TerraONE Tech Co., Ltd., a company specializing in modern IT solutions, has announced a strategic partnership with Wasabi Technologies, a leading cloud storage company, becoming the authorized distributor for Wasabi Technologies in the Taiwan market. With the partnership, Taiwanese businesses can enhance their data management and redundancy services with high-performance, secure, and cost-effective cloud object storage.Credit: TerraONEWasabi is one of the technology industry's fastest-growing companies. Wasabi Hot Cloud Storage is a predictable, affordable cloud object storage service. Compared to traditional storage solutions, Wasabi eliminates fees for egress and API usage and provides 99.9999999999% (11 nines) data durability and robust enterprise-grade security. Wasabi Hot Cloud Storage is widely adopted by tens of thousands of businesses and MSPs worldwide.Kevin Chen, General Manager of TerraOne Technology, said, "Amid digital transformation and IT modernization, many businesses are increasingly demanding highly flexible and scalable cloud storage. Wasabi Technologies' services offer significant advantages in performance, price, and security, making them ideal for storage, backup, redundancy, video surveillance, big data analytics, and other application scenarios across various industries. By partnering with Wasabi, we can provide our customers with more professional technical support, integration services, and customized solutions, helping businesses seamlessly transition to cloud platforms.""TerraONE has extensive experience in enterprise IT deployments and a broad distribution network in the Taiwanese market, making them a key partner in our efforts to expand our distribution network in Taiwan," said Raymond Koh, Country Manager, ASEAN, Wasabi Technologies. "We look forward to working together to accelerate the adoption and innovative applications of enterprise cloud storage."TerraOne Technology will host a Wasabi partner product launch event on 9th September 2025. Interested distributors are welcome to contact TerraOne. Alternatively, click here to stay up-to-date on TerraOne Technology events.For more information, please visit.

In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts. Yet as we step into 2025, the rise of AI, massive data processing, and edge intelligence is propelling memory from a “cycle-driven” market into a new stage of “structural growth.”The global memory market is moving beyond sheer “capacity expansion” toward “breakthroughs in performance, energy efficiency, and system-level integration”. Rapid advances in DRAM and NAND, coupled with the accelerated adoption of new packaging, protocols, and architectures, are propelling the memory ecosystem into a new phase of robust and sustainable development.According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market reached USD 346 billion in H1 2025, up 18.9% year-over-year, with the memory segment growing by 20%. Multiple institutions forecast that memory product prices will continue to rise in the third quarter of 2025, particularly in high-value segments such as enterprise SSDs and high-speed DRAM. This wave of AI-driven structural demand is becoming the starting point of a new growth cycle for the memory industry.GMIF2025: Shaping the Future of Memory in the AI Era. GMIFIn this paradigm-shifting moment, the industry needs a collaborative hub to connect upstream and downstream players, bridge technology with markets, and bring together key forces across the global memory ecosystem to explore trends, align resources, and foster partnerships.The 4th Global Memory Innovation Forum (GMIF2025 Innovation Summit) will be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., GMIF2025 will focus on the theme “AI Applications, Innovation Empowered” to discuss memory breakthroughs and ecosystem collaboration under the momentum of AI.Four Core Themes:01 Trends and Roadmaps of Storage and Memory Technologies: From CXL and Chiplet to near-memory computing, new architectures are transforming memory from isolated optimization to system-level synergy.02 AI Applications & Deployment Practices: Deep dives into emerging memory innovations driven by AI servers, AI smartphones, AI PCs, and intelligent vehicles.03 Industry Collaboration Across the Value Chain: Uniting IDM manufacturers, controller providers, solution vendors, packaging & testing suppliers, material and equipment companies to build dual engines of technology and market growth.04 Global Ecosystem & New Industry Dynamics: Exploring new pathways to reshape supply chains, jointly build standards, and establish a paradigm for cross-border collaboration in the post-globalization era.Summit Highlights. GMIFGMIF2024 Data Insights. GMIFAn Industry Gathering Not to Be MissedGMIF is more than just a technology summit; it is a global high-end platform that combines dialogue, showcase, partnership, and influence:For enterprises: it’s a premier stage to showcase technological achievements and expand upstream & downstream collaborations.For industry professionals: it’s a vital arena to grasp trends, access resources, and discover opportunities.For investors: it’s a unique vantage point to anticipate turning points and uncover industry value.For media & academia: it’s a core hub for first-hand insights and shaping industry discourse.We sincerely invite you to join us this September in Shenzhen Bay, where global industry leaders will gather to discuss memory innovation in the AI era, witness a new stage of collaboration, and co-create the future of the memory ecosystem.Click the link to secure a seat.An Industry Gathering Not to Be Missed. GMIFFor more information about GMIF, please visit.

