The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip manufacturing grows exponentially - die sizes are scaling, tolerances are tightening, and the margin for error has nearly vanished."Explaining the complexity isn't easy," says Ahmad Khan, President of Semiconductor Products and Customers at KLA. "Picture a six-lane highway. A decade ago, you could cruise down the middle, drift left or right - no problem. Today? Same highway, but cars are doing 200 miles per hour with gaps the width of a human hair between them. One wrong move causes catastrophe." This isn't traditional manufacturing anymore, he notes. "It's artisanal work. Exceptionally difficult work."KLA's philosophy in this environment is fundamental yet profoundly important: the company doesn't change the wafer - it observes it. That distinction defines KLA's entire approach. While other equipment modifies, deposits or etches, KLA provides the visibility and insights that allow customers to more tightly manage the complexity of semiconductor manufacturing. In this era where advanced wafers cost $15,000 to over $30,000 each and fabs produce 100,000 monthly, the ability to "see" every nanometer with absolute precision is essential.This capability is important for almost all semiconductor manufacturers, and particularly in Taiwan, which is home to nearly 90% of the world's advanced semiconductor production. The gravity of this ecosystem is one of the key reasons KLA recently opened its new Hsinchu headquarters and its largest Learning and Knowledge Services (LKS) Training Center - a combined US$15.5 million (NT$465 million) investment that underscores the company's commitment to staying close to customers.35 Years Strong: A $15.5 Million Vote of ConfidenceKLA's new Taiwan headquarters in Hsinchu's Tai Yuen Hi-Tech Industrial Park, with WELL certification. Credit:KLAThe investment breaks down to US$10.5 million (NT$315 million) for the new office and US$5 million (NT$150 million) for the training center. Located in Tai Yuen Hi-Tech Industrial Park Phase IX, the headquarters spans 10,000 square meters across two floors, accommodating up to 1,000 employees. The facility earned WELL certification - reflecting KLA's focus on employee wellbeing.KLA first set up shop in Taiwan in 1990. Khan himself has been coming here since those early days. "Back in the '90s, downtown Hsinchu had one hotel. One," he recalls. "The semiconductor sector was just getting started." What he found were engineers trickling back from Motorola, Texas Instruments, and Intel - talented people who returned when Morris Chang and other pioneers decided Taiwan was ready to build fabs."The transformation has been remarkable," Khan says, attributing the growth to what he calls "the Taiwan spirit" - relentless work ethic, intense collaboration, and a willingness to challenge conventions and push for excellence. "This industry is incredibly challenging," Khan acknowledges. "There's nothing harder. You can work yourself to the bone, pour in capital, and still fail completely. But so many of the players in Taiwan have figured it out and continue finding success. We’re honored to be a part of it."Today, KLA Taiwan employs roughly 1,800 people spread across Hsinchu, Kaohsiung, Tainan, Taoyuan, Linkou, and Taichung, with plans to surpass 2,000 by year-end 2026 as customer demand surges.KLA's Largest Training Center: Where Innovation Meets EducationThe LKS Training Center covers 2,950 square meters, including 825 square meters of Class 100 cleanroom, and features 14 classrooms, an AR/VR immersive learning center, four engineering labs, and a chemical analysis lab.With millions of configuration modes, KLA's systems can't simply be switched on. Customers often need PhD- and master's-level engineers who can dial in exact settings for their specific needs. That's one of KLA’s primary motivations for investing in training infrastructure close to customers.The new training center combines classroom instruction, hands-on practice, and immersive simulations to accelerate learning. Beyond training KLA's own people, it is also designed to help customers' fab teams sharpen skills and get to yield faster on new technologies.Building Talent for the Long HaulWhile the larger semiconductor industry continues to face a talent crunch, KLA emphasizes steady hiring and long-term career growth. The company runs disciplined forecasts to determine staffing needs, avoiding boom-and-bust waves.KLA's talent strategy rests on three pillars:Extensive Campus Recruiting: KLA hires substantial numbers of fresh graduates and promotes from within, building loyalty and institutional knowledge over time.80-90% Internal Promotion: The company thinks long-term when hiring, creating clear career paths from customer support teams  