As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.Credit: Smiths InterconnectThis strategic contract supports the customer's upcoming global launch of their next-generation AI semiconductor chips, designed for data center GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.Smiths Interconnect's DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect's test socket technology.The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer's previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect's position as a trusted technology partner in the semiconductor industry.Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown-and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel. GMIF2025, themed "AI Applications, Innovation Empowered", will bring together leading enterprises, technology experts, and industry leaders across the global memory industry chain to explore the evolution of storage technologies and emerging opportunities in the AI era.The Fourth GMIF2025 Innovation Summit is scheduled to be held on September 25, 2025. Credit:GMIFThe summit will feature executives and experts from School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Maxio Technology, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage Technology, iFlytek, OKN Technology, GreaTech Substrates, and more than 19 other top global companies and universities. The keynotes will cover topics ranging from storage and memory technology roadmaps and market strategies to AI application practices and ecosystem collaboration, empowering innovation across AI scenarios from cloud to edge.GMIF2025 Innovation Summit Keynote Agenda - Part 1. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 2. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 3. Credit:GMIFIn the exhibition zone, over 27 exhibitors will present more than 200 innovations, spanning the entire storage ecosystem-including leading IDMs, controller vendors, solution providers, packaging and testing companies, platform providers, and AI terminal enterprises. Attendees will experience immersive interactions, gain first-hand insights into the latest industry trends, and witness the evolving global storage ecosystem landscape.Register now by clicking the link to secure your GMIF2025 pass and join global storage industry leaders in shaping the future of AI-driven innovation!For more information about GMIF, please visit.

Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access to learning and measurable results across groups dispersed in different locations.Flexible working models give employees greater control over where and how they learn. However, they also create challenges around consistency, engagement, and measuring results. The solution lies in a blended approach: combining online and in-person training with a corporate LMS.Training Issues in Hybrid WorkplacesConsistency remains a significant issue. Hybrid workforces include both in-office and remote employees, and both sides need the same access to learning for both to be fair and productive. Skewed opportunities can quickly ruin employee trust and retention.Disengagement is another issue. Online sessions that last extended periods tend to cause fatigue, making learning less effective.Measuring effectiveness is also a challenge. Virtually based teams complicate monitoring skill acquisition, and organizations are left solely reliant on analytics and online tests as a fair gauge of results. Without effective systems in place, organizations often offer programs that are difficult to measure, thereby limiting their long-term impact.Corporate LMS as a Central FrameworkTo address these needs, a corporate LMS can serve as the central hub for all training content. It combines live classes, self-paced resources, and microlearning modules into one blended system. This approach gives employees the flexibility to learn in ways that fit their schedules, while still keeping development aligned with company goals.A business LMS also incorporates gamification elements, interactive modules, and certification tools that retain motivation. Integration with workflow systems, such as Slack or Microsoft Teams, allows training within everyday workflows.Just as important, corporate LMS platforms provide visibility. Progress tracking makes it easier to spot skill gaps, measure outcomes, and consistently meet objectives across the workforce. But their true value goes further: connecting business strategy with individual performance. In doing so, they transform learning from a functional process into a growth driver—for employees and the organization.Opportunities in Hybrid Training ModelsDespite the challenges, hybrid work presents new opportunities for business training.One is scalability since corporate LMSs can reach employees in various locations without logistical issues. Another is customized learning paths, which are also on the rise. These paths enable employees to progress at their own pace and focus on specific skills.Dynamic access to course materials provides added flexibility. Users can access or navigate