Japan announced that it would demonstrate its autonomous vehicle technology during the Tokyo Olympics as a demonstration of intelligent automobiles. Driven by 5G and artificial intelligence (AI), the ICT industry is heading towards an era of autonomous vehicles. The applications of ICT technologies in cars have been gradually shifted from entertainment videos, audio playbacks and navigation systems in early days to developing deep learning and vehicle-to-everything (V2X) communication in order to eventually make autonomous vehicles a commerical reality. To achieve this goal, semiconductor will undoubtedly be the primary driving force for any ICT technology.Advanced driver assistance system (ADAS) is the most popular application in the current automotive environment. It is composed of many functions such as Adaptive Cruise Control (ACC), Autonomous Emergency Braking (AEB), Blind Spot Detection (BSD) and Driver Monitoring System (DMS). Car vendors have been trying to work on more active safety protection and expect to reach the ultimate goal of self-driving cars. As such, more semiconductor manufacturers are cooperating with car OEM to boost device reliability.As mentioned above, currently there have been many actual semiconductors applications for automobiles, including the power semiconductors and video and audio playback and integration systems used in electric vehicles (including hybrid electric vehicles), micro-controllers/digital signal processor/semiconductor sensors used for vehicle and passive safety, and many other types of memories (such as NOR and DRAM). According to the statistics of IHS, the total output value of automotive semiconductor industry has grown at an average annual rate of about 7% in the past few years.DRAM applications in automobilesIn most systems in automobile, DRAM is responsible for storage of program codes and computing data, and it plays a more important role during the development of automobiles with more and more ICT functions, which include but are not limited to personal computers (PCs), servers, mobile devices and vehicles. So far, the primary memory-based automotive applications are information & entertainment system and ADAS, and they account for more than 80% of the entire output value of automotive DRAM industry.Among all ADAS applications nowadays, DRAM is mainly used for applications related to radar/lidar sensing and camera sensing in which large-size data of the environment has to be stored or processed by the domain controller in time. Therefore high bandwidth and high computing performance is required for controller and DRAM, and it will increase along with enhanced sensor resolution. To meet this requirement, LPDDR4/4x DRAM has become more and more popular in such applications because it supports data transfer rate up to 4266Mbps. In terms of information & entertainment applications, the major systems are instrument cluster, infotainment and telematics. DRAM is used in instrument cluster and infotainment systems for graphic function and is used in telematics system for data transmit function. The early development led to the long-term use of DDR (DDR2/DDR3) series. However, due to the power saving requirement of automobile, low power memory (LPDDR) has been gradually take the place of DDR, and LPDDR4/4x is becoming mainstream.It is interesting to see that, in addition to DRAM capacity, the performance is also a critical factor among these applications. Due to the large variety of automotive applications, not all of them require large capacity DRAM. More frequently seen applications actually require computation performance. For example, various automotive sensing technologies will rely on high speed computation to generate real-time results to be immediately used by on-board electronics devices. As a result, small-capacity LPDDR4x DRAM will play important roles in those applications.The importance of reliabilityComparing to consumer product, a major difference of automotive product is that not only the quality state of on-board electronics device upon factory delivery is concerned, but also whether it could operate normally for a long time. Cars are often driven in all kinds of weather and environment, so automotive semiconductor must withstand high and low temperatures in order to operate normally for many years. During driving, any mistake could result in extreme danger. That's why reliability of automotive semiconductor is so important. After all, the rebooting can solve most problems for consumer electronics products, yet for a moving vehicle this is not a feasible solution.Common hardware reliability issues of automotive semiconductor are errors in die and packaging. The possible errors in die include transistor instability, ion contamination, electromigration (EM) of metal conductor, and Electrostatic Discharge (ESD) while the reliability errors relating to packaging include warpage of packaging.In