Lotus Microsystems ApS, a power management solutions company, and EDOM Technology, one of the Top 10 Global Distributors, jointly announced the signing of a strategic distribution agreement for the Asia-Pacific region.This collaboration combines Lotus Microsystems’ innovative power management solutions with EDOM Technology’s extensive distribution network, strong field application engineering (FAE) force, and deep market expertise. The partnership is designed to accelerate customer adoption, deliver superior technical support, and strengthen the presence of both companies across the fast-growing APAC markets.Power and thermal management are crucial aspects of electronic design, especially in the rapidly developing computing, networking, and IoT markets. Effective thermal management ensures that devices operate within a safe temperature range, optimizing performance and extending their operational life. Lotus Microsystems’ work on high-efficiency power modules supports more sustainable computing by reducing energy losses and improving overall power usage effectiveness.“This partnership with Lotus Microsystems allows us to bring differentiated and forward-looking solutions to our customers in the APAC region. We see great potential in Lotus Microsystems’ technology and are confident it will contribute to the success of our ecosystem.”— Jeffrey Yu [CEO of EDOM Technology]“We are delighted to partner with EDOM Technology, a recognized leader in distribution across Asia. This agreement marks an important step in our global expansion, enabling Lotus Microsystems to better serve customers in key APAC markets with the strong support and capabilities that EDOM provides.”— Hans Hasselby-Andersen [CEO of Lotus Microsystems]

Tescan Group proudly introduces its new global brand platform, The Art of Discovery at this year's Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief that beauty lies in what is yet to be discovered, it reflects Tescan's ambition to be a trusted growth partner in science. Following its global introduction at MC 2025, the brand platform will make its Asia-Pacific debut at SEMICON Taiwan (September 8–12, 2025).This rebrand signals a pivotal step in Tescan's shift toward a more integrated model — combining advanced technology, workflow-focused solutions, expert support, and a community built on shared knowledge. This represents Tescan's broader focus on delivering customer-centric solutions rather than simply providing technology.New Aspiration, Approach and Drivers"Our brand transformation captures who we are today — a company built on strong partnerships, driven by results, fueled by innovation, and committed to delivering purposeful solutions that put users first," says Sirine Assaf, Chief Revenue Officer at Tescan. Guided by its core principles, Tescan sets a clear ambition: to empower customers and partners with tools, software, and services built for what's next. At the heart of this transformation is a simple idea — removing the barriers between a question and its discovery. "This transformation isn't just about technology. It reflects a continuous evolution in how we think, how we work together, and how we enable the scientific community with timely solutions to fasten their discoveries," says Assaf.Automation and InnovationBuilding on last year's successful introduction of multiple new instruments (including the plasma FIB-SEM Amber X 2) — Tescan continues its innovation journey across the entire portfolio. This year, the company's primary focus is on enhancing automation throughout all its products, aiming to streamline scientists' workflows at a time when speed and accuracy are more important than ever. Alongside its new brand platform, Tescan is also unveiling two new software solutions: AutoSection and TEM AutoPrep PRO – Inverted & Planar Lamella Automation. "Our primary goal in this area is to reduce the time from instrument purchase to when users can fully leverage its capabilities. We accomplish this through intelligent automation, deep application expertise, and close collaboration with our customers," closes Bruno Janssens, Chief Strategy Officer at Tescan.CEO PerspectiveJean-Charles Chen, CEO of Tescan Group, commented: "This is much more than a cosmetic redesign. It's a strategic repositioning that reflects the way we see how science is evolving, and how Tescan is evolving with it. We're aligning with a new era of scientific discovery by enabling better-integrated workflows, faster time from question to insight, and a tighter connection between our technology and our users' needs. It's a shift from being a product-oriented company to becoming a solutions partner. This means more automation, smarter software, and a mindset rooted in customer outcomes. The new look is simply a reflection of that deeper change.”APAC RolloutFollowing an exclusive offline preview at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) in early August, Tescan will make the APAC debut of its new brand at SEMICON Taiwan (September 8–12, 2025). As part of the Semiconductor Advanced Inspection and Metrology Forum, Herv? Mac?, Global Business Development Director for Semiconductors, will speak on September 12 on Development of New Workflows to Address Metrology and Failure Analysis Challenges at Macroscale, Microscale and Nanoscale.Venue: 701F, 7F, Taipei Nangang Exhibition Center Hall 2.Tescan Unveils New Global Brand Platform "The Art of Discovery" with APAC Rollout at SEMICON Taiwan. Tescan.

