Seoul, December 18, 2025 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has become the first in the industry to complete the Intel Data Center Certified process to apply 256GB DDR5 RDIMM1 - a high capacity server module based on 32Gb fifth-generation 10nm-class (1b) DRAM - to Intel Xeon 6 platform.As an Intel Data Center Certified system/platform, 256GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel's Advanced Data Center Development Laboratory, and is now the industry's first server module verified to provide reliable performance, compatibility and quality when combined with Intel Xeon processors. SK hynix has previously obtained similar validation in January this year for its 16Gb fourth-generation 10nm-class (1a) die-based 256GB product.By becoming the first in the industry to validate compatibility with Intel's latest server platform, SK hynix is demonstrating technological leadership in high-capacity DDR5 modules. Based on this, the company will expand cooperation with major global data center operators and continue to lead the next-generation memory market in response to rapidly increasing demand from server customers.In this new AI-driven infrastructure environment, memory has emerged as a critical determinant of performance. As AI inference models evolve beyond generating simple response to performing complex logical processes, the volume of data that must be processed in real time is growing exponentially. To manage these massive data sets swiftly and reliably, high-capacity and high-performance memory has become indispensable - driving a sharp increase in market demand.The company anticipates its latest product to be the ideal solution to meet this growing demand. Servers equipped with the new module deliver up to 16% higher inference performance compared with those using 32Gb die-based 128GB products. In addition, by utilizing 32Gb DRAM chips, the design achieves up to approximately 18% lower power consumption than previous 256GB products based on 16Gb 1a DRAM. With this improved power efficiency and outstanding performance per watt, the company expects strong interest from data center customers."We are now able to respond more swiftly to customer needs, solidifying our leadership in the server DDR5 DRAM market. As a full-stack AI memory creator, we will actively address the growing demand for high-performance, low-power, and high-capacity memory solutions to further enhance customer satisfaction." said Sangkwon Lee, head of DRAM Product Planning & Enablement at SK hynix."This achievement represents the culmination of collaborative engineering efforts across Intel and SK hynix and demonstrates our shared commitment to advancing memory technology. The high-capacity module addresses the increasingly demanding requirements of capacity-hungry workloads of AI applications, enabling our customers to unlock new levels of performance and efficiency in their data center operations," said Dr. Dimitrios Ziakas, VP of Platform Architecture, Intel Data Center Group.

Taipei As generative AI, software-defined vehicles, and intelligent automation accelerate in parallel, semiconductors are shifting from component suppliers to a critical foundation for intelligent systems in the physical world. At the recent 2025 NXP Technology Summit held in Taipei, NXP had focused on three major application pillars, AI, IIoT, and automotive electronics, working closely with Taiwan industry partners to bring smart technologies into real-world deployments.NXP as a System Platform Enabler Building a New Foundation for Smart Applications with AI × Edge × SDVRobert Li, Executive Vice President and General Manager of BL Greater China for NXP Semiconductors, noted in his keynote that the semiconductor industry follows a ten-year growth cycle, from PCs and smartphones to the current wave driven by automation, cloud computing, and Edge AI.By 2030, the market is expected to reach USD1.3 trillion. As data generated by edge devices continues to surge, sending everything back to the cloud would create bottlenecks in bandwidth, energy consumption, and latency, making real-time decision-making difficult. As a result, AI must move from the cloud to the edge.He further pointed out that AI is evolving from perceptual and generative stages toward a new era of Agentic AI and Physical AI, with applications in factories, autonomous driving, robotics, and energy systems at scale. To address this shift, NXP has transformed from a chip supplier into a system-level platform and ecosystem provider, integrating compute, connectivity, power, and security architectures. Through key acquisitions such as TTTech Auto, Aviva Link, and Kinara, NXP has strengthened its SDV(software-defined vehicles) and Edge AI capabilities while deepening Taiwan's strategic role in global R&D and application deployment.Stefan Poledna, CEO and CTO of TTTech Auto, stated that after joining NXP, TTTech Auto can more efficiently drive SDVs from concept to production-ready, system-level implementation. With more than a decade of experience in automotive software, system integration, and functional safety, the company has built a team of nearly one thousand engineers. Its software has been deployed in over five million vehicles, with more than sixteen million project instances under ongoing development, serving major automakers across Europe and Asia.Its capabilities span SDV core software, functional safety and cybersecurity services, as well as hardware reference designs supporting heterogeneous multi-chip architectures. These are deeply integrated with NXP automotive platforms to enhance overall system scalability. Based on this architectural approach, TTTech Auto has contributed its technical strengths to the NXP CoreRide