order to solve the aforementioned hardware reliability issues, the "High Temperature Operating Lifetime Test" (HTOL) will be conducted before product mass production to simulate the product operation status during high temperature acceleration. The "Burn In" process in the mass production line can be used for testing "Early Failure Rate" (EFR) of defective process component. As for the packaging, the warpage deformation can be solved via Board Level Reliability.Winbond has years of experience in fabrication of automotive memoryWinbond owns self-built wafer fabs, and is one of the top four IC makers that can simultaneously provide DRAM and NOR/NAND FLASH. The production lines of automotive DRAM include SDRAM, DDR/2/3 and LPDDR/2/4/4x with capacity ranging from 16Mb to 8Gb. It can meet customers' strict requirements of management of automotive memories, and provide longevity services. The capacity of Winbond LPDDR4/4x DRAM series is 1~8 Gb with 25nm technology node which is self-developed by Winbond, and the speed could be up to 4266Mbps. In addition to the supply type of known good die, Winbond also provides the standard 200BGA package with various kinds of automotive grade whereas AG1 grade will be ready at 3Q'20.With the products certified by IATF 16949 and AECQ-100 standards, Winbond has been a supplier of many automotive electronics devices manufacturers for many years. In the future, as more ADAS functions enter the car and gradually realize the self-driving cars, Winbond will continue to provide products with good performance and reliability to support customers in automotive industry.(Note: Hsiu-Min Lin is DRAM technical manager at Winbond Electronics.)Winbond LPDDR4/4x

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a new version of QspiNAND Flash designed for use with the Qualcomm 9205 LTE Modem.The industry's first 1.8V, 512Mbits (64Mega Bytes) QspiNAND Flash from Winbond Electronics offers the right density for designers of New Cellular NB-IoT Modules."As the Internet of Things expands to 50 billion connected devices by 2020, Quad SPI-NAND adoption rate may increase 4-5 fold within a few years," said Alan Niebel, president of WebFeet Research, an independent market-research firm. "Winbond's 1.8V QspiNAND Flash is suitable for both Automotive and IoT segments. NB-IoT is poised to grow in this new connected world with shipments that may reach 685M units worldwide by 2023"."Winbond is proud and committed to innovate and differentiate by designing our QspiNAND Flash KGD solution for use with the Qualcomm 9205 LTE Modem from Qualcomm Technologies," said Syed S. Hussain, Director Segment Marketing, Winbond Electronics America Flash Business Group. "We continue to work closely with Qualcomm Technologies on the Memory components for the next-generation LTE Modem solutions for IoT applications."Winbond expands its reach from traditional QSPI-NOR Flash to QSPI-NAND Flash, giving customers the flexibility to choose their Code Storage Feature-Set to expand with minimal cost. This is done by using the same 6-pin signals and QSPI command-set for SLC NAND Flash densities without compromising performance by utilizing the new Continuous READ feature at 104MHz Read Speed."Qualcomm Technologies has tested and qualified the Winbond QspiNAND Flash as a stacked KGD solution with the Qualcomm 9205 LTE Modem, allowing our OEM customers to create extremely small form factor systems," said Vieri Vanghi, vice president, product management, Qualcomm Europe Inc. "We are proud of our long-standing collaboration with Winbond, and look forward to continuing to provide leading IoT technology solutions together."W25N QspiNAND Flash family devices are offered in space-saving 8-pin packages which was not possible in the past for typical SLC NAND Flash memory. W25N512GW is a 512M-bit memory array organized into 32,768 programmable pages of 2,112 bytes each. W25N512GW provides a new Continuous Read mode that allows for efficient access to the entire memory array with a single Read command that is ideal for code shadowing applications.Clock speeds of 104MHz allow equivalent 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, an on-chip feature is provided to perform bad block management.To ensure meeting the growing global demand for high-volume solutions, Winbond QspiNAND Flash memories are manufactured in the company's 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet and to ensure support for new business growth anticipated in both Automotive and IoT Segments."Expanding the SpiFlash family to include QspiNAND Flash will benefit the NOR market and SLC NAND Flash conversion from both QSPI-NOR Flash and Parallel NAND Flash," said J.W. Park, Technology Executive of Winbond Flash Memory. "Winbond jointly-developed this new 512Mb QspiNAND Flash with Baseband Engineering-Team in delivering high performance with cost-benefit in mind."The 1.8V QspiNAND Flash memories feature:Low Power, Wide Temperature Range*Single 1.75V - 1.95V supply*25mA active, 10μA standby, 1μA Deep Power Down*-40 degree C to +85 degree C operating range, Industrial GRADE*-40 degree C to +105 degree C operating range, Industrial plus and Automotive GRADEUnique Memory Architecture*Page Read Time with ECC Enabled: 60μs*Page Program Time: 250μs (typ.)