Asia's largest tech expo COMPUTEX TAIPEI 2023 will raise the curtain at the TaiNEX 1 & 2, from May 30 to June 2 focusing on six major themes: high-performance computing, artificial intelligence application, next-gen connectivity, hyperreality, innovations and startups, and sustainability.MSI, the world's leading PC brand, is all set to tease its latest AIoT innovation and solutions for automotive, industrial, and commercial segments, showcasing eye-catching AMR collaborative robots, EV chargers, compact PCs and rugged tablets made for harsh settings, customized HMI, edge computing systems and more. At the event, MSI will also show off its AIoT strength through a captivating demonstration of an automated EV charging service, poised to steal the spotlight.MSI Automated EV Life service demo at AIoT booth TaiNEX 1#K0616"MSI's next-generation technology, combined with our innovative AIoT system and comprehensive one-stop service, enables us to provide dependable and cost-effective solutions in the fields of automotive, robotics and automation, edge computing, embedded sysmtems, and industrial automation," says MSI Marketing VP, Sam Chern.MSI's AIoT solutions highlights:AMR Collaborative Robot (Cobot) AMR CobotMSI has launched a new generation of algorithms and sensing technology for its ISO 3691-4 standard AMR platform, aimed at advancing the smart factory and smart logistics markets. The platform has been expanded to support Cobots compliant with ISO 10218-1 and ISO 10218-2.Utilizing a dual LiDAR sensing system, the platform achieves robust navigation and localization abilities in environments of various sizes. Moreover, the dual Deep Sensor depth imaging system empowers the precise positioning service content such as P2G, G2P, and D2D. During the event, MSI will demonstrate the automated EV Life service, which utilizes the AMR Cobot to grant automated charging (EVSE) for electric vehicles.MSI has launched a new generation of algorithms and sensing technology for its ISO 3691-4 standard AMR platform, aimed at advancing the smart factory and smart logistics markets.MSI AC Smart EV Charger - EV Life / EV Premium / EV AIEV Life, EV Premium and EV AI, AC smart EV chargers support Type 1 (SAE J1772) and Type 2 (I EC 62196-2) interfaces, and are certified by CNS 15511, UL 2594, and IEC 61851. It supplies a charging power range of 3.2 kW to 13.2 kW via 16A to 60A output current, and can charge standard 80kWh EVs to 50% battery capacity within 3 hours.The MSI EV charger also highlights a simple and stylish all-in-one design with a 7" display for charging status and supports mobile payment and RFID sensing. It has an IP55 rating, allowing for flexible installation, whether as a wall mount or a stand. The MSI EV charger can be used both indoors and outdoors, and is suitable for altitudes up to 3,000 meters.What's more, the EV charger utilizes AI-based smart applications to enhance user experience and streamline maintenance, including charging pay, license plate recognition, and remote management via Ethernet and wireless connections. It also acts as a WiFi Access Point for mobile phones and provides automotive OTA updates, even in unstable network environments.MSI satisfies charging solutions for commercial and residential use. Our commercial solutions are available at city parking lots, attractions, malls, hotels, and rental agencies. For residential use, we offer charging stations for personal garages and resident parking. Our integrated hardware and software solutions cater to the diverse EV charging needs in various fields.MSI will present the most powerful products and solutions for automotive, industrial and commercial sectors through integration of newest technologies including 5G, EV and AI recognition.Fleet Management SolutionMSI supplies rugged tablets, IoT boxes, and AI DVRs for various transportation applications, including commercial trucks, e-scooters, marine, and agriculture. Our solutions allow operators to manage fleets intelligently and efficiently by sending real-time alarms and monitoring driver behavior through facial recognition technology to ensure the driver's safety.Embedded HMI SolutionMSI is proud to introduce its latest smart HMI products for business use. By integrating facial recognition and voice control, our HMI is the perfect solution for coffee machines, treadmill consoles, and access control systems. These customizable solutions not only enhance the user experience but also improve the value of the products. With smart