At COMPUTEX 2025, DATOTEK INTERNATIONAL CO., LTD. launches its latest innovations under the theme "AI Star Voyage", representing creators and gamers navigating a limitless digital universe. Visit us at Booth J0327a for an immersive experience in next-generation storage.One key highlight is the Quantum MagSafe Portable SSD, featuring USB4.0 and dual Type-C ports that allow simultaneous video recording and charging—solving mobile creators' biggest pain points. The booth also presents CUDIMM and CSODIMM memory modules, equipped with onboard clock drivers for signal integrity and stability, enabling speeds of up to 8000MHz.Making its debut is the DATO microSD Express card, specially designed for Switch 2. This high-speed storage solution is also compatible with a wide range of mobile and gaming devices—delivering the perfect blend of speed, flexibility, and portability for power users.Find us at Booth J0327a, 3rd Floor, Hall 1, Nangang Exhibition Center. Industry professionals, gamers, and creators are welcome to stop by and explore our latest storage breakthroughs.Since its founding, DATOTEK has focused on high-performance storage and memory innovations. With product lines including USB4 devices, MagSafe-compatible SSDs, and now the Switch 2–ready microSD Express card, the company continues to push the boundaries of portable data technology.
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple-level cell 4D NAND flash for mobile applications.The development comes amid increasing requirements for high performance and low power of a NAND solution product to ensure a stable operation of on-device AI. The company expects the UFS 4.1 product, optimized for AI workload, to help enhance its memory leadership in the flagship smartphone markets.With an increase in demand for on-device AI leading to greater importance of the balance between computation capabilities and battery efficiency of a device, the mobile market is now requiring thinness and low power from a mobile device.The latest product comes with a 7% improvement in power efficiency, compared with the previous generation based on 238-high NAND and a slimmer 0.85mm thickness, down from 1mm before, to fit into an ultra-slim smartphone.The product also supportsa data transfer speed of 4300MB/s, the fastest sequential read* for a fourth-generation of UFS, while providing the best-in-class performance by also improving random read and write speed**, critical for multitasking, by 15% and 40%, respectively. Immediate provision of the required data for on-device AI and faster running speed and the responsivity of an application are expected to enhance user experience.* Sequential Read/Write: speed to read and write data of a file sequentially* Random Read/Write: speed to read and write data of dispersed filesSK Hynix plans to win customer qualification within the year and ship in volume from the first quarter of next year. The product will be provided in two capacity types – 512GB and 1TB.Ahn Hyun, President and Chief Development Officer, said that SK Hynix plans to complete the development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year. "We are on track to expand our position as a full-stack AI memory provider in the NAND space by building a product portfolio with AI technological edge."About SK Hynix Inc.SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korean Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com, news.skhynix.com.
DEEPX (CEO Lokwon Kim), a leading developer of ultra-low-power on-device AI semiconductors, and Nota AI (CEO Myungsu Chae), an expert in AI model optimization and on-device generative AI, have signed a strategic Memorandum of Understanding (MOU) at Computex Taipei 2025, the world's largest ICT exhibition. This partnership aims to strengthen their global position in the rapidly growing on-device AI market.Under the agreement, the two companies will co-develop AI solutions that combine DEEPX's advanced Neural Processing Units (NPUs) with Nota's lightweight AI models, enabling high-performance AI functionality even in ultra-compact, power-constrained devices. These joint solutions will serve as proof-of-concept models for applications in industrial robotics, smart appliances, security systems, mobility platforms, and more—accelerating market penetration both in Korea and globally.As part of the collaboration, DEEPX will provide its NPU SDKs and development kits to support the optimized integration of lightweight AI models. Nota AI will design and fine-tune application-specific models to meet diverse industry requirements. The partnership also includes co-marketing efforts, joint participation in global trade shows, and active engagement with B2B customers worldwide through proof-of-concept deployments."This agreement will be an important collaboration to expand the on-device AI ecosystem," said Lokwon Kim, CEO of DEEPX. "By combining the strengths of both on-device AI hardware and software, we will strive to bring competitive AI solutions to the global market.""Our strategic partnership with DEEPX combines Nota AI's