As digitalization penetrates every industry-whether in cloud computing, telecommunications infrastructure, automotive electronics, or IoT devices-the security of hardware platforms is no longer an isolated concern of a single sector, but a common challenge faced by all critical infrastructures. In the past, the focus of cybersecurity was largely placed on software.However, as attack methods continue to evolve-from supply chain infiltration and firmware tampering to chip-level exploits-the security and resilience of hardware have come to be recognized as a fundamental cornerstone of modern security architectures. At the heart of this shift, Secure Flash Memory is increasingly emerging as the critical enabler across diverse application domains.Secure Flash Memory is becoming the common language of cybersecurity across industries.Credit: WinbondEvolution of International Standards: Hardware and Firmware Security FrameworksIn recent years, international standards and certification frameworks for hardware and firmware security have gradually formed a tightly interwoven network. Among them, the NIST SP 800-193 Platform Firmware Resiliency (PFR) Guidelines established by the U.S. National Institute of Standards and Technology clearly define three core capabilities: detection, protection, and recovery.These requirements mandate that platforms be capable of identifying anomalies, blocking unauthorized updates, and securely restoring firmware when necessary. Initially widely adopted in servers and networking equipment, SP 800-193 is now regarded as a cornerstone for defending against firmware-level attacks.However, relying on a single framework alone is insufficient to address the diversity of application scenarios. To provide a more flexible and scalable approach that covers varying product types and market demands, the Security Evaluation Standard for IoT Platforms (SESIP) was introduced. Designed specifically for IoT and embedded platforms, SESIP emphasizes a modular approach to security evaluation.By decomposing security functionalities into reusable security claims, SESIP not only improves certification efficiency but also allows manufacturers to reuse existing security assets across product lines, avoiding the need to start from scratch for each market-specific requirement. This flexibility has made SESIP a critical tool in today's rapidly expanding landscape of IoT and smart devices.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.The Convergence of Industry Standards: Common Criteria, FIPS 140-3, and ISO/SAE 21434At the same time, other international security frameworks continue to exert their influence. Common Criteria (ISO/IEC 15408) remains one of the most widely recognized global security evaluation systems, providing stringent assurances for smart cards and critical infrastructure devices. FIPS 140-3, mandated by the U.S. government, sets clear requirements for the security of cryptographic modules, covering encryption, key management, and physical protections, and has been broadly adopted in finance, government, and cloud services.Additionally, ISO/SAE 21434, originally designed for the automotive sector, introduces a risk-based approach to cybersecurity lifecycle management. While its initial focus was on automotive electronics, its methodology is increasingly being extended to other safety-critical domains, highlighting the growing convergence of cross-industry security standards.Though these standards originate from different perspectives, they share a common foundation: ensuring the establishment of a Root of Trust, safeguarding firmware and cryptographic keys against tampering, and enabling systems to recover quickly after an attack.This is precisely where secure flash memory demonstrates its value. The latest generation of secure flash memory devices typically integrate multiple security mechanisms, such as secure boot support, immutable key storage, hardware-based authentication, and cryptographic accelerators.These features allow secure flash memory not only to meet the firmware integrity requirements of NIST SP 800-193 but also to align with the cryptographic module protections defined in FIPS 140-3 and to complement the modular security claims of SESIP. In other words, secure flash memory is not just a solution for one certification, but rather a bridge across multiple international standards.Practical Applications: Secure Flash Memory in Different Industry SegmentsFor example, in the server domain, secure flash memory ensures that both BIOS and BMC firmware are verified during startup, blocking any unauthorized modifications in real time-a direct embodiment of PFR principles. In IoT devices, the same memory can be evaluated through SESIP, modularizing secure updates and key management, thereby enabling shared security foundations across different product lines.In financial services or cloud platforms, the built-in cryptographic engines of secure flash memory directly support the requirements of FIPS 140-3, providing a trusted environment for key storage. In automotive electronics, these memories can be incorporated into the threat modeling and risk management frameworks outlined in ISO/SAE 21434, supporting end-to-end lifecycle security management.Secure Flash Memory as the Engine of Cross-Industry Digital TrustIt can therefore be said that the role of secure flash memory has moved far beyond being a mere data storage component; it has become the tangible foundation of a system’s Root of Trust. It is the essential vehicle through which security standards are realized and the shared language that enables cross-industry collaboration. As industries worldwide continue to raise the bar for cybersecurity, the ability to effectively integrate and align with multiple international standards will determine whether products can successfully enter the market and earn end-user trust.Looking ahead, as supply chain security challenges intensify—from manufacturing to system integration to end applications—the demand for security will only continue to grow. With its unique ability to span across multiple standards, secure flash memory is poised to remain the cornerstone of digital trust in industry. It is not merely a technological option, but a strategic necessity for companies seeking to maintain competitiveness and compliance in the global marketplace.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

Blockchain technology is steadily reshaping mobile gaming, introducing new systems for payments, fairness and transparency. As decentralized finance expands into consumer services, gambling platforms are emerging as an example of how blockchain can alter both digital infrastructure and user experience. The rise of digital assets is now most visible in the growth of mobile crypto casino platforms, which illustrate how blockchain is merging with on-the-go entertainment.The Evolution of Mobile Gaming and Cryptocurrency IntegrationOver the last few decades, the shift in mobile gaming has been unprecedented due to the accessibility of powerful smartphones and the widespread availability of the internet. Mobile gaming is now the primary means of digital gaming in developed and emerging markets, capturing the most gaming revenue in 2024.Cryptocurrency has rapidly expanded and is now widely used for many transactions. In 2024, approximately $40.9 billion of illicit transactions within the crypto space were conducted, mostly using stablecoins. Although the figure reflects illicit activities, it demonstrates how powerful blockchain technology is.The integration of these industries has facilitated the development of mobile crypto casino platforms. Users replacing traditional fiat casino transactions with Bitcoin and other cryptocurrencies have made international transactions almost instant. The reduction of delays because of traditional banking has made it quite appealing to mobile crypto casino users.Blockchain as Infrastructure for Transparency and TrustUsing blockchain technology in the crypto gaming industry increases trust and confidence in transactions, which is a common challenge in the crypto gaming industry. Automated deposits and withdrawals of crypto can expose the illicit activities of a casino. Blockchain technology can provide real-time transparency, thus building trust for players in the gambling sitePlayers can check the fairness of gambling games through "provably fair" systems. Distributed ledger technology (blockchain) improves auditability in gambling. Unlike traditional gambling systems, where payments are settled in days, blockchain gambling payments are settled in minutes, particularly useful in regions where digital payments are embedded with middlemen.Global Growth and Regulatory ConsiderationsThe global gambling market is uneven due to blockchain technology. In North America, regulatory restrictions at the state level reduce the likelihood of widespread adoption. European and Latin American countries are using controlled regulatory sandboxes to test and monitor the technology. The Philippines has digitized its licensing system and Australia is adapting its regulations to mobile-first systems.According to Grand View Research, the latest data indicates the online gambling market is currently valued at 78.66 billion dollars and is projected to reach 153.57 billion dollars by 2030, reflecting an almost 12 percent annual growth. This means that the online casino market is projected to grow from 19.11 billion dollars in 2024 to 38 billion dollars by 2030. This means that blockchain-enabled platforms will positively impact the overall growth of the market, with the limit being the regulators' actions towards new emerging technologies.Market Adaptation and Case StudiesAdaptation across the sector has culminated in mobile-first cryptocurrency convergence. The growing cryptocurrency blockchain payment networks will be integrated with entertainment systems, reflecting a shift in consumer expectations toward quick, transparent services.For developers and analysts, there are both opportunities and challenges. There is demand for quicker and less restricted services, but also compliance issues, cybersecurity threats and the absence of international laws. The ability to weigh user convenience against operational resilience will determine long-term profitability.The absence of definitive answers does not change the reality that mobile crypto casinos are a growing trend. They are a test of blockchain technology in consumer markets and a demonstration of how mobile technology and digital currency combine to provide services that are transparent, effective and scalable.However, regardless of which tools or platforms seem most promising, careful evaluation is essential before taking action. Success in this space depends not only on innovation, but on understanding the legal, technical, and ethical implications of each solution.Blockchain Integration Reshapes Mobile Gaming Platforms. Pexels

