In the age of digital residents, semiconductor chips are present in almost every aspect of our lives. Whether it is from data centers to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed. Contemporary microprocessors or graphics processors can hold more than 50 billion transistors on them, with a failure rate of just shy of one in a billion. To achieve such levels of reliability in chip operation, Smiths Interconnect's test sockets play a critical role in the overall chip design and package testing process.The role of testingWhat role does the chip play in these devices? The role of various chips on top of these electronic devices is more similar to the role played by various organs of the human body. The overall management of electronic devices and computing logic processing, etc., need the CPU (the core component is the chipset), the CPU is equivalent to the human brain. Electronic devices to identify sound, processing audio, need audio processing chip, equivalent to the human body's ears. Electronic devices receive images and process pictures, requiring a picture processing chip, which is equivalent to the human body's glasses. In short, these devices have various functions that require corresponding chips to achieve, just like the human body's various organs to achieve different functions.From the 'brains' of processing units to the 'eyes' of imaging systems, every socket undergoes comprehensive testing to ensure optimal performance. Credit: Smiths InterconnectTesting during production plays an important role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible, while precisely controlling each process parameter of the chip. The factory first performs basic functional testing of the semiconductor chip core at the wafer level, discarding any faulty parts, and then separates the tested chips into individual units and packages them for further testing. Usually the chip is tested up to 20 times before it leaves the factory. Most testing is done by special equipment attached to the chip, which uses electrical signals to stimulate the chip to simulate the real state and capture the response of the chip to see if it meets the design requirements. These are known as automatic test equipment (ATE) systems typically sell for $1 million to $2 million and can be programmed to test a variety of chips for many years.Smith Interconnect Semiconductor test solutionsSmiths Interconnect offers high quality test sockets with a wide variety of spring contacts designed using different design standards. The products are flexible, design optimized and quick to deliver. Test sockets are available in a variety of leaded and leadless package types, including leadless (QFN) packages, quad flat packages (QFP), small outline integrated circuits (SOIC), ball grid array (BGA) packages, and connection tray grid array (LGA) packages.Representative test socket: DaVinci high speed test socketSmith Interconnect's DaVinci Series test socket is a high-performance coaxial socket that precisely tackles 56/112G SerDes PAM4 test challenge. Consumer demand for next-generation technologies such as the Internet of Things, 5G, artificial intelligence (AI), deep learning and self-driving vehicles require high-speed data transmission and processing technologies, and high-reliability testing is critical for the high-speed, multifunctional digital and analog devices that drive them.The DaVinci Series test socket offers high-speed, high-reliability testing for advanced 5G and AI chips. Credit: Smiths InterconnectIn a wide range of high-speed applications, DaVinci series high-speed test sockets are the ideal high-speed solution for testing large network switching core chips introduced for 5G and cloud computing. DaVinci high-speed application sockets IC sockets integrate spring probe technology and patented insulation materials to provide excellent signal integrity and high mechanical durability. The socket provides an impedance-controlled coaxial solution with analog RF up to 67 GHz and digital transmission speeds of 112 Gb/s. The use of spring probe technology in a patented insulating material housing results in a coaxial structure that reduces test height and material deflection. In addition the reduced test height and low material deflection characteristics of the new DaVinci High Speed Series ensure efficiency and accuracy in the final test phase of intelligent network visualization technologies, 5G and artificial intelligence applications. The new DaVinci Series also features a fully shielded signal path, a socket frame that acts as a heat sink for excellent thermal performance, and interchangeable spring-loaded probe contacts. It is rated at 3.0A and has a low contact resistance (<80mΩ).With the current upgrade of high-speed communication standards such as 5G, designers of chip ICs for consumer electronics, smart driving and power management are increasingly using QFN packages in applications where both stringent electrical performance requirements and the smallest possible chip form factor and footprint are required. With their directly connected peripheral pad structure, large ground blocks for thermal and electrical performance, and very thin stack heights, QFN packages offer unparalleled advantages, but also present a new set of test challenges. Addressing these test challenges requires a stable, reliable and electrically "clean" test socket solution.Whether our customers' challenges are cost, R&D capability, lead time or quality, Smiths Interconnect aims to provide customers with the best possible solution for IC testing.

As the demand for secure and efficient embedded solutions continues to grow, manufacturers are integrating secure subsystems into System-on-Chip (SoC) architectures. Professionals such as engineers, security architects, systems architects, and product developers involved in embedded security, secure elements (SE), SIM cards, and hardware security modules (HSMs) for 5G connected devices—such as smartphones, IoT devices, and automotive applications—need to understand Protection Profile 0117 (PP0117). The article aims to elucidate how PP0117 establishes the security framework for integrating secure subsystems into SoCs, highlights its differences from PP0084, and discusses its endorsement by the GSMA, the global authority on mobile security.What is a protection profile?A Protection Profile (PP) is a security guideline document that standardizes the development, integration, and evaluation of security mechanisms in hardware and software. PP0117 was specifically designed to define security requirements for integrated secure subsystems in SoCs, such as embedded SIMs (eSIMs) and secure elements (SEs).Before PP0117, Protection Profile PP0084 was widely used for stand-alone security components, such as SIM cards and secure elements. However, integrating these components directly into SoCs presents new challenges that PP0084 does not address, such as defining security boundaries within complex chip architectures. PP0117 was developed to overcome these challenges, ensuring strong security for integrated secure elements (iSE) in SoCs.IntroductionProtection Profile 0117 (PP0117) is a protection profile designed to facilitate the integration of a secure subsystem (3S) into large-scale System on Chip (SoC) architectures.Prior to PP0117, Protection Profile PP0084 was used to evaluate stand-alone security components such as secure elements (SE) and SIM cards. However, when integrating the logical functions of SE or similar devices into a larger SoC, the implementation constraints render obsolete some of the methods and requirements of PP0084.Secure Sub-System in System-on-Chip (3S in SoC) Protection Profile was developed to address the security of integrated solutions and provide the industry with a unified set of clear and assessable security requirements to be fulfilled.This PP was developed under the Eurosmart association by gathering the technical committee members, including developers, labs (ITSEF), and certification bodies. The certification body selected for PP0117 is the German Bundesamt für Sicherheit in der Informationstechnik (BSI).PP0084 vs PP0117 based designsPP0084, originally designed for discrete security elements (such as SIM cards and smart card chips), assumes a physically isolated security boundary with strict interface protocols.By contrast, PP0117 adapts security guidelines for secure elements integrated into SoCs with complex internal and external interfaces. The key differences include:Credit: WinbondPP0117 ensures that integrated secure elements maintain the same level of security as stand-alone secure elements, while adapting security requirements to the realities of SoC design.There are several major differences that need to be considered when