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Wednesday 18 March 2026
iCatch Launches PAISB Sensor Bridge Platform for NVIDIA Holoscan Ecosystem
iCatch Technology, a leading provider of AI imaging SoCs and vision processing solutions, today introduced PAISB (Physical AI Sensor Bridge), an HSB-aligned ASIC sensor bridge platform designed to enable scalable multi-sensor data ingest for NVIDIA Holoscan-based Physical AI systems.The first product in the platform family, PAISB-E1, will be demonstrated at GTC 2026 running on NVIDIA Thor at ApproPho Booth #3420.As Physical AI systems increasingly rely on multiple high-bandwidth sensors - including cameras, stereo vision modules, and other perception devices - efficient and deterministic data pipelines from sensors to GPU compute platforms have become critical infrastructure. PAISB addresses this challenge by providing an ASIC-based bridge optimized for time-aligned, low-latency sensor streaming into GPU computing environments.Aligned with the NVIDIA Holoscan Sensor Bridge (HSB) architecture, PAISB enables developers to ingest synchronized sensor streams directly into GPU memory, allowing real-time perception workloads to scale across a wide range of Physical AI applications.At GTC 2026, iCatch will demonstrate PAISB-E1 using FoundationStereo Depth as an application example. The system streams synchronized multi-sensor data to NVIDIA Thor, enabling real-time perception pipelines for robotics and intelligent machines."Physical AI systems demand scalable and deterministic sensor-to-GPU pipelines to process massive volumes of multimodal data in real time," said Weber Hsu, President of iCatch Technology. "With PAISB, we are introducing an ASIC-based sensor bridge platform aligned with the NVIDIA Holoscan ecosystem, enabling developers to build high-performance, time-synchronized sensor architectures for Physical AI platforms."The PAISB platform is designed to support a broad range of Physical AI applications, including robotics, industrial automation, medical imaging, broadcast infrastructure, and automotive perception systems. By enabling high-bandwidth, synchronized sensor ingestion into GPU-based computing environments, PAISB accelerates the deployment of AI systems requiring precise perception and real-time decision-making.To learn more about PAISB and explore collaboration opportunities, visit us at ApproPho Booth #3420 during GTC 2026, or schedule a meeting in advance.
Wednesday 18 March 2026
Industry Leaders Unite for Mini SSD Ecosystem Seminar
The "Mini SSD Strategic Seminar" convened recently to strengthen collaboration and accelerate ecosystem development following the successful "Mini SSD Ecosystem Application Seminar" held in Shenzhen on January 26.Leading companies across the industry chain, including Intel, BIWIN, Longcheer, BYD Electronics, Luxshare, Emdoor, Weibu, JWIPC, CYX Industrial, MINISFORUM, Decenta, and SIXUNITED, reached a strategic consensus to jointly build the Mini SSD industry ecosystem, marking a significant step toward large-scale adoption of this emerging storage form factor.As the first batch of core builders of the Mini SSD ecosystem, the initial partners will gain early access to patent licensing benefits, as well as the synergies created through ecosystem collaboration. This milestone signals that Mini SSD is evolving from a standalone product innovation into a collaborative, win-win industry ecosystem.Global Recognition: International Awards Validate Mini SSD's Innovation and Commercial PotentialSince its market debut, Mini SSD has rapidly gained recognition on the global stage, earning multiple prestigious international awards that highlight its technological innovation, design excellence, and industry impact.International Awards Validate Mini SSD's Innovation and Commercial Potential. Credit:BIWINTIME Best Inventions of 2025Founded in 1923, TIME Magazine is one of the world's most respected media institutions. Its annual Best Inventions list is widely regarded as a global benchmark for breakthrough innovation. Selected from thousands of nominations worldwide by TIME's editorial experts, the award recognizes inventions that demonstrate outstanding innovation, practical value, influence, and future potential.Edison Awards (Finalist)Named after legendary inventor Thomas Edison, the Edison Awards are often referred to as the "Oscars of Innovation." Judged by more than 3,000 global academics, industry leaders, and technology experts, the awards evaluate candidates across four dimensions: concept, value, impact, and achievement. Mini SSD's recognition as a finalist highlights its world-class standing in technology innovation, market potential, and societal impact.CES TWICE Picks AwardsAt CES 2026, widely known as the world's premier technology showcase, Mini SSD stood out among over 4,000 exhibitors and tens of thousands of products to win the TWICE Picks Awards, presented by leading U.S. consumer electronics publication TWICE. The award honors products demonstrating breakthrough innovation, exceptional quality, and strong market potential, and is widely regarded as a mark of excellence in consumer technology.Embedded World "Best-in-Show"The Best-in-Show Award at Embedded World is one of the most respected honors in the embedded systems industry. Evaluated by professional engineers and industry experts, the award recognizes products that