*Block Erase Time: 2ms (typ.)*Fast Program/Erase performance*Supports OTP Memory AreaHigh-Performance QspiNAND Flash*QSPI implementation in 46nm process technology*More than 10-years data retention*104MHz clock frequency that can support up to 52MB/S continuous data transfer rate*Space Efficient Packaging*WSON8 6x8mm*WSON8 5x6mm*TFBGA24 6x8mm*KGD (Known Good Die)W25N512GW is available now. For QspiNAND Flash specific details, please contact www.winbond.com.Winbond QspiNAND

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications.HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which makes the circuit board layout simpler and the wiring area relatively small. Several IC design service companies have launched HyperBus related IP, which makes it easier for main chip manufacturers to design memory controllers, and there are more and more main chip manufacturers whose products support this interface. In response to this trend, Winbond Electronics has successively launched related HyperRAM series products.Comparing to the existing 3.0V HyperRAM products operating at 100MHz / 200Mbps and 1.8V HyperRAM products operating at 166MHz / 333Mbps, Winbond HyperRAM 2.0 products can operate at a maximum frequency of 200MHz and provide a maximum data-transfer rate of 400Mbps with either 3.0V or 1.8V operation voltage.In terms of memory density, Winbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications.In terms of package type, Winbond also provides a variety of options, including:*24-ball, 8mm x 6mm TFBGA for automotive and industrial applications *49-ball, 4mm x 4mm WFBGA for consumer applications *15-ball, 1.48mm x 2mm Wafer Level Chip Scale Package (WLCSP) *Known Good Die (KGD)Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer. The key advantages of the WLCSP are the minimum inductance of die to PCB, enhanced thermal conduction, reduced package size, weight and smaller foot print. These characteristics make WLCSP the best solution to meet the requirements of mobile products like cellular phones, smart watches, and other wearable electronics. Winbond HyperRAM series products with WLCSP will be the best memory solution for these applications.HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applicationsWinbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry's innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products.Automotive and IoT device manufacturers are increasingly adopting high-performance Single-Level Cell (SLC) NAND Flash as a low-cost alternative at densities of 512Mbits and higher to the NOR Flash traditionally used for code storage.Previous Winbond innovations in high-performance NAND Flash include the Quad SPI-NAND interface, which shares the same 6-pin signals and QSPI command set as Quad SPI-NOR, and the Continuous Read function, which achieves up to a 52MB/s continuous data transfer rate at a 104MHz clock frequency.Now Winbond has created another innovation in high-performance NAND Flash with the introduction of the Sequential Read function in its latest high-performance W25NxxxJW QspiNAND Flash devices. In Sequential Read mode, the QspiNAND Flash products achieve the same 52MB/s maximum data rate at 104MHz as in Continuous Read mode, but with new flexibility to configure the chip's operation. The most important new options are:* Freedom to apply the user's own ECC engine. In Continuous Read mode, a Winbond W25N device only supports its own on-chip 1-bit ECC engine. In Sequential Read mode, users can implement 4-bit, 8-bit or any-bit error correction when enabled by an external ECC engine.* Access to the entire memory array - both the Main Area and the Spare Area - with a single Read command. This is ideal for code shadowing applications in which low latency and fast boot time are particularly important.* Greater flexibility to configure the data arrangement to suit the user's application."By providing for high-speed operation with its Continuous Read function, Winbond had already made QspiNAND Flash a viable option for use in code storage applications, including for code shadowing and execute-in-place operations," said Syed S. Hussain, Director Segment Marketing, Winbond Electronics America Flash Business Group. "Now the addition of Sequential Read means that users can benefit from the same high Read speed of up to 52MB/s while implementing their chosen ECC engine and data access arrangements."The new 1.8V QspiNAND Flash products are available in densities of 512Mb, 1Gb and 2Gb. The 3.0V versions are available in densities of 2Gb and 4Gb. All are