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond. Taiwan's industry leaders are at the forefront of this transformation, proactively developing next-generation packaging technologies critical to AI semiconductor content.AI workloads are driving demand for specialized chip architectures that can process massive amounts of data quickly and efficiently. In data centers, high-performance AI chips-such as GPUs or AI accelerators-support large-scale model training and inference for applications like AI chatbots. At the edge, devices rely on high-efficiency chips like NPUs to enable real-time decision-making in applications such as autonomous vehicles, smart cameras and mobile devices.This shift in computing architecture depends on advanced packaging. By enabling higher performance and power efficiency through a tighter integration of compute and memory, advanced packaging supports the sophistication and scale of modern AI chips. Taiwan's expertise in advanced packaging and its expansive semiconductor supply chain are accelerating this shift.Why Heterogeneous Integration is Key to PerformanceMoore's Law scaling is becoming more expensive due to the complexity needed to keep increasing transistor counts. As a result, innovation is diversifying. Technologies like high numerical aperture extreme ultraviolet (high-NA EUV) lithography and new transistor designs such as gate all around (GAA) continue to push traditional scaling. Developments with backside power delivery (BPDN) are improving overall raw performance by providing a more stable power supply. Breakthroughs in semiconductor packaging are now playing an increasingly pivotal role.Semiconductor packaging has evolved beyond protecting and connecting chips to powering device performance. At the heart of this shift is heterogeneous integration-the ability to combine multiple chips or chiplets in a single package. This modular approach offers a flexible, cost-effective way to integrate diverse functions in packaging instead of on a single chip, to meet requirements without relying solely on traditional scaling.Advanced Packaging Technologies Enabling AIAI chips are growing in complexity, with some expected to contain up to a trillion transistors per package by the end of the decade. Advanced packaging supports this growth through system-level integration of compute and memory.High bandwidth memory (HBM) plays a key role. By stacking memory vertically and placing it close to the GPU, HBM reduces latency and boosts data transfer speeds while lowering power consumption. Interposers and substrates facilitate efficient communication between components. In many modern AI designs, hundreds of logic and memory chips are integrated into a single high-value package to meet specifications.Credit: KLATo support the growing architectural demands and evolving semiconductor chip requirements, the industry is advancing 2D, 2.5D and 3D packaging architectures-where 2D places chips side-by-side on a substrate, 2.5D arranges them on an interposer and 3D stacks them vertically. Technologies like hybrid bonding, embedded bridges, wafer- and panel-level interposers, glass core substrates and co-packaged optics help to increase interconnect density and improve system performance. These innovations provide new ways to shorten signal paths to increase bandwidth and reduce power loss-critical for AI workloads.Advanced Packaging Innovation Brings Manufacturing ChallengesAs packaging complexity increases, so do manufacturing challenges. More chip designs per package, larger die sizes, smaller features, denser interconnects and new materials all raise the bar for packaging yield management.Credit: KLAWith more components and interconnects placed into a single package, the number of potential failure points increases. A single chip or interconnect defect can compromise the entire multi-die package-resulting in costly yield loss. In this environment, tighter process control becomes essential to ensure high yield and reliability.Heterogeneous integration brings challenges similar to those found in front end semiconductor manufacturing, demanding greater defect sensitivity and tighter metrology precision. KLA addresses these challenges with a comprehensive portfolio of advanced packaging process control and process-enabling solutions-for wafers, panels and components – designed to scale advanced packaging complexity without compromising quality.Evolving 2.5D and 3D packaging architectures create new yield challenges that need improved process and process control solutions.Credit: KLAAI Needs Intelligent IntegrationThe semiconductor industry is anticipated to reach US$1 trillion globally by 2030, according to PwC in November 2024, driven by a wide range of applications-including the rapid growth of AI from data centers to edge devices. AI demands high compute capacity with optimized power use, pushing the boundaries of semiconductor chip design and integration. Taiwan’s semiconductor manufacturers welcome these opportunities.It's widely recognized that 90% of the world's advanced semiconductors are produced in Taiwan, contributing to a combined semiconductor output value that exceeded NT$5 trillion in 2024, up 22.4% from 2023, according to statistics released by the Industrial Technology Research Institute (ITRI). Global demand for AI chips is surging.AI is also driving a diversification of semiconductor content. Wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) provide higher power density, faster switching, and better thermal efficiency than silicon, making them increasingly important for efficient power delivery in AI systems.In data center and HPC environments, AI growth is also pushing development in photonics and co-packaged optics for network switches to improve data transfer speeds and energy efficiency. Quantum computing, still in early stages, could eventually reshape how complex AI workloads are processed.Across these domains, advanced packaging serves as the foundation for uniting diverse technologies into compact, high-efficiency systems. Taiwan technology leaders are driving this advanced packaging innovation, and KLA is proud to serve as their collaborative partner.2025 marks the 35th anniversary of KLA's operations in Taiwan. Headquartered in the United States, KLA is a global leader in semiconductor inspection and metrology, with over 15,000 employees worldwide. The expertise and insights cultivated at KLA Taiwan over three decades, in partnership with our valued customers, underscore a commitment to technical excellence in the AI era-when chip manufacturing requirements are more complex and challenging than ever before.The future of semiconductors isn't just about smaller transistors – it's about smarter integration. Packaging has become essential to performance. At the boundaries of Moore's Law, advanced packaging has emerged as the key to meeting next-generation semiconductor device requirements.With deep expertise in process, process control and customer collaboration, KLA is helping the semiconductor industry build what comes next. As AI redefines what's possible, the technologies that support it must evolve just as rapidly. KLA's dedicated team of engineers, physicists and data scientists embraces the scale and significance of this transformation, helping shape the future of semiconductor innovation in the AI age-where advanced packaging plays a pivotal role.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading enterprises, technical experts and industry leaders across the memory sector to explore pathways for technological evolution and emerging opportunities driven by AI. Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics, delivered a keynote titled "Architecting Al Advancement: The Future of Memory and Storage", unveiling a series of cutting-edge solutions and providing a glimpse into the challenges and innovation directions of memory technologies.Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics. Credit:GMIFMemory is Embracing an Architecture Reconfiguration with the Advent of Agentic AI EraAccording to the address by Kevin Yoon, AI is evolving from Generative AI to Agentic AI and will progress toward Physical AI. The memory industry is now officially transitioning into the Agentic AI era. Characterized by independent inference and decision-making capabilities, the Agentic AI is demanded to maintain multiple states over time built on top of generative AI and invoke external tools without noticeable latency. This shift is fueling explosive growth in global data and computing workloads."The inference of Agentic AI requires longer periods to achieve optimal outcomes, resulting in surging needs of memory capacity," Kevin Yoon underlined, data centers are transitioning into data-intensive computing mode in a fast manner. Therefore, memory technologies goes beyond a backend underpinning to become the determinant of AI system efficiency and scalability. Legacy storage architectures are faced by exponential bandwidth demands, power consumption nearing physical limits, and increasing latency constraints, so the memory hierarchy must be restructured to meet the needs of next-generation intelligent infrastructure.Dual-Track Advances in Memory: Samsung Mass Produces GDDR7 and Leads the CXL EcosystemRegarding high-bandwidth needs of AI servers, Kevin Yoon announced its major breakthroughs. Its first-ever 24Gb GDDR7 in mass production establishes deep collaborations with leading GPU partners. Engineered with leading-edge process and optimized IC architecture, it delivers transfer rate up to 42.5Gbps, a 30% enhancement in energy efficiency compared to last-gen products, making it stand out in AI training and graphics rendering.Compute Express Link (CXL) stands as a promising solution to address the capacity limit of DRAM. Samsung, the first to debut CXL products, has already mass-produced CXL 2.0 products benefited by its technology and ecosystem development since 2021. Kevin Yoon noted that as the industry moves into the CXL 3.0 era, Samsung is developing devices that support real-time memory sharing across multiple servers. A CMM-D solution with CXL 3.1 and PCIe Gen 6.0 compatibility is scheduled for launch next year, with plans to add full-feature support such as near-memory processing to further improve flexibility and scalability in data centers.All-Around Innovation: Advancing Performance, Density and Thermal ManagementIn memory sector, Kevin Yoon introduced Samsung's technology layout and product roadmap in terms of three major indicators: high performance, high density and thermal control. On the performance front, Samsung is tackling the challenges posed by interface upgrades to PCIe through coordinated design across NAND and controllers and is planning to launch its PCIe Gen6 SSD PM1763 in early 2026. This brand-new versions is expected to offer doubled performance under the power consumption limit of 25W and a 1.6-fold energy efficiency improvement, making it ideally suited to GPU-intensive