excel in performance, reliability, and real-world application value. The recognition underscores Mini SSD's strong potential across embedded and edge computing environments.MWC "Best in Show"At MWC 2026, Mini SSD also received the "Best in Show Award", jointly selected by leading global technology media including TechRadar, Tom's Guide, Android Central, and T3. The recognition highlights Mini SSD's achievements in technological innovation and user experience, further reinforcing its global industry recognition.Mini SSD Receives Multiple Global Industry Awards. Credit:BIWINToday, Mini SSD has rapidly progressed into commercial deployment, gaining adoption among leading device brands. OneXPlayer, GPD, and Waterworld have already integrated Mini SSD into flagship devices including handheld gaming consoles, AI PCs, and smart albums. Early partners report that the adoption of Mini SSD has enhanced user experience while driving measurable market growth and positive brand perception.From global awards to real-world product adoption, Mini SSD is steadily advancing from technology validation to commercial success.Industry Collaboration: Partners Outline the Future of the Mini SSD EcosystemDuring the seminar, industry participants engaged in in-depth discussions around standardization, ecosystem governance, and application deployment, jointly outlining the strategic roadmap for the Mini SSD ecosystem.Industry Collaboration: Partners Outline the Future of the Mini SSD Ecosystem. Credit:BIWINShared Value and Ecosystem GovernanceParticipants agreed on the need to establish a shared-benefit mechanism to accelerate ecosystem development. Plans include forming a dedicated IP management company and governance framework, with clear policies for incentive structures, licensing models, and revenue distribution, ensuring that ecosystem partners share both the value and growth opportunities generated by the technologyDesign-In and Technical CollaborationLeading partners including Longcheer, Emdoor, MINISFORUM, and GMKtec announced plans to initiate design-in programs for upcoming flagship products such as ultra-thin laptops and Mini PCs. Through joint development, design validation, and system optimization, the industry aims to establish a collaborative innovation model across the entire supply chain.Market Expansion and Application StrategyThe seminar also outlined a value-driven market strategy. For PC platforms, participants discussed the possibility of pre-loading popular games and AI models on Mini SSD, creating new value-added distribution channels that enable hardware vendors to unlock additional revenue opportunities.Moving forward, ecosystem partners will work together to accelerate Mini SSD adoption across handheld gaming devices, AI PCs, robotics platforms, and other emerging edge-AI applications.Enabling Edge AI: Mini SSD Unlocks New Possibilities for Next-Generation DevicesWith its ultra-compact footprint (approximately half the size of a coin), PCIe Gen4 flagship-level performance, LGA packaging for enhanced shock resistance, and SIM-card-style expandability, Mini SSD provides a flexible, high-performance storage solution for next-generation intelligent devices.IMini SSD Unlocks New Possibilities for Next-Generation Devices. Credit:BIWINUltra-Thin LaptopsWeighing just 1 gram and offering 40% smaller volume compared with traditional M.2 2230 SSDs, Mini SSD frees valuable internal space within ultra-thin devices, enabling manufacturers to integrate additional components. Its user-replaceable expansion design also allows users to scale storage capacity as AI PCs increasingly require large datasets for local AI model deployment.Intelligent RoboticsFor robotics operating in high-vibration and complex environments, Mini SSD delivers high-speed read/write performance and strong shock resistance, ensuring stable access to vision and environmental data. Its modular architecture enables flexible storage expansion across the robot’s lifecycle, supporting continuous data accumulation for lifelong learning and system evolution.DronesMini SSD’s shock resistance and wide temperature tolerance ensure reliable performance during high-speed flight, rapid maneuvering, and extreme temperature variations. With capacities up to 2TB, it supports stable recording of 4K and 8K aerial video, providing creators with greater storage capacity for professional content capture.Handheld Gaming DevicesIn high-performance handheld gaming consoles from brands such as GPD and OneXPlayer, Mini SSD delivers console-class loading speeds within a footprint only slightly larger than a TF card. With random read performance up to 850K IOPS, it enables near-instant loading for large 3D games, while meeting the strict space constraints of compact gaming devices.Building the Mini SSD Ecosystem Together for the FutureThe Mini SSD Strategic Seminar marked the formal establishment of the Mini SSD ecosystem on the basis of in-depth technical exchange. With a clear roadmap spanning shared-value mechanisms, unified standards, and Design-in collaboration, industry partners are now aligned around accelerating large-scale adoption.Backed by Shenzhen's market accumulation and fast response of the industry chain, BIWIN will continue working closely with ecosystem partners to develop technical standards, expand application scenarios, and build a thriving Mini SSD industry platform.