system-level platform.As generative AI, intelligent automation, and vehicle electrification continue to advance, global computing is shifting from the cloud back toward edge nodes closer to real-world environments, driving devices from being merely connected toward becoming autonomous. Luca Difalco, Senior Vice President of Global Channel Sales and Industrial Solutions at NXP Semiconductors, noted that the industry is moving from smart devices to autonomous intelligent edge systems with sensing, reasoning, and action capabilities. Where early devices relied on cloud-based decision-making, today's systems can perform AI inference at the edge under low power conditions and respond in real time, enabling truly deployable intelligent applications.In this context, he explained that NXP's core mission is not to expand cloud computing power, but to build Intelligent Nodes that can be deployed at scale, allowing AI to be realized in vehicles, factories, buildings, and healthcare environments. The value of AI lies not in model size, but in whether edge systems can perform timely inference and take the right actions. However, Edge AI involves sensing, power, security, connectivity, and data management, making integration far more complex than traditional embedded design.To address this, NXP adopts a modular, stackable architecture to simplify complexity and has established a tiered hardware platform spanning MCX and S32K MCUs to i.MX MPUs, gateways, zonal, and central compute, combined with Kinara NPUs for smooth scalability based on performance needs. On the software side, NXP provides a unified development workflow through eIQ and Time Series Studio, enabling even non-AI specialists to deploy models quickly, while building trusted AI foundations with Root of Trust, Secure OTA, post-quantum cryptography, and AI bias detection.Industrial IoT and Smart Mobility Tracks Reveal the Complete Path to AI DeploymentBeyond the keynotes, the summit featured two major tracks, Smart Industrial and IoT and Smart Mobility, led by NXP technical experts. These sessions comprehensively showcased NXP's technology roadmap across edge computing, connectivity, security, and AI, linking industrial, IoT, and automotive applications and illustrating the full evolution of future intelligent systems from perception to inference and action.The Smart Industrial and IoT track began by outlining how the industrial market is rapidly shifting from automation toward software-defined systems. Equipment now requires real-time computing, reliable connectivity, and higher energy efficiency to support the long-term evolution of smart factories and intelligent infrastructure. The NXP team further analyzed its MCU, MPU, connectivity, and AI NPU portfolio, demonstrating how scalable modular architectures reduce integration complexity and enable developers to move from design to deployment in shorter timeframes.In AI applications, NXP showcased practical deployments of generative and autonomous AI in industrial control equipment and IoT nodes, enabling devices to collect data, perform inference, and make on-site decisions without relying on the cloud. Experts also introduced next-generation intelligent power solutions that improve system efficiency and operational reliability, along with NXP's latest wireless connectivity technologies that ensure stable communication in high-noise, large-scale industrial networks. Applications span medical devices, smart buildings, humanoid robots, and industrial automation, all centered on edge computing, sensor fusion, and high-reliability connectivity.Finally, the team presented a comprehensive Edge Lock security strategy, providing protection from system boot to data exchange, covering OTA updates, helping enterprises maintain long-term trusted security foundations while scaling IoT deployments.In the Smart Mobility track, NXP brought together experts in automotive electronics, connectivity, and AI to provide an in-depth analysis of smart mobility trends and system architectures. The session began with market insights into the acceleration of vehicle electrification, electronics integration, and software-defined vehicles, followed by NXP's holistic solutions across sensing, control, connectivity, and security.New-generation automotive platforms such as S32K5 and CoreRide were then introduced, highlighting how scalable architectures, functional safety, and software reusability support rapid SDV iteration. As AI continues to penetrate in-vehicle edge nodes, experts demonstrated edge inference applications in driver monitoring, environmental perception, and behavioral decision-making, and explained how i.MX processors combined with wireless connectivity are advancing in-vehicle infotainment and intelligent cockpits.To address vehicle connectivity and high-speed data exchange demands, the session also explored the latest automotive Ethernet roadmaps and the high bandwidth and low latency advantages enabled by NXP's 10Gbps Ethernet switches. On electrification, X-in-1 integration solutions and 48V power conversion technologies were presented, underscoring the importance of efficient power management in future EV architectures. Overall, the track covered computing, connectivity, AI, security, and power architectures in a comprehensive manner, defining NXP's core position and forward-looking vision within the smart mobility ecosystem.In addition to keynote and technical sessions, the summit featured more than seventy technology showcases from NXP, ecosystem partners, and sponsors, helping customers understand market trends while gaining deeper insight into how NXP enables the real-world deployment of advanced technologies.In summary, NXP demonstrated how edge intelligence moves from concept to large-scale deployment through comprehensive computing platforms, trusted security architectures, and cross-industry application examples. Whether in industrial IoT, smart mobility, or emerging autonomous systems, the key lies in bringing AI into real-world environments with higher efficiency, lower power consumption, and greater predictability. As Taiwan's influence across technology and ecosystem value chains continues to grow, NXP will keep working closely with local partners to drive the next phase of global edge intelligence adoption.Credit: NXP