AI computing scenarios.With respect to high-density storage, Samsung is clearly ahead of the pack. It launched a 128TB U.2 SSD in 2025 and plans to roll out 1T-thickness EDSFF products between 2026 and 2027, pushing capacities to 256TB on Gen5 and 512TB on Gen6. These leaps are powered by Samsung's advanced 32-layer stacked packaging and the slim form factor of EDSFF, enabling higher density and better energy efficiency in limited space.To address the thermal challenges of high-performance storage, Kevin Yoon explained that Samsung is pivoting from traditional air cooling to direct liquid cooling technologies. By reducing the thickness of its E1.S 8TB SSDs from 15T to 9.5T and minimizing thermal resistance between cold plates and enclosures, this will ensure system stability under full-load conditions for next-generation storage products.New Product Category: Memory Class Storage Ushers in a Low-Latency EraTo support the rapid-access needs of AI inference on small data blocks, Samsung introduced a new category called Memory Class Storage (MCS), designed to close the performance gap between storage and compute. A key use case is GPU Initiated Direct Storage (GIDS), where data moves directly between storage and the GPU, dramatically cutting system latency.The company is now developing seventh-generation Z-NAND, the key medium behind MCS. Its third-generation product, tailored for GIDS, is expected to deliver throughput well above current industry benchmarks while maintaining ultra-high performance and peak energy efficiency. "Memory Class Storage will reset expectations for AI inference speed and underpin real-time intelligent applications," Kevin Yoon emphasized.In closing, Kevin Yoon stated that through full-stack innovation in memory and storage, Samsung not only aims to solve AI-era data management challenges but also unlock the full potential of AI technologies. Moving forward, Samsung will continue to push technical boundaries and work with global partners to build an open storage ecosystem and co-create an intelligent future empowered by AI.Honored for Excellence: Outstanding Storage Technology Leadership AwardThe GMIF2025 Innovation Summit, in addition to in-depth discussions of technological evolution and ecosystem collaboration in the AI era, also announced an award list that highlighted outstanding enterprises, innovative technologies, and exemplary solutions that have emerged in the storage field over the past year. As an industry leader, Samsung Semiconductor has continued to make major strides in both DRAM and NAND technologies and was honored with the "Outstanding Storage Technology Leadership Award."Samsung Semiconductor honored with Outstanding Storage Technology Leadership Award. Credit:GMIFThe judging committee noted that as AI fuels surging demand for high-bandwidth, energy-efficient storage, Samsung has moved fastest in bringing advanced technologies like HBM, DDR5, LPDDR5X and high-stack 3D NAND into large-scale production and real-world use. These innovations have helped accelerate large-model training, data-center upgrades and next-generation smart devices, giving global customers a much stronger technology backbone.The award also reflects Samsung Semiconductor's long-term investment in R&D and its role in continuously pushing the limits of storage performance and enabling digital transformation worldwide. The company reaffirmed that it will keep driving memory innovation, deliver cutting-edge solutions across the ecosystem and help advance AI adoption globally.GMIF2025 brought together top industry leaders and the keynote by Kevin Yoon offered a clear view of where storage technology is heading in the AI era. From agentic AI and breakthroughs in GDDR7 and CXL to progress in high-density storage and thermal design, Samsung is clearly at the forefront. Its introduction of Memory Class Storage adds an entirely new approach to AI inference. Moving forward, Samsung will continue working with partners around the world to unlock the next wave of storage possibilities and power an AI-driven intelligent future.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded recently in Shenzhen. Under the theme "AI Applications, Innovation Empowered", the GMIF2025 of the year brought together leading representatives across the global memory industry chain to engage in in-depth discussions on compute-storage convergence, AI deployment, and ecosystem collaboration, exploring pathways for storage technology innovations and ecosystem development in the AI era.Wallace C. Kou, President and CEO of Silicon Motion. Credit:GMIFWallace C. Kou, President and CEO of Silicon Motion Technology Corporation, was invited to deliver a keynote speech titled "From Cloud to Edge: Silicon Motion's Controller Technologies Accelerate AI Application Innovation." Wallace offered an in-depth analysis of the transformation of storage architectures in the AI era and showcased Silicon Motion's latest breakthroughs and product roadmap in controllers under AI.In his keynote, Wallace highlighted that as AI shifts from training to inference, data volumes are surging from PB to ZB levels. Traditional storage architectures are increasingly inadequate for the stringent needs of AI, particularly in high throughput, low latency, and energy efficiency. AI applications are pushing the memory industry evolving from "tiered storage" to "compute-storage convergence" and even "in-memory computing", making storage no longer merely a "warehouse for data" but a critical part of the AI computing pipeline."The rapid development of AI has made storage an indispensable core element in the entire value chain," said Wallace, "From cloud data centers to edge devices, AI inference will become the dominant trend after 2026. With leading controller technologies, Silicon Motion is building a full-stack storage solution that spans cloud, edge, and endpoints."Data Centers: The PCIe Gen5 SSD controller SM8366 supports sequential read/write speeds of 14GB/s and 3.5M IOPS random reads/writes. Equipped with Silicon Motion's in-house LDPC error-correcting algorithm, it ensures high reliability for high-capacity QLC SSDs.Edge & AI PCs: The PCIe Gen5 SM2508 series is in mass production with over 50% global market share. It supports the SCA interface and low-power design, making it ideal for AI PCs, all-in-one systems, and edge servers.Automotive & Embedded: The Ferri-SSD, Ferri-UFS, and Ferri-eMMC product families are purpose-built for harsh operating environments. Certified to the AEC-Q100 standard, this product lineup features wide-temperature tolerance, high reliability, and superior data integrity to meet storage needs in autonomous driving systems.Ecosystem Synergy: A Call for Industry CollaborationWallace emphasized that the future of AI storage requires deeper industry collaboration and urged stakeholders across the value chain to join forces to address the potential storage chip shortages forecasted for 2026. He noted that demand will surge due to the rise of AI inference devices, the popularization of TB-level storage in smartphones, and explosive growth in IoT terminals, while production capacity remains insufficient.Despite global uncertainties tied to geopolitics and tariffs, the structural demand for storage driven by AI remains unchanged. Wallace predicted 2026 will mark an inflection point for AI inference and edge AI, and Silicon Motion is well-positioned to seize this new growth cycle."From GPU Direct Storage to DPU architectures, from cloud to edge, no single company can achieve product innovation alone," Wallace said. "Silicon Motion will continue deep collaboration with NVIDIA, cloud service providers, and OEM/ODM partners to jointly build a thriving AI storage ecosystem."Award Recognition: "Outstanding Controller Technology Innovation Award"At its booth, Silicon Motion also showcased its latest-generation products, including SM2508, SM2504XT, SM2708, SM2324, SM2264XT-AT, and SM2268XT2-AT, as well as cutting-edge technology platforms such as MonTitan, FDP (Flexible Data Placement), PerformaShape, Ferri-SSD, Ferri-UFS, and Ferri-eMMC. SMI highlighted the value these solutions deliver to downstream device development, technological innovation, and industry applications.At its booth, Silicon Motion also showcased its latest-generation products. Credit:GMIFIt's worth noting that GMIF2025 had recognized the outstanding enterprises, innovative technologies, state-of-the-art solutions in the storage and memory sector over the past year, and the award list was concurrently released.Silicon Motion received the "Outstanding Controller Technology Innovation Award" in recognition of its leadership and innovation in controller technologies.According to the judging panel, Silicon Motion has demonstrated forward-looking technical deployment by being among the first to launch high-performance PCIe Gen5 SSD controllers. The company has also achieved continuous breakthroughs in key areas such as low-power architecture, firmware algorithm optimization, and AI acceleration solutions, significantly enhancing the performance, efficiency, and reliability of memory products. Its innovative solutions are widely deployed in PCs, portable devices, and enterprise markets, providing strong technical support for global ecosystem partners.Silicon Motion stated that the award reflects high recognition of the company's long-term R&D commitment and innovation strength. Looking ahead, the company will continue to explore frontier technologies and expand the boundaries of storage with more advanced and reliable controller products to empower the digital era.SMI Honored with"Outstanding Controller Technology Innovation Award". Credit:GMIFFrom cloud to edge, AI is reshaping the value map of storage and memory and remodeling the innovation dimensions of controllers. The insights shared by Wallace at GMIF2025 were beyond a technological vision and more of an open invitation to industry co-creation. As the world races into the Zettabyte era, industry progress will be collective-or not at all.Silicon Motion's achievements are demonstrated through the extreme performance of PCIe Gen6, large-scale deployment of Gen5, and stringent automotive-grade reliability, proving that controllers can act as the "invisible engine" driving leaps in AI computing power. Being honored with the "Outstanding Controller Technology Innovation Award" makes that dedication visible to the industry and trusted by partners. The storage landscape in 2026 will be a battleground of demand and supply, but only synergy across chips, systems, cloud, edge, and devices can turn scarcity into shared opportunity.By refining controllers into the key that unlocks innovation and scale, performance and efficiency, present and future, Silicon Motion is ready for the next leap-together with its ecosystem partners-to open the next door of AI storage and memory, where every byte of throughput becomes a step forward for intelligent computing.

