to reach into the trillions, or even tens of trillions of dollars. To ensure that such costly infrastructure is built right, manufacturing is moving toward a model defined by software, driven by artificial intelligence and anchored by digital twin technology.
Alphabet Inc. capped a historic fiscal year with a record-breaking surge in infrastructure spending, signaling an aggressive bid to cement its dominance in the artificial intelligence era.
Shin Bao Hong Technology (transliteration), a joint venture backed by three Taiwanese firms: Advanced Echem Materials (AEMC), Nan Pao Resins Chemical Group, and Trusval Technology, applied to establish a branch at the Tainan campus of the Southern Taiwan Science Park, where it plans to build an advanced research and development center focused on adhesive materials used in semiconductor manufacturing processes.