proprietary AI optimization technologies with DEEPX's world-class AI hardware innovation, positioning us as leaders in the global on-device AI market," said Nota AI CEO Myungsu Chae. "Together, we will accelerate the deployment of optimized AI across a range of industrial applications."This MOU highlights the growing global recognition of Korean innovation in on-device AI technology, signaling a new phase of international expansion for domestically developed AI solutions.About DEEPXFounded in anticipation of an era when artificial intelligence will be as pervasive as electricity and Wi-Fi, DEEPX develops core technology for high-performance AI semiconductors and computing solutions that bring intelligence to electronic devices. DEEPX currently holds over 326 patents pending in the U.S., China, and Korea—one of the largest patent portfolios in the world for on-device AI chip development.DEEPX's AI semiconductors are optimized for various applications, improving energy efficiency while enabling advanced AI functionality. The company is collaborating with customers such as Hyundai Kia Motors Robotics Lab, POSCO DX, Jahwa Electronics, LGU+, and Inventec on mass-production developments. In addition, DEEPX works with more than 120 global organizations in areas like smart cameras, surveillance systems (AI NVR), smart factories, robotic platforms, and AI servers, and conducts strategic global promotions in the United States, China, Taiwan, and Europe.About Nota AINota AI (Nota Inc.) is a leading on-device AI company specializing in AI model optimization and on-device generative AI. Leveraging its proprietary NetsPresso® platform, Nota AI delivers high-performance AI capabilities across various industries, including transportation, automotive, mobile, IoT, and beyond. The company maintains strategic collaborations with global semiconductor leaders and Fortune 100 corporations such as NVIDIA, ARM, Qualcomm, Sony, and Samsung Electronics. With established entities in the U.S. and Germany, Nota AI is actively expanding its global presence, notably into key markets in the Middle East and Southeast Asia. The company's technological leadership has been globally recognized, most recently by its inclusion in CB Insights' '100 Most Innovative AI Startups'.For more information, visit www.nota.ai.From left: Lokwon Kim, CEO of DEEPX, and Myungsu Chae, CEO of Nota AIFrom left: Myungsu Chae, CEO of Nota AI, and Lokwon Kim, CEO of DEEPX
DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power on-device AI semiconductors, is demonstrating its mass-production-ready product lineup in collaboration with 11 leading Taiwanese industrial PC and server companies at Computex Taipei 2025, held from May 20–23. Participating partners include MSI, IBASE, Inventec, Biostar, Portwell, AIC, Jetone, Mitwell, AAEON, DFI, and Zotac. This extensive collaboration solidifies DEEPX's position as a global AI semiconductor company with the most active local ecosystem network in Taiwan—one of the world's foremost hardware hubs.During the exhibition, DEEPX operates its own booth while also showcasing its NPUs live at partner booths. Global buyers and visitors can experience DEEPX's production-ready AI accelerators integrated into industrial PCs, workstations, and servers, including:• DX-M1 M.2 module for sub-3W ultra-low-power inference,• DX-H1 PCIe accelerator for high-performance, multi-channel AI processing,• DX-AiBOX, an edge system optimized for seamless deployment across customer platforms,• DX-V3 SoC, dedicated to AI-powered smart cameras.These solutions are being validated across various use cases with partners in factory automation, surveillance systems, smart city infrastructure, and intelligent buildings.The first-generation DX Series delivers up to 20x higher power efficiency and one-tenth the heat and total cost of ownership (TCO) compared to conventional AI accelerators. These advantages are setting new standards for fanless edge system design and cost-efficient cloud infrastructure, especially within Taiwan's ecosystem, which accounts for over 80% of the world's IPC and server production."Taiwan is a global manufacturing hub with a complete AI value chain—from components to systems to end solutions," said Lokwon Kim, CEO of DEEPX. "By working closely with local partners, DEEPX is reshaping the high-cost, high-power GPGPU paradigm and enabling customers to build the most stable and efficient AI systems."Recently, DEEPX was named one of the "Top 100 AI Companies" by Business Next (數位時代), a leading business and technology publication in Taiwan. The company has also established a Taipei branch office, localizing its customer support and logistics operations while accelerating partnerships with companies including Lanner, ASUS, ASRock, Supermicro, LEX, and Innodisk. To stay updated on the latest from DEEPX, follow the official DEEPX LinkedIn page.The DEEPX booth is located on the 4th floor of Nangang Exhibition Center Hall 2, in the AI & Edge Computing Zone, with additional showcases available throughout the 1st to 4th floors at partner booths.