modules at will again, boosting retention. Data-driven insights through analytics add a new level of value, providing organizations with a precise understanding of training results.Beyond talent development, training has since been used to maintain organizational culture, and long-distance teams can maintain a sense of shared mission and identity.Skill-building in the Hybrid WorldHybrid work environments demand more than technical know-how. They call for a renewed focus on soft skills. Today's training programs strike that balance, offering flexibility and efficiency while nurturing the human abilities that keep teams connected.A corporate LMS plays a central role in making this possible. Online learning sessions, quizzes, and exercises bring interactivity into virtual spaces, recreating the energy of face-to-face sessions and helping counter "Zoom fatigue." Scenario-based modules and group projects encourage peer learning, turning abstract concepts into real-world behaviors.What makes this even more effective is the insight behind it. Data gathered through the LMS highlights where learners struggle and where they thrive, allowing trainers to adjust and keep people engaged.Best Practices in Hybrid Workforce TrainingA corporate LMS makes it possible to turn hybrid training into a consistent and engaging experience. The most effective programs share a few standard best practices: flexibility and modularity allow training to adapt to shifting workloads and varied schedules, so learning becomes part of the flow of work rather than a disruption. Peer-to-peer learning fosters collaboration and community, helping employees stay connected even when they're physically apart. Accessibility is prioritized, with mobile-friendly design and multilingual content ensuring every team member can access training without barriers. Certifications and recognition keep motivation high by rewarding progress and giving learners a sense of achievement.The Final OutlookThe hybrid model is here to stay, and training strategies must evolve alongside it. Centralized systems, like a corporate LMS, are now the baseline. What sets organizations apart is how they weave flexibility, personalization, and engagement into every learning experience.Corporate Training for Hybrid Workforces. Pexels

The semiconductor industry is undergoing a profound transformation, driven by the strategic integration of artificial intelligence. At SEMICON Taiwan 2025, experts from Microsoft, Advantech, and Nvidia shared insights on the sector’s rapid shift toward “Lights-Out” factories—fully automated, 24/7 operations powered by AI. This evolution is designed to tackle monumental challenges while unlocking new levels of efficiency and resilience.AI Models Evolve for Deeper InsightsAI development has accelerated dramatically in recent years. From early domain-specific models for tasks such as entity recognition or computer vision, AI has advanced into sophisticated multi-domain models that integrate diverse functionalities within a single framework. Notable advancements include Retrieval-Augmented Generation (RAG), which constrains responses for greater accuracy, and multimodal models that seamlessly combine text, audio, and visual inputs.A pivotal breakthrough has been the emergence of reasoning models, capable of delivering deeper insights for complex problems across scientific, mathematical, and manufacturing domains. These models provide richer and more comprehensive analyses compared with their predecessors. Beyond individual models, multi-agent systems are now automating entire workflows, enabling specialized AI agents to collaborate on intricate challenges. One example is Toyota’s “obeya agent,” which integrates multiple sub-agents to assist powertrain engineers in analyzing vast datasets.According to Saj Kumar K, Senior Director of Manufacturing (APAC) at Microsoft, these advanced AI models are already being applied to manufacturing. The Production Copilot functions as a factory agent, analyzing data to identify root causes of downtime and optimize maintenance schedules. The Quality Advisor leverages multimodal AI for visual inspection and defect analysis, potentially rendering traditional image labeling obsolete. AI is also being used to optimize fab scheduling and Automated Material Handling Systems (AMHS), improving overall cycle times. Furthermore, large language models (LLMs) are training humanoid robots to perform complex tasks through single-shot teaching.Advantech’s Edge AI Strategy Targets Speed and PrecisionSemiconductor manufacturing faces unique pressures, particularly from the massive scale of data generated. A single wafer inspection can produce up to seven petabytes of data, requiring enormous computational power and real-time processing. The transition from single-beam to multi-beam inspection demands a tenfold increase in computational speed today, with projections of a hundredfold increase by 2030. Combined with the need for instantaneous data transfer and ultra-low latency to prevent defects, these requirements are