Wednesday 18 March 2026
EDOM Brings AI into Action at NVIDIA GTC 2026
EDOM Technology (TWSE: 3048), Asia's best solutions partner, will participate in NVIDIA GTC for the third consecutive year under the theme "From AI to Action: Physical AI in Motion." Together with ecosystem partners, EDOM will showcase its latest AI computing platforms, key components, and system integration capabilities. At Booth #242, EDOM will present physical AI and robotics solutions powered by NVIDIA Jetson hardware and software resources, demonstrating how AI technologies are being developed and deployed across diverse fields such as smart healthcare, vision recognition, and speech understanding. The showcase will highlight EDOM's capability to connect the AI ecosystem and accelerate industry innovation through integrated solutions.During the GTC exhibition, EDOM Technology plans to demonstrate several innovative applications that combine physical AI with edge computing. With the introduction of the NVIDIA Jetson Thor, AI inference and control architectures can now be integrated into a single system, providing a high-performance computing foundation for real-time closed-loop control and multimodal sensing, and accelerating the real-world deployment of multimodal intelligent robots.In the robot interaction showcase, EDOM collaborates with Algoltek to present "Dexterous Hand AI."Powered by 4D AI Vision technology and vision-action models, the system can recognize and predict audience hand gestures in real time and respond accordingly. This demonstration highlights low-latency AI inference and instant feedback, while also presenting a complete Sim-to-Real workflow, from virtual simulation to physical deployment. EDOM also partners with Nexuni to present "AI Workforce: Embodied Intelligence." Built on the NVIDIA Thor platform, the system enables dual-arm robot manipulation through few-shot learning. The demonstration shows a service robot performing household tasks, including object recognition, grasping, and fabric folding. Because fabric is a highly deformable material, handling it requires complex visual perception, state estimation, and coordinated dual-arm control. By leveraging Jetson Thor's edge AI inference and real-time dynamic path correction, the system continuously adjusts its movements during the folding process, improving task success rate and operational stability. This highlights the potential of physical AI in smart manufacturing, human-robot collaboration, and service robotics.In the area of enterprise AI and smart biotech applications, EDOM collaborates with Avalanche Computing to showcase the "Secure Offline Generative AI" platform. Combining enterprise-grade private LLMs with real-time speech intelligence, the platform runs on the NVIDIA Jetson edge platform, enabling low-latency offline speech recognition and semantic analysis. This allows generative AI to deliver real-time interaction within highly secure enterprise environments. EDOM is also working with CyteSi to present the "Software-Defined High-Throughput Wet Lab," an AI-driven laboratory automation platform. CyteSi's EWOD (Electrowetting-on-Dielectric) technology digitally controls micro-droplets with precision, supporting workflows such as NGS sample preparation, drug discovery, and synthetic biology research. The system uses NVIDIA Jetson as its edge computing core, integrating biochips from Japan Display Inc. (JDI) with real-time image analysis capabilities to provide an intuitive user interface and highly efficient experimental workflow, advancing AI adoption in smart biotech research and automated laboratories.In addition, EDOM will showcase the "NVIDIA Jetson Thor Peripheral Ecosystem," integrating a range of EDOM-certified peripheral components, including high-speed storage, Wi-Fi 6/6E and 5G communication modules, GMSL and MIPI cameras, 10G high-speed networking, sensors, camera modules, and high-speed I/O interfaces. This ecosystem helps developers rapidly build next-generation robotics and physical AI systems. Through comprehensive hardware integration and platform support, EDOM assists robotics developers in accelerating product design, deployment, and mass production, further expanding the physical AI and Jetson Thor ecosystem.Jeffrey Yu, CEO of EDOM Technology, stated, "The key to physical AI lies not only in computing performance, but in comprehensive hardware–software integration and ecosystem collaboration. Through NVIDIA's Three-Computer architecture and the Jetson Thor platform, we help customers build scalable, production-ready, end-to-end AI solutions - from model training and simulation validation to edge deployment." He further noted that EDOM is not just a hardware supplier, but is committed to integrating peripheral modules, AI software frameworks, and partner resources to help enterprises accelerate the adoption of AI and robotics technologies.EDOM Technology invites industry professionals, developers, and partners to visit Booth #242. Attendees are also welcome to check out the in-person session featuring Wilson Yen, Product Director at EDOM. The talk explores how EDOM leverages NVIDIA "Three Computers" architecture to help enterprises transform AI models into real-world applications, covering key domains such as computer vision, robotics, and edge AI. Participants are encouraged to add this session to their personal GTC schedule to experience firsthand the innovation of physical AI in action, and to explore the future of intelligent robotics and edge AI. Register now through EDOM's dedicated link to enjoy special GTC Conference registration offers. 
