ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group. By licensing TSMC GaN technology, ROHM will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles.GaN power devices offer excellent high-voltage and high-frequency performance, helping to improve efficiency and reduce size in a wide range of applications, and are already used in consumer products such as AC adapters. Adoption is also expanding in high-voltage applications such as power units for AI servers and on-board chargers for electric vehicles (EVs), and demand is expected to continue growing.ROHM began developing GaN power devices at an early stage and established a mass-production system for 150V GaN at ROHM Hamamatsu in March 2022. In the mid-power range, ROHM has built its supply structure while advancing external collaborations. One of the key partners in this effort has been TSMC: ROHM has adopted a 650V GaN process since 2023, and in December 2024, the two companies entered into a partnership related to automotive GaN, further deepening their collaboration.This latest integration represents an evolution of that partnership. Under a newly concluded license agreement, TSMC's process technology will be transferred to ROHM Hamamatsu. ROHM aims to establish the production system in 2027 to meet expanding demand in applications such as AI servers.Upon completion of the technology transfer, ROHM and TSMC will amicably conclude their automotive GaN partnership. At the same time, the two companies will continue to strengthen collaboration for higher efficiency and more compact power supply systems.

Luna, the health-tech company behind the Luna Ring today announced the launch of LifeOS V1, a foundational upgrade to the Luna Ring that introduces one of the first truly vertically integrated AI systems designed to unify the full spectrum of personal health data into a single, intelligent interface. LifeOS brings together wearable biometrics, nutrition, supplements, medication history, medical reports, reproductive health signals, workouts, environmental context, and recovery behavior, transforming fragmented inputs into clear, meaningful insight that users can understand and act on instantly.This release represents a critical step toward Luna's long-term vision of building a context-first health intelligence system, one that moves beyond passive tracking to help individuals understand why their body responds the way it does, and how daily behaviors shape recovery, resilience, and performance over time."Until now, health data has existed in silos: wearables in one place, nutrition in another, medical history somewhere else. LifeOS is designed to unify this complexity and translate it into simple, human-readable understanding. Our goal is not just to track health, but to bring clarity to it."Unlike clinical or diagnostic systems, LifeOS is not a medical product. Instead, it is designed to help users recognize how small, everyday choices: what they eat, how they move, how they sleep, and how they recover - collectively influence the body's long-term response and healing capacity.With LifeOS V1 now live, Luna begins the next phase of its roadmap toward real-time, context-aware health guidance, powered by continuous biomarker intelligence and adaptive AI. This is like an advanced version of ChatGPT for health which knows your body 24*7.Availability LifeOS V1 is rolling out starting today to Luna users via the latest version of the Luna app.

XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications.Under the partnership, XTPL will install a Delta Printing System in Manz Asia's  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production.The partnership combines XTPL's proprietary dispensing technology with Manz Asia's expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities.XTPL's UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures."I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside.The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.," said Filip Granek, CEO of XTPL.Robert Lin, CEO of Manz Asia, added: "This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios.By combining XTPL's dispensing technology with Manz's automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production."

Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform connects clients with precision component manufacturers in Taiwan and mass production facilities in Vietnam, addressing information gaps and geopolitical risks in cross-border sourcing. The digital platform serves companies implementing "China Plus One" strategies. Teamsworld combines Taiwan's research and development capabilities with Vietnam's cost advantages, providing sourcing solutions for mechanical components from prototype development to mass production with supply chain transparency and flexibility.AI-Driven Manufacturing SupportThe platform digitalizes traditional procurement processes using artificial intelligence. The system analyzes materials and geometric tolerances while incorporating Design for Manufacturing (DFM) experience to optimize production paths during early development stages. Company data indicates the platform helps clients increase production efficiency by 25% and reduce research and development costs by up to 40%. A cloud-based dashboard offers global clients real-time visibility into production status, fostering seamless cross-border collaboration while significantly lowering overhead.Taiwan-Vietnam Dual-Hub Model"In today's volatile global landscape, manufacturing has evolved from a race on price to a test of resilience," said Vincent Lin, CEO of Teamsworld. "We aren't just a matchmaking platform; we are a strategic partner. By integrating Taiwan's advanced R&D with Vietnam's cost-effective production, we empower enterprises to navigate the entire lifecycle from prototype to mass production with unparalleled agility."Specialized Thermal Management Solutions for EV and 5G MarketsTeamsworld has developed technical capabilities in thermal management for high-power consumption and harsh environment applications. The company provides precision thermal enclosures for electric vehicle battery management systems, 5G communication base stations, and industrial automation equipment. Production processes integrate over 50 techniques, including aluminum die casting and injection molding, with assembly services spanning thermal bases to protective enclosures. Further information is available at official website.

Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.SK hynix said, "By making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP1 will be launched with Sandisk to begin standardization work."Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM's high performance and SSD's high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.In the AI inference market, the role of a total memory solution company that can provide both HBM and HBF is becoming more important as system level optimization of CPU, GPU, and memory determines the overall competitiveness rather than the performance of a single chip.In line with this, SK hynix and Sandisk are proactively pursuing HBF solution's standardization and commercialization based on their design, packaging and mass production experience in HBM and NAND."The key to AI infrastructure is to go beyond the performance competition of individual technologies and to optimize the entire ecosystem," said, Ahn Hyun, President and Chief Development Officer. "Through HBF technology standardization the company will establish a cooperative system and present an AI-era optimized memory architecture to create new value for customers and partners."

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.) IP, achieving a data rate of 64 Gbps per lane, the highest speed defined in the UCIe specification. The 64G UCIe IP, supporting UCIe 3.0, delivers an impressive bandwidth density of 21 Tbps per 1 mm of die edge (10.5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P technology and CoWoS advanced packaging, typically leveraged by AI, high-performance computing (HPC), datacenter and networking applications.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling a seamless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently for each die withoutinterrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for re-training or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability."We are fully committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs on TSMC's advanced process and packaging technologies," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe-A, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of highperformance computing. Our strong collaboration with TSMC and its Open Innovation PlatformR (OIP) ecosystem is enabling our customers to accelerate time-to-market in today's AI-driven competitive market."Click here for more information.GUC UCIe 64G IP Highlights. Credit:Guc

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.ASUS Optimized Liquid-Cooling Solutions for next-generation AI compute densityAs AI and HPC workloads push compute density and power consumption beyond the capabilities of traditional air cooling, optimized liquid-cooling solutions by ASUS will provide the critical thermal management required for the next-generation NVIDIA Vera Rubin NVL72 system based data centers. By efficiently dissipating heat from high-performance CPUs, GPUs, and accelerator-dense racks, ASUS significantly reduces energy consumption, lowers PUE, and optimizes TCO while supporting unprecedented rack density.ASUS Optimized Liquid-Cooling Solutions offer a comprehensive portfolio spanning direct-to-chip (D2C), in-row CDU–based cooling, and hybrid configurations, enabled through collaboration with global infrastructure leaders. Leveraging a strategic framework of partners – including Schneider Electric and Vertiv, alongside precision components from Auras Technology, Cooler Master, and other industry leaders – ASUS provides purpose-built cooling solutions that ensure optimal stability and performance at scale. With 2,156 No. 1 SPEC CPU records and 248 No. 1 MLPerf results, ASUS continues to demonstrate leadership in real-world compute density and AI performance.Real-world deployment: ASUS powers liquid-cooled AI supercomputer at NCHCA flagship example of liquid-cooling expertise by ASUS is its recent deployment for the National Center for High-performance Computing (NCHC) in Taiwan. The system features a dual-compute architecture, including the Nano4 NVIDIA HGX H200 cluster and NVIDIA GB200 NVL72 system  -  Taiwan's first fully liquid-cooled AI supercomputer deployment of this architecture.Designed and engineered by ASUS from the ground up, the system implements direct liquid-cooling (DLC) technology to achieve an exceptional power-usage effectiveness (PUE) of just 1.18. This deployment seamlessly integrates high performance with sustainable design, demonstrating the strength of ASUS in thermal and energy management for large-scale AI infrastructure.Join ASUS at GTC 2026ASUS announced its participation as a Diamond Sponsor (Booth #421) at NVIDIA GTC 2026 from March 16–19 in San Jose, USA. Under the theme Trusted AI, Total Flexibility, ASUS is collaborating with NVIDIA and global infrastructure giants to showcase a robust, next-generation liquid-cooling ecosystem. Come explore with us and witness the next evolution of AI infrastructure.