As artificial intelligence (AI) and edge computing continue to accelerate worldwide, industrial displays are undergoing a significant transformation. Once regarded merely as passive terminals for visual output, displays have now become intelligent interfaces that connect human–machine interaction, data visualization, and real-time decision-making across diverse smart environments. From collaborative robots and medical systems to EV charging stations, automated factory lines, and self-service kiosks, industrial displays increasingly serve as the first point of contact between AI-driven systems and users, directly influencing operational efficiency, system reliability, and brand perception.Multi-Scenario Demand Accelerates Industrial Display EvolutionAcross factories, medical equipment, and retail environments, the role of industrial displays has expanded far beyond simple information presentation. Autonomous mobile robots and unmanned transport vehicles rely on displays for real-time navigation feedback. Medical diagnostic equipment requires precise visualization to support AI-assisted analysis. Self-service kiosks integrate touch interfaces, sensing, user identification, and edge computing to deliver responsive, data-driven interaction.  According to Roger Ma, Director of Advantech's Industrial Display Solutions Business Unit, industrial sectors exhibit vastly different display requirements. Medical environments demand high accuracy and easy-to-clean designs; outdoor EV charging stations require high brightness and durable weather-resistant builds; robotics and automation systems prioritize responsiveness, stability, and seamless user interaction. These increasingly differentiated use cases are driving industrial displays toward greater flexibility, durability, and customization—creating new growth momentum for the market.Sector-Driven Strategy Accelerates Customization and InnovationAs industrial applications become more complex, a key challenge is integrating display hardware with edge AI, image processing, and intelligent computing. Backed by extensive cross-industry expertise, Advantech adopts a sector-driven strategy, enabling the company to deeply understand the operational challenges of autonomous systems, robotics, factory automation, medical diagnostics, and retail environments. This approach allows Advantech to deliver display solutions tailored to specific industry demands and expedite deployment.Roger Ma pointed out that a major competitive strength lies in Advantech's Design To Order Service (DTOS) capabilities. Its in-house R&D teams cover the entire design spectrum, including mechanical and optical engineering, electronic and software development, touch-bonding integration, assembly precision, and picture-quality tuning. This vertically integrated capability enables stronger quality control and significantly accelerates development cycles.Advantech further enhances customer responsiveness through agile supply chain management and regional manufacturing, enabling rapid customization and efficient adoption of new technologies such as miniLED backlighting. Looking forward, the company is advancing the integration of edge-AI capabilities directly into displays, including embedded cameras, microphone arrays, and sensor modules to support intelligent video conferencing, AI-enabled recognition, and real-time decision-making. With these advancements, displays are evolving into intelligent front-end nodes capable of analysis rather than merely presentation.AI-Enabled Applications: Real Deployment across Factory and Retail EnvironmentsAdvantech's industrial display technologies are already demonstrating real-world impact across multiple vertical markets. In robotic palletizing systems, Advantech's 12.1-inch WXGA (1280 × 800) industrial display serves as the primary interface for complex robotic operations. Offering 400-nit brightness, wide 160/160° viewing angles, and responsive PCAP touch, the display ensures clear visibility and intuitive control even in demanding factory environments.For real-time information visibility on the production line, Advantech deployed the 55-inch VUE-55 digital signage solution, configured as a 2×2 video wall to create a 110-inch large-format display. With a robust design supporting 50,000 hours of LED lifetime and 24/7 continuous operation, the solution delivers reliable performance for critical factory data.In retail environments closely connected to consumers' daily lives, Advantech's technologies also play a critical role. The 850-nit high-brightness, optically bonded IDP31-101W display enhances the touch experience and durability of intelligent cleaning robots. Meanwhile, the VUE-2238 anti-glare touch display provides flexible landscape and portrait installation options for self-service ordering kiosks and hotel counters. Its IP65 front-panel water- and dust-resistant design, along with its color accuracy, not only improves product reliability but also effectively strengthens brand image.Global Reach and Cross-Platform Integration as Key AdvantagesDisplays serve as the critical bridge connecting humans and machines, as well as data and decision-making. In the era