to application teams and engineering teams . People can climb technical ladders or switch to management based on their strengths.University Partnerships: KLA engineers give tech talks and teach courses at leading local universities. The company sees it as paying forward, training the next generation who'll work across the industry.The company seeks candidates with physics, mechanics, math, and computer science backgrounds. "We're mainly physics folks because we deal in optics, photons, electrons," Khan explains. With the new facilities, KLA Taiwan is actively recruiting positions across application engineering, field service, R&D, customer support, and sales and marketing.Why Process Control Became Make-or-BreakAs die sizes grow and devices get more complex, process control has gone from important to mission critical. Each new node brings tighter design rules, smaller features, and narrower process windows. Customers are printing tinier features, and yield becomes inversely proportional to the smallest printable feature.The stakes are incredibly high, both technologically and financially. When something goes wrong, thousands of wafers stack up behind the problem, with each carrying enormous economic weight.The AI chip challenge compounds the problem: mobile chips packed 20 billion transistors, but today's AI chips contain hundreds of billions of transistors. Die sizes have exploded. The math is brutal - if you have 10 dies per wafer and one fails, you still have nine. But if you only get two giant dies per wafer and one fails, you've lost 50%. All AI chips use massive dies, creating brutal complexity for customers.KLA's comprehensive portfolio - from BBP optical inspection to e-beam platforms to overlay metrology - monitors thousands of parameters across more than 1,000 process steps. If one step fails, yield can very quickly drop to zero.The industry shift is clear: customers are buying significantly more process-control tools because they need yield faster. Khan describes it through a straightforward lens - As semiconductor manufacturing becomes harder, KLA's capabilities become more critical, especially when a single excursion can cost hundreds of millions of dollars.AI Integration and What's NextKhan frames AI not as a trend or fashion, but as an inevitable evolution. After millions of years of biological evolution produced human neural networks - networks that gave humanity its competitive edge - the next step was always going to be artificial neural networks. This wasn't any individual's invention; it was the natural progression of how intelligence develops and scales. The universe, he suggests, essentially selects for the species with the most connected neurons. Now that same principle is extending to how we use machines to amplify our own neural connections.KLA is integrating AI directly into its tools to sharpen defect classification and speed root-cause analysis. The technology also transforms service support: every engineer now essentially walks around with an expert in their pocket. When an engineer encounters a problem, the AI network can instantly surface solutions from decades of collective troubleshooting experience. Ultimately, AI is enabling faster solutions, more productive engineers and more satisfied customers.This matters because KLA's systems use AI, customers build AI chips, and AI is reshaping every part of the manufacturing chain. It's a fundamental transformation, not a passing phase.Looking ahead, KLA is developing panel-based inspection systems (volume production expected around 2028) and high-NA EUV systems. Khan, who's spent about 30 years in the industry, maintains the semiconductor industry hasn't peaked. His reasoning is straightforward: computing demand will always trend upward, not downward. Until the walls aren't made of silicon, there's room to grow.Join the TeamKhan sums up KLA's hiring philosophy simply: maintain a stable plan, partner with universities, train people well, and grow them over time. They become advocates, which brings company success—and through that success, customers succeed.For engineering graduates and professionals interested in joining KLA Taiwan's 1,800-plus team, opportunities span application engineering, R&D, customer support, and sales and marketing. To explore opportunities, you may visit our KLA Careers or follow KLA Taiwan Facebook Fan page.KLA Taiwan values talent development and their long-term career growth, building a young and dynamic team. Credit:KLA

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs). Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS. Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies. Trymax continuously innovates to support its customers' needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.

AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas, AGI presented its next-generation high-speed and mobile storage solutions under the theme "Powering What's Next with AGI Innovation", attracting interest from global brand partners, system integrators, and professional creators.With the rapid proliferation of AI in PCs and mobile devices, the demand for high-resolution media, real-time content generation, and edge AI applications has been surging. AGI emphasizes that storage is no longer just about capacity; it has become a critical factor determining system performance, bandwidth, mobility, and reliability.The AGI President, Miranda Lee, stated, "High-speed and high-capacity storage are now a market baseline. The differentiator lies in aligning solutions with real-world usage scenarios and maintaining consistent supply and quality. In the fast-changing AI era, AGI continuously adapts its product strategy and brand positioning to meet market expectations for practical usability."CES 2026 Product Highlights: Empowering High-Performance ComputingTo support the demands of AI and high-performance applications, AGI showcased its complete next-generation storage lineup, focusing on high-performance platforms and mobile usage:1.PCIe Gen5 SSD (Project S10): Designed for intensive workloads, delivering top-tier performance while managing power consumption and heat dissipation for sustained stability.2.DDR5 Overclocking Memory (Project K10): Engineered for AI-driven platforms and high-end gaming, offering extreme bandwidth to handle complex, high-speed data processing, ensuring stability.3.Portable SSD Series: Tailored for mobile content creation and outdoor professionals, the PSSD series emphasizes durability and high-speed transfer to ensure creative work and memories are quickly and securely preserved.A User-Centric Approach for Global MarketsThe AGI President Miranda Lee further noted that AI not only accelerates the capacity demands but also reshapes how data is accessed and transferred, making portable storage essential to modern creative workflows. Rather than competing solely on technical specifications, AGI focuses on user scenarios, integrating long-term value and stability into the product design. During CES, AGI engaged in in-depth technical and market discussions with global partners, strengthening its international distribution network through its precise product roadmaps.  Looking Forward: Stability and Practicality at the Core of the BrandCES 2026 served as a pivotal milestone for AGI's expansion. Moving forward, AGI will continue investing in high-speed interfaces and performance optimization, ensuring its products deliver outstanding stability in real-world scenarios, staying true to the brand promise: Preserve Your Uniqueness.AGI is a leading provider of high-performance storage solutions, dedicated to delivering innovative products that cater to the evolving needs of its customers. With a commitment to offering cutting-edge storage capacity and superior performance, AGI empowers users with reliable solutions for an enhanced digital experience.AGI GR0NNLUX 10K showcased DDR5 Overclocking RGB Memory Module. Credit: AGITechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI TechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI Technology

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries. The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection. The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time.Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own. Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle for GPUs and AI servers has been condensed to approximately 18 months, the conventional data center construction process remains at two to three years, resulting in a structural gap where the deployment of computing capacity lags behind technology advancements.Supermicro, in collaboration with Easy Field Corporation (EFC) and Chicony Power, has unveiled the world’s first containerized compute solution built on Data Center Building Block Solutions (DCBBS). This solution is designed to expedite engineering delivery timelines and offers an alternative approach to the construction of AI infrastructure. Originally developed by Supermicro, DCBBS is a comprehensive, modular data center architecture aimed at accelerating large-scale compute deployments.In this DCBBS solution, Taiwan's Institute for Information Industry (III) acts as a coordinator for industry integration, connecting resources from IT, infrastructure, engineering consulting, and manufacturing to ensure that all stakeholders comply with a unified delivery timeline.Wang Rui-min (transliterated from Chinese), Senior Strategy Director of the Market Intelligence & Consulting Institute (MIC) at III, explained that AI computing power initiatives involve various components and parts, such as servers, networking devices, power supplies, cooling infrastructure, structural engineering, testing procedures, and international certifications. Historically, inadequate coordination methods often led to asynchronous delivery within these categories.Simon Hsu, COO of Taiwan's National Applied Research Laboratories (NARLabs), observed that traditional data center construction methodologies are inadequate in accommodating the progress of AI technology. Computing power has become a crucial resource for scientific research and industrial development, with the speed of deployment significantly impacting the evolution of both research and applications. In this context, modular and rapidly replicable computing power supply models are garnering attention.The DCBBS solution, collaboratively developed by Supermicro and several Taiwanese manufacturers, utilizes a methodical design approach. It first develops the overall data center architecture, then deconstructs tasks such as power supply, cooling, networking, fire safety, and administration into modular components.Huang Shih-chin (transliterated from Chinese), Product Manager for Supermicro's Rack Solutions, stated that this solution explicitly demonstrates computing power density in its technical specifications, addressing the requirements of various GPU generations, and introduces the notion of "Container Scale," enabling the expansion of computing power on a container-by-container basis. The engineering design prioritizes uninterrupted water, electricity, and network connectivity.The generator, transformer, chiller, and UPS are arranged in a containerized configuration, equipped with wireless environmental control and remote monitoring systems, facilitating mobility and rapid deployment of the computing units. The container is designed according to weight, stress absorption, external circumstances, and transportation certification standards, rather than conventional container specifications. The test line construction and burn-in verification have been completed, and the DCBBS system has entered the final acceptance and shipment phase.In the DCBBS project, EFC used an engineering methodology to complete system integration tasks for computing resource deployments. Chairman Paul Luo stated that, while AI servers are expensive, the primary elements determining computing power competitiveness are deployment timeframes and engineering dependability; delays or system failures result in expenditures that much surpass hardware expenses. Thus, EFC used a modular approach to organize the structural design, vibration mitigation, transportation, and certification requirements for the outdoor installation of large, high-density equipment in atypical environments, before transferring these components to the factory for assembly and verification. Luo indicated that, moving forward, computing containers will primarily be deployed in areas rich in energy resources.Consequently, what is truly finite is not electricity itself, but the ability to swiftly replicate and maintain the level of engineering execution. EFC, possessing extensive expertise in the production of large-scale structures and high-reliability systems, ensures that its computer cabinets are thoroughly prepared for acceptance and delivery before shipment. They are considered the fundamental framework and structure of the entire computing center, enabling future expansion within a managed and foreseeable technical timeline.In terms of work division, Supermicro is in charge of coordinating the full rapid delivery process, drawing on its significant experience with high-density computing clients. In recent years, the company has obtained AI processing power contracts, including those from Tesla, gaining engineering experience in high-density configurations and fast delivery, which has become a critical basis for minimizing deployment delays. Chicony Power oversees the wireless environmental control system, employing sensors, digital twins, and remote-control technology to mitigate the effects of conventional extensive cabling on deployment efficiency, hence facilitating expedited scheduling and replication of computing cabinets.EFC monitors the structural engineering design and, using its expertise in ship door manufacture, has ensured the structural integrity, vibration mitigation, and marine certification compliance for large, high-density equipment employed in outdoor settings. On the power infrastructure side, a modular Power Interface Unit (PIU) developed under the Taiwan Busway (TBC) project enables flexible and scalable power configuration. Sinotech