manufactured in the company's 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet new demand expected in both the automotive and IoT market segments.The new W25N QspiNAND Flash devices are offered in compact 8-pin packages - a space-saving format which was not possible for SLC-NAND Flash memory products before Winbond's development of an effective QspiNAND Flash interface. Clock speeds of 104MHz allow the equivalent of 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, the devices perform on-chip bad block management.Key features of the Winbond W25N family of NAND Flash memory products are:Wide Temperature Range* -40 degree C to +85 degree C operating range in Industrial GRADE* -40 degree C to +105 degree C operating range in Industrial plus and Automotive GRADEUnique Memory Architecture* Page Read Time with ECC Enabled: 60μs* Page Program Time: 250μs (typ.)* Block Erase Time: 2ms (typ.)* Fast Program/Erase performance* Supports OTP Memory AreaHigh-Performance QspiNAND Flash* QSPI implementation in 46nm process technology* More than 10-years data retention* 104MHz clock frequency that can support up to 52MB/S continuous data transfer rateSpace Efficient Packaging* WSON8 6x8mm* WSON8 5x6mm* TFBGA24 6x8mm* KGD (Known Good Die)For more information, please visit www.winbond.com.Winbond QspiNAND FlashSequential read, more flexibility

Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of all NOR Flash memories worldwide.Based on recent market data from WebFeet Research, Winbond took the number-one NOR revenue position in 2019 with a 22.8% market share. In support of this mission, it shipped more than 3 billion Flash memories in 2019, which is the leadership position with 27.3% of all NOR Flash units worldwide. Additionally, Winbond has been the top supplier of Serial NOR Flash since 2012 and has 27.1% market share out of a total revenue of $2.009 B.Meeting the growing flash memory needs of its customers around the world with its own 12-inch wafer fabrication facility in Taichung - Taiwan, it has now planned to start construction of a second 12-inch wafer manufacturing facility in Kaohsiung in Southern Taiwan. This second fabrication facility will make it convenient for further expansion and growth of flash manufacturing at the Taichung facility to meet the demands of new applications of flash memories like AI, Automotive, Storage, Networking and 5G.NOR Flash market, particularly Serial Flash continues to grow"Worldwide Serial NOR Flash shipments will continue to grow from $2 billion in 2019 to greater than $2.89 billion by 2024," said Alan Niebel, founder and CEO of WebFeet Research, Inc. "Winbond, a pioneer in Serial Flash memories and now the leading supplier of NOR Flash that is predominately Serial Flash, is well positioned to take advantage of this market growth with its innovation in both products and packaging ingenuity, broad product portfolio and manufacturing capabilities.""We are extremely pleased with the popularity of our SpiFlash memories and becoming the top NOR Flash supplier worldwide," said J.W. Park, Technology Executive of Winbond Flash Memory. "We anticipate further growth after recovering from 2020 and are ramping production of our products to address a wide range of higher-density applications."Advanced Flash technology for high density applicationsWinbond has shipped more than twenty-billion Serial Flash memories since its SpiFlash product line was launched in 2006. Throughout this time the company has continued to advance its Flash process technology and packaging capabilities. Winbond introduced its first 58nm-based products in 2011 and now offers a broad line of high-density 58nm SpiFlash memories spanning 16Mb to 1Gb densities, 3V and 1.8V power supplies, in a range of packages and known-good-die (KGD) solutions, with plans to move to 4x nm technology by 2021. The 58nm technology provides a more cost-effective, feature-rich and higher-performance solution than the 90nm Flash technology, used primarily for lower-density SpiFlash products ranging from 512Kb to 16Mb as well as for several Automotive applications that have been designed in with key customers.Winbond's Flash business is expected to grow further in 2020 and beyond, as applications demand higher Serial Flash densities. Key applications driving this demand include: mobile phones, set-top boxes, digital televisions, electronic games, wearables and hearables, cable and DSL modems, wireless LANs, networking, automotive, servers, next generation gaming desktops and 5G. Winbond is now offering even higher-density 58nm 512Mb and 1Gb NOR Flash memories in 3V and 1.8V to address the need for higher density memory in the industry. For specific details of products and packages please contact Winbond.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Winbond ships 3.1 billion units in 2019, and continues #1 position in Serial NOR Flash since 2012

