Wise Integration, a pioneer in digital control for gallium nitride�]GaN�^and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer. Kaiser succeeds CEO and co-founder, Thierry Bouchet, who will continue to serve as Chief Technology Officer and General Manager, leading the worldwide R&D and driving the technological vision.A seasoned high-tech leader with a proven track record in growing and leading global teams in the semiconductor industry, Kaiser brings deep experience in scaling deep-tech ventures. In 2006, he cofounded Docea Power, a French EDA startup pioneering full-chip, system-level power and thermal modelling, with the vision of addressing the growing power-consumption and thermal challenges in IC and platform design.As CEO, he led the company to domain leadership and its acquisition by Intel in 2015. He then joined Intel, where for the next decade he held senior director roles, most recently overseeing system-simulation engineering and worldwide customer-enablement organization. Those programs tackled the most critical power, thermal, and performance challenges in designing consumer, data-center, and AI systems. Kaiser began his career at STMicroelectronics, where he held technical and leadership positions across test and product engineering, design, and architecture teams.Targeting Fast-Growing MarketsWith Kaiser’s appointment, Wise Integration is positioning itself to scale globally and capitalize on booming markets such as data centers powering artificial intelligence (AI), and electric vehicles (EV)-which demand more efficient, compact, and digitally controlled power architectures."I'm thrilled to join Wise Integration and build on its success in providing customers differentiated solutions in power electronics to meet their biggest challenges," Kaiser said. "This talented team has created an R&D-driven culture and a robust foundation to lead the GaN power electronics transformation globally."The Next Chapter"On behalf of the board of directors, I am pleased to welcome Ghislain Kaiser as Wise Integration's new CEO, and to compliment the team for their exceptional work," said Board Chairman Patrick Boulaud. "This marks a major milestone for the company as it transitions from a CEA�HLeti spinout into a pioneering force in GaN and digital power management innovation with strong growth potential. Ghislain's background makes him a natural choice as the CEO to guide the company through this next stage of growth.""Ghislain's arrival begins a new chapter for Wise Integration," Bouchet added. "With our WiseGan devices and WiseWare digital control, we've built a strong foundation in consumer markets. Now it's time to scale our innovations and tackle the next big challenges-bringing unmatched efficiency and power density to AI servers, data centers, and tomorrow's automotive systems."Selected Highlights (2020–2025)Spun out from CEA-Leti in 2020 using the institute's GaN-on-silicon R&D platform. Developed proprietary WiseGan IC and WiseWare microcontroller. Launched its fully digital controller, WiseWare 1.1. Opened a design center in Canada and established an Asian subsidiary in Hong Kong.Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth.WISE

The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While digital transformation greatly improves efficiency, it also exponentially expands the overall attack surface. In this model, risks are no longer isolated but systemic and cascading. Supply chain efficiency is built on an implicit digital trust model between partners, which is manifested through application programming interfaces (APIs), shared portals, and integrated software. However, this trust structure, built in pursuit of efficiency, has become a primary attack vector. Cybercriminals are no longer just breaking through firewalls—they are exploiting the fundamental fabric of digital collaboration. As a result, the traditional perimeter defense model is outdated; The new perimeter of defense is the entire supply chain ecosystem, and its security must be built on a zero-trust model enforced with cryptography.Third-party or fourth-party vulnerabilitiesAttackers often use the weakest link in the chain—often smaller, poorly secured vendors—as a springboard to infiltrate the network of their ultimate high-value target. This highlights a stark reality: an organization's security posture is only as strong as its least secure partners. This risk stems from the pursuit of supply chain efficiency, as the smooth operation of business processes requires granting partners a considerable degree of access. This expansion of access rights, without corresponding strict security controls, constitutes a systemic vulnerability based on excessive trust.The fundamental role of traditional cryptography and its limitationsCurrent supply chain security relies heavily on traditional public key cryptography (such as RSA, ECC) to protect data in transit and at rest. Mitigation strategies such as data encryption (using AES), risk assessment, and incident response plans are crucial, but their effectiveness is built on the strength of these underlying cryptographic algorithms. While these methods are still effective against today's threats, the entire security foundation is fragile and faces an existential threat that will be the focus of the next section.Quantum Horizons: A Paradigm Shift in Cryptographic ThreatsQuantum computers use quantum mechanical principles such as superposition and entanglement to solve mathematical problems (e.g., integer factorization, discrete logarithms) that form the security basis of today's public key cryptography (RSA, ECC, Diffie-Hellman). This is not a purely theoretical deduction, but a major engineering challenge that is making rapid progress. Once a quantum computer with sufficient scale and stability comes out, the current encryption system that protects global digital communications will fail in an instant."Get First, Decrypt Later" (HNDL): An imminent dangerThe Harvest Now, Decrypt Later (HNDL) attack transforms the quantum threat from a futuristic problem to a present reality. The mechanism is that attackers, especially state-state actors, are actively intercepting and storing large amounts of today's encrypted data. These attacks target information with long-term value, such as intellectual property, government secrets, financial records, medical data, and personally identifiable