As the focus on global climate change and environmental issues grows, MEAN WELL, with a strong foundation in standard power supply, continues to provide the market with high-quality electricity hardware. At the same time, we leverage our long-established expertise to integrate the capability from Suzhou SHARE WELL Intelligent Technology, a subsidiary of the SDG Group, launching all-encompass smart system solutions.To help clients quickly access the comprehensive information and accelerate the system application system, we set up a "C3 Green Technology Hall" at the virtual expo, where visitors can explore SHARE WELL Intelligent Technology's new products, application areas, and key features.SHARE WELL Intelligent Technology provides a comprehensive one-stop solution for intelligent system planning, design, and constructionSHARE WELL Intelligent Technology's Intelligent Product Application covers four main areas: the visualized smart building management platform, intelligent security, building control, and energy-saving management. By empowering data and following the standard operation procedure (SOP), the system automates over 70% of the daily management tasks, improving operational efficiency. With AI technology, the system is capable of scenario monitoring, such as detecting blocklist intruders, illegal entry, crowd gathering, violated parking, and smoking, ensuring both safety and efficiency. The system can quickly respond to various security needs, including preemptive warnings, decision-making during incidents, and post-event analysis, helping to transform the park security supervision from traditional monitoring into data-driven intelligent management.Regarding energy management, the system statistically analyzes data within the park from the various types, dimensions, and levels and categorizes it by types, items, and zones. It also supports immediate and past data analysis, helping the corporates optimize energy strategy, and reducing operational costs. The intelligent platform also provides a visualized interface, allowing staff to monitor every situation within the park in real time and to quickly identify the issues and implement solutions, significantly enhancing management efficiency.SHARE WELL Intelligent Technology's comprehensive solutions bring powerful system integration and launch diverse and innovative products customized for demands from all sectors and scenarios. A series of products self-developed by SHARE WELL Intelligent Technology aims to help clients optimize their business operation and up-grade to intelligent management, including the one-card system, turnstile machine, face recognition device, video monitoring system, parking system, intelligent lighting system, energy management system, building automated system, and visualized park management platform.As intelligent technology advances, SDG Group enforces the integration between software and hardware. It keeps investing in research and development to realize the "4S + 3 High" strategy, where the 4S represents System, Software, Solution, and Service. In contrast, the 3 highs are High Productivity, High Added Value, and High Cost-performance Ratio. Additionally, we will enhance our collaboration with other companies to expand the range of one-stop services, offering customers more intelligent and efficient energy solutions.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several High-Performance Computing (HPC) solution providers. This cutting-edge ASIC is expected to tape out this year and will feature the latest 9.2Gbps HBM3E memory technology.While GUC's HBM3E Controller and PHY IPs are being adopted by many AI companies, GUC is actively collaborating with HBM providers, like Micron, and developing HBM4 IP for next-generation AI ASICs.GUC HBM3E IP Highlights1. Proven across TSMC advanced process technologies: Ready on the TSMC N7/N6, N5/N4P, N3E/N3P processes.2. Silicon validated with all major HBM3 vendors3. Silicon validated on both TSMC CoWoS-S and CoWoS-R technologies: GUC designs eDTC for the TSMC CoWoS-S and IPD for the TSMC CoWoS-R to achieve the best power integrity.4. Advanced Interposer Routing: Patented interposer layout to support angle routing with a Y-dimension offset while keeping the best signal and power integrity.5. Built-in chiplet interconnect monitoring solution: GUC collaborates with proteanTecs and has integrated chiplet interconnect monitors into the HBM PHY. This feature enhances chiplet observability and reliability.6. Full 2.5/3D multi-die design service: GUC provides optional 2.5D and 3D service for HBM CoWoS ASIC platform design.Image: Eye diagram of HBM3E 9.2GImage: Interposer Angle RoutingImage: GUC provides total service for 2.5D/3D ASIC designCollaborative efforts between GUC and Micron have demonstrated the GUC HBM3E IP with Micron's HBM3E can achieve 9.2Gbps on both CoWoS-S and CoWoS-R technologies. The silicon results on GUC's test chip show passing PI and SI results with excellent eye margin across temperature and voltage corners with Micron's HBM3E at these speeds. Additionally, GUC's HBM3E IP when integrated with Micron's HBM3E timing parameters exhibit better effective bus utilization, further enhancing overall system performance."We are thrilled to see our HBM3E Controller and PHY IP being integrated in CSP and ASICs," said Aditya Raina, CMO of GUC. "This adoption underscores the robustness and advantages of our HBM3E solution, which is silicon-proven and validated across multiple advanced technologies and major vendors. We look forward to continuing our support for various applications, including AI, high-performance computing, networking, and automotive.""Memory is an integral part of AI servers and foundational to the performance and advancement of data center systems," said Girish Cherussery, senior director of Micron's AI Solutions Group. "Micron's best-in-class memory speeds and energy efficiency greatly benefit the increasing demands of Generative AI workloads, such as large language models like ChatGPT, sustaining the pace of AI growth."Website: www.guc-asic.com