The Internet has become an integral part of our everyday lives in the current digital era, changing how we interact, study, work, and relax. Online settings have made previously unheard-of levels of accessibility, flexibility, and creativity possible. Whether we're streaming our favorite programs, working with colleagues across countries, or attending virtual schools. There's so much we can do online now.Empowering choicesOne notable example of leveraging online environments for user empowerment is BonusFinder in Canada. This platform assists users in navigating the online gaming landscape by providing comprehensive reviews and comparisons of various gaming sites.By offering detailed information on bonuses, game selections, and user experiences, BonusFinder enables Canadians to make informed decisions tailored to their preferences. This exemplifies how online platforms can enhance user autonomy and satisfaction in the digital realm.Flexibility and accessibility in online learningOnline education has revolutionized access to learning, breaking down geographical and temporal barriers. Students can now engage with course materials at their own pace, accommodating diverse schedules and learning styles.This flexibility particularly benefits individuals balancing education with work or family commitments. Institutions like Boston University highlight that online programs often offer lower tuition fees and eliminate commuting costs. This makes education more affordable and accessible to a broader audience.Personalized learning experiencesDigital platforms facilitate personalized learning by allowing students to focus on areas where they need improvement and skip content they've mastered. Adaptive learning technologies and interactive tools, such as quizzes and simulations, cater to individual learning preferences, enhancing engagement and retention.Moreover, revisiting rZcordZd lZctures and materials enables students to reinforce their understanding at their convenience.Promoting inclusivity and accessibilityOnline environments have significantly enhanced inclusivity and accessibility in education and professional development. Digital platforms often incorporate features such as closed captions, screen readers, and adjustable text sizes. This makes content more accessible to individuals with disabilities.Moreover, the flexibility of online learning allows individuals from diverse backgrounds and circumstances, including those in remote areas or with caregiving responsibilities, to access quality education and training. Institutions like Bellevue University emphasize that online education breaks down geographical and temporal barriers. This, in turn, provides equal opportunities for learners regardless of location or personal commitments.Enhancing mental health supportThe digital realm has also expanded access to mental health resources, offering support through teletherapy, online support groups, and mental health apps. These platforms provide convenient and often more affordable options for individuals seeking assistance. This reduces the stigma associated with mental health care.However, it's crucial to approach online mental health resources with discernment. Experts caution against over-reliance on AI-driven therapy chatbots. While they can offer immediate support, they lack the nuanced understanding of human therapists and may not be suitable for all situations.Fostering global collaboration and cultural exchangeOnline environments facilitate global collaboration, connecting individuals across continents to share ideas, work on projects, and learn from diverse perspectives. This interconnectedness enriches the learning experience. In turn, this promotes cultural exchange and prepares individuals for the globalized workforce.Various platforms offer courses from universities worldwide. This allows learners to engage with international content and peers. Such exposure broadens intellectual horizons and fosters empathy and cross-cultural understanding, essential skills in today's interconnected world.Environmental sustainabilityTransitioning to online environments contributes to environmental conservation by reducing the need for physical resources. Traditional classrooms consume significant amounts of paper and energy. In comparison, online learning minimizes paper usage and lowers carbon emissions associated with commuting.According to The Starfish Canada, online education helps save millions of trees annually. In turn, this decreases paper waste and the demand for physical infrastructure.Enhancing digital literacy and technical skillsEngagement with online platforms inherently improves digital literacy. It's a crucial skill in today's technology-driven world. Students become proficient in using various digital tools and platforms, such as learning management systems, video conferencing software, and collaborative applications. These skills are transferable to the workforce, where digital proficiency is increasingly valued.Fostering global connections and collaborationOnline environments enable individuals to connect and collaborate across geographical boundaries. Virtual classrooms and forums bring together diverse perspectives, enrich discussions, and promote cultural exchange.This global interconnectedness prepares students for the international nature of the workforce, where cross-cultural communication and collaboration are essential.Supporting mental health and well-beingThe flexibility and accessibility of online environments can positively impact mental health by reducing stress associated with rigid schedules and commuting. Institutions emphasize the importance of supportive online learning environments that address mental health. This offers counseling and wellness programs to promote resilience and academic success.Encouraging lifelong learningOnline platforms provide opportunities for continuous learning beyond traditional educational settings. Professionals can upskill or reskill through online courses, staying current with industry trends and advancements. This accessibility to lifelong learning fosters personal growth and adaptability in a rapidly evolving job market.ConclusionOnline environments have become integral to modern life. They offer numerous benefits that enhance education, promote sustainability, and foster global connections. Platforms like BonusFinder in Canada exemplify how digital tools can empower users to make informed choices tailored to their preferences.So, as technology continues to evolve, embracing the advantages of online environments will be key to personal and societal advancement in the digital age.