information (PII).This means that by the time a "Cryptographically Relevant Quantum Computer" (CRQC) appears that can crack current encryption algorithms (known as "Q-Day", which is expected to arrive as early as 2035), these obtained data will be retroactively deciphered. Therefore, the security of any sensitive data transmitted today that requires long-term confidentiality is already at risk.This attack pattern transforms a company's data retention policy into a huge potential security liability. Regulations such as the Health Insurance Portability and Accountability Act (HIPAA) or the General Data Protection Regulation (GDPR) often require organizations to retain data for an extended period. The HNDL attack vector turns this legal compliance requirement into a potential ticking time bomb. Organizations are legally required to encrypt data stored for years, making it an ideal target for HNDL attacks. This creates a direct conflict between compliance and security: the act of adhering to data retention regulations inadvertently creates vulnerabilities for future quantum decryption threats. Therefore, risk management and legal teams must be immediately involved in the migration strategy of post-quantum cryptography. This is no longer just an IT issue, but a simmering corporate governance and compliance crisis.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Post-Quantum Cryptography (PQC): Laying the foundation for quantum resilienceDefinition of post-quantum cryptographyPost-quantum cryptography (PQC) refers to traditional algorithms that are designed to run on today's classical computers but are resistant to attacks from both classical and quantum computers. This distinguishes PQC from quantum cryptography, which requires specialized hardware, such as quantum key distribution, or QKD. PQC's goal is to develop a new generation of public-key cryptographic systems based on mathematical problems that are equally difficult for quantum computers.NIST PQC Standardized Process: A globally recognized markThe National Institute of Standards and Technology (NIST) has led a multi-year, transparent, and collaborative global process to select and standardize the next generation of public key algorithms. This process is crucial in building trust in the new standard. The process began in 2016 with a public call for proposals, receiving 82 proposals from 25 countries and undergoing multiple rounds of rigorous public review and analysis in the global cryptography community.The finalization of NIST standards is the starting gun that triggers a massive technology update cycle across the tech industry. This was not only an academic milestone but also a turning point in business and logistics. It directly prompted government agencies such as CISA and the National Security Agency (NSA) to issue migration directives, which in turn pushed major software vendors and hardware manufacturers such as Microsoft and Google to integrate these specific algorithms into their products. This ripple effect ultimately extends to enterprises, who must plan their migrations to maintain compatibility and security. NIST standards are the core domino that initiates PQC adoption worldwide.Secure the edge: Protect IoT and operational technology equipment in the supply chainInternet of Things (IoT) and operational technology (OT) devices face the biggest challenges in PQC migration for the following reasons:*Long life cycle: The device may be used in the field for 10-20 years without replacement.*Limited resources: Limited processing power, memory, and energy budgets.*Lack of Updability: Many devices are not designed to be conducive to easy firmware or cryptography updates.The application of PQC in these areas will be gradual and there will be significant differences between the old and new systems. For "greenfield" systems, such as new IoT product lines, PQC can be integrated from the outset. For "brownfield" systems, such as existing factory OT equipment, the challenge is enormous, often requiring the entire hardware to be replaced. This means that the PQC migration of the supply chain will be a two-speed process. Businesses must prioritize the adoption of PQC in new systems while developing long-term, potentially costly, retirement or retrofit capital plans for existing assets that are not quantum-safe.Use cases for PQC include:*Industrial automation: Protecting communication between sensors, controllers, and management systems in factories and processing plants.*Smart Infrastructure and Logistics: Protecting smart grid equipment, traffic control systems, and connected logistics sensors.*Automotive V2X Communication: Secure vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications to ensure security and prevent malicious manipulation.*Healthcare Supply Chain: Ensuring the integrity and privacy of data from connected medical devices.Conclusion and recommendationsWinbond's W77Q Secure Flash Memory is a robust solution to address the PQC threats mentioned above. Key PQC-Safe features of the W77Q Secure Flash include:*Platform Resilience: In accordance with NIST 800-193 recommendations, the system automatically detects unauthorized program changes and can automatically restore to a secure state to avoid potential cyberattacks. *Security Software Update and Fallback Protection: Supports remote security software updates while preventing fallback attacks, ensuring that only legitimate updates can be executed. To maintain the highest level of security and integrity, the W77Q adopts the quantum-secure Leighton-Micali signature (LMS) algorithm recommended by NIST Special Publication 800-208 to ensure the authenticity and integrity of updated software, providing additional security*Secure Supply Chain: Secure Flash ensures the origin and integrity of flash content at every stage of the supply chain. The W77Q implements LMS-OTS-based remote authentication (NIST 800-208). This advanced method effectively prevents content tampering and misconfiguration during assembly, transportation, and configuration, protecting the platform from cyberattacks.Winbond's secure flash solutions help system manufacturers meet industry regulatory compliance requirements, improve platform security, and improve supply chain information and communication security during production, shipping, and construction and operation.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.