Beijing's second annual World Humanoid Robot Games offered a vivid preview of where this technology race is headed. Over five days, more than 2,000 humanoid robots competed across 51 events and over 1,000 individual matches including running, table tennis, soccer participated in an Olympics-style spectacle that doubled as a statement of intent. As the technology race with the U.S...
Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering key insights into the company's strategic positioning under China's evolving economic framework...
Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance and safety management become increasingly urgent...
In the fiercely competitive European and global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly stringent requirements for supply chain transparency and device identity recognition...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.
SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of its corporate venture capital (CVC) brand, "SK hynix Ventures," aimed at expanding strategic partnerships within the global AI ecosystem and securing future innovative technologies.
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment. The next challenge is turning these technologies into scalable, high-yield production.
As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation...