Wolfspeed, Inc. (NYSE: WOLF), the global leader in silicon carbide technology, today unveiled a silicon carbide module designed to transform the renewable energy, energy storage, and high-capacity fast-charging sectors through improved efficiency, durability, reliability, and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC Bus applications were developed and launched utilizing Wolfspeed's state-of-the-art 200mm silicon carbide wafers.The 2300V baseplate-less silicon carbide power modules for 1500V DC Bus applications were developed and launched utilizing Wolfspeed's state-of-the-art 200mm silicon carbide wafers.Wolfspeed also announced today that it is partnering with EPC Power, a premier North American utility-scale inverter manufacturer. EPC Power will be employing the Wolfspeed modules in utility-grade solar and energy storage systems, which offer a scalable high-power conversion system and high-performance controls and system redundancy."The solar and energy storage market remains among the fastest-growing segments of the renewable energy industry. As the pioneers of silicon carbide, we are driven to create solutions that will open the door to a new era of modern energy," said Jay Cameron, Wolfspeed Senior Vice President and General Manager, EPC Power. "Energy efficiency, reliability, and scalability are top of mind for our customers, such as EPC Power, who recognize the substantial advantages Wolfspeed's silicon carbide brings to the table.""Silicon carbide devices open the door to a step-change in inverter performance and reliability. With our commitment to extreme reliability, performance, and security in our new 'M' inverter while also forging a deep commercial relationship with key suppliers, Wolfspeed was the obvious choice," said Devin Dilley, President and Chief Product Officer of EPC Power.With mounting global investment in renewable energy, the solar energy market is estimated to reach a $300 billion market capitalization by 2032. According to the International Energy Agency (IEA), 2024-25 will see the highest energy demand growth rate since 2007, reinforcing the need for efficient and reliable clean power. Wolfspeed's silicon carbide solution helps bridge this crucial gap, supporting the next era of modern energy technologies while reinforcing US clean energy manufacturing leadership.Cameron continued, "This platform further validates our investments in 200mm wafer technology and production as the potential of silicon carbide continues to be recognized by industry leaders across all mission-critical applications."Click here to learn more about Wolfspeed's partnership with EPC Power.Industry-leading switching performanceWolfspeed's 2300V modules will improve system efficiency while reducing the number of passive components. They offer 15% greater voltage headroom compared to similar silicon carbide modules, improved dynamic performance with consistent temperature stability, and a substantial reduction in EMI filter size. Wolfspeed's technology achieves a 77% reduction in switching losses over IGBTs and a 2-3x reduction in switching losses for silicon carbide devices intended for 1500V applications.Market scalability through design simplification2300V silicon carbide modules will allow system designers to leverage lower-cost printed circuit boards to cut manufacturing costs and significantly reduce development time compared to legacy bus bar solutions. Furthermore, Wolfspeed's 2300V modules will enable the industry to adopt the two-level topology, resulting in simplified system design and reduced driver count compared to IGBT-based three-level configurations. The benefits of 2300V modules support a building block approach to easily scale power tenfold, from kilowatts to megawatts.Prolonged system lifetimes & durabilityWolfspeed's 2300V silicon carbide modules will allow customers to further enhance the lifetime and durability of their systems. This is achieved through an optimized Failure in Time rate for continuous 1500V DC operation and improved cosmic ray susceptibility compared to a 2000V design. When used in a two-level implementation, 2300V modules reduce the amount of potential single points of failure across the system.Visit our website for additional information about technical specifications of Wolfspeed's pioneering 2300V module technology.About Wolfspeed, inc.Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of silicon carbide technologies that power the world's most disruptive innovations. As the pioneers of silicon carbide, and creators of the most advanced semiconductor technology on earth, we are committed to powering a better world for everyone. Through silicon carbide material, power modules, discrete power devices, and power die products targeted for various applications, we will bring you The Power to Make It Real. Learn more at www.wolfspeed.com.Forward-looking statements:This press release contains forward-looking statements by Wolfspeed involving risks and uncertainties, both known and unknown, that may cause Wolfspeed's actual results to differ materially from those indicated. Actual results may differ materially due to a number of factors, including the risk we may be unable to manufacture these new products with sufficiently low cost to offer them at competitive prices or with acceptable margins; the risk we may encounter delays or other difficulties in ramping up production of our new products; customer acceptance of our new products; the rapid development of new technology and competing products that may impair demand or render Wolfspeed's products obsolete; and other factors discussed in Wolfspeed's filings with the Securities and Exchange Commission, including its report on Form 10-K for the year ended June 30, 2024, and subsequent filings. For additional product and company information, please refer to www.wolfspeed.com.Wolfspeed is a registered trademark and The Power to Make It Real is a trademark of Wolfspeed, Inc.