driving a shift away from traditional data centers toward powerful edge computing solutions. Meanwhile, global labor shortages and skill gaps are accelerating the need for advanced automation.Advantech is at the forefront of this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. "Inspection is the heart of semiconductor manufacturers," said Magic Pao, Vice President at Advantech. The company’s strategy is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.Advantech is spearheading this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. “Inspection is the heart of semiconductor manufacturing,” said Magic Pao, Vice President at Advantech. The company’s approach is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.To achieve this, Advantech embeds AI into every element of its solutions, including products such as SkyRack and the MIC-7000/7500 industrial servers with direct-liquid cooling, both carrying critical SEMI certifications for fab deployment. High-speed connectivity is ensured through Time-Sensitive Networking (TSN) and industrial-grade switches. AI-powered vision systems—incorporating smart cameras with Nvidia GPU acceleration and FPGA-based technology—are central to the precision required for inspection. Advantech also emphasizes ecosystem strength, partnering with Nvidia for advanced computing and Intel for reliable system integration.Nvidia’s Physical AI Drives Industrial AutonomyNvidia is at the forefront of a new industrial revolution, evolving from a chipmaker into an “infrastructure company” advancing Physical AI. This strategy seeks to create “AI factories” that power advanced applications. Andrew Liu, Senior Manager at Nvidia, explained that this vision rests on two pillars: advanced foundation models for robotics and sophisticated simulation environments.Nvidia is developing powerful Vision-Language-Action (VLA) models that enable robots to interpret high-level prompts and images, translating them into precise physical actions and learning from observation or single-shot teaching. To address the scarcity of real-world robotics data, Nvidia relies heavily on its Omniverse platform for digital twins and simulation. Omniverse provides physically accurate, photorealistic virtual environments where synthetic data can be generated and robots can be trained and validated. This approach helps alleviate labor shortages and enables rapid “factory cloning” to mitigate geographic supply chain risks. Nvidia’s integrated platform spans systems for training foundation models, servers for Omniverse digital twins, and embedded platforms for industrial robot deployment.Toward the Lights-Out FutureThe convergence of advanced AI models, strategic infrastructure, and targeted edge solutions is accelerating the path toward fully automated “Lights-Out” semiconductor manufacturing, promising significant gains in productivity, efficiency, and resilience that will redefine the industry’s future. At SEMICON Taiwan 2025, the AI Technology Zone (advised by the International Trade Administration) underscores this transformation by showcasing the full AI ecosystem—from chip manufacturing and IC design to dedicated hardware.As part of its broader focus on AI innovation, SEMICON Taiwan 2025 also features the AI Technology Zone, advised by the International Trade Administration, underscores the transformation by showcasing the full AI ecosystem, from chip manufacturing and IC design to dedicated hardware. The zone brings together global innovators and industry leaders, providing a platform to foster collaboration and accelerate AI adoption across the semiconductor value chain.SEMICON Taiwan 2025 Smart Manufacturing Forum. SEMI

As the semiconductor market accelerates toward an estimated US$1.3 trillion valuation by 2030, industry leaders are converging on a shared vision. AI is ushering in an era of unprecedented growth and technological transformation.At the CEO Summit 2025, organized by SEMI, thought leaders from Infineon, NXP, Google,DENSO , Tenstorrent, and ASE gathered to discuss the critical role of power in enabling AI, the opportunities and challenges semiconductors bring across applications—from data centers to edge computing—and the importance of global collaboration across the ecosystem.In their inaugural speeches in Taiwan, the CEOs of Infineon and NXP delivered a unified message on the future of AI. Both leaders underscored a critical and often overlooked point: power is the foundational element driving the next wave of AI computing performance. Their presence also underscored Taiwan’s strategic importance within the global technology ecosystem.Infineon Technologies CEO Jochen Hanebeck highlighted that AI’s power demand is becoming a fundamental bottleneck. Without sufficient power, the challenge extends beyond generation to the infrastructure needed to deliver electricity from the grid to the processing core. Ultimately, he warned, society may be unable to enjoy the full convenience and progress AI promises.NXP Semiconductors CEO Kurt Sievers echoed this sentiment, emphasizing that