With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular in coming years. To image that the affordable AIoT device can guide people how to enjoy the life, it's so grateful. 1Gb LPDDR3 is the best partner to assist your AI device to get into this market.Like some emerging solutions, especially those eye catching use cases such as video surveillance, smart home applications, and upcoming 8K TVs are boosting semiconductor demands. In view of this, many IC design and chipset suppliers are developing new-generation SoCs with higher performance and expedite Time-To-Market goals in the most cost-effective manner. In addition, from the overall system design perspective, the DRAM that works with the SoC or microcontroller also requires new options to provide better advantages leveraging the existing Specialty DRAM product series.High bandwidth and cost advantages create 1Gb LPDDR3 unique market positionFully understanding these market trends, Winbond Electronics Corporation provides low and middle density memory product families to provide high performance and high speed features to create a successful business model to drive market growth. The existing LPDDR3 and LPDDR4 product lines with specific features to squeeze operation power which is due to LP4x w/ low VDD2=0.6V and FSP(Frequency Set Point) function. For 1Gb x32 LPDDR3, it's the alternative solution for developing high B/W(8.52GB/s) around 0.3W. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs.Both Winbond's LPDDR3 and LPDDR4 memory series are completed solution to variety customers. As for data transmission rate getting higher, the lower density memory is adopted like T-Con (Timing Control) of 8K TV panels could leverage LPDDR3 products with x32 or x64 data bandwidth for reaching high performance and cost advantage. These new T-Con chipsets require high speed 1Gb LPDDR3 memories to support key features such as Super Resolution, MEMC and Artificial Intelligence Picture Quality (AI PQ). The LPDDR3 memories used in these SoCs are welcomed by IC design teams.While looking at popular 8K TV T-con SoC design cases, two or four 1Gb DDR3 x16 memory chips are common arrangement. Winbond suggested to use one or two 1Gb LPDDR3 x32 chips to be better one of the cost-performance solution. This approach could provide data throughput of 8.52GB/s or17.04GB/s to fulfill requirements of IC design and semiconductor suppliers. The obvious benefits will have cost, power saving and, at the same time, reduce the extra issues of DRAM pairing concerns within two memory chips.In the other hand, considering AI PQ features, what Winbond offerings are providing two 1Gb LPDDR3 x64 memory chips to replace LPDDR4 options. This will help engineering teams not only gaining further cost reduction benefits but also saving product development time. From engineering perspectives, the migration from LPDDR2 to LPDDR3 is much easier than jumping directly from LPDDR2 to LPDDR4. This is because both LPDDR3 and LPDDR2 having 90% of similarity in circuit design. It will massively help to shorten development times and reduce its Time to Market for innovations of the end products.LPDDR3 will help engineers to expedite time to marketToday's embedded system developers face challenges to upgrade LPDDR2 memory for new embedded SoC chips. Considering the migration path from LPDDR2 to LPDDR4, the IC design teams will need to invest more resources to deal with more critical signal integrity of LPDDR4 specification under tight timing margins. It is taking a great deal of time to verify and test the new design. And this basically will be a high risk situation while the global coronavirus outbreak causing more people lockdown for many countries. And LPDDR3 approach will have unbeaten advantages with 90% similarity design with LPDDR2.Through past 9 months, there are more than 15 Design In & Design Win projects to implement Winbond's 1Gb LPDDR3 memory into the new SoC design including major IC design customers from Taiwan, Japan, South Korea and China in Asia region. The end products will cover AIoT, AI Inference chip, T-Con of 8K TV, AI-enabled video processors, smart speakers, smart video doorbells and mobile POS systems. The great market potential will begin ramping during 2020 and 2021.The trend to use AI technologies to power the smart applications is ushering in a new era for semiconductor devices and embedded systems that will bring many new opportunities but also many challenges. Winbond is a unique Integrated Device Manufacturer that is dedicated to provide niche DRAM solution with complete and competitive services on KGD (Known-Good-Die). This unique product offering is able to provide the best SiP solution by KGD for various applications.With exploiting its advanced design skills and production technologies, Winbond is continually boosting the competitive advantages of its dedicated brand-name products. The completed product series are ranging from Mobile RAM, Specialty DRAM products to Flash memory product lines, which are designed to meet the demands of niche memory market for high-speed memory with low-power consumption. With possession of its own 12-inch wafer fabrication, Winbond keeps pace with the latest technologies to provide cost competitiveness and long-term support for customers.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Windbond 1Gb LPDDR3