designing and evaluating a secure subsystem in a large SoC, as opposed to a stand-alone secure controller.The most notable differences arise from process constraints in device fabrication, such as the absence of embedded non-volatile storage and the difficulty in defining security boundaries. Evaluating an integrated secure subsystem is also more complex compared to a stand-alone device. This complexity stems from the numerous interfaces the integrated subsystem shares with the rest of the SoC, as opposed to a stand-alone device with limited pinouts and strict interface protocols. Consequently, all parties involved in the design, fabrication, evaluation, and utilization of such secure subsystems must adhere to a more comprehensive set of guidelines, as outlined by PP0117.A standard SE or eSIM is packaged in a small, limited pin-count package. In terms of security evaluation, this small, packaged device constitutes the Target of Evaluation (TOE). Evaluating such a device is relatively straightforward due to its limited range of connectivity and interfacing options. However, in the case of a large SoC, the majority, if not all, of the secure subsystem's interfaces are internal to the die and are seldom externalized. Additionally, there may be extra interfaces that are not typically present in stand-alone security devices, such as memory interfaces, debug interfaces, system bus interfaces, and those used for more advanced functions.PP0117 is designed to guide the development and evaluation of integrated secure functionality, defining the requirements for such interfaces and outlining methods to assess their security.PP0117 version 2 and GSMA endorsementThe GSMA (Groupe Speciale Mobile Association) is the global organization that sets security standards for mobile network security, SIM technology, and eUICC (embedded SIMs). In 2024, GSMA endorsed PP0117 as the security framework for integrated eUICC (embedded Universal Integrated Circuit Card) implementations.GSMA recently published eUICC (embedded SIM) Protection Profile V2.0. This Protection Profile allows for both discrete eUICC and integrated TRE (Tamper Resistant Element) implementations for embedded SIM/UICC implementation. The Protection Profile V2.0 references PP0117 for integrated solutions on top of PP0084 for the baseline requirements of eUICC. The GSMA's support for integrated secure subsystems that implement SIM/UICC capabilities facilitates a higher level of functional integration of handsets and IoT devices into the SoC.Major PP0117 use casesThe most notable use case of PP0117 is integration of SIM card functionality into SoC devices. The trend of SIM integration takes place in two major verticals – IoT connected devices and mobile phones.1) Integrated SIMIn mobile phones, the main SoC device integrates as many logical functions as possible. This approach enables a reduction in power consumption, offers better pricing, minimizes board space, and introduces new functionalities. Given that SIM cards essentially function as simple microcontrollers with non-volatile storage for code and data, their integration into larger SoC devices appears inevitable. In connected IoT controllers, most, if not all, of the system's functionality, including RF, baseband, and application processors, is integrated into a single device. Implementing an integrated SIM within such a device optimizes the overall cost structure, a benefit that typically extends to the end customer.2) Integrated Secure ElementAnother use case is the integration of secure elements into the mobile phone's SoC. These secure elements manage critical secure functions such as mobile payments, electronic ID integration, biometric user authentication, and operating system security. Almost all modern smartphones feature at least one secure element. The exception is in China, where a secure element isn't mandatory for mobile payments. Mid to high-range mobile phones incorporate two secure elements, one for embedded SIM (eSIM) functionality and another for mobile payment and related features. Embedding these elements into the SoC can notably impact the bill of materials (BOM) cost of the mobile phone, at times representing a significant portion of the total BOM.3) AutomotiveThe hardware security module (HSM) used in automotive subsystems is another example of PP0117-based secure subsystem applications. Such HSMs are used for protecting resources such as V2X networks, driver sensitive information, and vendor assets.In the PC and server ecosystem, security modules integrated into the main SoC devices are used to protect against cyberattack, e.g. boot protection and secure software update.Another emerging use case is supply chain protection, where the secure subsystem can be used to authenticate the hardware during all stages of the system life cycle.In all these use cases, incorporating the secure logic directly into the main SoC is a practical decision from a production cost perspective, since in comparison with the other SoC logic, the secure subsystem requires only a minimal amount of logic and physical space for implementation.Main methodology and evaluation conceptThe Protection Profile and all gathered information were compiled into a single working document, which was then provided to the auditor for conversion into the Common Criteria definition methodology.Several constraints were defined:A. P0117-based designs should have strict conformance to the Security IC Platform Protection Profile (PP-0084). The constraint was essential for the developers to ensure that if they need to certify their products for PP0084 due to the upper layers (software and applets) requiring a composite evaluation to PP0084, they would not need to manage two separate evaluation processes.B. The Protection Profile must comply with EUCC methodology so it can be accepted by the new scheme in Europe.C. The Protection Profile must be aligned with external entities which use\reference PP0084 or plan to use the new Protection Profile in a composite evaluation with their layers\components.D. The Protection Profile should be defined in an Agile way of base requirements and optional packages that the developers can use based on their development.E. The Protection Profile should be general so that it can be used for wide security subsystem solutions in addition to the Secure Element, such as eUICC, iSIM, HSM, TPM, V2X.F. The Protection Profile should support 3 forms of deliveries – IC, hard macro, and programmable macro (PL Macro) to align with industry standards and enable the reuse of the evaluation results across multiple SoCs.G. The Protection Profile should support the different architectures of memory – embedded memory (as in the traditional Secure Element), external off-the-shelf memory, "External Passive Memory", and "Secure Memory" which is a certified component that will be part of the evaluation by the composition evaluation method.Usage of external memoriesAs modern SoC devices are fabricated in cutting-edge technologies, on-chip memories are either costly to implement in terms of silicon area requirements, as in the case of RAM, or outright unfeasible to implement, as in the case of non-volatile memory such as Flash. These limitations dictate the use of external memories with the secure subsystem. To facilitate usage of external memories, PP0117 was structured in an Agile way with a base package. This includes the minimum requirements that any Secure Sub-System within a SoC must satisfy, along with a range of optional packages designed to meet additional industry requirements that have emerged due to the Secure Sub-System in SoC architecture:• External Memory packages (Passive and Secure, volatile and non-volatile memory) – the security requirements related to the data and code stored in the external memory.The external memory package specifies the following requirements:• Protection from content abuse (unauthorized reading erasing or modifying of memory content)• Protection from cloning or replacing of the memory chip between systems• Protection from unauthorized content roll-back• Protection from interfering communication on the external bus, e.g., command replay or modification, eavesdropping, and man-in-the-middle.Passive external memoryIn the case of the passive (i.e. standard, non-secure) external memory, the requirements mandate that the SoC manages all the protection, as the memory device itself has no security functions, and cannot perform or assist in any of the tasks required.Protection from content abuse requires data stored in the external memory to be encrypted. To avoid weakening a fixed encryption key, it is recommended to utilize distinct keys for repeatedly encrypting user-controlled data. Generating multiple encryption keys from a single root