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving advanced packaging technologies toward higher density and lower latency. Heterogeneous integration architectures such as CoWoS, CoPoS, and HBM are accelerating in adoption, while Thermo-Compression Bonding (TCB) has emerged as a critical process technology thanks to its advantages of low thermal stress and high bonding strength.Global equipment leaders including BESI, ASMPT, Kulicke & Soffa, Hanmi, and Shibaura are actively investing in TCB, underscoring its growing strategic importance.In response to this market momentum, Taiwan-based precision equipment manufacturer Micraft System Plus Co., Ltd. (MSP��) has officially announced the launch of its first self-developed TCB bonder, which will make its public debut at SEMI Taiwan 2025. Purpose-built for heterogeneous integration applications, the system integrates Micraft's years of expertise in precision automation and features localized heating, programmable temperature control, pressure sensing, platform leveling, and micron-level alignment—marking a new milestone for Taiwan's equipment industry in advanced semiconductor processes.According to Micraft, the system employs multiple independently controlled heating modules, enabling rapid localized heating and cooling to minimize the thermal-affected zone and reduce warpage risk. Leveraging its extensive wafer bonder experience with optical semiconductor customers, the company has incorporated pressure sensing and leveling technologies that dynamically adjust bonding pressure and thermal profiles. This ensures uniform bonding quality and high yield, particularly for fine-pitch, low thermal stress, high-precision, and high-throughput packaging requirements.The bonder is further equipped with advanced optical alignment modules from Carl Zeiss, combined with Micraft's proprietary optical system and cutting-edge vision algorithms. This enables alignment accuracy of better than 1μm. In addition, the system offers high process flexibility, supporting a wide range of materials and carrier formats to meet diverse requirements of OSATs and IDMs.Micraft has long been a pioneer in the MicroLED equipment market, with its laser mass transfer and repair platforms already adopted and mass-produced by Taiwan's two leading panel makers. By extending its expertise into advanced packaging, Micraft leverages its core strengths in precision motion control, optical integration, and thermal processing. Several leading domestic and international semiconductor customers have already initiated tool qualification programs.Looking ahead, Micraft plans to continue developing next-generation wafer-level bonding equipment, including Hybrid Bonding and Co-Packaged Optics (CPO), to address the rising demands of 3D IC and chiplet architectures. Through these efforts, Micraft aims to strengthen Taiwan's role in the global advanced packaging supply chain and further advance the localization and globalization of Taiwan's precision equipment technologies.Micraft System Plus warmly invites industry partners to visit its booth at SEMI Taiwan 2025 to explore collaborative opportunities and witness the next generation of bonding solutions.Micraft self-developed TCB bonding system, which will make its global debut at SEMI Taiwan 2025

SK hynix Inc. announced today that it has assembled the industry's first High NA EUV lithography system for mass production at the M16 fabrication plant in Icheon, South Korea.At an event to commemorate the assembly of the system, SK hynix's Head of R&D Cha Seon Yong, Head of Manufacturing Technology Lee Byoungki and ASML's Head of Customer Team SK hynix-Japan Kim Byeong-Chan celebrated the introduction of the equipment to produce next-generation DRAM.The move lays the foundation for a swift development and supply of the cutting-edge products that meet customer demand amid intense competition of the global semiconductor industry. SK hynix aims to enhance credibility and stability of the global supply chain through close collaboration with business partners.A sophisticated process technology to scale memory cells is critical to advance productivity and product performance. A more sophisticated pattern leads to an increase in the number of chips produced from a wafer and an improvement in power efficiency and performance.SK hynix has been expanding the scope of EUV adoption for production of the most advanced DRAM since the first introduction of the technology in 2021 for the 1anm, the fourth generation of the 10nm tech. The assembly of the next-generation technology system that outperforms the existing EUV equipment comes amid the company's efforts to prepare for the industry's requirement for extreme scaling and high density.The TWINSCAN EXE:5200B, the first model for volume production of ASML's High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.With the adoption of the new system, SK hynix plans to simplify the existing EUV process and accelerate the development of the next-generation memory to advance product performance and cost competitiveness. The company also aims to enhance its position in the high-value memory product market and make its technological leadership stronger.