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even with continuous improvements in processor performance, if data cannot be delivered in real time, overall system efficiency remains limited.To overcome this bottleneck, Die-to-Die high-speed interconnect and HBM4/PHY IP integration have emerged as critical technologies for next-generation AI and HPC chip designs.Progate Group Corporation(PGC), a member of the TSMC Design Center Alliance (DCA), leverages its ASIC turnkey expertise and participation in the Synopsys IP OEM Program to deliver advanced design capabilities comparable to leading international players-while offering a more cost-effective, high-value service model that helps global customers accelerate AI and HPC deployment and mass production.Technical Highlights: Comprehensive Support from Design to ProductionPGC provides one-stop technical services, supporting clients from chip design to production. The coverage includes high-speed interconnects, memory integration, foundry certifications, and AI/HPC application-oriented designs, helping clients shorten time-to-market efficiently.Die-to-Die Interconnect and Chiplet ArchitecturePGC offers advanced expertise in Die-to-Die interconnect and Chiplet-based system design, supporting 2.5D and 3D integration technologies to enable high-speed, low-latency, and low-power chip-to-chip communication. All solutions are compliant with the Universal Chiplet Interconnect Express (UCIe) standard, ensuring interoperability and scalability across heterogeneous and cross-supply-chain environments.This capability addresses the growing demand for high-bandwidth and flexible multi-die integration, empowering customers to build next-generation Chiplet-based systems with enhanced performance and modularity.HBM4 / PHY IP IntegrationLeveraging Synopsys-certified IP, PGC enables rapid integration of HBM4 memory and PHY interfaces to shorten design cycles while strengthening design reliability. These high-bandwidth memory solutions help design teams overcome data transfer bottlenecks and achieve terabyte-per-second (TB/s) throughput, meeting the stringent performance requirements of AI and high-performance computing (HPC) applications.TSMC DCA Certification AdvantageAs a certified member of TSMC's Design Center Alliance (DCA), PGC provides end-to-end design-to-tape-out support within the TSMC's ecosystem. Customers can leverage TSMC's CyberShuttle multi-project wafer (MPW) program to conduct rapid prototyping and design validation, followed by seamless transition to mass production through PGC's ASIC turnkey services. All designs are fully compatible with advanced packaging technologies such as Wafer-on-Wafer (WoW) and 2.5D/3D integration architectures within major foundry ecosystems, ensuring a smooth and efficient path from prototype to production.AI / HPC Application FocusPGC's dedicated ASIC designs are optimized for AI and high-performance computing (HPC) applications, spanning AI accelerators, data center chips, and high-speed network switch devices. These designs support AI training, HPC simulation, and large-scale data processing workloads, meeting the performance, power, and scalability requirements of next-generation computing environments.Ecosystem IntegrationPGC's services are closely aligned with TSMC's advanced foundry ecosystem, combined with Synopsys-certified EDA and IP solutions, to deliver a complete ASIC turnkey flow covering: High-speed interface IP - ASIC design service - process support - packaging service - verification - testing - mass production.In addition to its own testing equipment and validation capabilities, PGC maintains long-term partnerships with multiple advanced test houses, enabling precise analysis for high-frequency, high-speed interface and advanced-node devices.This level of integration significantly reduces design risk and accelerates time-to-market, while ensuring that the design results are fully compatible with mainstream advanced packaging technologies - such as 2.5D/3D integration and wafer-on-wafer architectures within major foundry ecosystems - as well as international standards including UCIe.PGC delivers high reliability, low risk, and accelerated time-to-production through its comprehensive ASIC turnkey services, allowing customers to focus on differentiated design and market innovation. By leveraging its proven engineering expertise and established partnerships across the semiconductor supply chain, PGC helps customers reduce overall design and ASIC development costs, enhance design success rates, and improve product stability.In addition, PGC provides cross-regional engineering and project management support spanning Taiwan, Japan, China, and the United States - empowering global deployment strategies for AI and HPC applications with consistent quality and technical alignment.PGC provides complete ASIC turnkey services supporting 2.5D/3D advanced packaging technologies.Credit:PGC

As the global energy transition accelerates, AI applications are also rapidly expanding. From data centers and electric vehicle charging infrastructure to home backup power, demand for power supplies and energy storage is growing exponentially. Balancing high power output, energy efficiency, and intelligent management has become a shared challenge for the industry.Credit: MEAN WELLAt the 2025 Energy Taiwan and Net-Zero Taiwan, global standard power supply leader MEAN WELL, together with distributor partner Union Industrial Automation CORP., showcased a range of standardized power products. Based on real-world application needs, they integrated solar panels, lead-acid batteries, and other supporting equipment, combining inverters, chargers, bidirectional power supplies, and smart control modules into a total solution, highlighting MEAN WELL's product advantages as well as its localized, real-time service value.The NTN-5K off-grid inverter exhibited at the show integrates three key functions - charger, inverter, and UPS - into a single device, offering charging power exceeding 4kW and a peak instantaneous output up to 10kW. It can simultaneously handle AC charging, DC-AC inversion, and an uninterrupted power supply. Its applications range from homes and small commercial spaces to outdoor operations, and it can even serve as a temporary emergency power source for electric vehicles. With multiple protection mechanisms and conformal coating treatments, it ensures stable operation under harsh conditions. It also supports MODBus, CANBus, and other communication protocols, allowing users to remotely monitor and manage systems.Another featured product, the BIC-2200 bidirectional power supply, enhances energy usage efficiency. In traditional battery testing, discharge energy is often lost as heat. The BIC-2200, however, can feed this energy back into the grid with a conversion efficiency up to 93%, switching between charge and discharge in less than 1 millisecond. This reduces energy waste while enabling peak shaving, valley filling, and kinetic energy recovery, minimizing downtime risks caused by voltage surges. Its high-efficiency bidirectional conversion mechanism also makes it well-suited for the home energy storage market. Already implemented in European household energy storage cases, it demonstrates strong international market potential.Beyond industrial and process applications, MEAN WELL also introduced the ES-S1000 and ES-S2000 portable energy storage units for consumer use, with approximate capacities of 1kWh and 2kWh, respectively. Targeting home backup and outdoor leisure scenarios, these units support multiple charging modes, including grid, car, and solar charging, and provide AC outlets as well as USB Type-A and Type-C ports. Coupled with an intelligent battery management system, they offer protection against overcharge, over-discharge, short circuits, and