Wedge Networks, a global leader in real-time threat prevention, and Edgecore Networks, a leader in open networking and Wi-Fi infrastructure, are proud to announce the launch of a joint OEM-based Managed Secure Wi-Fi Solution, WedgeCND, combining carrier-grade wireless connectivity with advanced, AI-powered cybersecurity.Set to debut at Computex 2025, this integrated solution enables MSPs, ISPs, and government organizations to deploy cyber-secure, cloud-managed Wi-Fi services at scale, with unmatched cost-efficiency, zero-touch provisioning, and enterprise-grade protection for all connected endpoints."This partnership combines Edgecore's robust, scalable Wi-Fi infrastructure with Wedge's patented real-time threat prevention to deliver WedgeCND as a truly AI-drive, cloud-first and cyber-first managed Wi-Fi platform. Our partnership with Edgecore made this a highly cost-effective solution, delivering significant savings in Total Cost of ownership when compared with industry peers." said Dr. Hongwen Zhang, CEO and CTO of Wedge Networks. "We're excited to introduce WedgeCND at Computex as the world's most cost-effective, AI-driven, and security-centric Wi-Fi offering."Next-Gen Managed Wi-Fi – Key Highlights✅ Edgecore's high-performance, leading-edge technology with the broadest Wi-Fi use case coverage. • 802.11ac (Wi-Fi 5), 802.11ax (Wi-Fi 6/6E), 802.11be (Wi-Fi 7)• Supports all Wi-Fi use cases: SMB, WFH, Enterprise, MDU, campus, warehouse, industrial, full indoor/outdoor portfolio• Delivers significant savings in combined AP and cloud licensing costs compared to industry peers.✅ Zero-Touch Cloud Management at Scale • Edgecore ecCLOUD enables centralized, multi-tenant management of APs, networks, and firmware — ideal for service providers and distributed enterprises.✅ Cybersecurity Built-In, Not Bolted OnWedgeCND is a Wi-Fi-optimized configuration of WedgeARP, an award winning and patented network management and real-time threat prevention platform from Wedge Networks. WedgeCND is tailor configured to meet the enterprise-grade security compliance needs of cloud managed Wi-Fi networks. Through a lightweight cloud orchestration architecture, it enables Wi-Fi APs with high performance, advanced security functions:• Secure Web Gateway (SWG)• AI based malware prevention to stop never-before-seen targeted malware• NGFW with Deep Packet and Deep Content Inspections o Network DLP o VLAN based network segmentation o ZTNA of all devices✅ AI-Driven Real-time Protection for Every Connected Device• Wedge's AI-powered real-time inspection engine blocks threats inline, without perceivable latency and stops never-before-seen malware at the network track — making it ideal for zero-trust, highperformance Wi-Fi networks.✅ Cost-Effective, Scalable, Globally Available• Designed for high-density, cost-sensitive deployments.• Available through both Edgecore and Wedge's global OEM, SI, and MSP channel network."Edgecore is excited to enable this powerful secure Wi-Fi solution with Wedge Networks. WedgeCND will also be available for all Edgecore ecCLOUD customers and partners," said TengTai Hsu, Vice President of Edgecore Networks. "This offering brings together best-in-class wireless hardware with cutting-edge enterprise-grade security functions — all managed through the cloud, and deployable at massive scale."Join Us at Computex 2025Experience live demos of the WedgeCND, a partnership between Wedge and Edgecore, for Managed Secure Wi-Fi solution at Computex 2025, where the combined power of high-performance APs and enterprise-grade cyber protection will be on full display.Availability• Now available for Edgecore EAP101 and EAP102.• Full Edgecore/ecCLOUD AP lineup support expected Q3 2025.• Offered in Canada and globally via Wedge Networks and Edgecore international channel partners.Partner with UsFor sales and partnership opportunities, pilot programs, or early deployment support:• Wedge Networks:sales@wedgenetworks.com• Edgecore Networks: ecwifi-info@edge-core.comClick/scan the QR code to see it in action: About Wedge NetworksHeadquartered in Calgary, Canada, Wedge Networks is an innovation leader in real-time threat prevention. Its Cloud Orchestrated Edge Detection and Response software platform WedgeARP™, with its patented Deep Content Inspection and AI threat detection and prevention engines, are protecting millions of endpoints in critical infrastructure and connected environments in 20+ countries/regions.About Edgecore NetworksA subsidiary of Accton Technology Corporation, Edgecore Networks delivers scalable, open networking and Wi-Fi solutions for service providers, cloud operators, and enterprises worldwide.