Wednesday 18 March 2026
Ultraband at Satellite 2026: Modular Tech for Multi-Orbit Satellite Era
As the global satellite communications industry rapidly advances toward a multi-orbit, multi-band architecture, the flexibility and scalability of ground terminal equipment have become core concerns for operators. Ultraband Technologies announced it will showcase its 16×16 Ku-band phased array module at the Taiwan Space Pavilion during Satellite 2026. Through a modular design philosophy, the company delivers more flexible and scalable terminal solutions for multi-orbit, multi-band satellite communications.Against the backdrop of multi-orbit, multi-frequency satellite networks gradually taking shape, ground terminal equipment must simultaneously support satellite systems operating across different orbits and frequency bands. However, when implementing multi-orbit, multi-frequency architectures, operators face the common challenge of rapidly escalating costs associated with mass production and large-scale deployment for terminals centered around phased array antennas. To address this need, Ultraband Technologies proposes a predictable and consistent ground terminal evolution strategy. This approach assists global satellite operators managing multiple satellite constellations in maintaining technological platform consistency while effectively addressing cost and performance challenges during mass production and deployment phases.Modular Stitching Architecture: Supports gradual expansion from UAV BLOS (Beyond Line of Sight) applications to large ground terminal equipment. Operators can enhance system capabilities through modular expansion, adapting to different orbital or frequency strategies and mission requirements without replacing the entire platform.Multi-Orbit, Multi-Band Switching Design: Collaborating with industry partners to enable a single terminal device to support multi-orbit and multi-band switching capabilities. This allows equipment to operate flexibly across different satellite orbits and frequency band systems, further reducing terminal SKU counts and lowering overall operational costs.Gallium Nitride (GaN) Technology: Integrating proprietary GaN design and process capabilities, this technology enhances signal output power while maintaining low power consumption and superior thermal performance. This ensures high stability and reliability for equipment operating in prolonged and all-weather environments.Ultraband Technologies'newly launched 16×16 Ku-band phased array module serves as a Proof of Concept (POC) and early testing platform, open for evaluation and validation by satellite operator technical teams and research institutions. Through real-world application testing, it assists industry partners in verifying the feasibility of antenna architecture design and field deployment processes prior to formal commercial deployment.For multi-orbit, multi-band operators, this signifies that phased array ground equipment is evolving from a high-performance technology demonstration into deployable, repeatably scalable, and operationally ready infrastructure, laying the foundation for the future large-scale development of satellite communication networks.In the drive toward seamless system implementation, Ultraband Technologies is collaborating with a strategic network of domestic and international partners - including Ubiqconn Technology - to leverage extensive expertise in ruggedized system integration and manufacturing.By introducing a cutting-edge Fast Calibration Mechanism, the collaboration effectively addresses the industry's mass production bottlenecks. This innovation significantly shortens calibration cycles for phased array systems during the manufacturing stage, ensuring superior batch consistency and drastically reducing system tuning costs for large-scale deployments.Ultraband Technologies will showcase the aforementioned phased array modules and related technological achievements during the Satellite 2026 exhibition, engaging in collaboration and exchange with global satellite operators, system integrators, and industry partners.Satellite 2026 Exhibition InformationExhibition Dates: March 23–26, 2026Venue: Walter E. Washington Convention CenterBooth Number: Taiwan Space Pavillion #2747Click here for more information.Ultraband
Tuesday 17 March 2026
SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix
Tuesday 17 March 2026
Chenbro Showcases Next-Generation AI Infrastructure Integration at NVIDIA GTC 2026
As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server chassis solutions at NVIDIA GTC 2026. The showcase features the NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72 systems, along with a comprehensive product portfolio based on NVIDIA MGX architecture, demonstrating Chenbros integrated capabilities spanning system design, thermal optimization, and rack-level deployment.Building on its close integrations with the NVIDIA ecosystem, Chenbro presented multiple server chassis solutions designed in alignment with NVIDIA reference architectures and the NVIDIA MGX architecture. These solutions address high-density computing, liquid cooling technologies, and enterprise-grade deployment requirements, enabling cloud service providers(CSPs) and enterprise data centers to accelerate AI infrastructure deployment.NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72- A New Standard for High-Density AI ComputingAs next-generation AI training and inference workloads continue to scale rapidly, data centers face increasing demands for space efficiency and advanced thermal design. At NVIDIA GTC 2026, Chenbro highlights the NVIDIA MGX 1U Compute Tray for Vera Rubin NVL72, engineered with optimized mechanical design and airflow management to deliver high-density computing within a 1U footprint. The solution is tailored for large-scale model training and high-performance inference applications.Chenbro also showcases:NVIDIA MGX 1U for NVIDIA GB200 NVL4, supporting high-performance inference and flexible deployment.NVIDIA MGX 2U Vera Server Chassis, offering enhanced scalability and enterprise-level integration options.Together, these solutions demonstrate Chenbro's system integration expertise under the NVIDIA MGX architecture framework.NVIDIA MGX Rack- Advancing from System Integration to Rack-Scale DeploymentAs AI infrastructure expands from individual systems to rack-scale environments, Chenbro highlights its integration capabilities based on NVIDIA MGX architecture. The company leverages its strengths in mechanical design and mass production to support the deployment