high temperatures. Emphasizing "lightweight, plug-and-play" usability, they provide users with rapid access to power during outages or outdoor activities.To maximize system-level benefits, integrating key components requires technical service support. Willard Wu, Senior Engineer at MEAN WELL Technical Service Center, noted that the PV-ML solar controller showcased at the exhibition uses MPPT (Maximum Power Point Tracking) technology to automatically adjust output under varying sunlight conditions, improving battery charging efficiency by 20 - 30%. Supporting 12V - 48V battery systems, it offers broad applicability. When paired with NTN-5K or BIC-2200, it helps build a complete photovoltaic energy storage system, forming a critical part of smart energy solutions.In addition to standardized products, Union Industrial Automation CORP. Showcased an integrated setup of MEAN WELL inverters, chargers, bidirectional power supplies, and control modules at the exhibition. By combining these with third-party solar panels and lead-acid batteries, they created a display simulating a solar power plant, enabling visitors to quickly understand how MEAN WELL products work together in practical applications, forming a complete system of "energy generation, storage, inversion, and intelligent management."Tony Hsieh, Section Manager at MEAN WELL Technical Service Center, emphasized that these products, combined with localized technical support strategies, showcase MEAN WELL's differentiated solutions. Standardized products paired with local demonstration sites, allow users across industries to quickly understand applications and integrate them into existing systems. With globally certified products and localized distributor services, MEAN WELL meets international market demands while providing timely support. Furthermore, by focusing R&D on power and control products and leaving integration of batteries, solar panels, and supporting equipment to partners, the company enhances operational flexibility and promotes energy industry collaboration through "multi-party cooperation."Looking ahead, MEAN WELL is optimistic about AI and smart technology trends. Hsieh noted that AI applications are rapidly expanding into smart homes, wearable devices, industrial automation, and large-scale data centers, creating higher demands on power supply. MEAN WELL's diverse product lines can simultaneously support high-performance servers and edge AI devices, offering core advantages such as high efficiency, reliability, low power consumption, and compliance with safety standards, meeting the market's demands. Moving forward, MEAN WELL will continue investing in high-power-density design and digital power management while integrating renewable energy, energy storage, and DC microgrids. Through one-stop power solutions, MEAN WELL aims to accelerate AI adoption and advance both intelligent and sustainable development.Credit: MEAN WELLCredit: MEAN WELL

Chenbro, a leading server chassis manufacturer, makes a strong presence at the 2025 OCP Global Summit from October 13 to 16 in San Jose, USA. Aligning with this year's theme, "Leading the Future of AI," Chenbro highlights three key business models: OTS (Off-The-Shelf), JDM (Joint Design Manufacturing), and OEM Plus services. Chenbro showcases strong capabilities from product design and mechatronic integration to global manufacturing, helping clients efficiently deploy AI and cloud server solutions and drive innovation in AI data centers.CEO Corona Chen led the Chenbro team to engage deeply with industry leaders. Credit:ChenbroThree Service Models Showcasing Design, Manufacturing, and Customization StrengthsAt this years summit, Chenbro highlights its customer-centric strengths through integrated R&D and manufacturing to accelerate the deployment of next-generation computing platforms and support the rapidly growing AI and cloud markets:OTS, with the slogan "Whatever's Inside, Chenbro Outside" offers flexible and customizable server chassis solutions that enable quick selection and deployment via product roadmap, demonstrating Chenbro’s leadership in product design compatibility and adaptability.JDM, embodying the philosophy "Agile R&D, Infinite Creation" focuses on agile development through global R&D deployment and the Joint Product Design Process (JPDP), while enhancing Design for Manufacturing (DFM) and validation services to deliver reliable, customized solutions.OEM Plus, under the motto "Manufacturing Glocalization" promotes global manufacturing localization through its G-LCIM (Green, Low-Cost, Intelligent Manufacturing) implementation. This strategy enables the establishment of an efficient, flexible production system that ensures high quality and consistent delivery.Chenbro CEO Corona Chen stated that amid the rapidly changing global industrial landscape, the company remains committed to its core strategy "Where our customers are, Chenbro is." Chenbro is actively advancing the localization of its global operations to enhance supply chain flexibility and operational resilience. The company's U.S. NCT facility is scheduled to officially commence operations in the fourth quarter, supporting local customers with front-end design and prototyping services. Meanwhile, its Malaysia mass-production plant is set to begin operations in the first half of next year, alongside ongoing plans for land acquisition and facility construction in Texas for another mass-production site. Looking ahead, Chenbro will continue to integrate automation and AI applications into its manufacturing processes to achieve lean and intelligent production, further strengthening its resilient global operations network.Connecting the OCP Ecosystem with Win-Win Collaboration to Shape the AI FutureAt this year's OCP event, Chenbro presented a comprehensive lineup of innovative products, including modular chassis designed for the OCP DC-MHS architecture, NVIDIA MGX architecture, and-making their debut-customized rack solutions. Together, these exhibits highlight Chenbro's capability to simplify system integration, enhance deployment flexibility, and empower customers to build the next-generation AI infrastructure.OCP DC-MHS Solutions: Chenbro showcased its DC-MHS-compatible designs, underscoring strong support for new-generation CPU platforms and expanding applications for AI inference workloads.GB300 & MGX Platforms: The GB300 system is engineered for large-scale AI model training, while the MGX 4U CX8 targets training and inference for small to medium AI models-demonstrating Chenbro's comprehensive coverage across AI computing demands.Customized Rack Solutions: Beginning this year, Chenbro has expanded into the rack solution business, and at OCP unveiled its first concept rack that supports interchangeable OCP 21-inch and EIA 19-inch standards. Integrated with Chenbro's MGX and DC-MHS chassis, the display reflected the company's growing strength in providing complete mechanical system solutions.In addition, Chenbro featured multiple AI and cloud server systems co-developed with global customers. Through these collaborations, Chenbro has solidified its role as a key enabler in the global transformation toward AI and cloud computing.Chenbro Makes a Major Debut at 2025 OCP Global Summit. Credit:ChenbroThe OCP Global Summit remains a vital platform for innovation and collaboration. CEO Corona Chen led the Chenbro team to engage deeply with industry leaders such as NVIDIA, AMD, Intel, and major CSPs. Chenbro has evolved into a strategic partner with product definition capabilities, directly connecting with global cloud and AI customers while collaborating with ODMs and system integrators to meet market demands. This comprehensive market and design insight accelerates product development and promotes AI application innovation.For more information, please visit.