key necessitates that the SoC maintains certain state information such as a monotonic, non-volatile counter.Protection from command replay in the case of passive memory is identical to protection from device unauthorized roll-back. In both cases, the adversary forces known and previously authentic information or state into the memory device.The responsibility lies with the SoC to monitor the freshness of the information stored in the external memory for the purpose of detecting modifications originating from command replay (such as writes and erases) or rolling-back the memory content to an earlier legitimate image. To facilitate this, the SoC must maintain state information pertaining to the stored data. This can be achieved using monotonic counter(s). Whenever data is stored externally, it is encapsulated and authenticated in a manner that allows the SoC to verify its version and ensure it has not been rolled- back to an older version.Protection from device cloning requires each SoC to use different keys for encryption and authentication of the data stored externally. This prevents cloning of the content from one memory device into another system, as the information will not be authenticated with a different key.Implementing a monotonic counter in the SoC requires the SoC to have an internal non-volatile storage. As mentioned above, standard non-volatile technologies such as Flash are not available in advanced process nodes, forcing the use of One-Time-Programmable (OTP) fuse-based memory arrays for monotonic counters. Even for a process where OTP is a reputable and robust technology, it has some major limitations and drawbacks:• Cost – OTP fuses require significant die area and usually do not scale well with node technology• Ease of operation – writing an OTP bit requires significant energy release within the die• Security – to withstand some fault-injection attacks on OTP-based monotonic counter implementations, more than one OTP bit is needed per count. In many cases, at least 4 bits per count will be required to maintain reasonable securityIn a typical SoC, under the above security requirements of PP0117 for passive memory, the amount of OTP needed during the life cycle of a SoC device can have a dramatic impact on the cost of the SoC. SoCs that have implemented an OTP-based monotonic counter were required to implement hundreds of thousands of OTP bits, and in some cases, over 1M of OTP bits. This is especially true for IoT devices, where data storage in external memory is common and power cycling occurs frequently. Moreover, these IoT devices are anticipated to have an extensive life cycle, often exceeding 10 years.Secure external memoryThe above requirements apply to secure external memory. However, due to the nature of the secure memory, these requirements are addressed by the memory device itself:• The memory device itself prevents unauthorized access. The commands are signed, and therefore, access and modification of the content require knowledge of a secret key or keys.• Cloning is not possible since the content cannot be accessed by unauthorized entities. Replacement is not possible since the SoC and the original secure memory are bound by a shared secret key, whereas any replacement memory will not have this secret key.• Roll-back of information cannot be accomplished since the secure memory protects the interface by its internal monotonic counter.• Command replay is not possible since the monotonic counter in the flash device ensures that commands are indexed and cannot be repeated.In addition to these protection features, the secure external memory has to be protected from interface abuse – man-in-the-middle modifications and eavesdropping. To facilitate this, the communication bus between SoC and memory is encrypted and authenticated. Read, write, erase, and configuration change commands are encrypted and signed so that the SoC can authenticate and verify the freshness of data coming from the memory against modifications. The memory device can ensure that write, erase, and configuration change commands did indeed originate from the SoC and that they are not replayed by an adversary.Winbond's secure flash for PP0117 certified secure subsystemsWinbond's W75F family of EAL5+ certified secure flash devices is designed for the requirements of PP0117. The secure flash devices allow efficient usage of the flash storage by allowing:• Secure, encrypted and authenticated interface between SoC and Flash• Strong, 128-bit symmetric key• Non-volatile monotonic counter implemented in the flash to prevent replay and roll-back and maintain data and code freshness• Strong counter measures against side-channel, fault injection and anti-hammering• Stored data integrity protection• Execution in place (XIP) from the flash, minimizing needed RAM size and increasing security by eliminating need to clear text code image in RAM• Multiple writes per byte• Composite certification readyCompared to an OTP-based counter implementation in the SoC when using passive memory, the secure flash from Winbond has potentially unlimited cycles of data update. The monotonic counter in the Winbond secure flash is incremented only once every power cycle, compared to OTP-based designs, where in many cases, each write of a new data set to the flash requires an increment, consuming more OTP fuses.Developing a PP0117-compliant solution with Winbond's secure flash is significantly more straightforward. The evaluation process becomes faster and simpler, and users can anticipate a smoother path to certification since the design eliminates the need for complex passive memory sharing and protection techniques.For more information on how Winbond can support your security and compliance needs, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation at the IEEE VLSI symposium 20251 held in Kyoto, Japan.1IEEE VLSI (Institute of Electrical and Electronics Engineers Very Large Scale Integration) symposium: One of the most prestigious academic events in the field of semiconductor circuit and process technology, presenting academic achievement in next-generation semiconductors, AI, memory chips, and packaging. The symposium is held in turn in the US and Japan annually.Cha Seon Yong, CTO (CTO) of SK Hynix, delivered on June 10th a plenary session on "Driving Innovation in DRAM Technology: Towards a Sustainable Future".In his speech, CTO Cha explained that it is increasingly difficult to improve performance and capacity with scaling through the current technology platform2. "In order to overcome such limitations, SK Hynix will apply the 4F² VG (Vertical Gate) platform and 3D DRAM technology to technologies of 10nm level or below with innovation in structure, material, and components," he said.2Tech Platform: A technological framework that can be applied to various generations of productsThe 4F²3 VG4 platform is a next-generation memory technology that minimizes the cell area of DRAM and enables high integration, high speed, and low power through a vertical gate structure.34F²: The area occupied by one cell, a unit to store data, is indicated as F2. F indicates the minimum feature size of a semiconductor. Therefore, 4F2 is an integration technology to put more cells in a chip in which one cell occupies an area of 2F by 2F.4VG (Vertical Gate): A structure in which a gate, which acts as a switch of a transistor, is vertically placed and surrounded by channels. Currently, it is a flat structure where a gate is laid horizontally on top of channels.Currently, 6F2 cells are common, but by applying 4F2 cell and wafer bonding technology that puts the circuit part below the cell area, cell efficiency and electrical characteristics can be improved.CTO Cha also introduced 3D DRAM as the main pillar for the future DRAM along with VG. CTO Cha said that although some in the industry warn of cost increase according to the number of layers stacked, it can be solved by constant technological innovation.Along with structural breakthroughs, the company will also strive to find a new growth engine by sophisticating technologies of critical materials and components of DRAM to lay the foundation for the next 30 years."Until around 2010, DRAM technology was expected to face limitations at 20nms, but with constant innovation, we have made it this far," said CTO Cha. "SK Hynix will continue to guide the future of long-term technological innovation to be a milestone for young engineers in the field of DRAM and maintain cooperation within the industry to bring the future of DRAM into reality."On the last day of the event, Joodong Park, vice president who leads the Next Gen DRAM TF, will present his findings from a recent research on how VG and wafer bonding technology affect the electrical characteristics of DRAM.