“High NA EUV is a critical technology that opens the next chapter of the semiconductor industry,” said Kim at ASML. “ASML will closely collaborate with SK hynix to bring forward the innovation of the next-generation memory.”“We expect the addition of the critical infrastructure to bring our technological vision we have been pursuing into reality,” said Cha at SK hynix. “We aim to enhance our leadership in the AI memory space with the cutting-edge technology required by the fast-growing AI and next-generation computing markets.”

Cypress Technology (CYP) has introduced its latest 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking, designed to meet the demands of real-time video transmission, remote control, and multi-source display management. The device integrates high-resolution video processing, scaling, multi-window display, and USB mouse control, providing a plug and play, intuitive, and flexible solution for professional environments. It is particularly suited for emergency operation centers, surveillance rooms, conference rooms, and multi-source display scenarios such as seminars and educational spaces.Flexible Multi-Window Display with Seamless switchingThe seamless switching matrix supports four input sources (two HDMI and two USB-C) and offers flexible viewing options including single full-screen, quad-view, picture in picture (PiP), and picture on picture (PoP) modes, outputting to two HDMI displays. The seamless switching technology ensures instant video transmission without delays or black screens in both matrix and multi-window modes, maintaining stable and continuous visuals for mission-critical decision-making or uninterrupted presentations.Intuitive Window Layout Control and Multiple Management OptionsUsers can resize windows and adjust window position directly with a mouse, or control the system via front panel buttons, on-screen display (OSD), Telnet, or RS-232. The system allows storing multiple custom window layouts for quick recall and uses highlighted borders to identify the active window, streamlining operations and improving workflow efficiency.Integrated USB Docking for Collaboration and Device ManagementWith a built-in USB docking function, the device supports keyboard and mouse control across multiple windows and also connects to USB cameras and storage devices. This eliminates the need for an external USB docking station, enabling streamlined video display and data access. It is ideal for control centers, command operations, and multi-tasking collaborative meetings, providing a simple, flexible, and real-time operating experience.High-Quality AV Performance with Broad CompatibilitySupporting resolutions up to 4K60Hz 4:4:4, the device is fully compliant with HDCP 1.x and HDCP 2.2 standards, ensuring secure, high-quality AV transmission. Audio support includes 2-channel LPCM, Dolby Digital, DTS 5.1 channel pass-through output, with the ability to independently select audio sources or switch via USB control, meeting the needs of modern conference and multimedia integration.High-Efficiency USB-C Input with Power DeliveryThe two USB Type-C ports support USB 3.2 Gen 1 with DisplayPort Alt Mode, delivering up to 45W and 30W of power. This allows laptops, tablets, and mobile devices stay powered while in use, enabling users to focus on meetings and video monitoring with improved efficiency.As the demand for synchronized video, remote control, and multi-source integration continues to grow in control rooms and multifunctional meeting spaces. CYP’s 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking stands as a vital core device for next-generation smart collaboration environments. With its flexible multi-window layout, intuitive USB control interface, and support for high-resolution visuals. CYP once again demonstrates its R&D expertise and depth of application in the professional AV industry, providing users with reliable, easy-to-deploy, and highly adaptable video integration solutions. Click here for more product information.4K60 444 Seamless Matrix with USB3.2 Docking. CYP4K60 444 Seamless Matrix with USB3.2 Docking in Control Room. CYP