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating and thermal management challenges. This extends from the infrastructure of data center rackmount AI servers to user-end AI PCs and a diverse range of electronic computing systems, consuming substantial resources and time for engineering teams to confront these new challenges. To effectively address the computational demands of the AI era while simultaneously mastering thermal design challenges, the use of multiphysics simulation systems, employing Computational Fluid Dynamics (CFD) methods to simulate airflow distribution and cooling efficiency, has become a prominent product development focus in the electronics and semiconductor industries.To embrace this immense AI demand and innovation momentum, Altair, the global leader in computational intelligence with a comprehensive portfolio spanning computer-aided engineering (CAE), high-performance computing (HPC), and AI solutions, offers a suite of multiphysics analysis and simulation solutions specifically addressing thermal management and related complex challenges. Frank Wu, Vice President of Global CFD Business at Altair, illustrates the capabilities of Altair® ultraFluidX® simulation software through application examples in thermal flow simulation, assisting the industry in rediscovering the "cooling" pathway in electronic system design.Leading-edge aerodynamics simulation tool ultraFluidX delivers innovative cooling solutions for electronic devicesAltair has cultivated long-standing collaborations with customers in Detroit, the automotive manufacturing hub of the United States. Its ultraFluidX, initially developed for the automotive industry to handle aerodynamic characteristics and simulation technology, utilizes Computational Fluid Dynamics (CFD) analysis to identify designs that minimize air resistance, thereby reducing fuel consumption and enhancing vehicle stability – establishing its leadership in the field. Now, trending products such as electronic systems, AI PCs, and data center AI servers face thermal system design challenges. Beyond optimizing cooling performance, these often require overcoming coupled multiphysics issues like noise and vibration. Due to the involvement of various design departments and architectures, Altair introduced ultraFluidX as a design simulation tool to address this complexity, supporting electronics manufacturing and thermal system supply chain partners and establishing crucial ultraFluidX usage examples to create optimized thermal system design workflows.He exemplifies solutions for the cooling fan and overall thermal system design, where the primary focus is on maximizing cooling efficiency through the airflow and aerodynamic effects generated by the fan. Secondly, it addresses the noise effects resulting from the turbulence created by the interaction of airflow with the fan blades – two key parameters influencing the quality of thermal system design. Effective analysis of these two main design requirements utilizes air pressure flow analysis to understand aerodynamics. In terms of processing and computational efficiency, ultraFluidX holds a leading position in the market. This is attributed to ultraFluidX's mesh generation method, employing the Lattice Boltzmann Method (LBM). Compared to traditional CFD mesh generation, LBM offers the advantage of not requiring simplification of complex geometric shapes and enables rapid part replacement, reducing the time engineers spend on meshing. Coupled with the Large Eddy Simulation (LES) mathematical model and GPU computing power for calculation and solving, it significantly reduces computation time compared to traditional CPU-based methods. A single ultraFluidX computation yields both flow field and sound field results, eliminating the need for secondary calculations. Furthermore, leveraging GPU computing resources enables a comprehensive grasp of details, providing a novel solution for fan and thermal design in electronic products. Regarding GPU computing power, Altair offers three flexible service models to cater to diverse customer needs: first, customers can utilize their own GPU processor servers to run ultraFluidX software; second, they can access ultraFluidX through Altair's connection to public cloud computing services; and third, Altair provides dedicated GPU systems for customers to use within their internal environments. These three models encompass different business service content, offering multiple choices to meet various customer requirements.AI-driven design tools enhance collaboration, accelerate design convergence, and foster product innovationTo meet the demands for design precision and reduced design and validation times, Altair's AI technology is rapidly proving its value. For instance, for manufacturers of fans or thermal modules, after accumulating a substantial amount of historical ultraFluidX data, software such as Altair PhysicsAI™ can be used to