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices.Dracula Technologies has developed a breakthrough organic photovoltaic (OPV) technology, LAYER®, capable of harvesting energy even in low or intermittent indoor light. In this collaboration, its OPV modules will be integrated into Linxens' smart label and traceability solutions. Linxens contributes its expertise in the design and industrial production of electronic inlays and flexible components, which are key elements in RFID tags, to create fully battery-free, reusable, and energy-autonomous smart labels.Together, the two companies are addressing one of the key limitations of today's connected labels: reliance on batteries, which reduces lifespan and increases environmental impact. This collaboration represents a technological leap forward, enabling long-lasting, cost-effective, and sustainable traceability solutions for logistics and other industries where durability and energy independence are essential."At Linxens, our goal is to develop technological solutions that meet our clients' needs while anticipating tomorrow's challenges. We believe that innovation only makes sense if it goes hand in hand with responsibility. That's why we consider environmental impact at every stage—from design to end-of-life," said Quentin Pretet, VP of Linxens IoT Solutions. "By integrating Dracula's innovative energy-harvesting technology into our devices, we reinforce our unique ability to deliver fully autonomous solutions that reduce environmental footprint without compromising performance.""Jérôme Vernet, VP Sales of Dracula Technologies, commented, "Our strategic collaboration with Linxens is a natural fit. The complementarity of our technologies and shared vision for a more responsible IoT industry make this collaboration particularly meaningful. By combining Linxens' design and manufacturing expertise with our OPV energy harvesting capabilities, we are enabling a new generation of sustainable, autonomous, and reusable connected devices."About Linxens: Linxens is a global leader in the design and manufacture of smartcard components and innovative electronic solutions. With over 40 years of experience, Linxens has delivered more than 120 billion micro-connectors and 6 billion RFID antennas used in payment and access cards, passports and ID documents worldwide.Operating 8 production facilities and 7 R&D centers across Europe and Asia, Linxens employs nearly 3,000 people and serves key industries including banking, telecommunications, transportation, healthcare, and government. Linxens also provides comprehensive IoT solutions, combining hardware and software for real-time traceability and authentication.For more information: www.linxens.comAbout Dracula Technologies: Dracula Technologies, headquartered in Valence, France, pioneers sustainable energy solutions with its LAYER® technology, revolutionizing power sources for low-power electronics. Its organic photovoltaic (OPV) modules, manufactured using patented digital printing, harvest ambient light, eliminating reliance on traditional batteries. LAYER®Vault complements the company's existing OPV harvesting product line, transforming it into a 2-in-1 product, combining low-light energy harvesting and storage on a single, flexible film ensuring uninterrupted device functionality, empowering Smart Buildings, Smart Homes, Smart Asset Tracking, and other related applications. With a commitment to clean, renewable energy, Dracula Technologies leads the charge towards a greener future by providing long-lasting, and cost-effective energy solutions. Supporting its mission is its new "Green Micropower Factory"—a state-of-the-art, fully automated facility, the largest of its kind in the world with a capacity of up to 150 million cm² of printed OPV devices per year.