AI’s power demands extend well beyond data centers into "physical AI" applications such as autonomous vehicles and humanoid robots. This shift, he explained, is fueling rapid growth in edge AI. When AI interacts with the physical world, factors such as bandwidth, energy efficiency, latency, and trust become paramount. Consequently, these complex systems require advanced architectures with sophisticated power management for critical functions such as motor control and sensor integration.Sievers further elaborated on this concept, referring to it as "attending A", which he believes will enable truly autonomous machines. He stressed the industry’s immense responsibility to ensure these technologies are developed responsibly for the benefit of humanity, remarking: "We all share quite some responsibility to do this right for the better of humankind." He explained that intelligent systems consist of multiple "agents" that must be carefully orchestrated and enabled to work in harmony.Dr. Hirotsugu Takeuchi, CTO of DENSO , shared insights on how semiconductors are transforming mobility. He outlined the requirements of automotive applications and the need for new SoCs to power the rise of Software-Defined Vehicles (SDVs). He pointed to the breakthrough of SiC technology as a key enabler of a sustainable, carbon-neutral society. Takeuchi emphasized that semiconductors will drive safer, more comfortable mobility and that collaboration with Taiwan and the broader global network will be essential to the future of the automotive industry.Rehan Sheikh, Vice President of Global Silicon Chip Technology & Manufacturing at Google Cloud, noted that demand for AI compute is growing exponentially. He highlighted that AI inference volume doubled in the past year, with Google’s internal data showing a 50-fold increase in monthly processed tokens across its services. Sheikh introduced Google’s latest TPU, Ironwood—a powerful, energy-efficient chip specifically designed for large-scale inference workloads. It represents Google’s first TPU purpose-built to balance high performance with power efficiency in meeting the demands of the AI boom.Jim Keller, veteran chip architect and CEO of Tenstorrent, emphasized his mission to champion open-source architectures and foster a spirit of global collaboration at a time when AI computing is becoming increasingly complex and costly. Keller explained that Tenstorrent aims to democratize high-end AI computing, making it more accessible, faster, and more open. The company’s strategy rests on three pillars: RISC-V, OpenAI, and a unified software stack. At the heart of this approach is a commitment to open standards and collaborative development, challenging the industry's traditionally closed ecosystems.During the fireside chat, speakers reflected on Taiwan's evolving role in the global semiconductor landscape. Long established as a manufacturing hub for logic chips, Taiwan is now emerging as the ideal platform for integrating diverse technologies and solving system-level challenges, thanks to its mature ecosystem, advanced packaging capabilities, and open-minded approach. Executives from Infineon, NXP, and Tenstorrent all stressed that no single company or region can address these challenges alone. The future of the industry, they agreed, depends on deep cooperation across sectors and geographies, combining expertise in areas ranging from high-performance computing to power and sensing technologies.In closing, ASE CEO Dr. Tien Wu referenced A Chip Odyssey, Taiwan’s first documentary film spotlighting its globally leading semiconductor industry. He described the film as a powerful reminder to both senior leaders and younger generations to maintain confidence in the steady progress of semiconductor development.The film chronicles Taiwan’s journey from humble beginnings to its emergence as a critical player in the global industry. Dr. Wu shared that he was deeply moved by the story of two generations of talent—each bringing vision, diligence, and leadership—who together created a lasting legacy. He extended this reflection beyond Taiwan, noting that the United States, Japan, Korea, and Europe have each experienced their own “chip odysseys.” This, he emphasized, illustrates that Taiwan's story is part of a larger global network of interdependence, where collective collaboration produces outcomes greater than the sum of individual contributions.SEMICON Taiwan 2025 CEO Summit highlights collaboration to drive semiconductor innovation. DIGITIMESTenstorrent CEO Jim Keller champions open-source architectures and global collaboration to democratize AI computing. DIGITIMES

OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console. Equipped with BIWIN mini SSD, the X1 Air achieves a “dual-drive” architecture that delivers superior data transfer speeds and flexible capacity expansion, supporting smooth performance across work, creation, and gaming scenarios. Meanwhile, with a modular, slot-in form factor, the mini SSD is user-installable, offering instant storage expansion with true plug-and-play convenience.Mini SSD vs. Traditional Storage SolutionsUFS: As a soldered-to-board solution, UFS is not user-expandable. Over time, limited capacity often leads to performance bottlenecks and slowdowns. For terminal manufacturers, maintaining multiple SKUs for different capacities increases supply chain complexity and after-sales maintenance costs, as faulty units often require full motherboard replacements.microSD Express: In spite of its expandability and flexibility, microSD Express card suffers from compatibility challenges that demand extra certification and validation efforts by device makers. Bandwidth limitations also prevent it from meeting today’s high-performance application needs.Mini SSD vs. Traditional Storage Solutions. Credit: BIWINIn comparison, mini SSD shows all-around excellence in performance, dimension and expansion. And its balance between total cost efficiency and user experience for terminal brands earns it the ultimate storage solution for portable intelligent terminal.Mini SSD shows all-around excellence in performance, dimension and expansion. Credit: BIWINHigh-Speed Read/Write, Ultra-Fast ResponseEngineered with scenario-specific firmware optimizations, BIWIN mini SSD supports PCIe Gen4 ×2, with its 4K random read/write speed up to 850K/750K IOPS by using the dynamic SLC cache technology. The low latency and fast response in data processing empower the X1 Air to handle high workloads and seamless mode switching across handheld, tablet, and notebook use. From multitasking and heavy software loading to instant 3A game rendering, the mini SSD unlocks the full potential of the X1 Air’s AI-ready processors, big-core CPU, and integrated GPU—delivering instant app launches, lightning-fast file transfers, and near-instant boot-ups for a fluid experience across all scenarios.Mini SSD: An Innovative Storage Expansion Solution for the Edge AI Era. Credit: BIWINUltra-Small, Lightweight, and ThinWithin a sleek 252mm x 163.5mm x 13.5mm chassis weighing just about 835g, the X1 Air delivers portability without compromise. Every component equipped has been rigorously tested and precisely integrated to achieve this level of compact efficiency. Built on innovative LGA packaging, BIWIN mini SSD achieves ground-breaking small size, with its volume only 40% of a traditional M.2 2230 SSD and its weight of only 1g (roughly equal to a paperclip). This ultimate miniaturized design frees valuable space for battery and cooling, perfectly satisfying the pursuit of both lightweight body and superior performance of X1 Air.As a 3-in-1 terminal designed for portable uses, X1 Air is built for on-the-go resilience, such as commuting vibrations or travel shocks. Featured with high-quality NAND and advanced controllers, BIWIN mini SSD delivers superior shock & vibration resistance, IP68-rated dust and water protection and 3-meter drop resistance, ensuring data safety during mobile office work, outdoor creative tasks, or handheld gaming.Meanwhile, BIWIN mini SSD comes equipped with intelligent power management technology, demonstrating high-speed responses while significantly lowering power consumption. In this way, not only is the device battery life extended, but heat generation is minimized, enabling the X1 Air to achieve “lightweight and always-on” mobile experience.Plug-and-Play, Ready in a SnapFor X1 Air, portability doesn’t come at the expense of capacity and performance. Benefited from the newly-designed expandable mini SSD slot, users are allowed to additionally add mini SSD to the device based on the standard M.2 PCIe 4.0 SSD. The maximum capacity expansion is up to 1TB (2TB to be launched soon), so the device is able to realize a total capacity of 3TB, more than enough for gaming libraries, creative projects, and productivity workflows.Plug & Play Slot Design. Credit: BIWINThe modular slot-in design supports safe hot-swapping and modular upgrades after power-down, requiring no disassembly or tools. Just like swapping an SD card, users can expand capacity or transfer data on the fly—whether refreshing a game library during travel or quickly loading project files in the studio. Built with premium TLC NAND and fortified by Wear Leveling, ECC, and LDPC error correction, the BIWIN mini SSD ensures data reliability and endurance even under frequent swaps, multi-mode usage, and mobile conditions.Infinite Storage, Unlimited SolutionsAs users demand greater performance, responsiveness, and immersive experiences from portable intelligent devices, storage has become a critical enabler and a key differentiator for competitiveness in edge AI systems. The collaboration between BIWIN and OneXPlayer exemplifies the perfect synergy of technological innovation and exceptional product philosophy.Looking ahead, BIWIN remains committed to its vision of “Infinite Storage, Unlimited Solutions”. By strengthening partnerships across the ecosystem, BIWIN will continue to drive innovation and accelerate the adoption of AI at the edge, unlocking new possibilities for the next generation of intelligent devices.

Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International, which is now rebranding as AsiaStrategy following its merger with Sora Ventures.The deal, finalized on August 15, marks the first instance of a publicly traded company in Taiwan investing directly in a firm whose strategy centers on holding Bitcoin as a treasury reserve.Top Win, previously known for trading luxury watches, is now listed on Nasdaq under the ticker SORA. In May, the company began shifting toward digital assets by adopting a model that blends traditional retail with Bitcoin-focused capital allocation. By holding Bitcoin on its balance sheet and investing in similar firms, AsiaStrategy aims to emulate the trajectory of its Japanese counterpart, Metaplanet. Metaplanet has accumulated over 7,800 Bitcoin and experienced a stock price increase of more than 3,600% over the past year.WiseLink contributed $2 million through a three-year convertible note, with the remaining funds provided by U.S. investor Chad Koehn and four private investors. Company executives described the transaction as a strategic integration of Bitcoin with cross-border financial operations. This hybrid model may offer both asset protection and new avenues for business development.WiseLink CEO Tsai Kun Huang referred to the investment as a timely opportunity to explore long-term innovation in decentralized and inflation-resistant assets.The investment strategy is similar to trends seen in North America and Europe. Here, companies like MicroStrategy have built multibillion-dollar Bitcoin treasuries. For Asia, however, Taiwan's move could be the beginning of a wave of corporate adoption. Market analysts state that the region's growing interest in digital assets reflects global monetary easing and a search for hedges against geopolitical uncertainty. The idea of a 1000x crypto opportunity, which is often discussed in investment circles, shows why firms are increasingly looking for exposure to high-upside, technology-driven financial assets like cryptocurrencies.Taiwan's initiative is not solely financial—it also reflects a technological shift. In July, the government launched a blockchain-based payment system, underscoring its commitment to digital innovation.This direction is evident in WiseLink's operations, which span fintech, SaaS, and a longstanding partnership with smartphone developer OPPO. The company is integrating crypto treasury management with tech platforms, positioning Bitcoin reserves as both passive holdings and potential enablers of new financial models.Top Win's evolution from luxury retail to digital assets represents a significant change in corporate identity. The rebrand to AsiaStrategy and its merger with Sora Ventures establish a broader regional footprint, with expansion plans targeting Thailand and South Korea.Sora Ventures has pledged to deploy a $150 million fund to support at least ten public companies with Bitcoin treasury strategies by the end of 2025. Co-founder Jason Fang stated that the goal is to "anchor Asia in the global Bitcoin treasury movement."Nonetheless, the transition carries risks. Top Win has previously reported issues in financial disclosures and had only $3.8 million in working capital prior to the deal. Its balance sheet remains modest compared to Western peers.Asia's tech sector is increasingly converging with blockchain and decentralized finance. Taiwan's first public Bitcoin treasury may be an early indicator of broader changes ahead. Stakeholders across the region are now exploring not whether Bitcoin belongs on corporate balance sheets, but how significant its role may become in shaping Asia's financial landscape.

Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high performance AI, mass production for the world's first time.SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production to lead the AI era. Through this momentum, the company has once again proven the AI memory leadership in the global market.“Completion of HBM4 development will be a new milestone for the industry,” Joohwan Cho, Head of HBM Development at SK hynix, who has led the development, said. “By supplying the product that meets customer needs in performance, power efficiency and reliability in timely manner, the company will fulfill time to market and maintain competitive position.”With recent dramatic increase in AI demand and data processing, the needs for high bandwidth memory for faster system speed are surging. In addition, securing memory power efficiency has emerged as a key requirement for customers as power consumption for data center operation has increased. SK hynix expects HBM4, with increased bandwidth and power efficiency, to be the optimal solution to meet customers' needs.HBM4, of which mass production system has been readied, has the industry's best data processing speed and power efficiency with the bandwidth doubled through adoption of 2,048 I/O terminals, double from the previous generation, and power efficiency improved by more than 40%. The company expects to improve AI service performance by up to 69% when the product is applied, which will lead to solve data bottleneck and significantly reduce data center power costs.The company has far exceeded the JEDEC standard operating speed(8Gbps) by implementing over 10Gbps(Gigabit per second) operating speed in HBM4.In addition, the company adopted the Advanced MR-MUF process in HBM4, which has been proven to be reliable in the market, and the 1bnm process, or the fifth-generation of the 10-nanometer technology, to minimize the risk in mass production.“We are unveiling the establishment of the world's first mass production system of HBM4,” Justin Kim, President & Head of AI Infra at SK hynix, said. “HBM4, a symbolic turning point beyond the AI infrastructure limitations, will be a core product for overcoming technological challenges.” “We will grow into a full-stack AI memory provider by supplying memory products with the best quality and diverse performance required for the AI era in a timely manner.”Credit: SK HynixSK hynix develops world's first HBM4, doubling bandwidth and boosting efficiency for AI memory. SK Hynix