Taiwan, long recognized as a global leader in semiconductors, is rapidly positioning itself as the "next frontier" for the space economy. With its strategic geographic location, world-class manufacturing base, and advanced technology ecosystem, Taiwan is attracting innovative SpaceTech startups from around the globe. These companies view Taiwan not only as a gateway to Asia but also as a critical partner in developing next-generation aerospace technologies.Credit: TAcc++Through the International SpaceTech Startup Supporting Program, organized by the Small and Medium Enterprise Administration (SMESA), Ministry of Economic Affairs, startups specializing in AI-driven satellite platforms, geospatial intelligence, Earth observation, and advanced space applications are forging new alliances, tapping into Taiwan's supply chains, and exploring joint R&D opportunities. Their visits underscore Taiwan's growing role as an indispensable hub for international collaboration in the space sector.SkyServe: AI Edge Computing for Smarter SatellitesIndia-based SkyServe is building cutting-edge onboard AI and edge-computing platforms that transforms satellites into "smart" systems capable of conducting real-time analytics in orbit. By embedding AI directly into satellite hardware, SkyServe enables faster, more efficient decision-making by processing satellite data directly onboard and reducing the latency of deriving insights from space. This capability has broad applications, ranging from maritime logistics and agriculture monitoring to disaster management and environmental observation.During its participation in the International SpaceTech Startup Supporting Program, the company set clear objectives for its Taiwan engagement: exploring strategic partnerships with local manufacturers, assessing Taiwan's semiconductor and electronics industries as supply chain partners, and exchanging expertise to co-develop advanced hardware and software for complex AI workloads in space. Taiwan's strengths in chipmaking and system integration align well with SkyServe's roadmap for next-generation intelligent space platforms.SkyServe has already signed multiple Memoranda of Understanding (MOUs) during the Taiwan Aerospace and Defense Technology Exhibition (TADTE), underscoring its commitment to long-term collaboration. Looking ahead, the company envisions building an interoperable system that connects both aerial and space platforms, enabling drones and satellites to collectively generate actionable insights. By deepening ties with Taiwan’s ecosystem, SkyServe is positioning itself as a global leader in AI-driven aerospace solutions.Marble Imaging: Earth Observation Data for Resilient FuturesMarble Imaging, a European startup specializing in Earth Observation data and AI analytics, is expanding its presence in Asia through new partnerships in Taiwan. The company leverages high-resolution satellite imagery and advanced analytics to deliver actionable insights for governments and industries, particularly in areas such as environmental monitoring, renewable energy, and disaster response. Its solutions provide low-cost, scalable ways to visualize infrastructure, assess risks, and support data-driven decision-making.While in Taiwan, Marble Imaging demonstrated how its technology could play a pivotal role in disaster management. The team personally experienced an earthquake during their visit, highlighting how satellite imagery can help assess affected areas quickly and provide situational awareness to local rescue units. Another case study presented was the monitoring of solar farm growth in southern Taiwan, particularly around Kaohsiung. By using satellite data, the company can map solar installations, estimate power production, and offer oversight tools to government agencies tasked with energy planning.Marble Imaging is already progressing toward formal partnerships. It is preparing to sign an MOU with the Intelligent Maritime Research Center at National Taiwan Ocean University, while also pursuing discussions with Foxconn to integrate its data-driven services with Taiwan's industrial capabilities. By combining Earth Observation data with Taiwan's vibrant SpaceTech ecosystem, Marble Imaging is helping to create more sustainable and resilient futures.Amelia Space Technologies: Geospatial AI for Sustainable GrowthAmelia Space Technologies, a company specializing in geospatial AI, is advancing its mission to transform satellite and multisource data into actionable intelligence. Its core platform leverages AI-driven analytics to generate insights that support environmental monitoring, water management, and circular economy initiatives. Amelia emphasized the importance of building long-term relationships in Taiwan to lay the groundwork for sustainable collaboration.The company sees great synergy between its software-driven business model and Taiwan's hardware-focused industry, particularly in chipmaking and sensor technologies. This complementary relationship could open opportunities for co-developing end-to-end solutions that integrate advanced hardware with AI-powered geospatial analysis. Amelia's current go-to-market strategy is already being tested in the United Kingdom, where its platform helps a government environmental agency address harmful algal blooms. By identifying intervention priority areas, the system reduces ecological harm and converts waste into valuable resources.Looking ahead, Amelia aims to expand into new domains, including maritime intelligence, smart agriculture, and water resource management. Taiwan's robust manufacturing ecosystem provides the hardware foundation that, when paired with Amelia, could create scalable global solutions. By engaging with local industry leaders through the International SpaceTech Startup Supporting Program, Amelia is positioning itself as a strategic partner for Taiwan in the next wave of sustainable space applications.Insight360.ai: Defense Intelligence for the Indo-PacificIndia-based Insight360.ai is a defense intelligence startup that combines AI and satellite monitoring to deliver advanced situational awareness across the Indo-Pacific region. Founded only two years ago, the company has rapidly developed its Unified Intelligence Platform, which integrates optical and SAR satellite imagery, hyperspectral data, AIS ship-tracking signals, and radio frequencies. This powerful fusion of data provides real-time alerts and predictive intelligence to defense and security agencies, enhancing their ability to respond to emerging threats.During its engagement in the International SpaceTech Startup Supporting Program, Insight360.ai highlighted the strategic relevance of Taiwan as a partner, citing shared geopolitical challenges and regional security needs. The company has already been working closely with the Indian Armed Forces, refining its platform for operational use. By expanding to Taiwan, Insight360.ai intends to collaborate with aerospace firms and defense stakeholders to adapt its solutions for local requirements.Its go-to-market approach centers on direct engagement with defense agencies and forming partnerships with aerospace companies for integrated solutions. With Taiwan's advanced technology ecosystem and growing defense innovation landscape, Insight360.ai sees an opportunity to jointly enhance security resilience in the region. This collaboration underscores the vital role of space-based intelligence in the evolving defense strategies of the Indo-Pacific.Sternula A/S: Maritime Connectivity through AIS 2.0 (VDES)Denmark's Sternula A/S, a leader in satellite-based maritime communication, is expanding into Taiwan to accelerate deployment of AIS 2.0 also known as a VHF Data Exchange System (VDES), a next-generation connectivity technology for the maritime industry. AIS 2.0 combines VDES, enabling higher data rates than traditional AIS, and MMS, which securely routes data via VDE-TER, VDE-SAT, or IP using digital signatures through the Maritime Connectivity Platform (MCP).This technology supports services like S-124 Navigational Warnings, where Sternula's MMS Proxy (Ship and Shore) focusing on the safety of seafarers through enhanced maritime communicationThrough the International SpaceTech Startup Supporting Program, Sternula formalized its Taiwan partnerships by signing two Memoranda of Understanding.The first, with National Taiwan Ocean University, builds on an existing collaboration to advance the development of VDES applications for Taiwan's maritime industry. The second, with Taiwanese firm VIVANTEX, explores a representation role to support Sternula's long-term business presence in Taiwan.Sternula also used its time in Taiwan to expand international connections, engaging with companies and institutions from India, South Korea, New Zealand, and the UK. This global network is designed to support market expansion and strengthen interoperability of VDES technologies worldwide. By aligning with Taiwan's strong maritime technology ecosystem, Sternula is contributing to the modernization of regional maritime communication and reinforcing Taiwan's role as a strategic partner in global shipping innovation.Slingshot Aerospace: Building Taiwan as a Regional HubUS-based Slingshot Aerospace is scaling its Asia-Pacific footprint by establishing a registered business in Taiwan and hiring local staff to support its expansion. The company delivers integrated hardware and software solutions designed to enhance situational awareness and Space Situation Awareness (SSA) and Space Domain Awareness (SDA) . By choosing Taiwan as its regional base, Slingshot aims to address both the Asia-Pacific and Southeast Asian markets more effectively.During the program, Slingshot chose not to sign formal MOUs, instead prioritizing relationship-building with Taiwanese businesses and research institutions. The company highlighted the competitive advantages of sourcing hardware from Taiwan's supply