As Taiwan's high-tech manufacturing and semiconductor sectors play an increasingly critical role in the global economy, companies are accelerating their overseas expansion to navigate rising geopolitical risks and supply chain realignments. These strategic moves aim to diversify operational risks, reduce manufacturing costs, get closer to end markets, and improve delivery speed and service efficiency, while meeting the global demand for supply chain security.However, expanding abroad comes with significant challenges, such as talent shortages, skills gaps, cultural and language barriers, and local regulatory compliance. That's where the right partner makes all the difference. A global leader in IT services and consulting, HCLTech brings robust capabilities in engineering R&D, digital transformation, cloud services, and AI. The company distinguishes itself through flexibility, rapid deployment, and strong localization support, three competitive edges that make it the partner of choice for 50% of Fortune 500 companies and 40% of the Global 2000, spanning industries such as high-tech manufacturing, semiconductors, finance, and automotive.“Setting up operations overseas requires more than just technical know-how, it involves understanding local tax policies, labor laws, and communicating effectively with governments, suppliers, and the workforce,” said Terry Tai, General Manager of HCLTech Taiwan. “Without proper support, language barriers or regulatory missteps can delay projects or inflate costs.”With $13.8 billion in revenue in FY25, a presence in 60 countries, and a global team of over 220,000 professionals from 167 nationalities, HCLTech is equipped to help companies establish operations across the US, Europe, and Southeast Asia. Its local teams offer culturally fluent and technically proficient support to minimize risks and ensure smooth setup and operation.A Trusted Partner for Semiconductor Leaders WorldwideHCLTech’s proven expertise is reflected in numerous global success stories. For instance, when a leading Taiwanese technology manufacturer expanded into India, it faced local system integrators struggling with ERP implementation and post-launch maintenance. Turning to HCLTech, the company deployed a bilingual team to manage coordination and swiftly completed IT infrastructure setup, data migration, and system testing, launching the plant within a short timeframe. It’s a textbook example of how HCLTech supports clients �ufrom plant setup to go-live�v.Tai further highlighted HCLTech's deep partnerships within the global semiconductor industry. The company supports IC design houses and semiconductor equipment vendors with comprehensive services, from RTL, Functional Verification, Physical Design to design verification (DV). These services address talent shortages by providing both technical solutions and support in recruiting and training skilled professionals.“Taiwan remains a global hub for semiconductor innovation,” Tai said. “However, when companies expand abroad, they often encounter challenges in finding local talent or addressing skill gaps, which can delay local operations. Beyond our engineering services, we help bridge that talent gap with tailored recruitment and workforce development solutions.”Notably, HCLTech is a member of TSMC's Design Center Alliance (DCA) and Samsung’s SAFE(Samsung Advanced Foundry Ecosystem) ecosystem. This membership allows the company to provide IC design customers with advanced process enablement and technical services that accelerate time-to-market and enhance competitiveness.AI-Powered Innovation to Shape the FutureAs AI technologies evolve and adoption expands, enterprises are increasingly eager to integrate AI into their operations. HCLTech has long invested in this space, offering proprietary platforms such as “AI Foundry and AI Force ”, designed to streamline data preprocessing and optimize AI applications. These tools have helped Taiwanese companies in sectors like manufacturing, semiconductors, and automotive improve efficiency and reduce costs.In IT service management, AI reduces the need for human agents by automating request classification and delivering instant online responses to user inquiries and issues. This significantly lowers labor costs and processing times, thereby helping maintain the stability and efficiency of enterprise systems.“In the semiconductor domain, we've implemented AI in optimizing DV scripts and automating code conversion, speeding up verification and reducing reliance on senior engineers,” Tai explained.In the automotive field, HCLTech supports clients in software-defined vehicles (SDVs) and advanced driver-assistance systems (ADAS). The 2024 acquisition of Germany's ASAP Group, an engineering service provider specializing in autonomous driving and connected vehicles enhances HCLTech's capabilities. Additionally, HCLTech collaborates with major automakers on smart manufacturing and digital innovation.With the accelerated pace of automotive system development and the growing importance of over-the-air (OTA) software updates powered by increasingly high-performance automotive chips, HCLTech offers technical support that complies with rigorous industry standards such as ISO 26262, ISO 21434, and ASPICE, making it a valuable partner for automotive electronics suppliers, including those in Taiwan.HCLTech also collaborates