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, and Karamba Security, a leading embedded security provider for connected devices, today announced secure flash memory chips with integrated runtime integrity for automotive ECUs, and IoT connected consumer and industrial devices.Winbond's new W77Q includes hardware root-of-trust and secure, encrypted, data-storage and datatransfer capabilities. Embedded with Karamba Security's XGuard software, customers will benefit from pre-packaged, verified-destination, and runtime integrity checks of all binaries before being loaded to memory. With Karamba Security's XGuard, the solution enables customers to ensure that binaries' integrity is verified during runtime. The combined solution offers deterministic integrity checks, from development throughout the supply chain, starting from the silicon Fab, through deployment in the customers' manufacturing plant, to runtime, without requiring customers to change their development or manufacturing processes.Additionally, thanks to Winbond W77Q secure channel, Karamba's XGuard whitelist verification, and CFI validation, users will benefit from an out-of-the-box secured OTA updates, without requiring to invest resources in costly OTA secure channels.The W77Q series products are supplied in industry-standard packages and pin-outs, and feature a standard single/dual/quad/QPI serial peripheral interface (SPI). This means that they can be used as a simple drop-in replacement for non-secure SPI NOR Flash devices."Given to the rapid growth of security demand in IoT world, Security by Design is essential to address the security concerns in diverse IoT landscapes, value chain, and ecosystem. Winbond is excited to work with Karamba Security on creating an end-to-end security solution for the OEM and microcontrollers to strengthen supply-chain security," said Hung-Wei Chen, Marketing Director at Winbond. "Winbond endeavours to provide a certified and scalable secure memory subsystem and looks forward to working with industry partners for a secure and flexible solution to serve various embedded applications, such as automotive ECUs and industrial IoT.""Karamba Security is excited to partner with Winbond to deliver secured automotive ECUs and IoT devices" said Assaf Harel, Karamba Security's Chief Scientist and Co-founder, "securing supply chain is a critical issue for our customers. Winbond secure memory, together with XGuard runtime integrity, enables our customers to ensure the auneticity of their supply chain as well as provide endto-end solution for our OEM customers."Winbond’s new W77Q

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME W75F Secure Flash Memory has achieved PSA Certified Level 2 Ready in the PSA Certified independent security assurance scheme.Now with PSA Certified Level 2 Ready, the TrustME W75F Secure Flash Memory provides a secure, certifiable, and flexible memory sub-system complementary to Arm v8-M architecture-based systems. It enables SoC and MCU vendors to design secure and certifiable solutions while expediting time to market.As a leading secure storage solution provider, Winbond focuses on the certified secure storage for security by design, immutable root of trust, secure boot, firmware confidentiality and integrity, trusted factory initialization of devices, and secure firmware updates. The certifiable secure memory sub-system can scale PSA Certified chip platforms to support larger storage-demanded applications. Hence, SoC and MCU chip manufacturing is not limited to the process nodes with embedded flash memory process in security-centric IoT era.Cybersecurity certification is a vital role in trust and security irrespective of products, services and processes in the IoT value chain and ecosystem. Security by design is essential to address the security concerns in diverse IoT landscapes. PSA Certified is an independent security assurance scheme based on the foundations of the Platform Security Architecture (PSA), which was founded by Arm and aims to build trust through independent security assessment. PSA Certified Level 2 Ready provides a pre-certification security assessment of the PSA Root of Trust to demonstrate solutions that protect against scalable remote software attacks.Designed to fit the needs of trusted hardware and trusted software vendors, PSA Certified Level 2 Ready is widely applicable to developers seeking a pre-certification assessment. PSA Certified Level 2 Ready is suitable for systems that use FPGA