of high-density AI computing environments in modern data centers.By closely aligning with NVIDIA reference architectures and the broader NVIDIA MGX ecosystem, Chenbro enables customers to extend from system-level builds to rack-level integration, accelerating scalable AI infrastructure deployment.NVIDIA MGX 6U Liquid-Cooled Server Chassis- Liquid Cooling for High-Power AI PlatformsIn response to power consumption and energy efficiency requirements for AI platforms, Chenbro presents the NVIDIA MGX 6U Liquid-Cooled Server Chassis. Designed to support high-power liquid-cooled deployment architectures, the solution enhances thermal efficiency and improves data center power usage effectiveness (PUE) through optimized mechanical and fluid management design, ensuring stable operations for next-generation AI data centers.Additional showcased solutions include:NVIDIA MGX 4U Air-Cooled Server Chassis and NVIDIA MGX 2U Short-Depth Server Chassis.These offerings provide flexible deployment options for enterprise server rooms and diverse application scenarios.Strengthening Global Footprint and AI Infrastructure CapabilitiesChenbro CEO Corona Chen stated that as AI applications continue to expand, market demand for high-density computing, liquid cooling, and rack-scale integration capabilities is rapidly increasing. Chenbro will continue deepening its collaboration within the ecosystem, strengthening its integrated R&D and manufacturing capabilities to help customers accelerate the adoption of next-generation AI platforms.                                                      With its global manufacturing footprint and localized service capabilities, Chenbro is committed to supporting diverse deployment needs across AI, HPC, and data center applications—driving sustained operational growth and industry competitiveness.At GTC 2026, Chenbro not only presents its product portfolio but is supporting NVIDIA AI platforms from system integration and thermal optimization to rack-scale deployment, enabling scalable AI infrastructure development worldwide.Chenbro supports diverse AI, HPC, and data center deployment needs. Credit: Chenbro
Friday 13 March 2026
NEXCOM to showcase solutions for Physical AI and SD-Edge computing
NEXCOM, A leading global provider of industrial computing and automation technology, is coming to Embedded World in Nuremberg (booth 3/341) with ambitious goals. With the help of European partners, the company aims to further expand its AI presence in edge applications, including automation, rugged mobile computing, safety-oriented robotics, smart cities, on-premises GPT, and industrial cybersecurity."As robots increasingly become the primary physical carriers for AI capabilities, NEXCOM is committed to accelerating their adoption across various industries," explains CEO Clement Lin, who will be attending Embedded World himself. "At Embedded World 2026, we will be presenting, among other things, a comprehensive range of safety-certified industrial robotics solutions in collaboration with the German robotics innovators. These solutions are specifically designed for smart factories, service robots, automotive manufacturing, and logistics."NEXCOM Robotic Solutions: Building a Safety-Oriented Foundation for Physical AIThe integration of physical AI into industrial environments requires rigorous and comprehensive safety certification for every component, from joint actuators and control motors to safety sensors, to ensure safe human-machine collaboration. As the central architect of the intelligent machine ecosystem, NEXCOM Robotic Solutions offers a robust motion control platform integrated with joint drive modules and safety software from European partner Synapticon. These solutions enable developers to significantly shorten development cycles while achieving the highest safety standards for robots used in manufacturing, logistics, and automated services."Over the past 34 years, NEXCOM has gradually evolved into one of the world's leading providers of robotics, IoT, and Industry 4.0 solutions. NEXCOM's extensive portfolio and long-standing experience in the global market perfectly complement the innovations developed by our team in Europe," reports Simon Fischinger, CEO at Synapticon. "Especially in the field of AI-based robotics, enormous opportunities are emerging as leading providers opt for open standards, enabling them to collaborate efficiently with partners."To further accelerate the deployment of safe and flexible robotic applications, NEXCOM is also collaborating with Botfellows, a German high-tech robotics startup specializing in safety-driven automation solutions. Botfellows focuses on enabling flexible and efficient robotic applications through software-defined safety architectures and intuitive robot programming."Physical AI will only scale if robotics becomes significantly easier and safer to deploy," says Dr. Mohamad Bdiwi, CEO of Botfellows. "Our collaboration with NEXCOM and Synapticon demonstrates how the combination of edge AI computing, advanced motion control, and software-defined safety enables a new generation of flexible robotic systems for smart factories and logistics."Embedded World 2026 Highlight: Unlocking the Potential of SD Edge ComputingUnder the motto "Unleashing the Genius of SD Edge Computing," NEXCOM's presentation is divided into two main areas: AIoT solutions and AI computing. The exhibition demonstrates the enormous potential of Software-Defined Edge Computing (SDEC) using real-world implementations of Edge AI and Physical AI in global AIoT infrastructures.Key product highlights include:NDiS B340: A rugged edge computing computer specifically designed for the demanding requirements of smart healthcare.APPC 160/210 C21: Industrial touch computers for high-performance AI applications in smart factories.IP67 AI edge telematics: Innovative, rugged solutions for challenging outdoor and vehicle environments.NEXCOM remains committed to accelerating the practical implementation of intelligent applications. From high-performance AI computing platforms and physical AI to comprehensive AIoT operating frameworks, NEXCOM delivers innovative products that empower the next generation of AI-driven businesses and improve people's lives.NEXCOM at Embedded World 2026NEXCOM invites trade show visitors to discover the future of autonomous innovation at its booth (4/341) in Nuremberg. Those interested can experience firsthand how NEXCOM's software-defined solutions are transforming the landscape of industrial automation and edge intelligence.For more information, please visit.