with partners like SAP and ServiceNow to build the next generation of AI-enabled enterprise solutions. In December 2024, HCLTech announced the opening of an SAP AI Innovation Lab in Munich, Germany. This strategic partnership with SAP's headquarters focuses on helping clients accelerate their transformation to SAP S/4HANA Cloud through RISE with SAP and SAP Business AI.HCLTech partners with ServiceNow to deliver GenAI-based solutions that enable personalized and seamless omnichannel user experiences. The collaboration ensures improved user engagement across all devices and at the right moments.Looking ahead to 2025, the company will focus on three strategic priorities: deploying AI-driven solutions, strengthening vertical industry support, and deepening localization capabilities. To date, HCLTech has introduced AI platforms and modules tailored to key industries, semiconductors, finance, and high-tech manufacturing helping enterprises derive actionable insights from data, accelerate decision-making, and shorten innovation cycles.Terry Tai, General Manager of HCLTech Taiwan. HCLTech

As vehicles become increasingly intelligent and connected, the complexity of electronic/electrical (E/E) systems is growing exponentially. The automotive industry faces unprecedented cybersecurity challenges. Attackers are no longer theoretical threats—they are real entities capable of remotely controlling critical vehicle functions and stealing sensitive data. To address this escalating situation, the International Organization for Standardization (ISO) and the Society of Automotive Engineers (SAE) jointly released the ISO/SAE 21434 standard, providing a comprehensive and authoritative framework for cybersecurity engineering in road vehicles. This standard is not just a technical guide but a fundamental engineering directive that embeds cybersecurity throughout the entire lifecycle of automotive products.Lifecycle Imperative: Security Begins with Design, Not After the FactThe core philosophy of ISO/SAE 21434 is its comprehensive coverage of the entire product lifecycle, marking a paradigm shift in automotive safety thinking. Traditionally, security was considered a late-stage add-on or a reactive measure after vulnerabilities were discovered. However, the 21434 standard clearly states that such reactive approaches are no longer sufficient. Cybersecurity considerations must span every phase—from concept design, product development, manufacturing, operation, maintenance, to final decommissioning.This "Security-by-Design" methodology means cybersecurity must be a core design parameter from the earliest stages of a project. The standard applies to all E/E systems, software, hardware components, and interfaces within road vehicles. This leads to a critical conclusion: every component in the system, no matter how small, becomes part of the cybersecurity chain. Even a seemingly insignificant memory chip can directly impact the cybersecurity posture of its ECU and the entire vehicle. Therefore, choosing components like memory during the concept phase is no longer just about performance and cost—it's a strategic security decision.The complexity of the automotive supply chain further emphasizes this point. From OEMs to Tier 1 and Tier 2 suppliers, collaboration is tight. ISO/SAE 21434 provides a common language and framework to ensure cybersecurity responsibilities and requirements are clearly communicated and enforced throughout the supply chain. For hardware components like NOR Flash, adherence to secure development processes and verifiable security features becomes a prerequisite for Tier 1 or OEM integrators to meet the standard.Core Pillars: CSMS and TARA as Dual Engines of ComplianceTo implement lifecycle security, ISO/SAE 21434 establishes two core pillars: the Cybersecurity Management System (CSMS) and Threat Analysis and Risk Assessment (TARA).Cybersecurity Management System (CSMS)CSMS is a systematic, risk-based approach that defines organizational policies, processes, rules, and responsibilities to continuously manage cybersecurity risks. It’s not a product but a management framework that must be built, implemented, and maintained by the organization. The goal is to foster a "cybersecurity culture" and integrate security considerations into daily operations.Threat Analysis and Risk Assessment (TARA)While CSMS operates at the organizational level, TARA is the technical engine. It is the cornerstone of ISO/SAE 21434—a structured process to identify potential threats, analyze attack paths, assess impact and feasibility, and determine risk levels to guide mitigation decisions. TARA bridges abstract threats with concrete technical countermeasures.For example, TARA might identify a threat scenario like "an attacker physically tampering with ECU firmware." The asset at risk is "firmware integrity." To mitigate this, the system needs cybersecurity controls. Secure NOR Flash provides hardware features like write-protected blocks and cryptographic boot code verification (secure boot), which serve as these controls.Thus, the choice of NOR Flash directly affects TARA outcomes. A standard NOR Flash might rate the feasibility of firmware tampering as "high," resulting in an unacceptable risk level. In contrast, Secure NOR Flash with robust security features could reduce feasibility to "low" or "very low," significantly lowering overall risk.