of AI and edge computing, industrial displays are shifting from simple information output devices to core interfaces that drive digital transformation and create business value. According to Roger Ma, the competitiveness of Advantech's display product line stems from the company's unique strengths, including its expertise in multi-platform system integration and its extensive cross-industry experience. These capabilities enable Advantech to deliver complete solutions that go beyond standard display products and integrate seamlessly into customers’ overall application ecosystems.Looking ahead, Advantech will continue to provide high-reliability, rapid-deployment intelligent display solutions for global customers. With stronger edge-AI integration and enhanced customization capabilities, the company is poised to lead industrial displays into a new stage of development.Advantech's Industrial Display Solutions.Credit: Advantech

Taipei, Taiwan (December 2, 2025) – ASRock Industrial made its mark at FIDO Taipei Seminar, presenting a keynote on Secure Device integration with FIDO Device Onboard (FDO) deployment technology, demonstrating how automated, trusted, and scalable onboarding is transforming industrial edge AI. As the first industrial computer company in Taiwan to achieve FIDO Device Onboard (FDO) certification, ASRock Industrial continues to raise the bar for industrial cybersecurity. Backed by IEC 62443-4-1 and IEC 62443-4-2 certifications, the company delivers a security architecture that spans from product design and manufacturing to deployment, building an unbroken chain of trust at every layer.With its newly introduced Ai FDO solution, ASRock Industrial empowers enterprises to automate device onboarding and configuration from factory to field, reducing risk, accelerating deployment, and enhancing operational resilience. By merging secure device, verifiable trust, and zero-touch deployment, the company continues to push the boundaries of what's possible at the industrial edge, anchored by its leading industrial cybersecurity platform and in collaboration with ecosystem partners, driving transformation across smart manufacturing, smart retail, smart cities, and other critical infrastructure industries.Security Engineered into Every Layer – Secure Device + FDO DeploymentBuilt on the foundation of the FDO trust chain, ASRock Industrial strengthens security across every layer – from secure device to secure deployment, establishing a comprehensive secure edge AI platform that sets a new industrial cybersecurity standard for critical infrastructure.Secure Device: ASRock Industrial's Secure Device architecture delivers multi-layered, industrial-grade protection built on a hardware-rooted and boot-time chain of trust. Leveraging TPM, Secure Boot, and other trusted technologies, it protects data from boot to runtime through defense-in-depth. The architecture reinforces virtualization and I/O isolation, strengthens memory and code safeguards during runtime, and incorporates accelerated cryptography to secure stored data.It also provides a verifiable security baseline for automated deployment and remote management. Fully aligned with the FDO onboarding stages (TO0, TO1, TO2), it verifies device identity, keys, and configuration integrity, reducing tampering risks and establishing trusted readiness for the intelligent edge.  Secure Deployment: Taking trust beyond the device, ASRock Industrial advances security by integrating its Secure Device design with FDO deployment through the Ai FDO solution, developed in accordance with the FIDO Alliance standard. Upon first boot, devices can automatically connect to designated servers to complete authentication, registration, and deployment - shortening time-to-deploy and minimizing manual intervention and human errors. Supporting bare-metal FDO onboarding, Ai FDO combines cryptographic validation and anti-tampering mechanisms to ensure consistent and scalable secure deployment across both cloud and private environments.Certified for Global Standards, Driving FDO Adoption Across the Industrial EdgeASRock Industrial’s secure hardware platform is certified under multiple international standards, including IEC 62443-4-1 (Secure Product Development Lifecycle Requirements) and IEC 62443-4-2 (Technical Security Requirements for IACS Components). Every stage - from design and development to testing - undergoes rigorous risk assessment and security validation to ensure compliance and resilience.As the first industrial computer company in Taiwan to achieve FDO certification, ASRock Industrial strengthens its leadership in trusted and verifiable edge AI platforms. Beyond product certifications, the company continues to enhance secure applications, supply chain transparency, and incident response capabilities - establishing multiple-layer defenses across device, deployment, and operations.At the FIDO Taipei Seminar, ASRock Industrial showcased its integrated Secure Device and FDO deployment solution that accelerates secure onboarding, reduces cyber risks, and ensures deployment consistency. James Lee, Chairman of ASRock Industrial, stated: "Industrial cybersecurity is the new baseline for intelligent edge computing. With field-proven expertise in secure edge AI, ASRock Industrial unifies secure device with FDO-driven deployment, aligned with international standards. Through zero-touch onboarding and a verifiable chain of trust, every device is protected from the first connection and runs reliably at scale - enabling enterprises to deploy faster, operate safely, and expand edge AI with confidence."For more information on ASRock Industrial's secure device and FDO deployment solutions, visit our Website or contact us via Product Inquiry.

