Ultraband Technologies, an emerging IC design startup, announced today the official signing of a Memorandum of Understanding (MOU) with NTT ADVANCED  TECHNOLOGY CORPORATION (NTT-AT), a subsidiary of Japan's NTT Group. Focusing on III-V compound semiconductor technologies, the two companies plan to establish a supply chain partnership spanning upstream epitaxial development, midstream product design and development, and downstream market expansion.Initial Focus on Power Semiconductors with Parallel RF DevelopmentThis strategic collaboration is intended to leverage the complementary technological strengths of Ultraband Technologies and NTT-AT in addressing global market opportunities in electric vehicles (EVs), automotive electronics, green energy, AI servers, and high-frequency communications, including 5G-Advanced, 6G, and satellite communications.To support concrete business execution, both parties have established a structured communication mechanism and will progressively align their technology and product roadmaps across two primary domains:1.In the field of power semiconductors, which represents the initial focus of the collaboration, NTT-AT's epitaxial material technologies in III-V compound semiconductors, including GaN, will be integrated with Ultraband's expertise in power device and chip design. The objective is to develop high-performance and reliable power management solutions for applications in new energy, AI, and industrial markets.2.In parallel, collaboration in RF semiconductors will be advanced concurrently. By combining Ultraband's design capabilities in RF ICs and Antenna-in-Module (AiM) technology with NTT-AT's III-V compound semiconductor crystal growth expertise, the two companies plan to co-develop RF components for applications such as 5G-Advanced, 6G, satellite communications, drones, and robotics.Strengthening Supply Chain Integration Through Epitaxial Structure DesignThis partnership is intended to extend beyond individual projects, with both companies working toward a long-term collaboration framework covering the full product lifecycle. Within this framework, Ultraband will leverage its capabilities in epitaxial structure design as a key technical interface to facilitate integration between the two organizations.Semiconductor chip performance has traditionally been constrained by material specifications and epitaxial growth limitations. Ultraband applies its proprietary research in device material physics and epitaxial structure design to enable precise optimization at the material level, with the aim of overcoming technical bottlenecks and enhancing overall chip performance.By integrating Ultraband's epitaxial structure design capabilities with NTT-AT's epitaxial growth expertise, the collaboration is expected to improve performance from the material foundation while ensuring alignment with subsequent product design and development stages. Looking ahead, both parties intend to leverage their respective market channels to introduce these solutions into the global supply chain, targeting mutually beneficial outcomes.Seizing Market Opportunities in High-Computing AI, Green Energy, and Advanced CommunicationsAmid the continued growth of AI data centers, digital transformation, and global net-zero initiatives, high-performance III-V compound semiconductors for power and RF applications are becoming increasingly critical. The stringent requirements of AI servers for power efficiency and thermal management, the efficiency demands of energy storage systems, and the high-frequency performance standards of next-generation communication technologies all underscore the importance of advanced semiconductor solutions.Ultraband Technologies aims to contribute to the development of next-generation AI computing, green energy systems, and advanced communication ecosystems through its technological capabilities.Going forward, Ultraband Technologies and NTT-AT will utilize their joint working group to further align epitaxial specifications and product roadmaps, with the goal of delivering reliable technologies and solutions to global customers.Click here for more information.

j5create, a global leader in 3C peripherals and smart workspace solutions, is showcasing a comprehensive lineup of new smart connectivity products at COMPUTEX 2026. Focusing on cross-device collaboration, wireless audio/video (AV), smart desktops, and AI-integrated applications, the exhibition demonstrates how j5create is expanding beyond traditional connectivity hardware to deliver a more intuitive, unconstrained digital experience.The year 2026 marks the 16th anniversary of the j5create brand. Originating from foundational 3C peripherals and adapters, j5create has consistently leveraged its core expertise in USB and video transmission technologies to expand product applications and user scenarios. Moving from "device connectivity" to "smart connectivity," the company is redefining how humans and devices interact within the modern digital experience.As hybrid work, mobile content creation, remote collaboration, and multi-device setups become the norm, users face challenges that go beyond a simple "lack of ports." The true demand lies in making the transition between different devices and spaces natural and seamless.At this year's exhibition, j5create centers its showcase on the core philosophy of  "Enabling Freedom of Flow in Digital Work and Life".  