In a world where semiconductors are the foundation of modern technology, powering everything from smartphones to satellites, their importance is widely acknowledged. While much attention is paid to chip design and fabrication, few recognize the critical role logistics providers play behind the scenes in keeping these complex global supply chains running smoothly.At the heart of this high-stakes ecosystem is Kuehne+Nagel, one of the world's leading logistics providers, whose strategy is deeply rooted in quality, specialization, and digital innovation. In an industry where nanometers are vital and billions of dollars depend on timing and precision, Kuehne+Nagel ensures that the smallest components arrive on time—every time."We don't make the goods. We create the solutions to move them safely," said Barry O'Dowd, Kuehne+Nagel's Head of Global Business Development Semicon, in a recent interview. With over 35 years of experience in the high-tech sector—more than 20 of them at Kuehne+Nagel —O'Dowd has witnessed the semiconductor industry evolve into one of the most demanding sectors for logistics providers.That level of expertise is built on a legacy that dates back to 1890, when August Kuehne and Friedrich Nagel founded a freight forwarding company in Bremen, Germany. Over the past 130 years, Kuehne+Nagel has transformed from a traditional shipping operation into a global logistics leader, now headquartered in Switzerland and serving key industries around the world with highly specialized solutions. "At the core of our business," O'Dowd added, "is a simple focus: understanding and meeting the needs of our customers."High-quality logistics tailored for semiconductorsKuehne+Nagel's strategic expansion into the semiconductor sector is no coincidence, it's a calculated move shaped by decades of experience. "Even before Taiwan became a semiconductor powerhouse, we were already supporting the broader electronics technology industry," said O'Dowd. While the company has long served customers such as materials and capital equipment suppliers, O'Dowd noted that only in recent years has the company made the semiconductor industry a dedicated growth focus, as part of its global "Roadmap 2026" strategy."We identified semiconductors as a market with strong growth potential and highly complex requirements where certified quality is essential," he explained. To meet these demands, Kuehne+Nagel established a network of over 35 certified logistics stations worldwide, capable of handling everything from oversized fab equipment to delicate wafer shipments. "Any disruption in this supply chain can have massive consequences for our customers," O'Dowd emphasized, "so precision, security, and specialized handling are non-negotiable."To meet the growing global demand for semiconductor-powered devices, Kuehne+Nagel launched "SemiconChain"—a quality-first logistics standard tailored to the semiconductor industry's complex requirements. Integrated with the company's specialized Air Logistics service, the SemiconChain network is supported by a global network of 38 certified stations, ensuring that shipments are transported under optimal conditions, with full air cargo tracking throughout the journey. Advanced digital tools are used to provide real-time updates and monitor the integrity of each shipment, helping to minimize the risk of damage or costly delays.Beyond infrastructure, SemiconChain emphasizes deep industry understanding- staff are trained industry experts who take part in a comprehensive and continuous training programme designed to give a deep understanding of the semiconductor supply chain and all its complexities. Whether moving delicate wafers or oversized capital equipment, Kuehne Nagel's SemiconChain network offers a consistent, certified, and expert-driven approach that delivers trust, visibility, and precision at every stage.An example of this commitment is Kuehne+Nagel's investment in its own Boeing 747 freighters—the Inspire aircraft—which operate flights to Taiwan twice a week as part of a global loop. "These aircraft were purposefully selected and dedicated to the semiconductor supply chain, capable of front-loading oversized, delicate tools essential for fab deployment and operation" explained O'Dowd.Enhancing services with digital innovationWhat distinguishes Kuehne+Nagel is not merely its hardware but the commitment to quality culture and technological integration. O'Dowd stated, "A supply chain's strength is determined by its weakest link. Our goal is to strengthen that link by implementing quality through comprehensive training, digital checklists, and advanced tools."For instance, Kuehne+Nagel's staff use multilingual mobile-based checklists to ensure handling consistency at each transfer point—critical when transporting wafers or capital equipment. These tools log visual inspections and feed real-time data back to customers via Kuehne +Nagel's tracking systems, offering visibility and assurance.Digitalization extends beyond checklists. Kuehne+Nagel also employs AI-based predictive models to estimate sea freight transit times, especially relevant post-COVID, when carrier reliability dropped. The company also developed smart labels in a project that collaborated with Alphabet's X (formerly Google X) to give cargo a digital "voice"—real-time reporting on location, condition, and expected delivery time.These examples highlight how advanced digital tools and integrated technologies are redefining semiconductor logistics by ensuring efficiency, security, and reliability throughout every mile. Kuehne+Nagel presented several real-world case studies that demonstrate this transformation effectively. One notable instance involved a 7,827-mile transport from Austin to Taipei, where photomask etching systems were delivered flawlessly using custom ULDs and temperature-controlled trucks.Another case saw 18 massive Purion ion implant units shipped from Boston to Dublin, requiring vibration protection and tightly coordinated handoffs to prevent production delays. Meanwhile, a shipment from Zurich to San Francisco presented a dual challenge of climate control and time sensitivity. With the use of Envirotainer units, real-time monitoring through the myKN platform, and direct flight arrangements, the delicate tools arrived on schedule and in perfect condition.Driving sustainability, navigating uncertaintySustainability is another pillar of Kuehne+Nagel's operations. The company has pledged to reduce its carbon footprint across all scopes by 2040 and recently signed a global sustainability MoU with 14 airlines. By developing optimized solutions, including sea-air combinations and pushing for fuel efficiency, the company helps customers balance environmental goals with delivery performance.Despite global uncertainties, such as shifting supply chains and regulatory challenges, O'Dowd remains confident. "We have been operational for 135 years, enduring wars, pandemics, and economic downturns. Our strength is derived from our scale, expertise, and the relationships we have established with suppliers and customers."In Taiwan, which hosts the world's most advanced semiconductor fabrication facilities, Kuehne+Nagel's logistics operations are extensive. They facilitate the inflow of materials and equipment, as well as the outflow of products, and they plan to expand as clients diversify manufacturing into other regions. "We follow our customers' leads. If that necessitates certifying ten additional stations for the SemiconChain network, we are prepared to do so," O'Dowd stated.As semiconductors become more central to everything from AI to electric vehicles, the silent force behind their delivery becomes ever more vital. Kuehne+Nagel may not be manufacturing chips, but its role in keeping the supply chain unbroken makes it an indispensable partner to the industry's biggest players."We're not just moving goods," O'Dowd concluded. "We're helping the world's most advanced technologies reach the world."