chains and expressed interest in working with startups offering technologies adjacent to Taiwan's semiconductor industry.Slingshot Aerospace has officially entered the Taiwan market through the International SpaceTech Startup Supporting Program, organized by the Ministry of Economic Affairs (MOEA), and has opened a Taiwan office to strengthen collaboration with local industry, academia, and government partners. This new office demonstrates Slingshot's commitment to investing in Taiwan's innovation ecosystem and building long-term partnerships that advance space technology development.Looking forward, Slingshot plans to collaborate with the Taiwan Space Agency (TASA) and local businesses to strengthen Taiwan's leadership in the regional space economy. Its long-term goal is twofold: expand its own business footprint while simultaneously helping Taiwan emerge as a hub for space innovation. By anchoring its Asia-Pacific operations in Taiwan, Slingshot underscores the island's growing reputation as a launchpad for international SpaceTech ventures.ECOTEN urban comfort: Urban Climate Resilience for Smart CitiesECOTEN urban comfort, a Czech startup, is addressing one of the most urgent urban challenges-extreme heat-by integrating space-based data with microclimate analytics to help cities become more resilient. The company's name combines "eco" for ecological services with "Ten" derived from founder Tencar's surname. Its mission is to deliver science-based tools that enable municipalities to design smarter and more sustainable urban spaces.During its participation in the International SpaceTech Startup Supporting Program, ECOTEN urban comfort met with government and academic stakeholders, including the Taipei City Government, which maintains a sister-city relationship with Prague City Hall. The company emphasized that while its work is not directly tied to manufacturing, it complements Taiwan's smart city initiatives and its drive to address natural hazards and climate-related risks.ECOTEN urban comfort has already executed projects in European cities such as Vienna, Prague, and Helsinki, as well as for a private client in Las Vegas. It is currently working with the Prague Real Estate Development Agency (PDS) to strengthen heat resilience and ensure high outdoor thermal comfort in newly developed residential neighborhoods. In Asia-Pacific, the startup is actively pursuing opportunities in Taiwan, Japan, Thailand, and Hong Kong.Taiwan's hot and humid climate, combined with its proactive urban innovation agenda, makes it an ideal candidate for ECOTEN urban comfort's first case study in Asia. The company hopes to build long-term partnerships that integrate climate resilience into Taiwan's smart city development.ResearchSat: Microgravity Research for New FrontiersAustralian startup ResearchSat is pioneering new frontiers in research and manufacturing by harnessing the unique conditions of microgravity. Its proprietary Space Bioreactors and specialized satellite platforms enable groundbreaking experiments across industries such as pharmaceuticals, semiconductors, agriculture, and space biology-areas where space-based research can generate insights unattainable on Earth.The company successfully completed its first mission in 2022, launching yeast samples into orbit and generating valuable biological data. Building on this success, ResearchSat plans to conduct missions every two years, with the next scheduled for 2026, sending 150 samples into space. The company is also extending opportunities to Taiwanese researchers, offering participation in its missions at an accessible cost of approximately NT$75,000 per 0.5 ml sample.ResearchSat intends to establish a subsidiary in Taiwan to strengthen collaboration with local research institutions and organizations such as the Taiwan Space Agency (TASA). By leveraging Taiwan's advanced supply chain and growing national space program, the company aims to expand its microgravity research services while embedding itself in the island's innovation ecosystem. This partnership could accelerate the development of advanced materials and biomedical breakthroughs, reinforcing Taiwan's role in the global space economy.Taiwan: A Global Partner in SpaceTechTaiwan is rapidly solidifying its role in the global space economy. Its strengths in semiconductors, electronics, and advanced manufacturing provide a unique foundation for next-generation aerospace innovation. The international startups participating in the International SpaceTech Startup Supporting Program are not simply seeking market entry-they are seeking partnership.With Taiwan’s expertise in hardware, its vibrant technology ecosystem, and its strategic regional location, the island has become an indispensable partner in shaping the future of SpaceTech. This collaborative spirit ensures Taiwan is not only a regional hub but also a vital global player in the new space era.Sep. 9 - Taiwan Space Agency (TASA) visit. Deputy DG Vicky Chu (TASA, row 1 fourth from right).DG GJ Lee (SMESA), Deputy DG Vicky Chu (TASA), and Dr. Lewis Chen (ITRI CIS) attended with TAcc+.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded recently in Shenzhen. Under the theme "AI Applications, Innovation Empowered", the GMIF2025 of the year brought together leading representatives across the global memory industry chain to engage in in-depth discussions on compute-storage convergence, AI deployment, and ecosystem collaboration, exploring pathways for innovation and development in the AI-driven memory era.The Fourth GMIF2025 Innovation Summit was successfully concluded recently in Shenzhen. Credit:GMIFIn addition to a lineup of insightful keynote sessions, the summit offered diversified formats such as exhibitions, annual awards, and global live broadcast of memory brands, serving as an integrated platform featuring technical exchanges, innovation showcases, brand promotion, and industry collaboration, offering a panoramic view of emerging trends and practical applications in the memory field.At the very beginning, Rixin Sun, President of Shenzhen Memory Industry Association (SMIA), signified that with the rapid proliferation of AI technologies on the edge side in 2025, the memory and storage industry are stepping into the spotlight. The industry growth mode is shifting into a new structural phase characterized by high performance, high efficiency, and system collaboration. Since its inception, GMIF has upheld the vision of "connecting the memory ecosystem and fostering industry win-win collaboration," aiming to unite global industry forces, drive cross-sector cooperation, and accelerate the integration of China’s memory sector into the global landscape.Credit: GMIFMarket Shift: AI Drives Memory Industry into a New Growth CycleThe global memory market is entering a new phase of structural growth driven by AI technologies. According to Xiaomin Han, General Manager of Consulting Services from JWinsights, the ongoing expansion of use cases in smartphones, data centers, and NEVs is unlocking a fresh round of growth for the storage industry. Challenges in advanced chip supply within the domestic industry chain have not diminished the strong investment momentum of internet companies, and it's predicted to achieve large-scale commercialization by 2027, which will propel a new value upgrade of storage products.Meanwhile, the scale and structure of data are undergoing profound changes. Maya Zhang, Product Marketing Director from Sandisk, shared that the global total data volume will reach 200ZB by 2025, among which 80% of the total is unstructured data. The increasing demand for real-time data is propelling the memory architecture evolving toward compute-storage convergence. Sandisk has achieved a 33% power reduction through technical innovation and plans to advance capacity from 400TB to 800TB.The popularization of AI applications has driven a multi-level leap in storage demands. Wallace C. Kou, CEO of Silicon Motion Technology Corporation, noted that the shift toward compute-storage convergence is accelerating the leap in storage configurations from TB to PB/EB levels. Individual servers now require over 200TB, and use cases are expanding quickly from cloud environments to edge terminals like AI PCs and intelligent vehicles. Silicon Motion is enhancing its collaboration across the industrial chain and participating in interface standardization to develop next-generation high-performance storage solutions.The market is poised for substantial expansion. Zining Wu, Founder and Chairman of InnoGrit Corporation, stated that global data volume is projected to hit 1,000 ZB by 2030, with AI-related storage expected to represent about two-thirds of the total. This surge in demand is set to grow the enterprise SSD market from USD 23.4 billion in 2024 to USD 49 billion in 2028. To support rising GPU computing requirements, the industry is targeting a jump in AI SSD IOPS from the millions to the hundreds of millions by 2027, marking a transformative memory performance breakthrough.Technological Breakthroughs: Architectural Innovation Accelerates Industry UpgradesThe rapid advancement of AI technology poses unprecedented challenges to storage systems, prompting industry players to seek breakthroughs at the architectural level.Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics, highlighted that AI agent characterized by autonomous decision-making capability is evolving, so traditional storage architectures face challenges in terms of bandwidth, power consumption, and latency. To address this, Samsung is mass-producing 24Gb GDDR7, expanding its CXL 3.1 ecosystem, and planning PCIe Gen6 SSD launches, introducing a new category of "storage-class memory (SCM)" aimed at reducing AI inference latency.Credit: GMIFEdge computing is emerging as a new innovation focus. Matt Bromage, Head of Global Storage Business from Arm, projected that 70% of AI inference workloads will soon be processed at the edge, promoting the growth of "ambient intelligence." Arm is advancing technologies such as near-data computing and Chiplet integration, leveraging customized designs to achieve performance improvements of up to 1,000 times.Benny Ni, GAR Sales VP from Solidigm, stressed that AI development is increasingly focused on real-world applications. Solidigm has launched 122GB QLC high-capacity products and liquid-cooled SSDs to meet the dual requirements for performance and energy efficiency of edge computing.On the ecosystem side, Haibing Xie, Director, Application Design in Center, Intel China, introduced an open ecosystem supporting over 900 large AI models, which helps promote AI PC adoption through hardware-software synergy. Xiaobing Wang, Director of Customer Projects from MediaTek, pointed out that the explosive demands for edge AI computing bring thermal and bandwidth challenges, and MediaTek is optimizing system performance through advanced packaging, new process technologies, and architectural innovations.Prof. Guangyu Sun from Peking University's School of Integrated Circuits stressed that it's necessary to balance storage costs and computing efficiency through path optimization and dynamic resource management. With the practical deployment of advanced packaging, collaborative innovation between storage and compute systems becomes increasingly critical, and attention shall be especially shifted into heterogeneous integration, in order to achieve large-scale commercial applications.Industry Collaboration: Building a Secure and Self-Reliant Memory EcosystemAmid AI-driven transformation, domestic enterprises are accelerating ecosystem development through technological innovation and collaboration.Credit: GMIFBIWIN is making concrete efforts to land its Integrated Solution and Manufacturing (ISM) strategy, specifically covering independent controller design, solution R&D and advanced packaging and testing capabilities. Han He, CEO of BIWIN, claimed that the company is committed to transitioning from a traditional module manufacturer to an AI solution provider. Supported by its ODM services, customized solutions and compute-storage integration capability, BIWIN will inject new energy into the memory industry.Maxio Technology is taking active steps to scale up production of new products while facing new requirements for performance, intelligence and energy efficiency enhancement. Guoyang Li, General Manager of Maxio Technology, underlined that Maxio remains steadfast in its vision as "One Chip, One Ecosystem, One Future", strengthening industrial chain cooperation to inject new impetus into the development of the storage industryIn underlying technology area, Montage Technology continues to pioneer CXL-based solutions. Shawn Xiao, Director of Ecosystem Partnerships and Field Applications, shared that its memory expansion solution is able to support 95-99% local DRAM throughput with 24%+ TCO savings in data center applications. In AI inference scenario, its single CPU performance can compete with dual-CPU configuration, effectively breaking the limits of "memory wall."Ming Zhao, General Manager of OKN Technology, expressed that as AI memory raises its demands for reliability, the company offers wide-temperature testing solutions ranging from -70�J to 150�J, capable of enhancing testing efficiency by 80%. At the same time, OKN is making forward-looking arrangements for the testing of high-speed interfaces such as PCIe 6.0. Its "equipment +service" business model underpins OKN to support the R&D and mass production demands of the memory industry.Tailored for AI semiconductor market demands, Lucas Lu, Director of R&D Department from GreaTech Substrates, showed that the company is capable of processing ultra-thin substrates with a thickness of 70 μm and line width/spacing of 10/15 μm. It can mass-produce 110×110 mm, 26-layer high-performance FCBGA substrates to meet differentiated demands on both the compute and storage ends. With six smart manufacturing bases in place, the company provides end-to-end substrate solutions for the AI era.Applications Deployment: Accelerating Adoption Across Vertical IndustriesAs AI technologies evolve, the application of memory solutions across industries is the crucial key to promoting industry revolutions.Credit: GMIFIn automotive manufacturing sector, Xuewen Chen, Chief AI Scientist from GAC Group, indicated that AI is expanding far beyond its single application in autonomous driving, while strengthening its presence in reshaping the whole industry value chain from R&D and manufacturing to terminal products. By improving R&D efficiency, enhancing manufacturing flexibility, and enabling autonomous decision-making in vehicles, AI is driving the automotive industry toward a fully intelligent transformation.In terms of the IT sector, Cheng Zhu, Product Director at China Greatwall, said that the company has established a full-spectrum product lineup compatible with domestic technology routes including Phytium, Hygon, and Kunpeng, offering end-to-end solutions from general servers to AI servers. With a four-layer security architecture in place, China Greatwall is deeply involved in key national IT projects, showcasing solid execution in government and mission-critical sectors.Regarding artificial intelligence applications, Shang Shang, General Manager of the Information Security from iFLYTEK, introduced that the Spark Large Model is the first nationwide open model in China trained on a domestically developed compute-storage platform. Through technical optimization, it delivers performance comparable to trillion-parameter foreign models with just 70 billion parameters. Notably, innovation efforts have increased the utilization rate of Huawei's Ascend 910B accelerator cards from below 30% to 95%, significantly boosting training efficiency on domestic platforms.These successful cases showcased a clear transition in AI technologies from research pilots to broad commercial rollout, providing solid support for digital transformation across industries. AI storage and memory solutions will become central to a growing range of scenarios in the acceleration of intelligent transformation as technology matures and ecosystem perfects.Solutions Showcase: Industry Leaders Demonstrate Collective StrengthBeyond keynote sessions, GMIF2025 featured product exhibitions, global live broadcast of memory brands, and the annual awards ceremony, fostering diversified collaboration within the semiconductor memory ecosystem.Over 20 leading enterprises showcased cutting-edge technologies. Highlights included Sandisk's high-performance consumer products based on 218-layer BiCS8 NAND, Solidigm's enterprise QLC SSDs with liquid-cooled solutions engineered for AI and cloud computing, Kioxia's all-scenario products such as ultra-large 245.76TB enterprise SSD based on BiCS FLASH, and Intel's Core Ultra and Xeon 6 processors with integrated NPU capabilities.Silicon Motion presented its SM2504XT controller for AI PCs; InnoGrit unveiled PCIe 5.0/Gen6 SSDs and RISC-V-based controllers; BIWIN displayed its full range of embedded and industrial storage products under its Integrated Solution and Manufacturing strategy; and Maxio Technology demonstrated comprehensive controller solutions for all scenarios.Exhibitors such as NAURA, Montage Technology, TOPDISK, OKN Technology, KingSpec, Hemei Jingyi, Silergy, and others displayed core equipment, testing systems, and chip modules, highlighting the collective strength of the global memory supply chain.The exhibition received strong industry acclaim for providing both technological insight and business collaboration opportunities.The GMIF2025 Annual Awards were announced concurrently at the summit. 37 sub-awards have been established in five major categories, namely Industry Contribution Award, Technological Innovation Award, Terminal Application Award, Market Service Award, and Intelligent Equipment Award. Leading companies at home and abroad, including YMTC, CXMT, Kioxia, Samsung Semiconductor, Sandisk, Silicon Motion, Solidigm, Maxio, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage, iFLYTEK, GreaTech Substrates, Loongson, LKAUTO, Heyan Technology, TOPDISK, KingSpec, POWEV, Microview, Maxwell Technologies, Silergy, Skyverse, AMIES Technology, Hemei Jingyi, Tytantest, Attach Point Intelligent Equipment, OKN Technology, Quanxing Technology, Greater Bay Advanced Technology, XING YUN, Yanxin Microelectronics, and UNIMOS, received honors, showcasing innovative vitality in the global memory industry.The "Bay Area Night" session following the award ceremony provided a relaxing networking platform for attendees to engage in meaningful exchanges. The event also featured a global live broadcast of memory brands, during which BIWIN Storage, Silicon Motion, InnoGrit Corporation, POWEV, KingSpec, Quanxing, Silergy, and OKN Technology shared forward-looking insights into storage technologies and AI application prospects.The GMIF2025 Innovation Summit (Global Memory Innovation Forum) provided a panoramic view of technological breakthroughs and ecosystem innovation in the storage industry in the AI era. From structural shifts in market demand to comprehensive upgrades in technical architecture, and from deep collaboration across the supply chain to the accelerated deployment of application scenarios, the storage sector is entering a period of unprecedented opportunity.Beyond serving as a high-end platform for industry exchange, the summit injected fresh momentum into high-quality development through solution showcases, technical discussions, and ecosystem collaboration. As AI becomes more deeply integrated into real-world applications, the storage industry is poised to open a new chapter of intelligent growth, driven by twin engines of technological innovation and ecosystem synergy.For more information about GMIF, please visit.