By introducing diverse solutions across smart desktops, cross-device collaboration, wireless AV, content creation, and AI applications, the company re-imagines how modern users interact with technology.JCD3195 — 4K144 Dashboard DockNext-Gen Dashboard Dock Redefines the Desktop Interaction ExperienceThe JCD3195 transcends traditional docking stations by integrating desktop connectivity, real-time information, and personalized interaction into a single device.As modern desks simultaneously host work, entertainment, creation, and communication, the dock is no longer just a hub hidden behind a monitor. Featuring a built-in interactive dashboard, the JCD3195 seamlessly integrates device status, world clocks, personalized imagery, and real-time data directly into the workspace—transforming the desk from a mere workstation into an intuitive digital interaction center.The product supports 4K @ 144Hz, 2K @ 240Hz, and 140W Power Delivery, catering to the demanding needs of high-performance workstations, content creators, and high-refresh-rate gamers, while signaling a new direction for smart workspaces and high-efficiency connectivity.JUAW22 — CrossLink Wireless Dongle AdapterAeroDrop Cross-Device Solution Makes Collaboration IntuitiveAs laptops, tablets, and smartphones become increasingly slim, physical ports on modern devices continue to disappear. This trend—especially prominent within mobile ecosystems and Apple environments—has turned cross-device data transfer and workflow switching into a widespread user pain point.As j5create's cross-device connectivity product incorporating its proprietary  "AERO DROP"  concept, the JUAW22 is more than a file transfer tool; it symbolizes a freer, more intuitive way for devices to interact.The adapter supports second-screen extension between Windows and iPad, mouse and keyboard sharing, clipboard synchronization, and AirDrop-like file transfers. This ensures files, displays, and workflows flow naturally across different operating systems.By delivering a seamless cross-platform experience, the JUAW22 liberates multi-device users from ecosystem and hardware constraints, re-linking disparate device scenarios in modern digital life.JVAW87 — ScreenCast 4K60 Wireless Display ExtenderThe New Flagship Wireless Display Solution for Premium AV ExperiencesAs the next-generation flagship of the j5create ScreenCast series, the JVAW87 packs high-definition, low-latency, and high-refresh-rate wireless transmission into a compact form factor. It enhances the practicality of wireless AV for entertainment, gaming, and cross-space scenarios, standing as the world's smallest 4K60 wireless display transmitter.Unlike conventional wireless display adapters that focus primarily on business presentations, the JVAW87 prioritizes premium, real-time AV experiences, supporting 4K @ 60Hz wireless transmission, 2K @ 144Hz / 1080p @ 240Hz high refresh rates, and ultra-low latency of under 30ms.These specifications ensure high-resolution media remains smooth and stable in a wireless environment. Additionally, the device supports DRM and HDCP technologies, allowing direct streaming of copyright-protected content from platforms like Netflix, Disney+, and Prime Video, thereby offering a complete solution for home entertainment and mobile media sharing.Furthermore, the JVAW86 and JVAW87 utilize a shared receiver architecture. Users can expand their setup with different transmitter (TX) versions based on their needs, creating a highly flexible wireless AV ecosystem and expanding j5create's overall footprint in the Wireless AV market.Simultaneous Expansion into Creator and AI ApplicationsIn addition to its flagship offerings, j5create is debuting several new products tailored for content creators and professional collaboration. The JCA3625 USB-C 4K Dual Display HDMI Video Capture Mini Dock integrates multi-monitor display, HDMI capture, and Picture-in-Picture (PiP) functionality to help creators and multitaskers build a more flexible content creation workspace. The JVK202 4K USB KVM with ALT Mode offers a software-free, browser-operated KVM control solution that simplifies multi-device collaborative demands. The JCDP4140 Dual 4K Powerbase Docking Station features a built-in power supply and integrated cable management to help users achieve a clean, clutter-free desktop. And the JSS830 3-in-1 Recording Speakerphone combines a speakerphone, voice recorder, and AI summarization capabilities, allowing meetings, interviews, and learning sessions to be transcribed and shared efficiently.Redefining the Modern Digital Experience Through Smart ConnectivityFrom its origins in baseline 3C peripherals to its current breakthroughs in smart desktops, wireless AV, cross-device collaboration, and AI integration, j5create continues to push the boundaries of digital life and work through smart connectivity technologies.From desktops to mobile devices, and from content creation to AI-driven collaboration tools, j5create is redefining the role of "connectivity" in modern life across its diverse product lines, moving steadily toward a freer and more intuitive digital experience.COMPUTEX 2026 Exhibition Informationj5create is exhibiting at COMPUTEX 2026 from June 2 to June 5 at the Taipei World Trade Center (TWTC), Exhibition Hall 1, Booth A333b.For more information, please visit the official j5create website. 

PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure planning to real-world deployment.The showcase spans AI infrastructure, edge and industrial AI, autonomous systems, and physical AI applications. Together, these solutions reflect PEGATRON's focus on turning AI technologies into deployable systems through its design, manufacturing, and system integration capabilities.On the opening day, PEGATRON's booth welcomed President William Lai and NVIDIA Robotics Software Product Line Manager Spencer Huang. The visit included exchanges on AI infrastructure and physical AI applications. SIMBA II also joined the on-site demonstration, delivering a corporate gift made with circular materials to President Lai and offering a practical look at the robot's mobility and interaction capabilities in a live exhibition setting.During the exhibition, several international industry representatives also attended as invited guests of the opening ceremony, including AMD, Intel, Micron, Sagemcom, FUJISOFT, Chunghwa Telecom, Far EasTone Telecommunications, and Swiss precision drive technology company maxon. The participation of companies across computing, memory, communications, software services, and precision drive systems reflects the broader industry focus on connecting AI infrastructure with real-world applications.COMPUTEX is one of the world's major technology industry platforms. Under this year's theme,“AI Together,” the show brings together more than 1,500 exhibitors from 33 countries and focuses on AI computing, robotics and smart mobility, and next-generation technologies. As generative AI, agentic AI, and physical AI continue to advance, industry discussions are expanding from chips and servers to edge deployment, smart manufacturing, robotics, next-generation communications, and end-user applications.PEGATRON Chairman T.H. Tung said the AI industry remains in a phase of rapid development. Applications are moving from cloud and data centers into robotics, autonomous systems, smart healthcare, and everyday environments. In recent years, PEGATRON has continued to invest in AI servers, Digital Twin technologies, and physical AI, using its design, manufacturing, and system integration capabilities to help customers turn next-generation AI technologies into deployable products and systems.In response to this shift, PEGATRON's COMPUTEX showcase goes beyond individual products. Built on its design and manufacturing services (DMS) capabilities, the company connects computing, connectivity, sensing, mechanical design, and system engineering to demonstrate a path from AI infrastructure to field deployment.

PEGATRON Corporation (PEGATRON) announced a strategic collaboration with maxon, the Switzerland-based precision drive technology company. The two companies will jointly develop robotic joint drive technologies, motor modules, and integrated robotic systems. The collaboration will make its public debut at COMPUTEX 2026.At the exhibition, PEGATRON's  second-generation quadruped robot platform, SIMBA II, will integrate maxon's  High Efficiency Joint 90 (HEJ 90) system. PEGATRON said the collaboration focuses on motion control, sensing integration, and edge AI computing for autonomous systems, with the goal of improving robotic mobility and operational stability in complex environments.Headquartered in Switzerland, maxon specializes in precision motors and drive systems. Since its founding in 1961, the company has focused on high-precision electric drive technologies for applications including medical equipment, industrial automation, mobility systems, aerospace, and robotics. The HEJ 90 is a robotic joint module developed by maxon for robotics applications. It integrates the motor, gearbox, and control components into a single compact architecture while delivering high torque output and precise motion control.SIMBA II is PEGATRON's independently developed quadruped robotics platform. Built with a modular architecture, the system supports different sensor configurations and payload modules depending on deployment requirements. The platform also integrates edge AI computing capabilities for applications including smart inspection, industrial site monitoring, autonomous mobility, and AI development. With the integration of HEJ 90, SIMBA II further improves dynamic motion performance and platform stability across complex terrain conditions.PEGATRON stated that as AI, sensing, computing, and precision drive technologies continue to evolve, robotics is becoming an increasingly important direction for next-generation intelligent hardware. The collaboration with maxon also reflects PEGATRON's continued investment in robotics platforms and autonomous system technologies.From platform architecture and key modules to full system manufacturing, PEGATRON aims to build a more flexible and customizable robotics development framework capable of supporting different deployment environments and application requirements.Looking ahead, PEGATRON and maxon will continue expanding their collaboration in robotic drive modules and system development. By combining maxon's expertise in precision drive technologies with PEGATRON's strengths in design and manufacturing services, system development, and production management, the two companies aim to accelerate the adoption of intelligent mobile robots across industrial, commercial, and specialized applications.