Friday 6 March 2026
ITRI, NCU advance Taiwan-Japan space collaboration through study program
The rapid advancement of space technology has led to a growing range of applications, including satellites and launch vehicles, attracting significant cross-sector investment worldwide. As space becomes an increasingly strategic industry, governments are accelerating deployment efforts to secure technological leadership and industrial competitiveness.Against this backdrop, Taiwan's Industrial Technology Research Institute (ITRI), through its Commercialization and Industry Service Center, partnered with the Department of Space Science and Engineering (DSSE) and the Center for Astronautical Physics and Engineering (CAPE) at National Central University (NCU) to organize the "Taiwan-Japan Space Education Exchange Delegation." The initiative targets students and early-career professionals interested in space technology, offering structured coursework and site visits to provide first-hand insight into global space industry developments and cultivate internationally minded talent for Taiwan's emerging space sector.The program centers on international industry-academia collaboration. ITRI provided industry trend analysis and facilitated R&D resource connections, while NCU designed and delivered academic training. The itinerary included visits to the Japan Aerospace Exploration Agency (JAXA), space technology enterprises, and major research facilities in Japan, enabling participants to bridge theoretical learning with real-world industrial operations and international cooperation models.Pre-departure workshop builds foundation for overseas engagementA pre-departure workshop was held at NCU on January 17 to equip participants with essential technical knowledge and industry context prior to departure. The curriculum covered space science fundamentals, satellite systems engineering, industry trends, and applied operations, providing a concentrated introduction to core space-sector competencies.The session highlighted NCU's research capabilities and emphasized the interdisciplinary integration of physics, mathematics, electronics, data analytics, and engineering practice. In the "Introduction to Space Environment and Satellite Systems Engineering" course, participants examined satellite design under extreme space conditions, as well as mission planning, testing, and operational workflows, laying the groundwork for subsequent field visits.Hands-on satellite training was also conducted. Led by SIGHT Space, participants assembled satellite structures, integrated sensors, and collected real-time data using the SMEK Educational Satellite Platform, translating theoretical engineering concepts into practical experience.ITRI and NCU host a pre-departure workshop featuring hands-on satellite training by SIGHT Space. Credit: ITRIVisit to JAXA Tsukuba Space Center integrates theory and practiceThe program began in Tsukuba, Japan, with an astronaut workshop led by experts "Japan Manned Space Systems Corporation(JAMSS)" experienced in human spaceflight missions. The curriculum incorporated NASA's Artemis Program, outlining the architecture and technical challenges of renewed lunar exploration and offering a mission-level perspective on current space strategies.In addition to lectures, the workshop featured a lunar exploration simulation exercise replicating mission execution scenarios. Participants made decisions under resource constraints and time pressure, gaining insight into task allocation, risk management, and team coordination. The module was adapted from elements of Japan's astronaut selection process, emphasizing analytical thinking and adaptability.Through exchanges with instructors and industry professionals, participants explored diverse career paths spanning engineering development, mission planning, and international collaboration. The workshop translated space exploration from an abstract concept into structured industrial processes.On the second day, participants toured the JAXA Tsukuba Space Center, a key hub of Japan's space activities. Established in 1972, the center oversees satellite development, mission control, astronaut training, and foundational research.The visit included major testing infrastructure such as a 13-meter-diameter environmental chamber, vibration and radio-frequency testing systems, and vacuum simulation facilities, providing direct insight into pre-launch verification procedures.Participants also observed operations at the mission control center for the Kibo module of the International Space Station, where they learned how ground teams coordinate with astronauts in real time and conduct remote microgravity experiments. The visit underscored the scale of system integration required for national-level space missions.Participants visit the JAXA Tsukuba Space Center during the Japan study program. Credit: ITRIIndustry visits to ArkEdge Space and ispace provide market insightJapan's private sector has become an increasingly influential force in space development. As part of the program, participants visited ArkEdge Space, a company specializing in small satellite development. ArkEdge is building an integrated ecosystem covering satellite design, production, ground station operations, and key component development, aiming to lower entry barriers through commercialization.Its 6U CubeSats support missions ranging from Earth observation and communications to navigation and lunar applications. During the visit, ArkEdge shared insights into modular design and shortened development cycles, illustrating operational approaches adopted by emerging space enterprises.ArkEdge has collaborated with the University of Tokyo, Taiwan Space Agency (TASA), and NCU on the ONGLAISAT mission, contributing to the technological foundation of Taiwan's ultra-high-resolution optical remote sensing capabilities. The project represents a concrete example of Taiwan-Japan industry-academia cooperation.Participants also visited ispace, a company focused on commercial lunar development with the goal of extending human presence beyond Earth. ispace invests in lunar transportation, exploration, and resource utilization technologies, reflecting broader commercialization trends in deep-space missions.The company's core technology centers on its independently developed lunar lander. The team outlined mission architecture and technical challenges spanning launch, transit, and lunar orbit insertion. Hakuto-R Mission 2 carried a Deep Space Radiation Probe developed by NCU, marking the first time a Taiwanese research payload traveled beyond low Earth orbit and representing a milestone in bilateral cooperation.Participants said the visit reshaped their perception of the Moon as not only an exploration objective but also a potential pillar of the future space economy. Discussions highlighted pathways for translating academic research into commercial missions, reinforcing the role of sustained industry-academia collaboration.The program also included a visit to Space Travelium TeNQ, a space-themed experiential facility integrating technology, art, and education. Through interactive exhibits and virtual reality, participants explored spaceflight concepts from a different perspective. In the VR experience "SORAVEL LINE," they simulated a lunar journey from Earth departure to lunar surface landing, deepening their understanding of microgravity environments.Participants affirm value of structured international engagementThe program received strong feedback from participants. Engagement levels across online briefings, pre-departure training, and on-site visits averaged 4.4 out of 5, reflecting sustained participation throughout the program.Survey results indicated that the astronaut workshop, satellite hands-on training, and company visits were the most impactful components. Participants reported broader technical perspectives and clearer direction in academic planning and career development, with several expressing increased interest in space engineering and related interdisciplinary fields.As competition in the global space sector intensifies, talent development and international collaboration remain central to long-term industrial positioning. The Taiwan-Japan Space Education Exchange Delegation represents a structured effort to strengthen Taiwan's space capabilities through deeper bilateral engagement and practical exposure.