or test-chip based hardware."As IoT continues to have a transformational impact on industries ranging from healthcare to industrial, it's fundamental that trust is built into these devices from the chip level," said Andy Rose, chief system architect and fellow at Arm. "The achievement of PSA Certified Level 2 Ready gives the ecosystem evidence that the TrustME W75F Secure Flash Memory has the necessary protection against scalable, remote software attacks.""The days of old-fashioned security as an option are over. These days, it's all about getting ready to fulfil the promises of security by design," said Carlos Serratos, Business Development Director at Brightsight. "We are delighted to be collaborating with Winbond on the PSA Certified Level 2 Ready security evaluation for the TrustME W75F Secure Flash Memory. It is a fantastic achievement, with a clear show of commitment, enabling trust on IoT devices.""In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security foundation. Winbond TrustME Secure Flash strengthens the robustness of Platform Security Architecture implementations by securing code and data storage for trusted boot and firmware update using external secure flash," said Hung-Wei Chen, Marketing Director at Winbond. "We look forward to continuing our support for certifiable secure memory solutions with our expertise and ability to meet the growing demand for secure, certifiable, and flexible solutions in the era of IoT."The TrustME W75F Secure Flash features:-Advanced Security *Common Criteria EAL5+ certified *Secure eXecute-in-Place (XiP) *Tamper and Side Channel Attacks Resistant Secure Flash Device *Code and Data Confidentiality and Integrity *Mutual Authentication with SoC *Support Shared Memory Architecture for Multiple-Domains *Support AEC-Q100 with AG2 Qualification available or upon request *100,000 Program/Erase Cycles *20 year Data Retention -Low Power, Wide Temperature Range *Single 1.65 to 1.95V supply *-40 degree C to +105 degree C operating rangeTo meet the growing demand for high-volume embedded solutions, Winbond TrustME memories are in mass production in Winbond's wholly own and secure 12-inch wafer fabrication facility in Taichung, Taiwan. For more information about Winbond, please visit: www.winbond.com.TrustMER Stencil

Secure-IC, a world-leading provider of embedded cybersecurity for best in class protection technologies, integrated secure elements and security platforms, with security evaluation tools for certification readiness and assurance and consulting expertise and security assessment services, today announced a collaboration with Winbond, a leading global supplier of semiconductor memory solutions and a pioneer in certified secure memories, to enhance embedded software security in automotive and other connected industries. Under the partnership, Secure-IC will offer an enhanced security platform that supports the whole security lifecycle in complementary fashion with the use of Winbond TrustME Secure Flash Memory.Secure-IC and Winbond's collaboration will provide cybersecurity offerings that leverage Winbond's TrustME Secure Flash Memory with Secure-IC's Securyzr integrated security service platform. Secure-IC's secure element is an integrated security service platform to provide security from chip to edge and cloud, composed of 1) (ISE) Integrated secure element, 2) Associated service stack, (Firmware including secure connectivity libraries, 3) Server security lifecycles such as key management). Securyzr is a major enabler for complete customer ownership of security. The family of Winbond's TrustME Secure Flash Memory combines its leading edge NOR flash manufacturing process and state-of-the-art hardware security technology. The company's offerings range from the world's first and most secured EAL5+ Common Criteria certified flash memory device to cost-effective EAL2 memory devices that address the security challenges and requirements in different application scenarios.Secure-IC's integrated secure element, combined with Winbond's TrustME Secure Flash Memory offers the host system various services all along the life of the system: Key provisioning and management, Secure Boot and Firmware update, Lifecycle management, memory access management, etc. The combined solution is compliant with the highest levels of security certification and performance requirements."Teaming with a world class pioneer in certified memories enables us to improve security while maintaining the high-performance characteristics required in a number of markets, said Yan-Taro Clochard, North Asia Sales Director & Corporate Marketing Director. Our offering brings key provisioning and full lifecycle security credentials management. Partnering with Winbond, with its certified secure memories, strengthens our commitment to offer state-of-the-art cybersecurity solutions and increases customer trust by reducing its amount of work for