PEGATRON, a globally recognized total server solutions provider, today unveiled its next-generation AI infrastructure portfolio and AI factory validation framework at COMPUTEX 2026. Powered by NVIDIA Vera Rubin platform , NVIDIA HGX Rubin NVL8, and NVIDIA RTX PRO Servers, and aligned with the NVIDIA DSX AI factory reference design, Pegatron is advancing how AI factories are designed, validated, and deployed - from digital twin simulation to production-ready infrastructure.As an NVIDIA DSX ecosystem partner, Pegatron is extending AI infrastructure validation beyond traditional manufacturing by integrating SimReady digital twins and AI factory workflows into its server development and deployment process. Through the NVIDIA Omniverse DSX Blueprint Pegatron enables customers to simulate, validate, and optimize rack-scale AI infrastructure before deployment."AI factories require not only high-performance computing, but also end-to-end infrastructure intelligence,"said Gary Cheng, President & CEO of Pegatron."By leveraging NVIDIA DSX architecture, SimReady digital twins, and AI factory validation capabilities, Pegatron has strengthened both its manufacturing operations and AI infrastructure integration expertise. Together with NVIDIA, we aim to help customers simulate, validate, and optimize AI deployments, improving the scalability, reliability, and efficiency of next-generation AI data centers."NVIDIA Vera Rubin NVL72 Rack-Scale AI SupercomputerThe centerpiece of showcase is the NVIDIA Vera Rubin NVL72  Pegatron's RA4803-72N3, a fully liquid-cooled supercomputer built on the third-generation NVIDIA MGX rack design for seamless drop-in deployment into existing Blackwell data centers.Unified Fabric: Integrates 72 NVIDIA Rubin GPUs, 36 NVIDIA Vera CPUs, NVIDIA ConnectX-9 SuperNICs, and NVIDIA BlueField-4 DPUs. It scales up via NVIDIA NVLink 6 and scales out via NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-X Ethernet. Paired with NVIDIA Groq 3 LPX racks, it delivers ultra-fast trillion-parameter inference.TCO Optimization: Trains mixture-of-experts (MoE) models using 1/4th the GPUs, slashes token costs by 10X, and delivers 10X more tokens per megawatt compared to previous Blackwell architectures.NVIDIA Vera CPU: Purpose-built for agentic AI and reinforcement learning, completing workloads 50% faster with twice the efficiency of traditional CPUs.Scaling AI Factories with NVIDIA HGX Rubin NVL8Pegatron also introduced the AS210-2T1-8H3, a 2U fully liquid-cooled server based on NVIDIA HGX Rubin NVL8 with dual NVIDIA Vera CPUs or Intel Xeon 6 processors.The platform leverages NVIDIA Rubin GPUs, NVIDIA NVLink 6, NVIDIA ConnectX-9 SuperNICs, NVIDIA BlueField-4 DPUs, and NVIDIA Spectrum-X Ethernet to accelerate enterprise AI and HPC workloads.To support rack-scale deployments, Pegatron expanded the architecture into: RA4800-64H3 — supporting eight 2U systems per rack, up to 64 GPUs and 16 CPUs. RA4800-72H3 — supporting nine systems, up to 72 GPUs and 18 CPUs within a 48U liquid-cooled rack.Factory-Native NVIDIA DSX Integration and SimReady Digital TwinsBeyond hardware innovation, Pegatron showcased its NVIDIA DSX-aligned AI factory validation workflow, integrating digital twin simulation, thermal analysis, and full-load burn-in testing within the same manufacturing facility.Pegatron's L11 thermal lab combines Ansys Fluent CFD simulation, NVIDIA Omniverse digital twins, liquid cooling analysis, and power modeling to optimize AI factory infrastructure before deployment, while the L12 burn-in room validates every system at 100% TDP against DSX digital twin predictions prior to shipment.Using the NVIDIA AI Factory Digital Twin Pipeline Samples, Pegatron converts engineering data into SimReady OpenUSD assets for NVIDIA Omniverse DSX Blueprint environments, enabling customers to validate cooling, power, and rack-scale AI deployments before installation.Pegatron also highlighted PEGAVERSE, its AI-native manufacturing intelligence platform that combines simulation, factory telemetry, and AI-driven operational analysis to continuously optimize AI factory performance and efficiency.Experience the Future of AI Infrastructure at COMPUTEX 2026Pegatron invites customers, partners, and media representatives to explore its AI infrastructure and DSX-integrated digital twin ecosystem at COMPUTEX 2026.Date: June 2–5, 2026,Location: Taipei Nangang Exhibition Center Hall 1, 4F,Booth: L0104.

Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed around three core pillars: Business Development (AI Zone), Product R&D (R&D Zone), and Professional Manufacturing (Manufacturing Zone).The showcase fully highlights Chenbro's comprehensive end-to-end advantages, spanning from precise front-end business alignment and collaborative component design to high-value-added back-end manufacturing services. Furthermore, to address the massive demand fueled by the explosive growth of AI servers, Chenbro is unveiling its newly integrated "Rack Level Solution" for the very first time. Through live physical demonstrations on-site, Chenbro powerfully declares its determination and fruitful milestone achievements as it comprehensively advances into the mechanical components market.Blockbuster Debut: From Server Chassis to Rack Mechanical Integration, Expanding the Innovative Value of AI InfrastructureDriven by the rapid iteration of AI computing architectures, Chenbro officially ventured into the rack mechanical components business last year. Chenbro's CEO stated that industry trends and customer demands have clearly shifted from the "Server Level" to the "Rack Level." Embracing this trend, Chenbro has progressively expanded from traditional chassis to comprehensive rack-level solutions. The physical rack displayed at the exhibition fully demonstrates Chenbro's profound capabilities in mechanical design and manufacturing. With a deep understanding of thermal management technologies (including advanced liquid cooling solutions) and power configuration planning, Chenbro is able to start from the