Darveen Co., Ltd., a global provider of rugged industrial computing solutions, is pleased to announce a strategic distribution partnership with IP SYSTEMES, a well-established French value-added distributor known for its expertise in rugged computing and industrial automation. Under this agreement, IP SYSTEMES is now an authorized distributor of Darveen's full range of industrial computing products in France.This partnership marks a significant step in Darveen's long-term strategy to enhance its presence in the French market. By leveraging IP SYSTEMES' strong distribution network, Darveen aims to better serve local customers while introducing its cutting-edge technologies to new system integrators and industrial users previously unfamiliar with Darveen."We are excited to partner with IP SYSTEMES to bring our industrial computing innovations closer to customers in France," said Kevin Liang, General Manager of Darveen. "Their deep industry expertise, customer-centric approach, and broad market reach perfectly align with our commitment to delivering reliable, high-performance solutions for demanding industrial environments."Headquartered in Lyon, IP SYSTEMES has over 35 years of experience and is recognized as a leader in France's automation and rugged computing sectors. The company provides comprehensive industrial computing and automation systems across a wide range of industries including robotics, medical, industrial communication, IoT connectivity, and surveillance. Its strong technical capabilities and deep customer relationships are set to play a vital role in supporting Darveen's localization.Through this collaboration, both companies aim to enhance solution delivery, accelerate project deployment, and provide exceptional local support to industrial customers throughout France.About Darveen Co., Ltd.Established in 2007, Darveen has been dedicated to developing rugged industrial computer solutions tailored to the unique needs of various vertical industries. Our product lines include in-vehicle computers, industrial panel PCs, rugged tablets, embedded box computers, and industrial monitors. Darveen's vehicle-mounted computer solutions have successfully helped hundreds of container terminals in streamlining their processes and operations. With nearly 20 years of experience in product design and manufacturing, Darveen's products have gained widespread acceptance in diverse markets, including container terminals, warehousing, manufacturing, industrial equipment, mining, and special vehicle fleets. For more information, visit https://www.darveen.com/.About IP SystèmesFounded in 1986, IP Systèmes is a French company specializing in the distribution and integration of industrial IT and automation solutions. With over 35 years of expertise, IP Systèmes supports manufacturers, equipment suppliers and systems integrators in the design and implementation of robust, innovative and sustainable solutions adapted to the challenges of Industry 4.0. From fanless embedded PCs and industrial tablets to energy-efficient HMIs, PLCs and control systems, IP Systèmes offers a wide range of certified products and customized services. The company works for demanding sectors such as railways, mechanical engineering, medical, energy and transport. IP Systèmes is committed to quality, responsiveness and customer satisfaction, and has become a trusted partner in industrial digital transformation in France and Europe. For further information: www.ip-systemes.com

BIOSTAR, a leading manufacturer of edge computing solutions, motherboards, graphics cards, and storage devices, proudly concludes a highly successful COMPUTEX TAIPEI 2025 showcase. This year's campaign drew significant attention from global media, industry professionals, and tech fans, highlighting BIOSTAR's strong presence across edge AI platforms, industrial edge computing, and next-gen AI PC solutions. Credit: BIOSTARA major highlight of BIOSTAR's COMPUTEX 2025 campaign was the official debut of the EdgeComp series, a new generation of edge computing systems developed to meet the demands of modern industries. Drawing on over two decades of expertise in industrial motherboard manufacturing and deep experience on developing industrial computer systems, BIOSTAR's engineering team has built platforms that are purposefully designed for smart manufacturing, smart retail, and smart city applications.Credit: BIOSTARAmong the featured edge AI platforms, the EdgeComp B850MT-H1 demonstrated its capability to handle real-time AI recognition across more than 100 video channels simultaneously. The EdgeComp N97-MX3, equipped with the MemryX AI NPU, demonstrated real-time environmental safety monitoring applications, including construction site safety and wildfire detection scenarios. The EdgeComp AI-NONXS was demonstrated live performing three simultaneous edge AI tasks: multi-object vision recognition, body pose detection, and a locally-run SLM AI assistant. BIOSTAR showcased how seamlessly integrates leading-edge AI NPU solutions from NVIDIA, DEEPX, and MemryX to deliver reliable, high-performance edge AI computing.As AI continues to reshape the future of technology, BIOSTAR is strategically positioned to lead with its close partnerships with industry giants like Intel, AMD, and NVIDIA. This synergy allows BIOSTAR to fine-tune hardware and software integration at every level, ensuring optimized performance, stability, and adaptability across a wide range of edge AI workloads. From automation system integrators to digital signage specialists, HMI solution providers, and edge AI developers, BIOSTAR offers tailored solutions that meet the specific needs of each client, delivering not just products but full-stack platforms engineered for real-world applications.Among the notable EdgeComp systems unveiled at COMPUTEX, BIOSTAR introduced the ultra-compact EdgeComp MU-N150 and the robust 2U rackmount platform EdgeComp MW-B670, highlighting scalable edge computing solutions for space-constrained deployments and data-intensive industrial applications. From the EdgeComp MS-1335U and MS-X7433RE to the MS-J6412, BIOSTAR showcased a comprehensive range of EdgeComp embedded systems, tailored to meet the diverse demands of smart manufacturing, smart retail, and smart city applications.Credit: BIOSTARBIOSTAR also showcased the EdgeComp MS-N97 and EdgeComp MS-J6412 in a DIN-Rail demonstration setup—an industrial-friendly design tailored for factories and compact spaces, enabling wall-mounted installation via rail systems to optimize space utilization.Credit: BIOSTARIn addition, BIOSTAR showcased its reliable range of industrial motherboards, including the BIW88-AHS with ECC DRAM support and the versatile BIQ87-AHS which designed for industrial automation. BIOSTAR also introduced the first NVIDIA Jetson Orin edge AI developer kit, the AI-NONXS, compact SBC BITWL-N150, ERX93-AXP, and RASL-D5DE, purpose-built for EV charging solutions.On the consumer side, BIOSTAR's booth also drew significant attention with its showcase of custom-built PCs and cutting-edge components. Two standout modded systems wowed visitors, one built around the Z890 VALKYRIE motherboard in a high-performance showcase rig complete with a dedicated highlight video and another fully water-cooled ARGB build powered by the B850MT-E PRO motherboard and AMD Ryzen 7 9800X3D processor. Running DDR5 memory at 8000MT/s, the system impressed with both looks and performance.BIOSTAR's consumer motherboard lineup at COMPUTEX 2025 featured a strong mix of Intel and AMD platforms designed for next-gen computing. On the Intel side, the Z890A-SILVER leads with support for Intel Core Ultra processors, PCIe 5.0 M.2, dual