AIRoute Technology is a US-based AI startup building vertical AI agents that deeply understand domain data, workflows, and decision processes. The company's mission is to turn complex, information-heavy work into streamlined, intelligent workflows so professionals can focus on judgment, not manual processing.At the center of its portfolio is StockNews.AI, an AI agent platform for financial and market intelligence. Powered by advanced AI models, StockNews.AI continuously ingests large volumes of news, filings, and research, then delivers real-time alerts, concise summaries, and clear views of what has changed. It is designed to plug directly into the daily routines of analysts and investment teams-helping them cut hours of information sorting into minutes, standardize their research process, and respond faster with greater confidence.To serve enterprise customers, AIRoute Technology builds on Microsoft Azure as its core cloud platform and is expanding integration across the Microsoft ecosystem. Azure's security, reliability, and compliance foundation allows enterprises to deploy AIRoute Technology's solutions at scale while maintaining control over data and access. Through the Microsoft Startup Accelerator program, Azure Marketplace listing, and upcoming integrations with Microsoft 365 and Copilot on Windows, AIRoute Technology aims to bring its AI agents into the tools knowledge workers already use every day-so AI becomes a built-in assistant, not a separate destination.AIRoute Technology's approach has already earned international recognition. The company won 2nd place at the 2025 Erupture Global Hackathon in California, underscoring both its technical strength and its ability to translate advanced AI into practical products for real users.At the same time, AIRoute is actively stepping onto international business platforms. By bringing StockNews.AI to Singapore's SWITCH exhibition, the team is building new partnerships and exploring collaborations with leading enterprises and ecosystem partners. In 2025, AIRoute is running proof-of-concept projects with global companies to validate its AI agents in real-world, high-stakes environments. These POCs, combined with planned new funding, will support AIRoute's next stage of growth as it expands its advanced AI solutions across Asia and North America.AIRoute Technology brings StockNews.AI to 2025 Singapore SWITCH.Credit: AIRoute

In 1988, Japanese firms controlled 51% of worldwide chip sales, dominating memory production and manufacturing equipment. Fast forward to 2019, and that share had steadily declined to 10%, a stunning reversal that left the country dependent on foreign suppliers for critical technology.Fusion Worldwide: Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan.Credit: Fusion WorldwideBut 2025 marks a turning point. Armed with unprecedented government investment and strategic partnerships with global tech giants, Japan is mounting an ambitious comeback that could reshape the semiconductor landscape.The Decline: What Happened to Japan's Chip Dominance?The 1986 U.S.-Japan Semiconductor Agreement created challenges. Under pressure from Washington, Tokyo agreed to minimum chip prices and doubled foreign market access from 10% to 20%. These concessions immediately eroded Japanese competitiveness, allowing American, South Korean, and Taiwanese companies to capture market share.Meanwhile, Japan's economy entered the "Lost Decades" after 1990. Corporate investment dried up just as the industry shifted toward a specialized "fabless" model, where design and manufacturing separated. While TSMC pioneered contract manufacturing in Taiwan and Samsung built massive fabs in South Korea, Japanese firms clung to outdated integrated models, trying to do everything in-house.By the 2000s, legendary Japanese chipmakers like NEC, Hitachi, and Toshiba had consolidated and exited.The $65 Billion Comeback StrategyJapan's revival plan centers on massive government intervention. Between 2021 and 2025, Tokyo has allocated approximately $65 billion in semiconductor subsidies, representing a larger share of GDP than America's CHIPS Act.This funding targets three strategic pillars:1. Attracting Foreign Fabs: TSMC's Kumamoto facility, which began operations in 2024, received $8 billion in Japanese subsidies. The plant produces 12-28nm chips for automotive and consumer electronics, with a second fab targeting advanced 6-7nm production by 2027.2. Building Domestic Champions: Rapidus Corporation, backed by Toyota, Sony, and SoftBank, represents Japan's boldest bet. Partnering with IBM, Rapidus aims to mass-produce cutting-edge 2nm chips by 2027 at its Hokkaido facility, a feat only TSMC and Samsung have achieved. The government has committed $12 billion to this project alone.3. Strengthening Equipment Makers: Tokyo Electron, the world's third-largest semiconductor equipment manufacturer, continues receiving R&D support to maintain Japan's edge in critical manufacturing tools.The strategy also includes workforce development, infrastructure upgrades in semiconductor hubs like Kyushu and Hokkaido, and participation in the "Chip 4" alliance with the U.S., South Korea, and Taiwan.Why This Matters GloballyJapan's semiconductor resurgence isn't just about national pride, it addresses critical vulnerabilities in the global supply chain.The 2020-2023 chip shortage exposed dangerous dependencies. When Taiwan made chips became scarce, Japanese automakers like Toyota lost production of 500,000 vehicles. With 75% of advanced chips manufactured in Taiwan, just 100 miles from mainland