Friday 6 March 2026
Myogai Built with AI and designed for Humans
In today's wellness-driven world, yoga has evolved into more than just a physical practice - it has become a daily ritual for hundreds of millions of people worldwide. It now stands as one of the most widespread and diverse disciplines in the health and fitness industry.  Yet between "doing yoga" and "doing it right," a persistent instructional gap remains."In live classes," explained Myogai Project Manager Dale Neal, speaking from experience, "we often felt like we weren't getting the attention we needed. And instructors? They were struggling to manage larger groups while trying to keep instruction personalized." That experience became the spark behind Myogai.Led by Neal, Myogai is the product of a multidisciplinary team united at National Taiwan University of Science and Technology (NTUST). The group includes Nic, an expert in AI-based computer vision; Valer Vanco and Andrés Brítez, who bring strengths in business strategy and finance; Luis Manzanero, a full-stack developer; and Fatima, a seasoned yoga instructor with years of in-studio teaching experience.Together, they created a real-time yoga instruction platform that uses BlazePose pose tracking technology and intelligent AI feedback to assiststudents and instructors—enhancing accuracy, engagement, and safety.At the heart of Myogai is a multi-platform system that analyzes human posture in real time. Students perform asanas while the system tracks more than a dozen key skeletal points. Based on this data, the AI engine delivers instant alignment feedback, while instructors can access live dashboards that support more effective coaching - whether in physical studios or online sessions."It works both online and in-person," Neal said. "Our competitors often go to extremes - either they build AI tools that try to replace instructors completely, or they offer platforms too simplistic to be useful. We've built something in between. Myogai is a digital extension of yoga instruction - not a substitute."This hybrid approach is what makes Myogai a game-changer. By integrating real-time analytics into live or remote sessions, it allows instructors to teach more students effectively, deliver personalized feedback at scale, and even support AI-assisted certification programs.And yoga is just the beginning."Our roadmap includes everything from calisthenics to dance to physical therapy," Neal added. "Anywhere body movement matters, our system can make a difference."Myogai did not emerge from Silicon Valley, but from the startup ecosystem of Taiwan - a decision the team believes was pivotal."The startup environment here is incredible for AI," said Neal. "You get access to world-class engineers, rapid prototyping, and strong institutional support. NTUS's incubation program is what first connected us to this opportunity."Taiwan's technical talent, affordability, and proximity to leading hardware partners, such as sensor and device manufacturers - enabled Myogai to iterate rapidly and test early-stage concepts in real-world environments.Myogai's go-to-market strategy begins with independent yoga instructors - those running small studios or teaching virtually who need better tools to grow and retain their student base. With global organizations like Yoga Alliance listing over 60,000 instructors, the opportunity is substantial.The team also plans to expand into physical yoga studios, certification institutions, and fitness platforms. They are exploring potential partnerships with wearable technology companies to build richer, sensor-integrated experiences.Myogai recently won Silver at the Ministry of Economic Affairs'Best AI Awards - a major milestone that brought not only funding, but industry validation."This award shifted our mindset," Neal said. "We've always believed in our product, but now others in the AI community are recognizing its potential too. The visibility helped us land interviews, attract advisor support, and generate new business leads. It's already speeding up the rollout of our second version."That next-generation version, due to launch soon, will feature multilingual support, expanded device compatibility, and refined posture recognition models built on Mediapipe and enhanced with proprietary tuning.But for the team, this is just the beginning. The vision extends well beyond yoga - toward a future where AI doesn't replace human instruction, but elevates it across wellness, fitness, and rehabilitation."In a world rushing toward virtual everything, we're betting on something different," Neal said. "We're building AI that makes the physical world better—not obsolete."Myogai won the Silver Adward in the International Group AI Application Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates.