customers' system architecture requirements, translating complex technical demands into optimized mechanical design solutions. By co-developing rack mechanical integration solutions with clients, Chenbro helps accelerate the implementation and deployment of AI infrastructure. The CEO emphasized that amid this technological evolution, Chenbro is no longer solely focused on cost reduction (Cost down); instead, it aims to create higher value (Value up) through system-level collaborative design, truly realizing its strategic vision of becoming a "comprehensive mechanical solution partner."Closely Tracking AI Trends: Heavyweight Exhibition of Next-Generation NVIDIA MGX SolutionsIn the Off-The-Shelf (OTS) exhibition zone, Chenbro leverages modularity as its design foundation, demonstrating highly flexible configuration capabilities that fully cover four major application domains: AI, Cloud, Storage, and Edge computing. As a collaborator of NVIDIA MGX, Chenbro is publicly premiering its 1U NVIDIA Vera Rubin server chassis solution based on NVIDIA MGX, which supports the next-generation architecture. Simultaneously, it is exhibiting a full series of AI chassis products—including 1U, 2U, 4U, and 6U models—developed based on NVIDIA MGX architecture. This powerfully demonstrates Chenbro's top-tier development prowess in satisfying diverse market and customer application needs.Dual Engines of R&D and Smart Manufacturing: Innovative Collaborative Design and the Factory of the FutureTo highlight its ultimate efficiency from R&D to market realization, Chenbro showcases deep technological moats in both its JDM and OEM exhibition zones.Joint Design Manufacturing (JDM): The company displays high-U-count AI servers co-developed with clients, alongside a 21-inch chassis series compliant with OCP ORV3 specifications. By sharing its proprietary JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) optimization mindsets, combined with tolerance analysis and around-the-clock technical services, Chenbro significantly enhances client collaboration efficiency and product stability.Original Equipment Manufacturing (OEM): This zone centers on "Chenbro's Factory of the Future," comprehensively introducing digital and automation technologies. By integrating big data analysis, AI, IoT, robotic arms, and AMR (Autonomous Mobile Robots), the exhibit perfectly demonstrates consistency in product quality and the maximized efficiency of its global localized production.Joining Forces: Building a Win-Win AI Server EcosystemAt this year's COMPUTEX, numerous leading global technology giants are also showcasing AI servers co-developed with Chenbro, fully validating Chenbro's pivotal position in the industry. CEO Corona Chen further pointed out that Chenbro will continue to deepen its partnerships with global CPU/GPU chip companies —such as NVIDIA, AMD, Intel, and Ampere—as well as its core clients, investing heavily in the R&D and manufacturing of next-generation high-end servers. Chenbro will keep exploring the blueprint driving the future of AI, committing to satisfying the diverse application demands of global data centers, and jointly creating a mutually beneficial and prosperous industry ecosystem.For more information , please visit.

PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing to help customers turn emerging technologies into production-ready products.AI is expanding beyond model training into enterprise and industrial applications. This shift shows that customers need not only computing performance, but also system integration, deployment flexibility, and long-term reliability. Through its AI Tech Maker strategy, PEGATRON turns compute, connectivity, sensing, and product design into deployable systems. PEGATRON will highlight three product areas in Computex: AI infrastructure for AI factories and high-performance computing; edge and industrial AI for manufacturing and communications; and physical AI platforms spanning robotics, drones, intelligent vehicles, and smart devices.Building AI Infrastructure for AI Factory and High-Performance ComputingLarge-scale AI deployment is driving new requirements for computing performance, networking bandwidth, thermal management, and system integration.At COMPUTEX 2026, PEGATRON presents a next-generation AI infrastructure portfolio that includes NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin NVL8, NVIDIA RTX PRO Server, and AMD Instinct MI355X and MI350P GPU server platforms. The solutions support enterprises and cloud service providers building next-generation AI Factory and high-performance computing environments.PEGATRON also showcases 400G, 800G, and 1.6T AI infrastructure switches designed for large-scale AI training and inference workloads requiring high-speed, low-latency data transmission. Open data center solutions compliant with Open Compute Project (OCP) standards are presented to improve scalability, deployment flexibility, and energy efficiency.The portfolio further integrates GPU servers, AI networking, liquid cooling, and full-rack system integration. This approach expands PEGATRON's role from hardware manufacturing toward comprehensive AI infrastructure platform deployment, helping customers shorten implementation cycles for generative AI, agentic AI, and enterprise AI applications.Bringing AI from Digital Twins to Edge ConnectivityAt the industrial AI layer, PEGATRON presents its PEGAVERSE portfolio, a smart manufacturing platform built around digital twins and agentic AI. The portfolio includes ARCHITECT for site planning, YODA for engineering knowledge training, and JEDI for intelligent manufacturing processes. These applications translate PEGATRON's manufacturing experience into repeatable and deliverable industrial AI offerings.In communications and edge AI, PEGATRON showcases next-generation 5G equipment, AI-RAN concepts, Wi-Fi 7 modules, and 6G antennas. The company is also integrating radio units (RUs) with NVIDIA DGX Spark, reflecting the growing convergence of AI compute and communications