HDMI, DisplayPort, 2.5GbE LAN, and WiFi 7 module support. The B860M-SILVER and B860MT-E PRO offer mainstream flexibility with similar high-end features, including DDR5 support up to 256GB and 2.5GbE LAN. For AMD users, BIOSTAR showcased the industry's first B840 chipset motherboard, the B840MT-E, built for compact systems. The B850MT-E PRO and B850MT2-E DJ deliver high-speed connectivity, PCIe Gen5 or Gen4 M.2, and broad support for the Ryzen 9000/8000/7000 series, ideal for gaming and multimedia applications.Complementing its motherboard and system showcases, BIOSTAR revealed a strong lineup of consumer hardware designed for modern performance builds. The AMD Radeon™ RX 7000 series graphics cards were a major highlight, featuring the RX7900XTX, RX7900XTX, RX7800XT, RX7700XT, and RX7600OC, which deliver exceptional graphics performance for gaming, creation, and compute-intensive tasks. For storage, the spotlight was on the M800 PCIe Gen4x4 M.2 SSD, built for high-speed data access and efficient thermal control in compact, high-performance systems. BIOSTAR also showcased its GAMING X DDR5 memory modules, designed for next-gen platforms and featuring sleek heatspreaders and dynamic RGB lighting, which combine speed, stability, and style in a single package.Credit: BIOSTARLooking ahead, BIOSTAR is committed to driving innovation in the edge AI space, building on the momentum of its successful EdgeComp series. Through close collaborations with leading technology partners, including Intel, AMD, NVIDIA, DEEPX, MemryX, and others, BIOSTAR continues to develop next-generation edge AI platforms that are smarter, faster, and more adaptable to real-world applications. As global demand for AI-powered edge solutions accelerates, BIOSTAR stands ready to support its clients with advanced, reliable technologies rooted in decades of engineering expertise as a trusted edge computing partner.Connect with usWebsite https://www.biostar.com.tw LinkedIn https://www.linkedin.com/company/biostar Facebook www.facebook.com/BiostarHQ X https://twitter.com/BIOSTAR_Global Instagram www.instagram.com/biostarofficial YouTube www.youtube.com/user/BiostarTaiwan Availability http://www.biostar.com.tw/app/en/wheretobuy/index.php BIOSTAR VIP Care https://store.biostar.com.tw/customerABOUT BIOSTARBIOSTAR is a professional brand dedicated to the production of motherboards, graphics cards, computer peripherals, industrial PC, and AI computing solutions. Since its establishment in 1986, BIOSTAR has become a major supplier in the IT industry. In order to pursue the best quality and aesthetic design, BIOSTAR has invested heavily in ID design, global marketing as well as R&D. With an unceasing focus on enriching lives, BIOSTAR consistently strives to pioneer a fresh future, bringing solutions into reality.

As climate change escalates and significant disasters arise more frequently, Taiwan's public safety concerns continue to grow. The gas explosion at the department store in Taichung in 2025 underscored the critical issue that the "golden rescue time" prior to the arrival of trained rescuers is frequently underutilized. During the second "2025 AI Wave: Taiwan Generative AI Applications Hackathon," the "Revenge Seekers" team identified a significant social issue and provided a unique AI-driven solution, ultimately securing victory in the "Resilient Future" category of Chunghwa Telecom."Revenge Seekers" wins Chunghwa Telecom's Resilient Future award with an AI-powered emergency assistant that helps save lives in disaster zones. Credit: CompanyIn response to the frequent occurrence of significant disasters in recent years, the "Revenge Seekers" team has developed an intelligent system that is designed to aid non-medical individuals during emergencies. The purpose of this system is to improve the disaster response capabilities of the entire population by leveraging technological advancements. The team conducted a comprehensive analysis of significant accidents, including the 2015 New Taipei water park dust explosion and the department store gas explosion in Taichung earlier this year, and identified three urgent issues at the disaster sites that required immediate attention.First, the general public lacks basic first aid knowledge, preventing them from effectively using the "golden rescue time" before medical personnel arrive. Secondly, the inability to record and classify casualty information on-site in real time leads to the inefficient deployment of following medical resources. Thirdly, the prompt distribution of casualties is challenging to understand, significantly affecting the overall decision-making and resource allocation of governmental agencies during rescue operations. These problems become even more severe in mass casualty events.The team developed "First Aid Master - Public Edition v2.0" to resolve the aforementioned pain points. This first aid assistance system integrates generative AI technology. It is capable of assisting individuals without a medical background in conducting preliminary triage of the injured and providing situational basic first aid guidance through an intuitive interface. The system will categorize the injured into four categories based on the current condition of the injured as entered by the user: red (immediate treatment), yellow (treatment can be postponed), green (minor injuries), and black (extremely low chance of survival). It will then provide corresponding first aid suggestions for each category in real time, such as stopping bleeding, maintaining airway patency, and performing CPR.Furthermore, the rescue efficiency and resource allocation accuracy can be significantly enhanced by the system's ability to autonomously generate injury records and zoning information for the reference of professional medical teams that arrive later."First Aid Master" is built on Amazon Web Services (AWS) cloud infrastructure and leverages multiple innovative technologies to enhance the stability and responsiveness of system operations. The team utilized AWS PartyRock, a no-code, generative AI application builder, in conjunction with large language models such as Amazon Nova Pro and Anthropic Claude 3.5 Sonnet v2 as the primary AI engine. To enhance the professionalism and precision of answers, the team independently structured the emergency documents and developed a compact retrieval-augmented generation (RAG) system.Amazon CloudFront delivers content with low latency through its content delivery network with secure HTTPS connections; Amazon Route 53 ensures reliable and efficient DNS routing, while Amazon Elastic Compute Cloud (Amazon EC2) provides scalable compute capacity for the website and backend services. The open-source search engine OpenSearch retrieves first aid knowledge base information, and AWS WAF helps protect web applications and APIs from attacks. The system incorporates an AED map feature to help individuals quickly locate the nearest automatic external defibrillator, significantly improving rescue response time—critical for patients experiencing cardiac arrest."Revenge Seekers" distinguished itself within the Chunghwa Telecom "Resilient Future" group. The judges determined that this technology has the potential to provide immediate assistance at disaster sites and to function as an emergency education instrument during peacetime to disseminate first aid knowledge to the public. The system has substantial practical utility and can help Taiwan establish a robust civilian emergency network. Moreover, the system's real-time summary of patient information provides public departments with valuable insights for decision-making, which are expected to enhance the allocation of medical resources.