certification""Providing a proven and certifiable solution to customers significantly reduces product time to market as privacy and cybersecurity regulations are becoming mandatory." said Hung-Wei Chen, Marketing Director at Winbond. "As a certified and scalable secure memory subsystem, Winbond's TrustME Secure Flash Memory is complementary to Secure-IC's Securyzr architecture as a complete system to serve a wide range of embedded applications."In an increasingly connected world, a significant amount of sensitive data shall be securely managed by a number of applications and across several devices. Secure-IC in this partnership offers access to an integrated design for secure provisioning of cryptographic keys and subsequent security assets management.Security is everyone's business, and every layer must take part in securing the overall system, so memory with built-in security is becoming indispensable. Winbond's Common Criteria certified production site guarantees secured production, software programming, and key provisioning for connected systems. Partnering with Secure-IC complements the security offers and leverages the trusted firmware that comes as essential part of the solution.You can learn more by visiting Secure-IC at Embedded World 2020 in Nuremberg from February 25-27 where demonstrations of Securyzr will be available.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its innovative family of certified TrustME Secure Flash memory chips by introducing the W77Q series for IoT and smart connected consumer and industrial devices.The new W77Q provides hardware root-of-trust and secure, encrypted data-storage and data-transfer capabilities. By ensuring robust, end-to-end security in IoT devices it enables:*Secure code updates, including over-the-air updates, via an end-to-end secure channel between an update authority and the W77Q even when the host processor or SoC has been compromised.*Secure boot and root-of-trust*Authenticated and encrypted data transfer between the Flash device and the host*Secure Execute-in-Place (XiP) of boot and application code *System resilience, supporting the key security functions of protection, detection and recoveryThe W77Q series products are supplied in industry-standard packages and pin-outs, and feature a standard single/dual/quad/QPI serial peripheral interface (SPI). This means that they can be used as a simple drop-in replacement for non-secure SPI NOR Flash devices.Independent security certificationThe W77Q and W75F are designed to cover the whole range of assurance levels mandated by the European Cybersecurity Act and other regulations. The W77Q is intended for use in consumer and industrial devices which need the security functions required for compliance with the Substantial and Basic assurance levels specified in the Act. The W77Q supports conformance to the Common Criteria EAL2, SESIP and Arm Platform Security Architecture (PSA) security specifications.The W75F is certified for Common Criteria EAL5+, which means it is suitable for use in payment and communications devices, and in applications requiring the High assurance levels specified in the Cybersecurity Act.Hung-Wei Chen, Marketing Director for the Secure Flash product line at Winbond, said: 'The W77Q is a game-changer product, a follow-on to the existing W75F which offers the industry's strongest security in an SPI Flash memory, suitable for the most sensitive financial and communications applications. Now, with the W77Q, Winbond is meeting the need of customers to protect and authenticate any kind of smart, connected device used at home or in the factory.Comprehensive security functionalityThe W77Q offers the secure storage and data-transfer capabilities needed to protect IoT devices and user data. Its main security features include:*Hardware-based Root-of-Trust engine *TCG DICE-like device attestation *Cryptographically secured Write protection *Secure code updates with roll-back protection *Secure boot from Flash*Authenticated watchdog timer *Secure interface: -End-to-end encrypted and authenticated data transfer -Replay Protection Monotonic Counter (RPMC)*Incremental Security -Fail-safe (in-field) configuration updates -Secure symmetric key management *Secure unique device IDThe W77Q also provides the high speed, long data retention and strong data integrity of Winbond's standard SPI Flash memory ICs. Its specifications include:*66MHz operating frequency at Double Transfer Rate/133MHz at Single Transfer Rate *20 years' data retention *100,000 Program/Erase cycles *Wide operating temperature range of -40 degree C to 105 degree CThe W75F will be demonstrated in an Arm PSA security application running on the Arm TF-M operating system.The first W77Q part, in a density of 32Mb, is available for sampling now. The W75F is available in production volumes. More information may be found at www.winbond.com.Winbond TrustME Secure Flash memory chips