Friday 6 March 2026
How NeuroSpine AI Is Rewriting Surgical Planning
When spine surgeons talk about pressure, few procedures rival C1–C2 fixation - a surgery so delicate that a deviation of just a few millimeters can mean the difference between success and catastrophic complications.That reality became the starting point for NeuroSpine AI, a project developed by Sanny Kumar Sahani, a PhD researcher in computer science and commercial engineering, and Shweta Prajapati, a master’s student in biomedical engineering. Both are from India, both study at Chang Gung University, and both work in the same lab under the same advisor.Their collaboration has earned them international recognition- the Bronze Medal at Taiwan's Ministry of Economic Affairs Best AI Award, standing out in a field crowded with enterprise and academic innovations.Sahani recalls that during collaboration with Chang Gung Memorial Hospital, one experienced spine surgeon, Dr. Wu, described the mental burden of C1–C2 screw planning. Even for veteran surgeons, the risk remains high. The anatomy is complex, patient variation is significant, and the vertebrae sit dangerously close to the brainstem, nerves, and major blood vessels. If automation and precision could be applied anywhere in spine surgery, this was it.Prajapati emphasizes that the motivation was never purely academic. Surgeons identified real constraints: planning is time-consuming, only highly experienced specialists can safely perform these procedures, and screw misplacement remains a serious clinical risk. The team's goal became clear - reduce planning time, lower dependence on elite expertise, and improve consistency without compromising safety.Most existing surgical planning tools focus on the thoracic and lumbar spine. Those vertebrae are relatively uniform, making automation easier. C1 and C2, by contrast, are anatomically unique, highly variable, and structurally complex.Sahani explains that current solutions either require extensive manual adjustment or do not support C1–C2 at all. NeuroSpine AI took the opposite approach: start with the hardest problem first.The system automatically generates multiple screw trajectories, performs geometric safety checks, and ensures consistency regardless of who uses the software. Unlike manual planning - which varies between surgeons and depends heavily on experience - AI-generated trajectories remain stable and repeatable.That consistency matters, especially for junior surgeons still building experience. The system does not replace surgical judgment, but it removes unnecessary variability from one of the most critical planning steps.In traditional workflows, planning a single screw trajectory can take 30 to 60 minutes. NeuroSpine AI generates multiple trajectories in just two to three minutes.More importantly, the system has been trained to understand the geometric patterns of C1–C2 anatomy, learning from diverse datasets collected through Chang Gung Memorial Hospital and an international collaboration in France. The AI does not simply segment images; its reason about spatial constraints, vessel proximity, and safe paths for screw placement.The result is a pre-operative planning tool that balances speed, safety, and accuracy — something surgeons rarely get at the same time.The role of AI is more Than just automation. First, it specializes exclusively in C1–C2 anatomy, rather than applying generalized spine models. Second, it performs geometric reasoning to avoid nerve and vessel damage - a non-negotiable requirement given the proximity to the brain. Third, it generates multiple alternative trajectories, ensuring that even abnormal anatomical cases still yield viable surgical options.Prajapati notes that the system is designed for pre-operative use. Surgeons can review trajectories before entering the operating room, making the procedure safer and more predictable - particularly for less experienced doctors.NeuroSpine AI has already completed initial clinical validation at Chang Gung Memorial Hospital, where surgeons confirmed that AI-generated trajectories aligned closely with what experienced clinicians would plan manually.That validation marked a turning point. The project is now transitioning from research to a deployable product.The next phase involves expanding beyond C1–C2 to cover the entire spine - all 26 vertebrae - and integrating the system into existing clinical workflow software. Given that C1–C2 is the most complex region, the team believes scaling to other vertebrae is both realistic and strategic.The potential market spans hospitals, medtech companies, surgical planning platforms, robotic surgery firms, and spine implant manufacturers. As spine surgeries increase globally, automated pre-operative planning is becoming less optional and more essential.The team plans to begin commercialization in Taiwan, leveraging established hospital partnerships, before expanding internationally.For Sahani and Prajapati, participating in the Best AI Award was less about winning and more about validation. They wanted to know whether their work mattered beyond the lab - whether people outside academia could see its value. Winning the Bronze Medal provided that answer.Prajapati admits they did not expect to win. The recognition, especially among international teams, gave them confidence that NeuroSpine AI is not only meaningful but scalable.Both researchers express strong interest in continuing their work in Taiwan, citing the strength of its AI, biomedical, and hospital ecosystems. For Sahani, the integration between technology and healthcare feels unusually seamless.Their roadmap is clear: expand anatomical coverage, refine clinical integration, and continue building AI systems with real-world medical impact.As Prajapati puts it, the most meaningful part of the journey has been having a platform to explain how AI can truly help surgeons - not in theory, but in practice. And in a field where millimeters matter, that distinction makes all the difference.NeuroSpine AI won the Bronze Award in the International Group AI Application Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates.