Advances in AIoT technologies have given rise to burgeoning smart applications in a variety of use scenarios including factories, power plants, traffic control, data centers and electric vehicles (EV). When business owners attempt to incorporate smart applications, they often face challenges and have to purchase all kinds of software and hardware systems in order to meet their needs for control, gateway and visualization capabilities. These systems add to upfront costs, occupy spaces, impose integration challenges and burden maintenance staff.As a leading edge computing solution provider, ADLINK brings cross-sector integration creativity into full play and launches the market's first all-in-one (control/gateway/display) HMI device, named the PanKonix HMI panel PC series. Available in 10-inch, 15-inch and 21-inch models, the PanKonix panel PCs are all based on Intel Core i processors to deliver the computing power that distinguishes them from conventional HMI devices.According to Simon You, Director of Smart Machine Division, ADLINK, the HMI market can be divided into small-, medium- and large-size segments. The small-size segment primarily includes 4.5-inch, 7-inch and 10-inch devices. The medium-size segment primarily includes 12-inch, 15-inch and 18-inch devices. The two are often used in machine automation (MA) application scenarios for PLC and IO module controls. Their uses may further include data access and acquisition, edge analysis, cloud data transfer and IIoT. Large-size HMI devices primarily come in 21-inch, 23-inch and 27-inch dimensions and are generally used in the control room or on the factory floor as visual display units. They are more for factory automation (FA) applications. Available in various sizes, PanKonix meets a complete range of MA and FA needs.The HMI panel PC eliminates the need for IoT gateways and costly motion control PLC modulesConventional HMI devices are for the most part used to control PLC modules. PanKonix has more than 300 built-in PLC drivers to not only meet basic PLC control needs but also feature better compatibility than conventional HMI devices. The use of just one PanKonix touch panel PC can accommodate all types of PLC modules. On top of that, PanKonix integrates ADLINK's exclusive SuperCAT (software-defined EtherCAT) motion controller, which controls traditional PLC modules as well as EtherCAT motors and IO modules.You notes that PLC modules and HMI devices have been standard equipment on factory production lines. However, with growing AIoT needs, gateways are being added onto production machines for data acquisition and visual display. As gateways are also PC-based, why not add gateways to the panel PC? This gave rise to PanKonix's first and foremost feature – eliminating gateways. By supporting Modbus RTU and Modbus TCP/IP on the OT side as well as OPC UA, MQTT and RESTful API on the IT side, PanKonix satisfies every need, whether it's for IoT data collection, visualization or cloud upload, making it an extremely cost-effective integrated solution."Another highlight of PanKonix is that it eliminates motion control PLC modules as well," says You. Featuring software-defined PLC and motion control with very user-friendly designs, PanKonix enables IT engineers unfamiliar with OT to easily use IT languages to do PLC programming while allowing OT engineers unfamiliar with IT to make use of No Code/Low Code environments to complete IoT programs for data transfer. This means companies can leverage their existing IT/OT teams to realize their digital transformation and build up their competitive edge.Harnessing the power of SuperCAT to break the IT/OT barrierPanKonix boasts many features from the hardware design perspective. Based on AUO IP65 panels, PanKonix is built with slim-bezel capacitive touch screens featuring world-class color saturation to present a chic feel. Compared to traditional HMI devices with resistive touch screens, PanKonix enables superior touch control user experience.Furthermore, PanKonix comes with built-in GUI-based control software that is simple and easy to use and highlights the "no code" feature. Developers can intuitively drag and drop icons or fill out forms and charts to effortlessly link HMI programs to IP addresses of PLC modules, inverters, motors or other devices and enable monitoring capabilities in a snap. The GUI-based control software provides a vector graphics library, allowing users to resize the graphics without distortion. Even if users switch to screens of different sizes, there is no need to redesign the UI. Companies that originally operate in PC-based development environments can leverage PanKonix's GUI-based control software to overcome the HMI development barrier and easily design a premium-quality HMI, helping them meet their customer needs more swiftly. In view of ADLINK's 25-year experience in motion control R&D, the market has high hopes for PanKonix's built-in SuperCAT software. According to You, SuperCAT replaces the physical card, thus enabling controller miniaturization while supporting the control of a greater number of axes and IO points. Moreover, users can control most devices on the market with standard EtherCAT buses instead of PLC. This frees users from the reliance on a single brand that controls the price and delivery schedule. With SuperCAT's API support, IT engineers can effortlessly create OT control programs without spending time learning PLC programming.SuperCAT supports 125μs EtherCAT control cycle, doubling from the previous-generation traditional motion control cards. The number of synchronized axes has also increased from 64 to 128. These are the top-rated spec in the industry today. Also featuring IEC 61131-9 support, SuperCAT enables factories to collect the operation time of sensors or main equipment components, allowing factories to accelerate preventive maintenance implementations.With these features, PanKonix has grabbed the attention from users that were relying on MA applications (such as electronics manufacturers) after its launch. This also broadens PanKonix's applications in scenarios where ADLINK rarely set foot in. For example, data centers use PanKonix to monitor operation environment parameters. Machinery factories use PanKonix to add state monitoring capabilities to their products. Large power plants and traffic control centers use PanKonix for remote equipment monitoring. Electric Vehicle charging stations use PanKonix to keep an eye on the battery status on all their charging equipment. With its applications extending far beyond where existing HMI devices are used, PanKonix is bringing unlimited HMI possibilities.According to Simon You, the PanKonix panel PCs are all based on Intel Core i processors to deliver the computing power that distinguishes them from conventional HMI devices.PanKonix integrates ADLINK's exclusive SuperCAT (software-defined EtherCAT) motion controller, which controls traditional PLC modules as well as EtherCAT motors and IO modules.

STAr Technologies, a leading manufacturer of semiconductor test probe cards, unveiled the new 3D/2.5D MEMS micro-cantilever probe card for WAT reliability testing. The Virgo-Prima Series probe card is designed and delivered for nanometer technology node process with extent performance beyond any known solutions in the test industry market.STAr has been devoted to MEMS probe technology development for years and continuously unveils advanced test probe cards to meet various industry test requirements. The Virgo-Prima Series is specifically designed for minification process-ICs and is an ideal integrated probe card solution for End-of-Line WAT/E-Tests, In-line/process Parametric/E-tests, and reliability tests including HCI, TDDB, EM, etc.With excellent physical characteristics, Virgo-Prima 3D/2.5D MEMS probes enable enhanced test efficiency. The low parasitic LC, low leakage current, and higher stability at wide operating temperatures range from -40°C to 200°C enable Virgo-Prima to enhance test efficiency with reliable measurement results. In addition, advantages such as small scrub, fewer particles, good alignment, and better probe mark will exactly reduce the test maintenance cost to industry customers.Dr. Choon-Leong Lou, CEO & CTO of STAr Technologies commented: "Advanced node technology is increasing the requirement for cost-effective test solutions at wafer level acceptance tests. STAr Virgo-Prima MEMS probe card is designed to correspond to rapid application development and integrated key capabilities to deliver greater value and test performance to our customers."STAr Technologies unveils 3D/2.5D MEMS probe card for reliability test

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications. GLink 2.3LL die-to-die interface provides best-in-class power, performance, and area (PPA) with 5ns end-to-end latency, 5Tbps/mm beach-front (2.5T full-duplex) and 0.27pJ/bit power efficiency. The test chip is taped out at the TSMC 3nm process and adopts the TSMC CoWoS advanced packaging technology.GUC's HBM3 Controller and PHY IPs are available at TSMC's 7nm and 5nm process nodes supporting both CoWoS-S and CoWoS-R technologies. The IPs were validated with both SK hynix and Samsung HBM3 memories GUC's HBM3 Controller demonstrated higher than 90% bandwidth utilization at random access.GLink 2.3LL supports TSMC's InFO_oS and CoWoS-S/R technologies. It had already been silicon-validated at TSMC's 5nm process node. GUC provides full AXI, CXS, and CHI bus bridges with configurable parameters using the GLink 2.3LL physical interface. The GLink 2.3LL I/Os' high cross-talk tolerance allows CoWoS/InFO unshielded routing, effectively doubling the number of signal traces of the interposer or RDL.Both HBM and GLink have integrated proteanTecs' interconnect monitoring solution to provide high visibility for testing and characterizing the PHY, and to enhance the end-product with in-field performance and reliability observability. With this tape out at 3nm, the GLink/HBM IP portfolio is now available in TSMC's 7nm, 5nm and 3nm technologies, which have been adopted by AI/HPC/Networking clients in their products."We are proud to be the world's first company to tape out an 8.6Gbps HBM3 controller and PHY IP as well as the most efficient die-to-die interface GLink 2.3LL at 3nm technology," said Dr. Sean Tai, president of GUC. "We have now established a complete 2.5D/3D chiplet IP portfolio for advanced technology up to 3nm. Together with design expertise, package design, electrical and thermal simulations, DFT and production testing on TSMC 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies including TSMC-SoIC, CoWoS, and InFO, we provide cutting edge solutions to our customers and assist them to achieve even greater success in their products and businesses.""We keep delivering best-in-class die-to-die interfaces enabling a chiplet revolution. Our IPs span through all TSMC's advanced process and 3DFabric technologies. Convergence of 2.5D and 3D packaging using HBM3, GLink-2.5D/UCIe and GLink-3D interfaces enables highly modular, chiplet-based, much bigger than reticle size processors of the future," said Igor Elkanovich, CTO of GUC.To learn more about GUC's HBM3/2E, GLink-2.5D/3D IP portfolio, and InFO/CoWoS/3DIC total solution, please contact your GUC sales representative directly or email guc_sales@guc-asic.comSource: Company

As the COVID-19 pandemic that swept the world in 2020 comes to an end, the food and beverage retail industry is seeking ways to adapt in response to its profound impact. In addition to the necessity to survive, the industry also must explore fresh business opportunities and enhance its competitiveness. Leveraging its extensive experience in retail equipment and technology, DataVan (3521.TWO) provides a comprehensive range of products and services to empower clients to strengthen their competitive edge and successfully navigate through transformation.Improving Governance and Encouraging Innovation for Sustainable SuccessAs the post-pandemic era commences, Roland Chang, General Manager of DataVan, remains cautiously confident despite the market challenges predicted for the year. In addition to introducing a series of new and innovative products at EuroShop, the world's leading retail trade fair, DataVan will fortify its internal and external operational efficiency to foster mutually beneficial relationships with its clients.Chang elaborated that DataVan will prioritize three key areas in terms of internal corporate governance and operations this year. Firstly, the company will enhance its corporate governance by ensuring that management operates the company in the best interests of shareholders, while employees comply with the company's rules and standards of discipline. The objective is to establish a robust and effective corporate governance system that is compliant with legal requirements.Secondly, DataVan will strive to enhance its business execution. By promoting a "performance-oriented" culture, the company will establish clear and quantifiable business execution goals and KPIs for all employees, from individuals to entire departments. Additionally, the company will require its back office to provide full support to the sales department in achieving annual performance goals.Thirdly, DataVan will encourage employees to be more creative. Chang highlighted that the spirit of innovation has been an integral part of DataVan's DNA since its establishment in 1986. As such, all employees across departments, including R&D, sales, production, and back office, must be more innovative in their respective roles to drive the company's growth and development.Creating Operational Strategy through Product Innovation, Software and Hardware Integration, and Market ActivationChang has identified three key areas for the company's external operational strategy: product innovation, software and hardware integration, and market activation. In the area of product innovation, DataVan is adapting to new business models and changing demand in the food and beverage industry following the pandemic. To address the needs of delivery stores with limited space, DataVan has developed a new multifunctional POS terminal that is highly flexible and cost-effective. This new solution will be launched in the second quarter of this year and unveiled at upcoming COMPUTEX.In addition to product innovation, DataVan is placing significant emphasis on software and hardware integration this year. Chang has highlighted DataVan's extensive experience in hardware manufacturing and sales, which will serve as a foundation for introducing new technologies such as AI and IoT, and enhancing the integration of software and hardware. The aim is to develop comprehensive service solutions that enable stores to implement smart operations and management scenarios, while utilizing new retail automation equipment to expand into new consumer markets. These innovative technologies have the potential to address the current labor shortage while also fostering new business models.DataVan's third priority is to solidify its position in established markets while also entering new ones. With COVID-19 restrictions easing, DataVan plans to reconnect with its European partners to extend its reach to more local clients, strengthen the DataVan brand reputation in the European market, and introduce platform-upgraded POS terminals and new products. Additionally, DataVan aims to expand into markets where it has been less active in the past, such as Japan, Southeast Asia, the Greater China region, and other regions. This year, the company will actively evaluate the entire East Asian market, expand local client contacts, and increase product visibility through marketing campaigns, all in an effort to secure additional business opportunities.Chang confirmed that the above-mentioned strategies are already in motion. At the recent EuroShop, DataVan unveiled several new high-performance POS terminal models with platform upgrades. These terminals are integrated with DataVan Central, an IoT device management platform that meets the demand for remote management of multiple POS terminals. DataVan also showcased innovative software and hardware integrated solutions, including MenuSync, which uses AI image recognition for menu recognition, and a smart beer dispenser that can pour beer automatically while maintaining a consistent foam level in every glass. These products gained significant attention from buyers at EuroShop.Smart Deployment and Internal TransformationChang also indicated the significance of smart technologies in DataVan's progress, as evidenced by this year's strategy deployment and marketing efforts. The food and beverage retail industry, being a rapidly evolving sector, necessitates flexible solutions that can adapt to market shifts, decrease operating costs, and enhance operational management efficiency. With the software and hardware integration advantage, DataVan strives to provide smart retail solutions that align with these requirements. Additionally, the company intends to boost client brand loyalty by ensuring a superior user experience.DataVan is not only focused on smart deployment, but also actively pursuing transformation. According to Chang, this transformation will involve the entire company, from employees to R&D, products, and operations. This includes strengthening departmental professionalism, promoting employee expertise, and improving innovation abilities. DataVan is also expanding its product planning by turning creativity into profitability, emphasizing the importance of "commodification," and seeking key opportunities through cross-departmental collaboration to maximize the value of its innovations. Additionally, the company is allocating more R&D resources to software and hardware integration and providing more comprehensive solutions through a "one-stop shopping" service model to further improve the quality of its services.Creating Win-Win Situations with ClientsIn summary, Chang emphasized that DataVan values its strong relationships with clients, and will continue to prioritize honesty and fairness in building solid partnerships based on mutual trust. The company is committed to creating value for its clients through respectful and empathetic interactions, while increasing its own "serviceability" value to become a long-term partner of choice. DataVan is dedicated to working collaboratively with its clients to achieve mutual success and create a virtuous cycle of growth.

Avalue Technology Inc. (stock code: 3479), an embedded industrial PC maker and a Titanium member of the Intel Partner Alliance, is announcing its latest ATX Server Board powered by 4th Gen Intel Xeon Scalable processors with Intel C741 Chipset and IPMI 2.0, supports up to 250W TDP.Dubbed the Avalue HPM-SRSUA, it is the company's server-grade ATX motherboard that supports the Intel 4th Generation Xeon SP Sapphire-Rapids LGA4677 single-socket platform. Applications that can benefit from this latest technology include:Smart manufacturing, for automation and real-time defect detection; healthcare, for image guided therapy and accelerating disease diagnosis; life sciences, for genomics, computational chemistry, and bioinformatics; smart cities, for security, traffic management, and air quality monitoring."Moving to 4th Gen Intel Xeon Scalable processors lets us increase performance considerably for a variety of applications," says Eric Huang, a Senior Manager at Avalue. "Customers can benefit from the industrial standard ATX form factor solution as it minimizes the effort and resources needed to upgrade existing systems, while reducing the time to market."The HPM-SRSUA offers 6x DDR5 4800 RDIMM memory support for up to 1.5 TB featuring 50% faster bandwidth, 4x PCIe 5.0 x16 slots, and 3x PCIe 5.0 x4 slots. It allows up to 4x full-height and double-wide GPGPU cards. The server board increases I/O throughput up to 2.5X as compared to the company's previous generation. Users can easily upgrade as their needs expand.For storage, there are 5x SATA III (6-Gbit/s) ports with RAID functionality, as well as 1xM.2 M-Key slot to support NVMe SSDs. In addition, the interface includes 4x USB 3.2 Gen1, 2x USB 2.0 type A, 1x COM and 1x VGA. Dual 10-GbE Ethernet ports increase the transfer rate between computing nodes and further boost overall performance.Using the baseboard management controller (BMC) and intelligent platform management interface (IPMI2.0), an administrator can access the system remotely 24/7, to adjust startup settings, real-time system health diagnostics, firmware, OS upgrades, and prearranged predictive maintenance.

ThroughTek Co., Ltd. (TUTK), a solution provider of AIoT cloud platform services, has announced its participation in ISC West 2023, a leading security industry trade show in the United States. The event will be held from March 29 to 31 at Venetian Expo in Las Vegas, Nevada. ThroughTek team will be at booth no.34060 to demonstrate its latest Cloud VMS and showcase a series of video surveillance solutions, while giving visitors an introduction to learn how these solutions can benefit their businesses.TUTK Cloud VMS is a cloud-based service platform for video monitoring and event handling. With ThroughTek's SDK plugins and cloud services, it supports seamless data connectivity and video integration with various devices, including IP cameras, NVRs, DVRs, and IoT devices. The Cloud VMS enables users to remotely configure, monitor, perform the smart search, and record videos via the cloud, all while utilizing encrypted transmission for optimal security. Additionally, the Cloud VMS provides flexible user and device groups that simplify video and device management, resulting in a seamless and hassle-free user experience.Additionally, TUTK Cloud VMS integrates AI technology from 3rd party for event processing and offers easy management of videos and devices. It is a perfect choice for brand companies and system integrators seeking an easy-to-implement solution to attract more businesses.ISC West is a comprehensive and converged security trade event in the U.S., and it brings professionals to discuss and explore the latest trends and advancements in the security industry. "We are excited to be exhibiting at ISC West 2023 and to have the opportunity to showcase our latest TUTK Cloud VMS," said Patrick, Kuo, CEO of ThroughTek." Our Cloud VMS has earned recognition from one of Taiwan's top telecom service providers (TSPs), and we have signed the MOU with the TSP recently. The TSP is planning to integrate TUTK Cloud VMS with traffic cameras to create a system for technical law enforcement. This system can provide real-time monitoring to crack down on traffic violations and alleviate the burden on traffic police officers in handling accidents. We are excited to showcase TUTK Cloud VMS at the event and share our expertise with attendees. We also look forward to exploring potential collaborations with interested parties to further develop more solutions for vertical markets."The highlights in the exhibition will only show a part of ThroughTek's commitment to leveraging its IoT technologies and cloud-based solutions to support video surveillance applications. ThroughTek will be continuing to enhance its capabilities and provide diversified value-added solutions.ThroughTek is ready to unveil latest Cloud VMS at ISC West 2023

The "smartification" trend has led to a revolution in the automobile and motorcycle industry. But after entering the post-pandemic era, the global auto market rapidly shifted. According to statistics from the Taiwan Transportation Vehicle Manufacturers Association (TTVMA), the total output value of Taiwan's auto industry exceeded NT$560 billion in the first three quarters of 2022, with a growth rate as high as 7%, showing that the market is already recovering. Aiming to help Taiwanese automobile and motorcycle manufacturers access the huge business opportunities, TAITRA will hold three exhibitions, TAIPEI AMPA, AUTOTRONICS TAIPEI, and 2035 E-Mobility Taiwan concurrently for the first time. All three exhibitions will show Taiwan's solid domestic automotive ecosystem and its sound technical capabilities. Also important to note is that, in addition to the physical exhibition at the Taipei Nangang Exhibition Center (TaiNEX 1), held from April 12 - 15 this year, there will also be online exhibitions and various OMO marketing activities, altogether providing a one-stop purchasing platform for the global automobile and motorcycle industry.A solid automotive supply chain demonstrates Taiwan's sound technological capabilitiesTAIPEI AMPA is now entering its 39th year. This professional B2B automobile and motorcycle spare parts exhibition is the fourth largest in the world and the second largest in Asia. Each year, it draws enthusiastic participation from domestic and foreign manufacturers and buyers. Supply and demand are well-matched in its large-scale, diverse product exhibition. Well-known power supply manufacturers have pointed out that the results of their participation were significantly reflected in their companies' turnover. Building on that prosperity, the scale of the three exhibitions has been stepped up this year. With a total of 820 exhibitors and 2,200 booths, the 11 exhibition areas will display Taiwan's OEM and AM aftermarket and other vehicle parts, gas/electric-powered cars and components, automotive electronic components, and C.A.S.E-IoV, self-driving, sharing, and electrification products.2023 TAIPEI AMPA and AUTOTRONICS TAIPEI will gather major manufacturers, including Nan Hoang, Kuo Chuan, Sonar, Coplus, Jscar, Eagle Eyes, and many other top manufacturers. They will be exhibiting a series of innovative products, such as Adaptive Front Lighting (AFS) and Adaptive Driving Beam (ADB) light systems, various lightweight and impact-resistant products, environmentally friendly seats using natural plant fibers, and more. In the field of automotive electronics, components and system manufacturers such as Hon Hai, Cub Elecparts, E-Lead Electronic, JET Opto, Ta Ya, Whetron, and Diptronics will also exhibit the latest trends of EV, IoV (Internet of Vehicle), IVI (In-Vehicle Infotainment) system, and automobile electronics products. This will show Taiwan's strong ICT industry and R&D ability to the world.To enhance the competitiveness of Taiwan's gas/electric-powered motorcycles, 2023 TAIPEI AMPA further expanded the scale of the motorcycle exhibition area. In addition to exhibiting products such as gas-powered vehicles, electric vehicles, motorcycle components, modification accessories, and rider products, it has also planned themed events with large vehicle manufacturers, motorcycle parts manufacturers, and maintenance channel dealers, such as "Streetfighter: Motor Runway." The event is aimed at presenting the solid supply chain and sound R&D and manufacturing capabilities of domestic automobile and motorcycle spare parts manufacturers, and to use this to guide the industry toward technological innovation, to realize goals such as electrification and smartification, and connect with global trends in innovation.2035 E-Mobility Taiwan outlines the blueprint for future vehiclesTaiwan's most influential E-Mobility trade show, 2035 E-mobility Taiwan, will be held from April 12 to 15 at Taipei Nangang Exhibition Center Hall 1, 4th floor. The show features 6 main categories: Electric, Autonomous, Connected, Interaction, Shared, and EVs, showcasing a complete sourcing platform for electric and autonomous vehicle solutions.2035 E-Mobility Taiwan revolves around the two major themes: Drive Smart, Drive Sustainability, bringing together industry players such as Master Transportation, Hotai Motor, mTARC, Zerova, Delta Electronics, Shihlin Electric, Pacific Electric Wire & Cable, Clientron, Advantech, TECO, KST, Gus Technology, Texas Instruments, Smartgreen Solution, and Gigabyte to exhibit electric buses, electric vehicles, battery, motor, ADAS, IoV, infotainment, smart cockpits, and other cutting-edge solutions. The Mobility Taiwan Automotive Research Consortium (mTARC), Ministry of the Interior, and Taiwan Telematics Industry Association will showcase innovative smart mobility solutions.To promote industrial upgrading and accelerate startups' interactions with enterprises, TAITRA and Epoch Foundation jointly organize the "2035 E-Mobility Global Demo Day" startup competition. After 2 rounds of selection, 12 startups are selected from the U.S., Canada, France, UK, Israel, Vietnam, and Taiwan to exhibit in the trade show. They will showcase technologies such as edge AI chip solution, automotive AI, human machine interface, imaging sensor chip, voice-AI technology, autonomous last mile delivery, and repairable battery for bikes and scooters, providing a more convenient and sustainable solutions for the industry.2023 ESG Achievement to enhance green movementIn addition to electrification and smartification, one other topic of focus in the automobile and motorcycle industry in recent years has been ESG. To address this crucial topic, the three major exhibitions are also actively promoting the concept of green management, and showcasing the achievements of domestic industry operators in areas of sustainable development and social participation. In addressing the global trend for ESG, Taiwanese manufacturers have launched a diverse layout and have actively invested in EV technology. While helping mitigate emissions of gas-powered vehicles, they have also initiated R&D in this area. One example is in the recycling and sustainability exhibition area: visitors will see automotive electronic products, battery recycling, battery life extension, and other technologies and materials, as well as various automobile and motorcycle equipment that uses environmentally friendly materials. The exhibition will also have 2023 ESG Achievement activities to promote ESG concepts. Overall, the exhibition aims to work with domestic and foreign automobile and motorcycle manufacturers to move us closer to a sustainable future.As top-level exhibitions in the global automobile and motorcycle industry, TAIPEI AMPA, AUTOTRONICS TAIPEI, and 2035 E-Mobility Taiwan will show a variety of next-gen software and hardware products, both physically and virtually. Also, the concurrent exhibitions will hold a variety of peripheral activities, including 3 international forums, to which it will invite various professionals to analyze industry trends. In addition, there will be expert theme tours, expert lectures, E-Mobility Global Demo Day-PowerUp & MeetUp, one-on-one procurement meetings, and live tours at the exhibition. The event is an excellent one-stop platform for procurement and negotiation for domestic and foreign buyers, helping them take advantage of the plentiful business opportunities created by this new wave of change in the automobile and motorcycle industry.

With over 35 years of experience in electronics R&D as well as manufacturing, Might Electronics, launched a new plant in October 2021, which expanded its production capacity in Taiwan and also introduced the PowerArena AI vision inspection program, powered by the Advantech SKY-6400 industrial GPU server to their motor assembly line.Managing Production Lines With Stopwatches Was Time-Consuming and Much Less EfficientThe company's previous motor assembly line relied on IE engineers conducting regular on-site visits with stopwatches to record the cycle time of each workstation. Due to limited manpower, IE engineers could only record about five cycles at each stop. Furthermore, stopwatch records contained only numbers without visual recordings, making it very difficult to discover the real reason behind excessive completion times, not to mention finding the right solutions.In addition, the manual collection of cycle time data was an enormous burden for IE engineers. It took 1 to 2 working days just to collect data, which then had to be adjusted to confirm the cycle times of each station, leading to troublesome and time-consuming workloads.SolutionMight Electronics introduced the PowerArena AI visual inspection program, which has cameras set up at each workstation to collect images and send them to the Advantech SKY-6400 server for AI analysis. Cycle times can then be calculated instantly by referring to production times and quantities for each workstation and operator.If the cycle time of a workstation shows an abnormality, the system will actively alert the managers to pinpoint the cause, and by replaying images of the abnormal workstation, managers will understand the cause of the abnormality. Ray from Might Electronics stated that "With real-time production line data, Might Electronics can dynamically adjust production line resources, optimize on-site manpower allocation, and ensure that the production line is always in balance. This allows us to improve the overall production performance."Gavin from PowerArena added that, when implementing the PowerArena AI visual inspection program, camera angles were specially adjusted to ensure that the faces of the workers are not recorded as it only focuses on hand movements. The company emphasizes communication to ensure the workers understand the introduction of AI is meant for quality improvement, rather than stricter labor supervision.System Diagram (Advantech)Three Major Features of AI Visual Inspections: Efficiency, Quality, and Comprehensive Production HistoryFirstly, the overall operation efficiency at Might Electronics was improved with the implementation of the AI system. In the past, IE engineers had to establish specific SOPs and countless working hours were spent on trivial tasks in order to collect data. Now, after setting up SOPs and completing disassemblies, engineers can obtain cycle time statistics from a computer. The process is not only faster but also includes larger sample sizes. Now, up to a whole day's data are available to assess each workstation. Furthermore, the time saved by using the AI solution can now be dedicated to planning production line optimizations and other improvements.Second, product quality can be verified. Ray pointed out that for quality control, Might Electronics used to mainly rely on first-article inspection and production end sampling. Since first-article inspections can only be done independently by on-site personnel, uncertainties are inevitable. As the AI records the full processes of each product at each workstation, it will actively notify managers in real time when any abnormalities occur. The new method is similar to treating every product as the first product to be inspected, allowing for much greater control of product quality.Third, a comprehensive production history is established. Thanks to the PowerArena AI visual inspection program, the complete visual records of each assembly operation can be kept. When the quality control staff finds a problem with a product or encounters a customer complaint, Might Electronics can trace it back to the records of the exact assembly operation within the system, confirming which part of the process caused the defect so that improvements can be conducted.Advantech SKY-6400 Offers Both Performance and Scalability to Build a Solid Foundation for AI ApplicationsMight Electronics' success with implementing AI applications in their factories is thanks to PowerArena's AI algorithms and integration capabilities as well as the crucial hardware implementations. "At that time, the hardware envisioned by Might Electronics required good performance, long-term stable operations, and the hope of meeting AI computing demands with just one device. Advantech SKY-6400 was the perfect choice for our needs, and it was also offering the best price-performance ratio." Gavin from PowerArena explained that SKY-6400 is an industrial-grade server that can operate 24-7 with unquestionable operational stability. Furthermore, it is very scalable and can hold multiple additional graphics cards, making it the top choice for Might Electronics' future expansion plans for AI visual inspection applications.For the future, Might Electronics is planning to use AI for SOP analysis. Such a system will require a large number of hardware resources. But with the scalability of Advantech SKY-6400, they will not be required to purchase additional main hardware when launching the system, as simply adding more graphics cards will offer the computing resources needed for SOP AI analysis.Ray emphasized that in response to the trend of smart manufacturing development, Might Electronics has fully adopted the Wi-Fi 6 protocol in the new plant, laying a solid foundation for the introduction of AI applications. In the future, Might Electronics will also consider the possibility of AI applications from the perspective of personnel management and plant safety. The company aspires to accelerate the transition of its plants into intelligent factories, thereby enhancing Might Electronics' competitiveness in the global market.To learn more about the complete case, please fill in your information in the form and we will send the complete case through your mail.

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent thermal dissipation performance. NeoGene Tech's proprietary ultra-thin, two-phase-flow-circulation MagicWick-Inside vapor chamber technology was adopted by Xiaomi 12S Ultra.Just half year later, NeoGene Tech is now unlocking another breakthrough in direct-to-silicon cooling technology to solve the growing ultra-high-power-density semiconductor heat dissipation issues for data centers and cloud computing. The key to such technology is to use both internal and external cooling circulation systems to work together in a single IC package. The silicon chip and PGA substrate are integrated into a high efficiency liquid cooled package module to form a complete IC device.NeoGene Tech tries to redefine high-power IC components, making the IC not only a semiconductor, but also a cooling packed thermal management device. Its core technology adopts a proprietary three-dimensional vapor chamber device with excellent wick structuring and very high efficiency two phase flow circulation. The company named it "NeoGene Cooling Engine." Since pure water has a very high latent heat acting as a working fluid in a vapor chamber, the high-density heat generated by a semiconductor can be dissipated very quickly through the evaporation process at the touched evaporator area, once the design of the wick structure and residual water inside the 3D vapor chamber are optimized."In our IC package approach, the high-power density silicon chip directly contacts the evaporator area of the 3D vapor chamber located outside the heat exchanging chamber. The column shape condenser and the coupled dissipation fins are accommodated inside the heat exchanging chamber that can be filled with a circulating coolant liquid. The heat generated by silicon chip will be efficiently carried away by the circulating liquid accordingly. We call this technology '3D VC Embedded Liquid Cooling,' according to Jeffrey Chen, CEO of NeoGene Tech.By leveraging NeoGene Cooling Engine technology, NeoGene Tech is not only proposing a new approach to IC packaging, but also offering a variety of product solutions for different application scenarios at data centers. "Based on NeoGene Cooling Engine, we plan to provide three types of liquid cooling solutions. First is the NeoGene Liquid Cooler which will be used for packaged IC heat dissipation at 1 U configuration. The second is the Direct-to-Silicon Cooling Package Module, which can be adopted by IC Brands at the packaging level. We will also offer NeoGene Immersion Dissipator, which can be used for immersion cooling auxiliary schemes" said Jeffrey Chen.According to Jeffrey Chen, NeoGene Tech's patented 3D VC embedded liquid cooling technology can not only be widely used for cooling servers in data centers and cloud computing, but also used in cooling IGBT and ADAS modules in electric vehicles. For different application scenarios, the flexible modular design of the cooling engine can meet any power consumption requirements of Multi-Chips-Module (MCM). Combining efficient two-phase flow circulation with liquid flow circulation, ultra-high power density heat can be effectively carried away. The installation is also very simple and cost-effective in different application scenarios.Theoretically, the energy required to evaporate 1g of pure water under the saturated vapor pressure of 40° C is 2405.94 joules, which is equivalent to the heat generated by a 2.4KW semiconductor chip within a second. By properly using the NeoGene Cooling Engine and the liquid cooling circulation technology, once the two-phase flow circulation speed in the NeoGene Cooling Engine is fast enough and the water in the wick structure is replenished in time, even if the TDP of the semiconductor is greater than 1000W, the heat dissipation problem can be effectively solved.The market size of liquid cooling in data centers globally data is estimated to be 1.82 billion US dollars in 2021, and will reach 7.12 billion US dollars by 2028. During the forecast period, it is expected to grow at a compound annual growth rate of 21.5%, according to market research reports.NeoGene unlocks direct-to-silicon liquid cooling technology by novel IC package approach

Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, in cooperation with MediaTek Inc., the leading global fabless chipmaker, to launch the "Fast-to-deploy" one-stop solution for FWA based on the 5G Sub-6GHz module FG370 at MWC Barcelona 2023.The innovative "Fast-to-deploy" 5G FWA solution includes the reference designs of two forms of FWA devices, CPE and MiFi, integrating with Fibocom 5G Sub-6GHz module FG370, significantly simplifying the hardware design of FWA devices and reducing the time to market. Leveraging multiple key features of the latest advanced Wi-Fi 7 technology, the CPE supports tri-band Wi-Fi 7 solution delivers a high throughput and seamless in-home connectivity, while the MiFi supports dual-band Wi-Fi 7 solution brings a reliable and stable network connectivity for mobile hotspot users.It is worth mentioning that the FG370 was firstly-introduced to the market in October 2022, certified by GCF and CE in early January 2023, now it is ready for mass production. By utilizing the powerful quad-core Arm Cortex-A55 CPU on MediaTek's T830, FG370 supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, significantly improves the utilization of spectrum resources and ensures an extended 5G coverage. In addition to new features such as 8RX (Receive Antennas) and Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), FG370 module is capable of delivering maximum 7.01Gbps on the downlink and 2.5Gbps on the uplink."I am very pleased that Fibocom's FG370 5G module has achieved market-entry certifications such as GCF and CE in a short time," said Evan Su, General Manager of Wireless Communications��, MediaTek. "During the MWC Barcelona 2023, we jointly released the "Fast-to-Deploy" 5G FWA solution based on Fibocom FG370, it will help CPE and Mobile hotpot customers to implement the migration from previous generation to the newest platform in a very short term, bringing ultra-fast gigabit experience. In the future, we will expand our cooperation in product development, industry solutions and more, empowering the future with our 5G innovations.""The advent of 5G has bolstered the use of FWA solutions, huge opportunities come with challenges, the utilization of 5G spectrum, the complexity in device design, and the reliability of network connection are the obstacles of FWA roll-out," said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. "By working closely with MediaTek, we have achieved several product milestones ahead of the market. We believed that by launching the reference design for both CPE and MiFi, FWA customers worldwide can upgrade to the latest 5G solution smoothly and easily, significantly reduce the time to market and maximize the ROI."Fibocom will dive deep into the cooperation with MediaTek to launch the mmWave version of FG370 and to introduce the storage separation capability to the module in future generations.Fibocom collaborates with MediaTek to pioneer FWA market with fast-to-deploy 5G solution based on FG370 module at MWC 2023Credit: Company