Engineering Consultants also contributed to the end-to-end planning of JBL’s large-scale computing center in Indonesia. Overall, the DCBBS-based initiative has now entered the active implementation phase.Hsieh Chieh-shou (transliterated from Chinese), a director on Viscor Computing's board, stated that the DCBBS project is not intended as a conceptual demonstration but as an engineering solution based on the principles of deliverability and replicability.Unlike other teams that are still engaged in architectural design and strategic planning, the DCBBS project, led by Supermicro, EFC, and Chicony Power, has completed the setup of operational test lines, which include physical equipment integration, power configuration, and burn-in verification, and is ready to advance to the replication and delivery phase. As this model evolves, the team has been emulating the collaborative strategy of "national second-tier teams," thereby broadening the participation of Taiwanese firms possessing engineering and manufacturing expertise. This enables the metal and electromechanical sectors, which have faced challenges due to shifts in the global industrial landscape in recent years, to venture into computing infrastructure and pursue an additional transformation opportunity.Wang noted that the delivery approach of the DCBBS project offers significant advantages for implementing enterprises in both financial and engineering aspects. In engineering, factory modularization and pre-integration—including wiring, labeling, performance verification, and burn-in testing—conducted prior to shipment can substantially diminish the uncertainty and risk associated with repeated modifications during onsite construction abroad. Financially, acceptance and payment can come quickly after testing, shortening the project payback period and reducing foreign deployment and travel costs. He stated that this design allows computing power efforts to evolve into a business model with predictable delivery and cash flow patterns, rather than long-term investment ventures with low returns.Building on this foundation, the DCBBS project has evolved from a single compute cabinet into a sustainably scalable, modular system architecture. The team will subsequently release modules pertaining to generators, transformers, UPS, chiller units, control rooms, and coatings, while including a new 800V DC power architecture and cooling-in-rack design to improve the overall system's integrity and adaptability. Essential technical tasks, such wiring, labeling, integration, and testing, are consistently performed in Taiwan, thereby mitigating the unpredictability of international construction and expediting acceptance and payment processes. Wang emphasized that the core value of the DCBBS initiative lies not only in improving engineering and financial efficiency, but also in retaining the majority of high value-added integration and verification work in Taiwan, laying a sustainable foundation for long-term industrial competitiveness in the AI era.Taiwan-built DCBBS delivers deployable, scalable compute architecture. Credit: Easy Field Corporation

At CES 2026, the world's leading consumer and enterprise technology event, MICROIP Inc. (Emerging Stock Board: 7796), a Taiwan-based provider of ASIC design services and AI software solutions, is showcasing its latest advancements at the AI Applications Pavilion. The company is presenting its CAPS (Cross-Platform AI Powered Solutions) architecture and highlighting AIVO (AI Vision Operation), a flagship Edge AI platform that has already entered commercial deployment.Through a software-defined approach, MICROIP demonstrates how AI applications can be deployed across global environments with lower barriers to entry and higher operational efficiency - bridging the gap between proof-of-concept and real-world deployment.From Technology Demonstration to Operational AIDr. James Yang, Chairman of MICROIP, stated: "CES is not just a venue for showcasing technology—it is where AI must prove its real-world value. AIVO was not designed to maximize model benchmarks or raw hardware performance, but to address real deployment constraints in transportation security, smart agriculture, and autonomous systems, including heterogeneous network conditions, limited edge compute resources, and long-term operational costs.By starting from these real-world constraints, MICROIP has built AIVO as an Edge AI platform that can be deployed, operated, and maintained over time - allowing AI to become part of daily operations rather than remaining at the proof-of-concept stage."CES 2026 Focus: Turning Edge AI into Operational CapabilityCAPS is MICROIP's  cross-platform AI software design framework, developed to help customers define AI systems that are deployable and maintainable in production environments. At CES 2026, MICROIP presents AIVO as a reference implementation of CAPS, demonstrating how Edge AI evolves from pilot projects into scalable, operational systems.Positioned as the deployment-focused pillar within the CAPS architecture, AIVO addresses two of the most persistent challenges in Edge AI: bandwidth constraints and multi-task processing at the edge.Distributed Master–Client Architecture for Large-Scale Edge DeploymentTo support geographically distributed and large-scale deployments, AIVO adopts a master–client distributed architecture. Real-time inference is performed locally on edge devices, while system management and decision logic are centralized at the host level.Instead of streaming raw video data, edge nodes transmit only structured inference results and metadata. This design significantly reduces bandwidth requirements and allows the system to maintain centralized oversight and real-time responsiveness - even in 4G/5G or unstable network environments.Real-Time Heterogeneous Multi-Tasking at the EdgeAIVO integrates a dynamic resource scheduling mechanism that enables multiple AI models to run concurrently on a single hardware platform. In security scenarios, object detection, behavior analysis, and environmental sensing models can operate in parallel, with compute resources allocated dynamically based on task priority.This ensures that mission-critical events are processed and responded to in real time, even under constrained edge compute conditions.Proven Edge AI Applications Across Transportation, Agriculture, and Autonomous SystemsLeveraging its system architecture, AIVO has completed multiple international field validations and is now focused on high-reliability application domains worldwide:Transportation Security: AIVO is being rolled out across metro systems, railways, buses, commercial aviation, and airport environments. Edge-based AI enables real-time detection of anomalous behavior, with alerts integrated into control centers or government security systems—enhancing response capability without increasing manpower requirements.Smart Agriculture: Addressing labor shortages and an aging workforce in U.S. agriculture, AIVO uses computer vision to monitor livestock health and environmental conditions. Expert knowledge from experienced farmers is encoded into AI models, while optimized system design ensures stable operation under low-power and limited-network farm environments.AI Drones and Robotics: For infrastructure inspection and disaster response, AIVO strengthens on-device autonomy. Even in GPS-denied or connectivity-limited conditions, drones and robots can perform real-time object tracking and dynamic obstacle avoidance, expanding the use of autonomous systems in high-risk scenarios.CAPS Ecosystem: Software-Driven Hardware Through Global PartnershipsDr. Yang emphasized that CAPS represents MICROIP's holistic vision for AI software design services:"Through vertical integration of AIVO as the deployment platform, XEdgAI as the system development platform, and CATS as our custom ASIC service, we establish a core advantage where software defines hardware specifications and real-world applications validate design direction."To accelerate global adoption of this model, MICROIP announced at CES 2026 strategic partnerships with Axelera AI (Europe), Axiomtek, Lex System, and U.S.-based Physical AI and robotics integration startup Universal AI Services, forming an international Edge AI alliance.Through CAPS' cross-platform compatibility, MICROIP has integrated mainstream AI chip platforms with industrial-grade hardware to deliver end-to-end, software-defined hardware Edge AI solutions. This strengthens MICROIP's technical leadership within the Edge AI ecosystem and enables customers worldwide to deploy high-performance, low-power AI systems across transportation, agriculture, and robotics applications.CES 2026 Exhibition Information – Next-Generation Edge AI Solutions,Dates: January 6–9, 2026;Location: Las Vegas, USA; Hall: North Hall;Booth: #9277.For more information on MICROIP, please visit MICROIP website.

EDOM Technology (TWSE: 3048), Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the growing demand from system integrators, equipment manufacturers, and enterprise customers for balanced performance, power efficiency, and deployment flexibility. With powerful inference capability and a lightweight design, NVIDIA Jetson T4000 enables faster implementation of practical physical AI applications.Powered by NVIDIA Blackwell architecture, NVIDIA Jetson T4000 supports Transformer Engine and Multi-Instance GPU (MIG) technologies. The module integrates a 12-core Arm Neoverse-V3AE CPU, three 25GbE network interfaces, and a wide range of I/O options, making it well suited for low-latency, multi-sensor, and real-time computing requirements. In addition, Jetson T4000 features a third-generation programmable vision accelerator (PVA), dual encoders and decoders, and an optical flow accelerator. These dedicated hardware engines allow stable AI inference even under constrained compute and power budgets, making the platform particularly suitable for mid-range models and real-time edge applications.For system integrators (SIs), the modular architecture of Jetson T4000, combined with NVIDIA's mature software ecosystem, enables rapid integration of vision, sensing, and control systems. This significantly shortens development and validation cycles while improving project delivery efficiency especially for multi-site and scalable edge AI deployments.For equipment manufacturers, Jetson T4000's compact form factor and low-power design allow flexible integration into a wide range of end devices, including advanced robotics, industrial equipment, smart terminals, machine vision systems, and edge controllers. These capabilities help manufacturers bring stable AI inference into products with limited space and power budgets, accelerating intelligent product upgrades.Enterprise users can deploy Jetson T4000 across diverse scenarios such as smart factories, smart retail, security, and edge sensor data processing. By performing inference and data pre-processing at the edge, organizations can reduce system latency, lower cloud workloads, and improve overall operational efficiency - while maintaining system stability and deployment flexibility.In robotics and automation applications, Jetson T4000 features low power consumption, high speed I/O and compact footprint make it an ideal platform for small mobile robots, educational robots, and autonomous inspection systems, delivering efficient and reliable AI computing for a wide range of automation use cases.NVIDIA Jetson product lineup spans from lightweight to high-performance modules, including Jetson T4000 and T5000, addressing diverse requirements ranging from compact edge devices and industrial control systems to higher-performance inference applications. With NVIDIA's comprehensive AI development tools and SDKs, developers can rapidly port models, optimize inference performance, and seamlessly integrate AI capabilities into existing system architectures.Beyond supplying Jetson T4000 modules, EDOM Technology leverages its extensive ecosystem of partners across chips, modules, system integration, and application development. Based on the specific development stages and requirements of system integrators, equipment manufacturers, and enterprise customers, EDOM provides end-to-end support - from early-stage planning and technical consulting to ecosystem enablement. By sharing ecosystem expertise and practical experience, EDOM helps both existing customers and new entrants to the edge AI domain quickly build application capabilities and deploy edge AI solutions tailored to real-world scenarios.For more information on NVIDIA Jetson T4000, please visit website.

DigiKey, has introduced an industry-power supply configuration tool, which simplifies the process of designing power supply solutions.Developed for engineers, designers, and system integrators, this intuitive online tool enables the quick selection of key attributes - such as outputs, voltage, current and more - to generate a tailored power supply solution that meets users’ desired requirements. Once configured, the custom power supply is assembled and shipped directly within days. Hosted on DigiKey's trusted, high-performance website, the configurator enables fast and accurate selection and sourcing - making it easier than ever to design, customize and order the right power solution for the project."DigiKey is thrilled to offer this industry-first tool that allows our customers to configure their own power supply independently," said Heather Fulara, senior director, interconnect and electromechanical for DigiKey. It dramatically reduces the time it takes to acquire a configured unit, which allows for more efficient workflows, saving time and accelerating design.The tool available from DigiKey currently features the NEVO+ and VCCM series from Vox Power, which is the first supplier involved in the program."Vox Power is proud to collaborate with DigiKey as the first supplier to participate in this innovative, time-saving tool," said Marco Prinsloo, co-owner of Vox Power. "We trust DigiKey's expertise in making our customers' designs come together seamlessly through its efficient online design and customization options."

AGIBOT, a leading robotics company specializing in embodied intelligence, today marks its official entry into the U.S. market at CES 2026, showcasing one of the industry's most comprehensive humanoid robot portfolios, backed by the shipment of 5,000 robots to date. At a time when most of the humanoid robotics industry is still in prototype or pilot phases, AGIBOT's showcase at CES highlights its accomplished transition: from advanced R&D to a full portfolio of mass-produced humanoids already deployed at scale in real-world operations.At the heart of AGIBOT's technology is its innovative "One Robotic Body, Three Intelligences" architecture, which deeply integrates interaction, manipulation, and locomotion capabilities into a unified humanoid platform, creating a distinct competitive edge over traditional robotics. These robots excel in rapid adaptation to diverse scenarios, delivering swift responses to market demands and driving significant productivity improvements through enhanced efficiency and automation. Committed to open collaboration, AGIBOT invites global technology partners, developers, and ecosystem players to join in advancing embodied AI and building a mutually beneficial robotics future."Bringing our full robotics portfolio to CES marks a defining moment for AGIBOT," said Dr. Yao Maoqing, Partner at AGIBOT, Senior Vice President, and President of the Embodied Business Unit, "it demonstrates how we are able to build an ecosystem of humanoid robots, not for a single task or setting, but for a future where embodied intelligence can serve people across industries, environments, and everyday life."Introducing AGIBOT and Its Full Humanoid Robotics PortfolioAGIBOT was founded in 2023 with a clear ambition reflected in its name: building robots for the AGI era. Rather than creating single-purpose machines, AGIBOT is focused on developing embodied intelligent robots that can learn, adapt, and evolve in the real world.At CES 2026, AGIBOT presents its full lineup of embodied robots for real-world deployment. The portfolio includes the AGIBOT A2 Series, full-sized humanoids enabling multimodal interaction and autonomous navigation for guided presentations and showroom spaces; the AGIBOT X2 Series, half-sized compact humanoids that can interact naturally with people, walk in a humanlike way, and perform complex, expressive movements, designed for entertainment, research and education; and the AGIBOT G2 Series, industrial-grade embodied robots combining interactive intelligence with precise force-controlled manipulation for rapid deployment in industrial environments. The lineup is further complemented by the AGIBOT D1 Series quadruped robots for inspection and operations in complex environments, as well as OmniHand, AGIBOT's dexterous manipulation system for embodied robotic platforms.What unifies AGIBOT's diverse humanoid lineup is its "one robotic body, three intelligences" framework. Each robot is designed around the balanced integration of motion intelligence, interaction intelligence, and task intelligence, enabling natural movement, meaningful communication, and reliable execution of real-world tasks. This system-level approach allows AGIBOT robots to move beyond isolated demonstrations and toward sustained, scalable deployment across real commercial and societal settings.

Actxa, a Singapore-based preventive health technology company, recently announced significant enhancements to its proprietary BGEM technology, the world's first clinically backed, non-invasive, AI-driven blood glucose evaluation and monitoring technology. The advancements strengthen BGEM's ability to deliver medical-grade glucose insights through everyday wearables.One key innovation is BGEM Glucose Range, a clinically backed, medical-grade technology that estimates blood glucose levels within a numeric range using a quick, one-minute measurement. Developed using data collected through clinical studies, BGEM Glucose Range offers pain-free and meaningful glucose insights anytime, throughout the day, it provides a cost-effective and convenient approach, making glucose monitoring accessible and sustainable.BGEM Glucose Range: Medical-Grade, Non-Invasive Glucose InsightBGEM Glucose Range represents a major advancement in non-invasive glucose evaluation. Using data from clinical studies, the technology estimates glucose levels within a dynamic range to enable convenient metabolic monitoring throughout the day.Designed for wearable integration, BGEM Glucose Range delivers a cost-effective alternative to traditional glucose monitoring methods. BGEM Glucose Range combines wearable PPG sensors and AI-driven analysis of digital biomarkers to estimate blood glucose results.Everyday Glucose Awareness on the Core Smart RingIn addition, the Core Smart Ring, Actxa's first smart ring under the Core range, is integrated with the AI Glucose Scan feature, powered by BGEM Glucose Status technology, to help users take better control of their metabolic health. The feature enables users to check their glucose status and receive a Normal or Elevated result linked to daily habits.Developed using clinically collected data, AI Glucose Scan interpretsPhotoplethysmography (PPG) signals from the Core Smart Ring to provide simple, everyday glucose awareness. Paired with lifestyle and wellness guidance, the Core Smart Ring's AI Glucose Scan supports healthier decision-making and metabolic awareness.Driving the Future of Non-Invasive Glucose Monitoring"Glucose health is becoming a defining challenge for global preventive health, yet most monitoring solutions remain invasive, costly or difficult to sustain," said Marcus Soo, Chief Executive Officer of Actxa."We want to make health insights simple, personal, and actionable. Actxa is empowering individuals and partners to integrate preventative health and glucose awareness into everyday life.