management capabilities, businesses can save on manpower and increase cash flow.MS-C902 Thin Intelligent Embedded PCPowered by Intel Alder Lake-P U-series processors with support for up to 28W TDP, the MS-C902 is packed with features, encomassing four independent displays (two HDMI and two DisplayPort), two 2.5GbE ports, and two storage units. Despite its 29mm-thick and fanless design, the industrial mini PC has ample horsepower to handle a wide variety of tasks, making it ideal for digital signage, kiosks, automation, and AIoT edge computing.MS-98M3 3.5" Single Board Computer Built-in AMR-AI-PJ-UVGI RobotMS-98M3 is the embedded 3.5"/3.5-inch SBC that is capable of multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series. This processor is designed to be both highly performant and ultra-low power, shaping the mini PC reliable and durable. The MS-98M3 is employed in numerous fields, for instance, MSI's Texcell-certified AMR-AI-PJ-UVGI Robot.1A71: The Slim Panel PC That Can Withstand Harsh Industrial EnvironmentsEquipped with latest Intel Alder Lake-N solution, 1A71 is a thin panel PC built to last in harsh settings such as factory, production areas and dusty manufacturing environments. Featuring an IP65 rated front panel and IP41 rated rear cover, 1A71 is a fanless design protects the internal components from dust damage.Besides, 1A71 comes with an abundance I/O including 4x USB 3.1, 2x USB 2.0, 2x GbE ports, and 3x COMs, gives flexible connectivity options for a range of industrial applications. The 1A71 also has an optional internal backup battery that lasts up to 1 hour in case of power outages. Dual storage support offers both HDD and system storage options, and the durable lean panel PC is available in sizes ranging from 10" to 21.5" (10"/12"/15"/15.6"/21.5") to to accommodate various kinds of applications namely automation, manufacturing, transportation, logistics, retails & hospitality.MSI's Rugged Tablet - The Ultimate Mobile Solution for Industrial ApplicationsMSI unveils a new range of rugged tablets that have been crafted to resist harsh conditions in industrial sites, like automotive, warehouse, and logistics. With a build that can withstand shock, vibration, and extreme temperatures, the tablet promises durability and reliability. MSI has also developed a range of accessories that can be used in car maintenance, factory automation, and mobile POS applications, making the tablets even more versatile.ND91 is MSI's lastest sleek and lightweight rugged tablet. It comes equipped with cutting-edge WiFi 6 technology, rendering the tablet prime option for indoor usage, such as in retail or storage facilities. On the other hand, ND55 is a reliable partner for outdoor and field service users, thanks to its high battery capacity, which can support up to 16 hours of usage. Additionally, it features sunlight-readable display and hot-swappable battery for high dependability. Among the models that stood out, the 10.1" tablet ND62 boasts a tough yet compact design, making it the best choice for businesses seeking a durable computing solution without compromising on portability. Stay tuned for more updates on this exciting up-to-date development from MSI's rugged tablet and accessories at https://ruggedtablet.msi.com/

Organizations of all sizes are increasingly falling victim to ransomware attacks and inadequately protecting against this rising cyberthreat. According to new data in the Veeam 2023 Ransomware Trends Report, one in seven organizations will see almost all (>80%) data affected as a result of a ransomware attack – pointing to a significant gap in protection.Veeam Software, the leader in Data Protection and Ransomware Recovery, found that attackers almost always (93%+) target backups during cyber-attacks and are successful in debilitating their victims' ability to recover in 75% of those events, reinforcing the criticality of immutability and air gapping to ensure backup repositories are protected.The Veeam 2023 Ransomware Trends Report shares insights from 1,200 impacted organizations and nearly 3,000 cyber-attacks, making it one of the largest reports of its kind. The survey examines key takeaways from these incidents, their impact on IT environments and the steps taken, or needed, to implement data protection strategies that ensure business resiliency. This research report encompasses four different roles involved in cyber-preparedness and/or mitigation including, security professionals, CISOs or similar IT executives, IT Operations generalists, and backup administrators."The report shows that today it's not about IF your organization will be the target of a cyber-attack, but how often. Although security and prevention remain important, it's critical that every organization focuses on how rapidly they can recover by making their organization more resilient," said Danny Allan, CTO at Veeam. "We need to focus on effective ransomware preparedness by focusing on the basics, including strong security measures and testing both original data and backups, ensuring survivability of the backup solutions, and ensuring alignment across the backup and cyber teams for a unified stance."Paying the ransom does not ensure recoverabilityFor the second year in a row, the majority (80%) of the organizations surveyed paid the ransom to end an attack and recover data – now up 4% compared to the year prior – despite 41% of organizations having a "Do-Not-Pay" policy on ransomware. Still, while 59% paid the ransom and were able to recover data, 21% paid the ransom yet still didn't get their data back from the cyber criminals. Additionally, only 16% of organizations avoided paying ransom because they were able to recover from backups. Sadly, the global statistic of organizations able to recover data themselves without paying ransom is down from 19% in last year's survey.To avoid paying ransom, your backups must surviveFollowing a ransomware attack, IT leaders have two choices: pay the ransom or restore-from-backup. As far as recovery goes, the research reveals that in almost all (93%) cyber-events, criminals attempt to attack the backup repositories, resulting in 75% losing at least some of their backup repositories during the attack, and more than one-third (39%) of backup repositories being completely lost.By attacking the backup solution, attackers remove the option of recovery and essentially force paying the ransom. While best practices – such as securing backup credentials, automating cyber detection scans of backups, and auto verifying that backups are restorable – are beneficial to protect against attacks, the key tactic is to ensure that the backup repositories cannot be deleted or corrupted. To do so, organizations must focus on immutability. The good news is that based on lessons learned from those who had been victims – 82% use immutable clouds, 64% use immutable disks, and only 2% of organizations do not have immutability in at least one tier of their backup solution.Do not re-infect during recovery When respondents were asked how they ensure that data is 'clean' during restoration, 44% of respondents complete some form of isolated-staging to re-scan data from backup repositories prior to reintroduction into the production environment. Unfortunately, that means that the majority (56%) of organizations run the risk of re-infecting the production environment by not having a means to ensure clean data during recovery. This is why it is important to thoroughly scan data during the recovery process.Other key findings from the Veeam 2023 Ransomware Trends Report include:Cyber-insurance is becoming too expensive: 21% of organizations stated that ransomware is now specifically excluded from their policies, and those with cyber insurance saw changes in their last policy renewals: 74% saw increased premiums, 43% saw increased deductibles, 10% saw coverage benefits reduced. Incident response playbooks depend on backup: 87% of organizations have a risk management program that drives their security roadmap, yet only 35% believe their program is working well, while 52% are seeking to improve their situation, and 13% do not yet have an established program. Findings reveal the most common elements of the 'playbook' in preparation against a cyberattack are clean backup copies and recurring verification that the backups are recoverable. Organizational alignment continues to suffer: While many organizations may deem ransomware to be a disaster and therefore include cyberattacks within their Business Continuity or Disaster Recovery (BC/DR) planning, 60% of organizations say they still need significant improvement or complete overhauls between their backup and cyber teams to be prepared for this scenario.The full Veeam 2023 Ransomware Trends Report is available for download at https://www.veeam.com/ransomware-trends-report-2023, and as part of sessions at VeeamON 2023, the community event for data recovery experts, taking place online May 22-24 and in person in Miami, Fla. Designed by and built for the backup and recovery professional, attendees will expand their skills, learn how to protect their businesses from ransomware, and share industry knowledge with exclusive content from Microsoft, AWS, Hewlett Packard Enterprise and more. Registration for the in-person event and the virtual option is now open.New Veeam research finds 93% of cyber attacks target backup storage to force ransom payment