learn the relationships between these flow field plots and sound pressure level. This enables the creation of accurate AI prediction models, allowing for rapid evaluation and design of more effective fan blade shapes to reduce aerodynamic noise while ensuring maximum cooling capacity, and overcoming various engineering challenges.This example of AI technology accelerating simulation, design, and AI applications offers the electronics and semiconductor industries a new perspective on solving engineering design problems. More multiphysics simulation technologies and applications will play an indispensable role in electronic system and semiconductor design, with their scope and reach continuously expanding. This includes areas such as chip package design, electronic printed circuit boards, and the common technical challenges in electronic systems involving structural, impact, electrical, thermal, thermal warpage, and fluid dynamics phenomena.Altair Technology Conference Taiwan 2025 Credit: AltairAltair Technology Conference focuses on "AI-powered engineering"To ensure customers stay ahead of this product design trend, Altair will convene its Altair Technology Conference in Taipei on May 28, 2025, focusing on the widespread application scenarios of "AI-powered Engineering." Leveraging its extensive experience in the simulation domain and the power of AI technology, Altair will provide research and design engineers in the semiconductor and electronics manufacturing industries with comprehensive multiphysics simulation solutions. This will empower R&D and manufacturing teams to grasp complex physical phenomena early in the product development cycle, enabling optimized designs.In recent years, Altair has not only integrated numerous AI capabilities into its comprehensive HyperWorks platform to streamline modeling and analysis processes but has also leveraged features like PhysicsAI. By utilizing vast amounts of historical multiphysics simulation data, PhysicsAI helps engineers create entirely new design concepts. This conference will feature an overview of the new capabilities in HyperWorks 2025, demonstrating its seamless integration of finite element analysis, multiphysics, and materials simulation to assist R&D teams in solving complex and interconnected challenges. Keynote speeches will also delve into realizing smarter product engineering through AI agents and small language models (sLLMs).Furthermore, the conference will address the various challenges arising from the popularity of AI chips and AI PCs, ranging from advanced high-level packaging chips to thermal modules on PCBs or electronic systems, and liquid cooling systems in data center servers. Dr. Chou, Ming, Chief Engineer at Altair and a 2025 National Academy of Engineering elected, will provide insights for electronics and semiconductor customers in Taiwan on leveraging Altair SimLab in PCB and 3DIC packaging design. He will also share how to integrate AI prediction and present case studies from world-class IC design industry clients, promising compelling content.To learn more about Altair's solutions and event details, please click here to visit the registration website.
Chenbro, a global leader in the server chassis industry, is making its most significant appearance to date at COMPUTEX 2025, taking place from May 20 to 23 in Taipei. This year's expanded presence highlights Chenbro's strategic focus on three core service models: OTS, JDM, and OEM Plus. Chenbro showcases its latest AI server enclosure solutions, along with cloud server products co-developed with leading partners from the U.S. and Taiwan. Demonstrating a full spectrum of capabilities—from standard products to fully customized solutions—Chenbro reaffirms its robust R&D and manufacturing strength in addressing the evolving needs of global enterprise and cloud markets.Nvidia Global Vice President and Taiwan General Manager Eunice Chiu, alongside Chenbro CEO and General Manager Ya-Nan Chen. Credit: Chenbro Exemplifying Chenbro's core values with three service modelsAt COMPUTEX 2025, Chenbro showcases its strength through three key service models. The OTS demonstration highlights the latest Nvidia MGX and DC-MHS solutions, along with a product roadmap spanning AI, Cloud, Storage, and Edge applications. Its modular design approach enables flexible configurations to meet diverse customer requirements, including OTS-customization solutions. In the JDM area, Chenbro features high-density AI servers and 21-inch OCP ORV3-compliant chassis, co-developed with clients. This model also underscores Chenbro's global R&D collaboration, along with its JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) capabilities that enhance collaboration efficiency and improve product quality. Meanwhile, the OEM Plus showcase emphasizes Chenbro's manufacturing glocalization strategy, Lean Intelligent Manufacturing, and tooling knowledge management, demonstrating its