infrastructure.PEGATRON also presents its Scalable Central Computing Rack (SCCR) for smart mobility. As a vehicle central computing platform, SCCR integrates IVI, gateway, and ADAS functions, addressing the industry shift from distributed vehicle electronics toward centralized architectures and extending edge computing into mobility systems.Expanding Physical AI Across Ground and Aerial PlatformsAI is moving from data centers into physical environments, where autonomous systems must combine sensing, compute, and motion control to operate reliably in complex conditions. At COMPUTEX 2026, PEGATRON presents ground robot and aerial drone platforms that bring physical AI into mobility systems.SIMBA II, PEGATRON's next-generation quadruped robot platform, combines power electronics, mechanical design, sensing systems, and edge AI computing for inspection, monitoring, and automation tasks. Developed with Swiss precision drive specialist maxon, the platform integrates the HEJ 90 high-performance joint system to improve motion control and stability, while supporting real-time environment recognition and autonomous navigation.The G720 SOM+EVK and AI Companion Computer extend PEGATRON's edge computing and visual perception technologies to intelligent drone platforms. Built on MediaTek's MT8391 platform, they support ROS2 and MAVLink integration with flight control systems and mission workflows, enabling navigation, sensing, and real-time image processing. Vision perception and multi-camera imaging modules further support obstacle avoidance and environmental interpretation.Through its ground and aerial platforms, PEGATRON brings AI compute, sensing, and autonomous control into physical mobility systems, turning related technologies into deployable products.Bringing AI and Design into Smart Endpoint DevicesIn smart devices and user experience, PEGATRON applies its DMS model to combine industrial design, engineering, materials, and manufacturing into the product development process. The M16P Optimus modular laptop uses a modular architecture for key components such as the motherboard, I/O, keyboard, battery, and storage. The design allows flexible configuration based on customer requirements and supports easier maintenance, faster customization, and future platform upgrades.The award-winning Armo Emotion Sensing Game Handle brings sensing technology into interactive applications. It integrates heart rate, electrodermal activity, and temperature sensing to analyze physiological signals and adapt gameplay based on user conditions.In personal care, the PRIIo product line extends PEGATRON's design capabilities into everyday consumer applications. The products combine electronic control, sensing technology, and industrial design for facial and scalp care scenarios.PEGATRON said AI development is shifting from technology-led progress toward practical use. The key is turning innovation into products and systems that can operate reliably over time. The company will continue strengthening its productization and integration capabilities while working with global partners to support technology adoption across different environments.PEGATRON's COMPUTEX 2026 booth is located at L0104, 4F, Taipei Nangang Exhibition Center, Hall 1. Professional guided tours will be available during the show.

Edimax Group will host Expo 2026 during Computex 2026, bringing together its group companies, including EDIMAX Technology Co., Ltd. (TWSE: 3047, including its Edimax and Acelink business units), Comtrend Corporation (TWSE: 8089), and SMAX Technology Co., Ltd. The exhibition will take place from June 1 to June 11, 2026, at Edimax Group headquarters in Taipei.Edimax Group to Showcase AI Edge Innovation at Expo 2026. Credit: EdimaxThis year's Expo carries special meaning as Edimax Group marks its 40th anniversary. Since its founding, the Group has grown from a networking equipment developer into a global provider of connectivity technologies across home networking, enterprise and industrial networking, broadband communications, and AIoT applications.For four decades, Edimax Group has focused on one mission: making technology more reliable, practical, and closely connected to real-world business and lifestyle needs. As the company enters this important milestone year, Edimax Group extends its sincere appreciation to its global partners, customers, and supply chain partners for their long-standing trust and support.Expo 2026 Event InformationEdimax is pleased to announce its upcoming exclusive showcase, centered around the theme "AI Edge. Autonomous Future. Resilient Living." Running from June 1 to June 11, 2026, the event will take place at the Edimax Group Headquarters, located at No. 278, Xinhu 1st Road, Neihu District, Taipei, Taiwan.The showcase will be open from Monday to Friday, 9:00 AM to 6:00 PM. Please note that attendance is by appointment only. We cordially invite industry leaders and partners to schedule a visit and explore the next generation of technological innovation with us.Exhibition FocusExpo 2026 will highlight four key areas: Autonomous Future - AI Edge, autonomous operations, and self-service applications for scalable business growth. Ultra-Speed & Trusted Network - Wi-Fi 8, 25G networking, AI management, and green computing for next-generation connectivity. Secure and Resilient Connectivity - Edge networking and AI-driven management to strengthen security and network resilience. Market-Ready Solutions - Proven, ready-to-deploy solutions that help customers accelerate project launches and market adoption.Edimax Group stated that it will continue to deepen the integration of AI, broadband communications, and smart networking technologies while working closely with global partners to advance next-generation intelligent networks and digital applications.Expo 2026 will be held by appointment only. Global partners and customers are invited to visit and experience Edimax Group's latest innovations, celebrate the company's 40-year milestone, and explore the future of smart connectivity.