China, geopolitical tensions threaten the entire tech ecosystem.Japan's revival offers geographic diversification. Its partnerships with TSMC, IBM, and American firms like Micron (which received $3.6 billion for Hiroshima expansion) create alternative production nodes outside the Taiwan Strait flashpoint.Moreover, Japan retains formidable strengths. Companies like Sony control 50% of the global image sensor market, while Japanese firms dominate semiconductor materials—holding 88% of the coater/developer market and 53% of silicon wafers.The Road AheadJapan isn't just catching up, it's positioning for next-generation leadership. Rapidus's 2nm technology, if successful, will power AI computing and autonomous vehicles. TSMC's expanding Kumamoto operations are already attracting 44 supplier companies, creating a self-reinforcing ecosystem.The critical test comes in 2027, when Rapidus targets mass production. Success would prove Japan can compete at the cutting edge. Failure would raise questions about whether even $65 billion can overcome decades of decline.One thing is certain, Japan is back in the semiconductor race, and this time, it's playing for keeps.(Article Sponsored by Olivia Seohyun Ju, Vice President of Sales, Korea/Japan, Fusion Worldwide)

Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity.Air cargo shipment reflects growing Asia-to-US/EU demand.Credit: Dimerco"In 2026, the overall market outlook will be cautiously optimistic," said Catherine Chien, Chairwoman of Dimerco Express Group. "Ocean freight will not be driven by a sudden surge in demand, but rather by capacity imbalances and regional differences. At the same time, demand for high-tech, AI-related, and e-commerce shipments continues to drive growth in air freight from the Asia-Pacific region to North America and Europe. Our role is to integrate our ocean and air freight, contract logistics, and brokage and compliance resources to help customers build supply chains that are both secure and resilient."Freight market outlook: capacity is back, but complexity is higherOn the ocean side, new vessel deliveries and relatively stable bunker prices are being offset by structural bottlenecks. Major European hubs continue to face congestion, while Red Sea and Suez diversions still disrupt rotations and tie up ships and equipment.Regional tariff and carbon schemes are fragmenting cost structures. As a result, some Asia–Europe services have seen rates rebound from unsustainably low levels, even as several Transpacific lanes face softer demand and continued rate pressure. Global schedule reliability has recovered to around 65 percent but remains below pre-pandemic levels; for many shippers, booking at least three weeks in advance on key trades has become standard risk management. Overall, the 2026 ocean freight market is not defined by a demand boom, but by capacity often being in the wrong places and by strong regional differences.Airfreight tells a different story. Demand is driven by AI servers and semiconductor equipment, communications and electronic components, and resilient cross-border ecommerce. "Taiwan+, China+" manufacturing strategies are shifting production toward Southeast Asia and India, driving strong growth in air volumes from these origins-as well as from Taiwan-into North America and Europe. Following changes to US de minimis rules, some direct China–US e-commerce flows have decreased, but more cargo is now routed via alternative hubs and forward-stocking models, making trade lanes more diversified. Shippers that can flex between multiple lanes, multiple modes and multiple origin countries will be better positioned than those relying on a single country or mode.China+, Taiwan+ and tariffs: four logistics pain pointsManufacturers extending production from China into Southeast Asia, India or Mexico typically face four major challenges: Inadequate capacity at critical times, as port congestion, diversions and blank sailings reduce effective ocean supply even when the global fleet is large; Difficulty choosing a second warehouse or hub outside China that truly optimizes total landed cost-combining transport, duties, inventory and lead time with available government incentive schemes at each location; Limited knowledge of local regulations, customs requirements and tradecompliance rules; and Lack of practical experience managing complex factory relocations involving used machinery and oversized equipment.Dimerco's solutions: from capacity to complianceTo close capacity and lead-time gaps as more freight shifts from Southeast Asia to North America and Europe, Dimerco combines multi-modal options with consolidation through selected Asia gateways. This approach helps secure uplift for high-value cargo when local air capacity is tight, while preserving flexibility on routing and transit time.For manufacturers searching for a "second hub" outside China, Dimerco applies a structured assessment tool to compare locations across Southeast Asia. The analysis covers service levels, duties and taxes, regulatory and investment environment (including incentive schemes), transport infrastructure and labor. Using this framework, Dimerco has helped global customers select and launch warehouse hubs in markets such as Singapore, Malaysia, Thailand and Vietnam, enabling more flexible inventory deployment between China and secondary locations and giving shippers more routing options as conditions change.Dimerco also supports complex factory and line relocations. In one case, a data-center and IT equipment manufacturer planned to move a production site from