With the advancement of digital technology and the onset of the post-pandemic era, the human desire for emotional bonds has increased. The idol industry is experiencing substantial transformational challenges as fans grow discontented with unilateral idol worship and seek more interactive experiences. At the second "2025 AI Wave: Taiwan Generative AI Applications Hackathon," the "Disheveled in the Wind" team created an innovative solution merging physical dolls with AI technology, establishing a new paradigm for the idol economy, and won the Gamania Group Vyin AI's "AI Idol" category.Disheveled in the Wind wins "AI Idol" category with Aidol—an interactive AI companion that redefines emotional connection in fandom. Credit: CompanyThe "Disheveled in the Wind" team members are from Taiwan's National Tsing Hua University and National Central University. Their enthusiasm for the idol sector, combined with their robust technical expertise, led them to leverage generative AI technology to develop a sophisticated idol product capable of genuinely engaging with fans, addressing the market's need for emotional connection, and creating new value within the idol economy.Through comprehensive user research, the team discovered that most current idol products are unidirectional, showing a substantial lack of interactivity and genuine connection. Despite their profound devotion to their idols, fans are unable to establish authentic connections due to limited interactive resources. The user study findings reveal that fans are intrigued by the emotional depth, personality, and authenticity of their idols' voices. They anticipate receiving unique responses tailored to specific occasions, such as anniversaries and farewells, rather than mechanical, standardized interactions.In response, "Disheveled in the Wind" created an intelligent doll named "Aidol" that integrates interactive capabilities, vocal communication, and emotional memory functions. This device is advertised as an "AI idol that can accompany you" and has five primary purposes.The five key features include: first, the "share daily life" function, allowing users to upload photos to the cloud and receive feedback from idol about their lives; second, "personalized conversation memory," archiving previous interactions for a more authentic idol experience; third, "exclusive event reminder," automatically notifying users of birthdays, idol activities, and other important events; fourth, "multiple personality switching," offering various personality modes including energetic, gentle, dark, and comical; and fifth, "manual switch memory and interaction intensity," enabling users to regulate interaction pace and protect privacy. Through these features, "Aidol" delivers an unparalleled companionship experience while addressing the limitations of traditional idol products' one-way interactions.The technical architecture of Aidol is comprised of two components: cloud AI services and hardware.The doll features an integrated camera, microphone, speaker, sensor, and Bluetooth module that enable interaction through a mobile application. For cloud services and AI technology capabilities, the solution uses Amazon Bedrock, a fully managed service from Amazon Web Services (AWS) that makes high-performing foundation models, along with speech-to-text, text-to-speech, and natural language understanding services. The team also established a database of idol-exclusive quotes and catchphrases to enhance the naturalness of the interaction.The system's core employs Raspberry Pi to process sensors, networking, voice processing, and other modules, while also connecting to Gamania Group's API to access idol-exclusive sound resources. The prototype clip provided by the team in the competition clearly demonstrated the actual operation process of several activities such as shooting images, recalling discussions, and pushing events, and was well appreciated by the judges.This innovative idol product solution received widespread praise from the judges of Gamania Group Vyin AI's category. They commended the product for its comprehensive business plan and technically feasible implementation, noting its potential to create a unique companionship experience for fans while generating various revenue streams, including hardware sales, app subscriptions, and downloadable voice and appearance packages. Compared to existing market offerings, Aidol focuses on the emotional economy of idol fandom, demonstrates clear competitive advantages, and presents significant potential to become a major technological innovation in the idol industry.

Generative AI (GenAI) is swiftly revolutionizing corporate operations, product development, business models, and the overall ecosystem. According to a survey report published by Taiwan's Market Intelligence & Consulting Institute (MIC), in 2024, 19% of Taiwan's five major industries utilized GenAI or engaged in related activities, with the finance and insurance sector representing 25% and the manufacturing sector following at 22%. Amid the proliferation of Generative AI for developing AI assistants, some firms have found that their substantial investments in these assistants did not yield the expected results, leading them to terminate their AI projects and thus diminishing their overall competitiveness.Alpha Three wins with a smarter AI assistant—boosting accuracy through improved data chunking for enterprise knowledge Q&A. Credit: CompanyThe primary cause of the poor performance of AI assistants, according to "Alpha Three," the winning team in the "2025 AI Wave: Taiwan Generative AI Applications Hackathon" from Walsin Lihwa's "Smart Manufacturing" group, is the excessively small data chunking during pre-processing. This can easily disrupt the original document paragraph context, resulting in the AI model's misunderstanding deviations and a response content that is not sufficiently accurate.The team recommended that the "amount of text in a single PDF page" be used as the unit of chunk in order to preserve the natural paragraph structure and comprehensive context, as well as to prevent semantic discontinuity. The review committee unanimously recognized this method for successfully achieving three substantial advantages: "optimizing user query experience," "reducing the risk of hallucinations," and "enhancing semantic coherence and search and answer accuracy."Pre-competition training proves valuable; effectively utilizing AI tools to realize creativity"Alpha Three" utilized a steel standard inquiry as a test case and posed the question, "Does ASTM A276 steel grade 316Ti comply with the EN 10088-3 standard?" The AI system retrieved comprehensive information covering the chemical composition and standard specifications of steel grades. The content of the response is highly focused and accurately reflects the primary data. The AI system demonstrated extraordinary reliability in the application of enterprise knowledge by achieving a perfect score (1.0 out of 1.0) across the three metrics of "search relevance," "answer solidity," and "answer relevance."To achieve these results, the team utilized Amazon Web Services (AWS) to develop a comprehensive enterprise knowledge question-answering framework.PDF, PNG, JPG, and other file formats are uploaded to Amazon S3, the cloud object storage service, during the initial phase. The second phase is providing quick query services with a comprehensive language model and the Flask API. In the third phase, the team leverages Amazon Bedrock, a fully managed service that makes high-performing foundation models, to connect extensive language models, thereby improving scalability and reaction speed. Amazon Elastic Compute Cloud (Amazon EC2) is employed in the fourth phase to expedite API processing, thereby guaranteeing system stability and efficiency.The extensive system design includes data uploading, management, retrieval, and response, allowing users to easily submit inquiries and obtain prompt professional responses, which became a crucial factor in their victory.The "Alpha Three" team, comprised of recent information engineering graduates from National Taiwan University in 2024, observed that, despite their degrees in information-related fields, they were completely unfamiliar with contemporary mainstream AI tools in the face of the rapid advancement of Generative AI technology. The project was successfully completed within 30 hours, and the award was secured, thanks to the professional training provided by the organizer, which included a series of enterprise data workshops and AWS Generative AI workshops, as well as Walsin Lihwa's explanation of the steel standards.