Artificial Intelligence Industry Exhibition (hereinafter, AI EXPO KOREA 2026) - the largest AI exhibition in Asia, presenting a comprehensive view of the present and a blueprint for future industries - will be held for three days from May 6 to 8 at COEX Hall A (entire 1st floor) in Samseong-dong, Seoul.First launched in 2018 to foster the domestic AI ecosystem and promote the development and activation of the AI industry, AI EXPO KOREA 2026 marks its 9th edition this year. The event is jointly organized by the Korea Artificial Intelligence Association, Seoul Messe, and AI Newspaper. Over the years, the exhibition has established itself as a leading platform that diagnoses the current state of AI and presents future directions, functioning as a venue where the latest AI technologies and real-world business applications can be directly experienced while relevant information and insights are actively shared.Scenes from AI EXPO KOREA 2025 held last year. Credit: AI EXPO KOREA 2026In particular, it has firmly positioned itself as a practical forum where companies and institutions across diverse industries plan and design strategies in response to the AI era, playing a pivotal role in shaping the domestic AI ecosystem and advancing industrial development. It is widely recognized as the largest and most authoritative AI event in Asia in both name and substance.At the 8th edition held last year, 322 companies and institutions from 18 countries, including the United States and Canada, participated with a total of 544 booths. Over the three-day event, 43,788 visitors and buyers attended, proving its status as a premier standalone AI exhibition. Building on this success, AI EXPO KOREA 2026 is expected to be held on an even larger scale with more diverse content. The organizers anticipate participation from approximately 350 companies from around 20 countries with a total of 600 booths, setting a new record as the largest edition to date.If 2025 marked the era of "thinking machines" driven by generative AI, we are now entering the era of "moving intelligence," namely the age of Physical AI. The AI industry is expected to experience explosive growth centered on AI Agents capable of autonomously performing personalized tasks, increasingly sophisticated and versatile Large Language Models (LLMs), and the powerful AI infrastructure that supports all of these technologies. Furthermore, as AI expands beyond the digital world to directly interact with the physical world through robots, autonomous driving, smart devices, and industrial automation systems, Physical AI is rapidly reshaping the very structure of industries and daily life. AI EXPO KOREA 2026 will spotlight these key trends and provide visitors with an opportunity to experience the forefront of AI technology.Moving beyond simple chatbots, AI Agent technologies that understand user intent and autonomously plan and execute complex tasks are transforming paradigms across industries. In particular, these AI Agents are no longer confined to software environments but are expanding into Physical AI that acts directly in the real world through integration with robotics and autonomous systems. This exhibition will showcase a wide range of AI Agent solutions and real-world applications across fields such as personal assistants, smart home control, industrial automation, customer service innovation, robotics, and autonomous systems. Visitors will be able to directly observe how AI Agents maximize work efficiency and create entirely new user experiences.Represented by LG EXAONE, Solar, A.X K1, OpenAI's GPT series, Google's Gemini, Meta's LLaMA, Hangzhou DeepSeek, and Qwen, LLMs have evolved into multimodal systems capable of generating not only images but also videos, demonstrating increasingly creative and advanced task execution capabilities. These LLMs go beyond simple content generation and, when combined with robotics, serve as the "brains" of Physical AI by directing and controlling physical actions. At AI EXPO KOREA 2026, the latest LLMs developed by leading domestic and international companies, along with various application services and industry-specialized LLM solutions, will be presented through live demonstrations. In particular, in-depth discussions are expected on the ethical use of LLMs, data security, and technologies for model lightweighting and optimization.Above all, establishing AI strategies requires more than simply selecting a model; it demands solutions that can fine-tune models for specific use cases and efficiently manage the substantial costs associated with AI deployment and operation. Accordingly, this exhibition will introduce comprehensive AI infrastructure technologies and solutions, ranging from AI chips and accelerators to storage, AI servers, various edge devices and computing, HPC, cloud, and data centers. Key discussion topics will include robotics computing for the Physical AI era, real-time sensor processing, on-device AI, and low-latency edge infrastructure. On site, a series of solutions and demonstrations will illustrate practical strategies for how AI infrastructure and on-device AI enable AI to interact with our daily lives, industries, and businesses from the perspective of AI convergence and real-world application.In addition, the exhibition will provide a comprehensive overview of core infrastructure technologies and solutions for AI development and operations, including data collection, processing, and analytics platforms, as well as automation tools for AI model training and deployment. Domestic and international semiconductor companies, data center solution providers, and cloud service companies will present their latest technologies, showcasing hardware and software competitiveness for the AI era.Ultimately, AI EXPO KOREA 2026 will go beyond a simple technology and industry exhibition to serve as a venue that presents concrete answers to the business innovations and industrial transformations driven by AI. Participating companies will showcase their AI technologies and solutions to discover new business partners, while visitors will gain the latest information and valuable insights on strengthening competitiveness through AI adoption and securing future growth engines.Detailed information can be found on the official website.

Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider SixSense, following a comprehensive market evaluation. The partnership aims to advance Tong Hsing's smart factory initiatives, with an initial focus on AI-driven defect classification (ADC) in manufacturing processes.As semiconductor manufacturing becomes increasingly complex and high-volume, traditional manual defect inspection and classification methods face growing challenges in terms of labor cost, consistency, and efficiency. After evaluating multiple solutions, Tong Hsing Electronic selected SixSense for its strong performance in classification accuracy, deployment flexibility, and seamless integration with existing production systems - aligning closely with the company's long-term digital transformation and smart manufacturing strategy.By adopting SixSense's AI-powered ADC solution, Tong Hsing Electronic look forward to automatically analyzing and classifying large volumes of defect images generated across production lines. This significantly reduces reliance on manual inspection, improves classification consistency, accelerates cycle time, and enables engineering teams to identify and address process issues more effectively.Skid Chiu, Senior Assistant Vice President of Tong Hsing commented:"Reducing labor-intensive steps while maintaining quality is critical for sustainable growth. The adoption of SixSense's AI ADC solution is expected to enable us to optimize resources more effectively while keeping pace with increasing inspection demands."Akanksha Jagwani, Co-Founder & CEO of SixSense, added:"Our goal is to help semiconductor manufacturers scale operations without scaling complexity or cost. The results currently validated by Tong Hsing Electronic Industries also demonstrate how AI can simultaneously reduce labor dependency and improve cycle efficiency in high-volume manufacturing environments."Tong Hsing Electronic emphasized that this collaboration represents more than a system deployment - it marks a key milestone in its smart factory roadmap. Moving forward, both companies plan to deepen their collaboration by expanding AI applications across additional process stages and product lines, further strengthening manufacturing resilience and competitiveness.

QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today announced the signing of a Memorandum of Understanding (MoU).This agreement builds on the companies' complementary strengths in photonic system design and their positions within the broader semiconductor ecosystem. The collaboration is aimed at strengthening hardware integration, improving manufacturability, and lowering operational energy requirements in photonic quantum computing systems.Building quantum hardware for practical environmentsAs quantum computing matures into real-world applications, operating efficiently beyond specialized laboratory environments is becoming increasingly critical. The collaboration focuses on integrating advanced detector components more closely within photonic quantum hardware, enabling meaningful reductions in infrastructure demands. This direction contributes to quantum computing hardware that is increasingly compatible with modern data-center environments and designed with deployability and total cost of ownership in mind.Integration, scalability, and energy efficiencyBy combining Artilux's expertise on germanium silicon (GeSi) photonic technology with QuiX Quantum's system-level photonic quantum computing development, the collaboration seeks to simplify system architecture and reduce detector-level cooling requirements and support infrastructure. This approach improves overall manufacturability and supports QuiX Quantum's objective of delivering high-performance photonic quantum computing hardware in Data Centers and HPC infrastructure, enabling scaling with industry needs.Executive Quotes:Dr.-Ing. Stefan Hengesbach, CEO, QuiX Quantum "We are thrilled to partner with Artilux as this collaboration supports our long-term strategy of building scalable and most energy-efficient photonic quantum computers. This allows us to improve manufacturability, uptime and reduce operational complexity while further expanding practical deployment."Erik Chen, CEO, Artilux "We are excited to collaborate with QuiX Quantum on leveraging our detector technologies to advance and support more energy-efficient and scalable quantum hardware. Partnerships like this help accelerate progress in next-generation photonic computing and underscores our growing role in global deep-tech innovation across multiple industrial sectors."Bas Pulles, Representative of Netherlands Office Taipei "We are pleased to witness the signing of this agreement between two technology pioneers; this agreement exemplifies how international cooperation can accelerate breakthrough technologies and create long-term economic and technological value for both regions."