At the MEMS & Sensors Forum in SEMICON Taiwan 2025 held in Taipei on September 9, two leading experts presented complementary visions for the future of robotics. Dr. Hiroshi Ishiguro, a renowned Japanese humanoid robotics expert, offered a philosophical perspective on avatars and societal change. Meanwhile, Dr. Jwu-Sheng Hu, Executive VP of Taiwan’s Industrial Technology Research Institute (ITRI), provided a more "down to earth" view on industrial strategy and the robotics supply chain.The Human-Avatar Symbiotic SocietyDr. Ishiguro argued that the most transformative industries are those that repeatedly reshape the world, such as semiconductors. His focus is on developing avatars, which he defines as any robot or computer-generated agent that acts based on a person's intentions. He believes that the COVID-19 pandemic accelerated the adoption of remote work, finally removing the societal barriers that once hindered the avatar market.Central to his philosophy is the idea that humanoid robots are the ideal interface because our brains are naturally wired to recognize other humans. Dr. Ishiguro views this work as a "constructive science," using the creation of humanlike robots to understand our own higher cognitive functions, such as emotion and consciousness, and to explore "what it means to be human". He credits the advent of large language models with solving the longstanding challenge of creating humanlike conversational functions in robots.He showcased his own robot avatar, a "convenient double" that can speak multiple languages, including Chinese (which he cannot). The avatar's perfect memory and ability to conduct media interviews allows Dr. Ishiguro to manage his busy schedule. He even uses over 50 robots to guide visitors through his Expo pavilion, a demonstration of his vision for a future where people are no longer constrained by their physical bodies.Dr. Ishiguro then highlighted practical use cases, many of which are already under development through Japan’s government-backed Moonshot project. The initiative’s first goal is to establish by 2050 a society where individuals are no longer constrained by their physical bodies, brains, space, or time—expanding human abilities and granting new opportunities for participation.Dr. Ishiguro showcased how avatars are already reshaping daily life across multiple sectors:Retail and Service: In Japanese convenience stores and supermarkets, avatars assist customers around the clock. One wheelchair user was able to control five avatars remotely, earning a higher salary than in-person staff. Avatars also open global labor markets, enabling people in other time zones—for instance, Brazil—to work overnight shifts in Japan.Education: Avatars act as personalized tutors, adapting to each student’s strengths and preferences, while also enabling international students to join classes virtually.Healthcare: On a remote Japanese island of just 200 residents, avatars allow the local doctor to collaborate with university hospital specialists, effectively transforming a small clinic into a major medical hub.Business: From public officials delivering speeches without security risks to life insurance agents conducting sensitive consultations, avatars are reshaping professional engagement.From Automation to AutonomyDr. Hu’s presentation focused on the fundamental shift in robotics from automation to autonomy. He explained that while earlier robots were pre-programmed for repetitive tasks, advances in AI now enable them to handle complex, multi-joint motions. This new capability also introduces challenges such as high power consumption and overheating—issues Dr. Hu described as “exciting” because they fuel fresh opportunities for business and industry. He noted that the service robot market is projected to grow at a significant 23% annual rate through 2030.He highlighted the key difference: in automation, humans provide both the objective and the action plan, whereas in autonomy, the robot generates its own plan from a human-defined objective. A major hurdle, he stressed, is the shortage of real-world data to train what he calls the “large behavior model.” Dr. Hu outlined two strategies to address this challenge:Learning by Demonstration: A robot observes a human performing a task and uses that data to generalize the behavior to new situations.Sim2Real: Robots are trained in a virtual world using digital twins, which is cost-effective but requires massive amounts of electricity and computing power to process image and sensor data.Taiwan’s Strategy and a Shared FutureDr. Hu outlined Taiwan’s robotics strategy, which builds on the nation’s strength in small and medium-sized enterprises (SMEs). The plan emphasizes enhancing existing systems with AI functions and advancing manufacturing and design for next-generation hardware. He underscored Taiwan’s role in supplying key components for the global robotics value chain.ITRI has already spun off several robotics startups, including companies developing exoskeletons and robotic skin. As part of a new four-year, US$20 billion initiative, ITRI will also establish a national robotics center to spearhead this research.Both speakers concluded with a unified message. Dr. Ishiguro stressed that avatars can enable a society of diversity and inclusion by liberating people from the constraints of their physical bodies and highlighting their skills and contributions. Dr. Hu reiterated that the ultimate goal is for robots not merely to entertain but to work—and specifically to perform the “dirty and dangerous” jobs on behalf of human beings. Together, their presentations offered a compelling roadmap for a future in which robots are seamlessly integrated into society to enhance human potential.Professor Hiroshi Ishiguro, the key note speaker of MEMS & Sensors Forum of SEMICON Taiwan 2025. SEMIDr. Jwu-Sheng Hu, Executive Vice President, Industrial Technology Research Institute at SEMICON Taiwan 2025. SEMI