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Mapping Secure NOR Flash Features to ISO/SAE 21434 RequirementsSecure Boot is the cornerstone of any secure electronic system. It is a rigorous verification process that ensures every stage of software execution from power-on is authorized and untampered. This process begins with an immutable Hardware Root of Trust (RoT) and builds a complete "Chain of Trust." If Secure Boot is bypassed, attackers can load malicious firmware and gain full control of the ECU.A key activity in the TARA process is identifying critical system assets and defining controls to protect their confidentiality and integrity. These assets may include cryptographic keys, digital certificates, proprietary algorithms, user privacy data, or vehicle identifiers. Storing these sensitive assets in unprotected memory is akin to leaving a safe's key under the doormat.Secure NOR Flash provides multi-layered hardware mechanisms to protect these assets:- Configurable Secure Memory Regions- Hardware Block/Sector Protection- Built-in Cryptographic Engine and Encrypted CommunicationGlobalized and decentralized automotive supply chains introduce new risks, such as counterfeit or unauthorized components entering production lines or the aftermarket. These "component swapping" or "ECU cloning" attacks are key threats identified in TARA. Secure NOR Flash provides robust hardware authentication mechanisms to counter these threats, directly addressing ECU cloning and forgery threats identified in TARA. These mechanisms ensure supply chain security and component authenticity during production, and establish hardware-based trust between processor and memory—a core principle of secure design.Summary Table: Threat Scenarios and Secure NOR Flash CountermeasuresSummary Table: Threat Scenarios and Secure NOR Flash Countermeasures. WindbondConclusion: From Chip-Level Security to System-Wide ResilienceIn conclusion, the automotive industry is at a turning point where security is no longer optional—it is a prerequisite for market access. In this context, system architects and engineers must recognize that investing in foundational components is an investment in system-wide trust.In the new era of automotive cybersecurity defined by ISO/SAE 21434, memory component selection is no longer a simple engineering decision based on capacity, speed, and cost. It has become a foundational and strategic decision that profoundly impacts the overall security posture of the system.Winbond's secure flash memory solutions help system manufacturers meet regulatory compliance and enhance platform security. To learn more about Winbond’s secure flash memory products, please visit Winbond's TrustME.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

Holtek Semiconductor will exhibit at Electronica India 2025, held from September 17 to 19 at the Bangalore International Exhibition Centre (BIEC). As one of South Asia’s leading trade fairs for electronic components and production technologies, the event is organized by Messe Munchen, Germany.At the exhibition, Holtek will showcase its latest technological developments and market-ready solutions. Featured applications include:1. Electric Two-Wheelers: Central controller unit, BLDC motor controller, dashboard display, battery management, and anti-theft control.2. BLDC Motor Solutions: High/low voltage ceiling fans, pedestal fans, air coolers, and BLDC e-chimneys with touch and gesture control.3. Health Products: Blood pressure monitors, glucose meters (BGM & CGM), ear thermometers, pulse oximeters, and electronic scales.4. Smart Energy & Safety: Energy storage inverters, smoke detectors, gas sensors, safety lights, and human presence detection.5. Wireless Control: Wireless doorbells and remote-control systems.Supporting India’s "Make in India" initiative, Holtek will also present touch-control reference designs for small home appliances, including Continuous low-power induction cooker solutions for local recipes.Headquartered in Hsinchu Science Park, Taiwan, Holtek set up its Indian subsidiary in Bangalore in 2018, followed by a North India branch in New Delhi in late 2024 to expand localized support and services.Holtek warmly welcomes all customers and partners to visit our booth for further discussions and collaboration opportunities.Event Website: electronica-india.comVenue: BIEC, Bangalore, IndiaBooth: H3. E27Dates: September 17–19, 2025