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs designed for immersion cooling and engineered for AI-driven data centers, along with a comprehensive portfolio of industrial and enterprise SSD solutions.As generative AI and high-density computing evolve, thermal management is critical. To address this, SSSTC has optimized its SSDs for immersion cooling environments by enhancing corrosion resistance through specialized materials, component protection, and structural design. The lineup includes the SATA ER3, ER4, and ER5 series, as well as the PCIe U.2 PJ1 and EJ5 series.These SSDs are optimized for immersion cooling environments, where systems are submerged in non-conductive dielectric fluids. By leveraging the high heat capacity and convective properties of liquids, heat can be efficiently dissipated through fluid circulation and heat exchange. This approach reduces reliance on traditional air cooling while improving Power Usage Effectiveness (PUE) and overall system reliability.SSSTC is also highlighting a range of industrial and enterprise SSDs optimized for AI and edge applications. Industrial SSDs support Edge AI and harsh environment deployments, with operating temperatures ranging from -40-degrees Celsius to 85degrees Celsius, along with anti-vibration and shock-resistant designs for outdoor and industrial environments. The pSLC architecture enhances endurance for sustained write-intensive workloads, while a multi-tier PLP (Power Loss Protection) framework -  including hardware PLP, firmware PLP, and PLN -  provides flexible data protection.Enterprise eTLC SSDs are designed to deliver stable performance for AI workloads, offering endurance options of 1 and 3 DWPD over a five-year period for varying workload intensities. Under sustained workloads, they maintain more than 90% random IOPS consistency, minimizing performance fluctuations. Firmware optimized for high-density computing enables low latency operation, while capacitor-based PLP and immersion cooling support ensure reliable performance in demanding deployment environments.With more than 18 years of in-house firmware development expertise, SSSTC understands diverse storage requirements across industries and provides flexible customization options, including configurable over-provisioning, lifespan and capacity optimization, performance and power tuning, and application-specific firmware development. SSSTC remains committed to helping customers build stable, efficient, and sustainable AI storage infrastructures.Founded in 2008, SSSTC became a subsidiary of Kioxia Corporation in 2020 and delivers high-quality SSDs through in-house firmware and NAND expertise. For more information, visit the SSSTC website.Remark: PCIe is a registered trademark of PCI-SIG.Credit: SSSTC

MSI, a global leader in high-performance computing and industrial solutions, returns to COMPUTEX 2026 (Booth #J0605a) to unveil its strategic AI roadmap. This year's showcase centers on a seamless continuum from data center scale to autonomous edge execution, featuring liquid-cooled AI platforms and supercomputers built on NVIDIA MGX, NVIDIA DGX Station, and NVIDIA DGX Spark architectures.Cloud Foundation: Liquid-Cooled Infrastructure for Hyperscale AITo meet the demands of modern AI data centers, MSI is introducing high-density platforms that prioritize thermal efficiency and performance: CG681-S6093 6U Liquid-Cooled AI Server (based on NVIDIA MGX): Built on NVIDIA MGX architecture, this server supports dual AMD EPYC processors and up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition Liquid Cooled GPUs. It delivers the compute density required for large-scale AI inference - with support for a wide range of agentic, physical AI, scientific computing, simulation, graphics, and video workloads.High-Speed Connectivity: The platform is equipped with NVIDIA ConnectX-8 SuperNICs, providing up to 8×400Gbps Ethernet connectivity for distributed AI environments.    Rack-Scale Scalability: MSI's liquid-cooled rack-scale architecture supports up to four CG681-S6093 GPU systems within a 48RU configuration. Networking is anchored by NVIDIA Spectrum-4 SN5600 Ethernet switches and SN2201 out-of-band switches for high-performance AI cluster connectivity.Deskside Development: The Desktop AI SupercomputerBridging the gap between the data center and the developer's desk, MSI presents high-performance AI computing for local workflows: XpertStation WS300 (NVIDIA DGX Station): Powered by NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip with up to 748GB coherent memory and 7.1TB/s HBM3e bandwidth, supporting Windows-based AI development while enabling high-speed CPU-GPU data sharing for large AI models and data-intensive workflows.Efficient AI Refinement: The WS300 is designed for AI model development, fine-tuning, and inference, utilizing a compact, liquid-cooled design with dual 400GbE networking powered by NVIDIA ConnectX-8 SuperNICs to sustain peak performance. (Recently showcased at GTC Taipei).Edge Execution: EdgeXpert and Autonomous IntelligenceMSI is bringing data center-level performance directly to real-world environments through the debut of its edge supercomputing platform: EdgeXpert AI Supercomputer: Built