Singapore to Malaysia in 48 weeks; Dimerco completed the relocation in just 36 weeks by coordinating government liaison, customs-compliance advisory for used machinery and heavy-lift transport using a combination of low-bed and open trucks.With more than 45 years of operational experience in Southeast Asia, Dimerco helps foreign manufacturers navigate customs and regulatory environments through FTZ and bonded warehouses across Mainland China, Hong Kong, Taiwan, India, Southeast Asia, Mexico and the US. Dimerco's Expand to India Advisory Service allows customers to implement phased "Test – Trade – Manufacture" models, utilize FTZ and bonded policies to optimize duties and inventory placement, and reduce compliance risks in multi-country, multi-node supply chains.Building for AI-driven growth in 2026Dimerco's differentiation is centered on three areas: deep Asia presence, with around 130 owned offices across the region; a focus on high-value, time-critical freight in sectors such as semiconductors, electronics and aerospace; and consistent systems and quality, enabled by a secure, cloud-based global operating platform that connects air, ocean, customs, warehousing and distribution services."For our customers, 2026 is not about whether they will grow, but about how to grow safely under new tariff, compliance and capacity constraints," added Catherine Chien."By combining flexible multi-modal options-such as switching from sea to air for urgent shipments, or from air to sea for cost-sensitive cargo with controlled lead times-with strategic charter flight services, deep Asia expertise, integrated warehousing solutions and strong compliance advisory, Dimerco is ready to help customers turn AI, Taiwan+, China+ from buzzwords into real, executable opportunities."Catherine Chien, Dimerco Chairwoman.Credit: Dimerco

DigiKey, a leading global electronic components and automation products distributor, proudly announces the official launch of its Indian subsidiary, Digi-Key Electronics & Automation Trading Private Limited, which will operate a Global Capability Center (GCC) in Bengaluru. This reinforces DigiKey's long-term commitment to the Indian market by leveraging the expertise of nearly 300 DigiKey India employees to support its global operations.The launch of DigiKey India marks a significant milestone in the company's global expansion strategy. The newly established DigiKey GCC will serve as a hub for innovation and collaboration, signaling future growth in hiring and capability expansion.This milestone represents a major step forward in DigiKey's global strategy, said Dave Doherty, chief executive officer of DigiKey. India’s tech ecosystem and skilled workforce are key to our continued success in the region. We are thrilled to deepen our roots and invest in the future of DigiKey India.

The Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) hosted the "AWS JIC Demo Day" on November 18 at InterContinental Kaohsiung, bringing together technology leaders, startups, and enterprises across Southern Taiwan. The event focused on how AI-driven innovation can accelerate startup growth, advance enterprise digital transformation, and enhance Taiwan's global competitiveness.Robert Wang, Managing Director of AWS Taiwan & Hong Kong, emphasized that since the AWS Joint Innovation Center launched in Kaohsiung in 2022, it has continued to empower the city to seize emerging opportunities. Through startup incubation and cloud-driven support, the JIC has helped accelerate innovation among local industries and expand Taiwan's presence in international markets. Moving forward, AWS will work closely with Kaohsiung under the core strategy of "New Finance, New Economy," with the goal of making the city a key financial innovation sandbox and a major demonstration hub in Asia. This initiative aims to inject new economic energy into Kaohsiung while accelerating enterprise modernization across sectors.Lin Chin-Tien, Director of the Southern Region Service Office of the Small and Medium Enterprise and Startup Administration (SMESA), Ministry of Economic Affairs, noted that the event represents a major milestone for Kaohsiung's smart economy and startup ecosystem. "Our collaboration with AWS has enabled startups to strengthen their technical capabilities while securing business opportunities with enterprises. We will continue supporting outstanding teams as they expand onto the global stage," Lin said.Lin Liao-Chia-Hung, Deputy Director-General of the Kaohsiung City Government Economic Development Bureau, highlighted the unique advantages of Kaohsiung's diverse industrial environment - where emerging technologies and traditional industries coexist and complement each other. He expressed hope that startups will leverage AWS's cloud technologies and ecosystem resources to help accelerate economic development in Kaohsiung and further contribute to Taiwan's overall industrial transformation.New Economic Growth Driven by AIA spotlight session, the "Joint Innovation Forum - The Smart New Economy Driven by AI," showcased public-private joint innovation cases where established enterprises collaborate with startups to create new industry momentum.Jacky Pan, Vice President of the Technical R&D Group at iPASS Corporation, shared how AI-driven, user-centric services are beginning to generate tangible public impact. For instance, AI analytics derived from iPASS Senior Citizen Cards usage data enable proactive early-warning mechanisms, allowing local governments to deliver timely care and strengthen elderly support services - a clear demonstration of how