achievements in lean production and manufacturing transformation.Chenbro CEO, Corona Chen, stated that with its strong capabilities in electro-mechanical integration, Chenbro has adopted innovative and diversified business models to expand its market reach. By operating three parallel service models, Chenbro can meet the needs of a wide range of customers—including cloud service providers, system integrators, brand vendors, and channel partners—offering quick and efficient responses to market demands. This approach accelerates the deployment of AI, HPC, and big data infrastructure across data centers and enterprises. Looking ahead, Chenbro will continue to strengthen its global presence by expanding localized manufacturing and R&D teams, aiming to capture new growth opportunities in the AI and cloud server markets in collaboration with its customers.Deepening AI strategy with Nvidia MGX architecture and server developmentAI servers remain a key focus in the market. With the release of Nvidia's GB300 NVL72 platform, Chenbro, an Nvidia MGX ecosystem provider, showcases the next-generation Nvidia GB300 compute tray at COMPUTEX 2025. Chenbro also displays a full range of AI products based on the Nvidia MGX architecture, including 1U, 2U, and 4U server chassis. Many leading technology companies at the event have also demonstrated AI servers co-developed with Chenbro, highlighting the collaborative momentum among industry leaders and the promising future of AI applications.In addition to its work with Nvidia, Corona further emphasized that Chenbro will continue to strengthen its collaborations with CPU providers such as AMD, Intel, and Ampere. Chenbro is committed to investing in the R&D and manufacturing of next-generation servers, exploring the future landscape of AI, and addressing diverse application needs to build a mutually beneficial and thriving industry ecosystem.About ChenbroFounded in 1983, Chenbro has been the trailblazer in designing and manufacturing of own-brand rackmount system, tower server and PC chassis for over 42 years. Chenbro is not only qualified by the first-tier server brands and provides OEM Plus and ODM/JDM services with EMS companies, but also successfully develops its OTS (Off The Shelf) products to meet market demand. Chenbro extends its business footprint to datacenters and industrial solutions by continuously investing in technologies and delivers the most trusted server chassis with the highest standard of innovation. For more information, please visit www.chenbro.com
PEGATRON, a globally recognized Design, Manufacturing, and Service (DMS) provider, is pleased to announce its participation in COMPUTEX 2025, where it will unveil a comprehensive portfolio of advanced rack-scale solutions designed to meet the increasing complexity and scale of AI and data center workloads. These solutions deliver exceptional compute density, energy efficiency, and scalability, aligned with open infrastructure standards.A major highlight of PEGATRON's COMPUTEX showcase is the introduction of the RA4802-72N2, a rack solution featuring the NVIDIA GB300 NVL72, which includes 72 NVIDIA Blackwell Ultra GPUs and 36 NVIDIA Grace CPUs. This system delivers up to a 50X increase in AI factory output with optimized inference capabilities. The rack integrates PEGATRON's in-house developed Coolant Distribution Unit (CDU) to enhance cooling efficiency in high-density environments. Equipped with redundant hot-swappable pumps and a cooling capacity of 310 kW, it ensures optimal performance and high reliability for mission-critical data center operations.Also debuting is the PEGATRON AS208-2A1, a 2U liquid-cooled server system accelerated by the NVIDIA HGX B300 system and dual AMD EPYC™ 9005 processors. Scaled to 48U NVIDIA MGX rack solution, it supports 128 GPUs and 32 CPUs within a high-efficiency, direct liquid cooling framework. This platform delivers exceptional compute density and thermal control while enabling efficient GPU utilization across the rack. Designed for the AI reasoning era with increased compute and expanded memory capacity, it offers breakthrough performance for complex workloads from agentic systems and reasoning to video generation, making it ideal for every data center.Additionally, PEGATRON will be offering NVIDIA RTX PRO 6000 Blackwell servers (AS400-2A1, AS205-2T1), which provide nearly universal acceleration for a broad range of enterprise AI workloads, from multimodal AI inference and physical AI to design, scientific computing, graphics and video applications.Pushing the boundaries of rack-scale compute performance even further, PEGATRON unveils AS501-4A1, the 5OU system features the latest AMD Instinct™ MI350 series GPUs and AMD EPYC™ 9005 processors. Scaled up to 51OU liquid-cooled rack solution, it integrates configuration of 128 AMD Instinct™ MI350 series GPUs and platforms. The solution employs direct-to-chip liquid cooling across both GPUs and CPUs, enabling sustained performance for generative AI, inference, training, and high performance computing—all within a compact, energy-optimized footprint."With the increasing scale and complexity of AI workloads, data center infrastructure must evolve to deliver higher performance, better efficiency, and thermal resilience," said Dr. James Shue, SVP & CTO of PEGATRON. "Our latest liquid-cooled solutions reflect our commitment to enabling the next wave of AI innovation through scalable, ultra high-density systems optimized for real-world deployment."PEGATRON welcomes attendees to Booth #L0118, 4th Floor, Nangang Exhibition Center, Hall 1, from May 20–23, 2025, to explore its newest platforms and engage with the experts behind PEGATRON's breakthrough compute and cooling technologies.PEGATRON Liquid-Cooled Ultra High Density GPU RackPhoto: Company
Retronix Technologies Inc. announced the launch of two cutting-edge AI edge computing platforms, developed in collaboration with Renesas Electronics Corporation.The newly unveiled Sparrow Hawk Single Board Computer (SBC) and Raptor System on Module (SoM) are both powered by the latest Renesas R-Car V4H System-on-Chip (SoC), delivering up to 30 TOPS (Dense) of AI inference performance. These open platforms are designed to support a wide range of embedded edge AI applications and smart automotive solutions.Sparrow Hawk focuses on robotics, industrial automation, and rapid prototyping, offering a highly flexible and cost-effective development platform. Raptor, with its modular design and multi-camera processing capabilities, is engineered for commercial vehicles, advanced driver-assistance systems (ADAS), and autonomous guided vehicles (AGVs), meeting demanding requirements for reliability and AI edge computing.Product Highlight 1: Sparrow Hawk — A Versatile Platform for Edge AI ApplicationsSparrow Hawk is a compact and highly expandable edge AI development board featuring the Renesas R-Car V4H SoC. It offers up to 30 TOPS of dense AI inference performance and supports a fully open-source Linux environment, accelerating the development of industrial and embedded AI solutions.Key Features:*Optimized for Edge Intelligence: Designed for industrial robots, smart manufacturing, and autonomous control systems. *Raspberry Pi HAT Compatible: Easily integrates with popular modules and sensors to streamline development.*High AI Performance: Handles real-time image processing and AI workloads with ease thanks to 30 TOPS deep learning capabilities.*Open Development Environment: Built on an open-source Linux architecture with extensive community support.*Developer-Friendly Pricing: Campaign program at only USD 300, no paper contract required to get started.*Compact Design: Measures just 146mm x 90mm, ideal for embedded and terminal devices.Rich I/O and Expansion Interfaces:*8GB / 16GB LPDDR5 memory*Dual-camera interface and 40-pin GPIO header*1x DisplayPort, PCIe (4x USB3.0, 1x M.2 Key-M), 2x CAN-FD, Audio (2x In. 1x Out) and AVB Ethernet*Supports USB PD 20V power input and MicroSD removable storageRetronix Sparrow HawkPhoto: CompanyProduct Highlight 2: Raptor — Automotive-Grade AI SoM for Smart Vehicle Vision ProcessingRaptor is a high-performance SoM designed for automotive vision processing and edge AI computation. Powered by the Renesas R-Car V4H SoC, it supports multiple camera inputs, pre-processing, and AI inference. Raptor is ideal for applications including ADAS, smart cockpits, surround-view systems, and AGVs.Key Features: *Automotive-Grade Architecture: Built with safety-oriented design principles, long-term supply, and compliance with automotive standards.*Multi-Camera Support: Integrated ISP supports up to 8 video channels with synchronized vision processing.*Powerful AI and Specialized Automotive IP: Delivers 30 TOPS AI inference performance with integrated Image Rendering Unit, Dense Optical Flow, Structure from Motion, and CV/Deep Learning Engines.*Reference Carrier Design & Custom Development: Retronix offers reference designs and engineering services to accelerate product development. *Comprehensive Software Resources: Compatible with Yocto Linux and includes the Renesas AI Hybrid Compiler toolkit.*High Reliability: Designed for high-temperature environments with optimized power efficiency for automotive use.Retronix RaptorPhoto: CompanyAvailability and Computex ShowcaseSparrow Hawk and Raptor are scheduled to sample in late Q2 2025, alongside the launch of a developer program and open-source community support platform to help users rapidly prototype and deploy AI applications.We warmly invite industry professionals to visit Retronix at Computex 2025 (Booth N0814 / B-4) to experience the capabilities of Sparrow Hawk and Raptor firsthand. Explore their architectures, image processing performance, and AI inference efficiency across smart manufacturing, robotics, unmanned vehicles, and intelligent automotive applications.