on the NVIDIA DGX Spark platform, EdgeXpert enables enterprises to deploy smarter, faster, and more scalable AI agents and applications at the edge.OpenClaw/Hermes Agent on MSI EdgeXpert: MSI showcases prominent AI Agent frameworks, providing open-source Agentic AI structures that support sustainable local operations and self-optimization capabilities.EU CRA Compliant Agentic AI with Galene Elettra: Powered by a Multi-Agent System (MAS), this solution enables intelligent decision-making across complex workflows while maintaining compliance with the European Cyber Resilience Act (CRA). Legal AI Suite: A specialized platform for enterprise AI, streamlining legal research, document analysis, and IP governance. Smart Campus Patrol: The Smart Campus Patrol Vehicle demonstrates real-time computer vision for precision inspection and smarter industrial operations. Tarot AI Experience with Reachy Mini: An interactive demonstration of Agentic AI, blending robotics with generative AI to deliver personalized engagement. End-to-End AI in Action Across IndustriesMSI delivers purpose-built Edge AI solutions developed with leading industry partners across diverse vertical markets:Smart Manufacturing & Semiconductor:The Edge AI Box MS-C910E with Memorence AI enables real-time machine vision. Partnering with Qiming Tech, MSI leverages the Edge AI Box MS-C939 to deliver real-time, high-precision automated optical inspection (AOI) to optimize semiconductor production yield.Voice AI & Driver Safety: Powered by Ubestream, the Slim Box MS-C926 provides real-time translation, while the Embedded Box MS-C927 enables instant voice-to-order experiences for retail. For driver safety, the In-vehicle Box MS-C932 runs real-time AI Driver Fatigue Detection to enhance on-road security.Smart Transportation & Precision AgricultureIntegrating edge inference with frontline mobility and field operations, MSI optimizes commercial transit and smart farming workflows:Smart Transportation × AI Vision Solutions:MSI is expanding its smart transportation portfolio with mobility solutions powered by Edge AI and in-vehicle vision. The lineup features fleet management tablets, telematics boxes, smart rearview mirrors, and AI-enabled ADAS and DMS systems for fleet monitoring and video analytics. Utilizing real-time AI processing, MSI helps logistics and fleet operators improve management efficiency and strengthen road safety.Smart Agriculture & Drone Integration: MSI introduces an intelligent agricultural solution that seamlessly integrates autonomous drone technology, Edge AI computing, and ground control systems.Built for harsh environments, this comprehensive platform combines drone ground control stations, rugged tablets, T-Box connectivity modules, and centralized multi-drone management platforms. It is engineered for critical use cases including automated field inspection, precision spraying, crop monitoring, and pest/disease identification. By leveraging real-time video analytics, edge inference, and cloud data synchronization, the solution empowers agricultural operators to boost efficiency, streamline operational workflows, and accelerate the transition to smart farming.Extreme Field Mobility (MS-NE21): The NE21 Rugged Industrial Tablet features an Intel 13th Gen Core i Series (Raptor Lake-U) processor, supporting up to 32GB LPDDR5/LPDDR5X memory and 2TB PCIe SSD. Built to MIL-STD-810G standards with an IP65 rating, it survives 4-foot drops and functions from -10°C to 50°C. It offers a 650-nit sunlight-readable 11.6" display with glove/wet-touch modes and a continuous hot-swappable battery system (64Wh to 98.1Wh).Industrial Panel PCs & Robust Hardware FoundationTo support heavy enterprise workloads, MSI highlights its high-reliability industrial hardware portfolio:Industrial Panel PCs: Features include the MS-1A81 (21.5") for Smart Healthcare clinical workflows; the MS-1A22 (12.1") and MS-1A32 (15") for factory floor monitoring; and the MS-1A91 (10.1") and MS-OP01 (15.6") for secure Smart Locker Systems.Hardware Backbone: For multi-industry infrastructure durability, MSI showcases its robust hardware portfolio featuring the Intel Wildcat Lake, NXP, and NVIDIA Jetson Thor series platforms, alongside industrial 4U rackmount systems.Sustainability & EV Charging InfrastructureBringing intelligent infrastructure to the energy transition, MSI presents its smart EV charging solutions:Eco Series Home EV Charger: Awarded the Taiwan Excellence Award, this residential smart charger delivers up to 22kW three-phase output. Powered by NXP industrial MCUs and AI smart control, it integrates with solar storage. Featuring a UL94-V0 fire-rated enclosure (extinguishing over-heat sources in 10 seconds) and RDC-DD leakage detection for underground parking safety, it holds global safety certifications, RPC certification in Taiwan, and $5M USD product liability insurance.MSI Hyper 80 Dual Fast Charger: Designed for urban commercial hubs, this DC fast charger delivers 80kW power distribution within an industry-leading 30cm ultra-slim chassis to maximize space efficiency.Visit MSI at COMPUTEX 2026, Booth #J0605a, Hall 1 (1F), to experience the future of the cloud-to-edge AI ecosystem.Credit: MSICredit: MSI