AI enhances public welfare and unlocks new avenues of innovation.DOTDOT Global CEO Ting Hsieh discussed digital transformation challenges faced by SMEs, noting that despite the company's initial aim to serve street-side vendors, many business owners lack the time and technical familiarity to adopt complex IT systems. "From an AI implementation standpoint, the biggest beneficiaries aren't the shop owners - it's the consumers and franchise headquarters. AI-driven features such as weather-triggered advertising help maximize order conversion and operational efficiency," he explained.Frank Liao, Director of Partnership at AIFT, highlighted how the company integrates red-teaming and real-time protection modules to establish strong compliance and safety guardrails for enterprise generative AI adoption. This solution has enabled innovation in highly regulated industries such as finance while ensuring compliance with global standards.Startups and Enterprises Co-Creating New Economic MomentumTwelve startup teams from the 2025 Startup Terrace Kaohsiung AWS Joint Innovation Center showcased their AI solutions spanning manufacturing, retail, legal services, smart buildings, and sports technology. Startups included AIRA (facial recognition and tracking), Ret[AI]ling Data (smart retail and manufacturing AI), LegalSign.ai (generative AI legal workflow platform), eCloudEdge (AIoT edge orchestration platform), eNeural (edge AI self-learning), PowerArena (Data insights for manufacturing using AI computer vision), Linker Vision (Vision AI with data-centric insights and edge integration), SHIPENG Technology (digital twin and smart construction AI), StatsInsight (Data solution for baseball), and Seasalt.ai (Cloud communication AI technology solutions). These teams demonstrated how the AWS JIC ecosystem is accelerating innovation and enabling enterprises to modernize through cloud-powered AI.AIRA, for example, develops facial recognition, face tracking, human detection, and smart fencing technologies that have been deployed in retail stores, factories, smart buildings, and public safety applications to enhance site management and safety.Addressing the challenges of data diversity, cloud-edge collaboration, and cybersecurity compliance in manufacturing and energy sectors, eCloudEdge provides the NeoEdge Edge Orchestration Platform. By integrating physical AI and sensor fusion technologies, NeoEdge helps enterprises accelerate innovation across OT and IT environments.The event brought together more than a hundred representatives from enterprises, startups, investors, and government agencies. AWS Taiwan & Hong Kong Managing Director  Robert Wang concluded the event by sharing his commitment to empowering promising startups with AWS cloud technologies and ecosystem resources, enabling them to achieve transformative growth and expand their reach from Taiwan to international markets.

 AGI Technology, a leading memory brand from Taiwan, announced that it will participate in CES 2026 from January 6 to 9 in Las Vegas at The Venetian Resort, Level 2, Bellini 2001B, where it will debut its complete lineup of next-generation high-speed storage solutions. Under the theme "Powering What's Next with AGI Innovation," AGI will showcase breakthrough technologies across extreme overclocking, high-speed transmission, and rugged mobile storage to address the surging demands of AI computing, ultra-high-resolution content workflows, and multi-task creative environments.AGI's Next-Generation Storage Portfolio DebutsProject S10 Gen5 SSD - 6nm Controller, 11,000 MB/s PerformanceAGI introduces its new flagship Project S10 Gen5 SSD featuring TSMC's 6nm controller, delivering significantly enhanced efficiency and effectively addressing the thermal challenges common in Gen5 devices under extended heavy workloads. With PCIe Gen5 x4, the drive reaches speeds of 11,000 MB/s, offering a dramatic bandwidth upgrade over Gen4. Combined with its low-power controller and high-efficiency cooling module, the S10 provides sustained, stable performance for AI datasets, AAA gaming, and high-resolution rendering.Project K10 DDR5 - 10,000 MT/s Overclocking FlagshipBuilding on the success of the Turbojet series, AGI reveals Project K10 DDR5 memory, achieving an impressive 10,000 MT/s with optimized latency and a 24GB x2 high-capacity configuration. The aluminum heatsink and a fluid-cut design with a dynamic RGB light bar enhance both cooling performance and visual aesthetics, delivering an exceptionally smooth overclocking experience for gamers.Comprehensive Mobile Storage: High Speed x Durability x Capacity in One LineupAGI presents three new portable SSDs designed around mobility, high-speed transmission, and rugged durability. The AGI ED158 uses a cap-less sliding connector that plugs directly into smartphones for 4K ProRes recording and instant backup with zero cables needed, enabling intuitive and efficient mobile creation. The AGI ED268 features IP55 water- and dust-resistance, 2-meter drop protection, and 20 Gb/s transfer speeds, offering the ideal balance between durability and performance. The AGI ED368 adopts the latest USB4 Gen3 x2 interface, reaching up to 40 Gb/s with an outdoor-grade reinforced enclosure suited for field production, on-the-go editing, and professional imaging teams.AGI Technology invites attendees to visit Bellini 2001B to experience the power of its next-generation storage innovations. Additional products and accessories will be showcased, with AGI engineers available for technical discussions on the future of high-speed computing and storage.