Avalue Technology Inc. (TAIEX: 3479-TW), a global industrial PC solutions provider and a Titanium member of the Intel Internet of Things Solutions Alliance, is committed to providing a complete range of smart retail, smart healthcare, smart manufacturing, smart transportation, and embedded solutions. Avalue recently introduced the ARC-1738, a fanless multi-touch panel PC with rugged design, suitable for various industrial automation applications, human-machine interface applications, and self-service kiosks.The ARC-1738 is a multi-touch panel pc with a full-flat front panel design, featuring the Intel 11th Generation Tiger Lake U Core i5/i3 processor platform, with a maximum TDP of up to 15W. The Intel 11th generation Tiger Lake U processor is a product designed for the non-embedded market and specifically for IoT-related applications. The "U" stands for ultra-low voltage design, which is used in embedded products. In addition to low power consumption performance and excellent system processing performance, it also brings higher graphics processing capability, better AI acceleration, and efficient power management, to provide users with a faster, smoother, more efficient, and cost-effective product experience.The ARC-1738 is designed with a fanless structure, which reduces operating noise and maintenance requirements. The front panel adopts a full-flat die-casting process and 7H hardness surface glass with a projected capacitive touch panel (PCAP) touch function, supporting 10- points multiple-touch even with rubber gloves, providing a smoother and more intuitive user experience. The back of the device is made of aluminum with a beautiful design, ensuring durability, reliability, and ease of maintenance, suitable for various applications in industrial environment.In terms of specifications, the ARC-1738 supports up to 64GB 32GB 3200MHz DDR4 memory and provides a rich and diverse I/O port with high flexibility for expansion, including 2 x Display Port, 4 x USB3.2 Gen2, and 3 x COM ports. It also provides optional 3 x COM/GPIO/USB. In addition, to meet the needs of the IoT applications, it also provides 1 x 2.5G LAN, 1 x Gigabit LAN, 2 x Antenna for Wi-Fi 6/BT (optional), 4 x Antenna for 5G (optional) for high-speed transmission providing faster speeds, lower latency, and higher device density. For data storage, it provides 1 x SATA III 2.5-inch storage space and 1 x M.2 Key-B, 1 x M.2 Key-E expansion slot, increasing the reliability and flexibility of operation for the ARC-1738 in harsh environments.Main features of ARC-1738Details17" Advanced Rugged panel PC10 points multiple PCAP touchOnboard Tiger Lake U 11th Intel Core SoC i5/i3 BGA Processor2 x 260-pin DDR4 3200 MHz SO-DIMM socket, supports up to 64GB Max2 x LAN, 4 x USB3.2 Gen23 x USB2.0 (optional)1 x RS232/422/ 485, 2 x RS232(default)3 x RS232/GPIO/USB2.0 (optional)Wi-Fi & BT (optional)Front Panel IP65TPM 2.0Windows 10/11 IoT/ Linux SupportARC-1738 fanless rugged panel PC

Semiconductor manufacturing company Fusion Worldwide clinched the Supply Chain category win at the recently held SBR International Business Awards for its proprietary data tool Scout RMS.Being the premier open-market distributor of electronic components and finished products, Fusion Worldwide has served as an integral link in customers' supply chains, solving both short-term challenges and providing long-term support. It offers comprehensive solutions for customers across numerous verticals including computing, IT infrastructure, automotive, consumer electronics, and medical, amongst others.The company's commitment to technological innovation led to the development of Scout RMS, a tool that helps its sourcing team to constantly monitor the electronic component and finished product markets. Such function ensures a data-driven approach to all facets of supply chain management, from enhancing sourcing capabilities for the electronics component market to servicing the semiconductor value chain.The proactive, engineering-based management of the Scout RMS means customers always have sufficient stock levels based on business conditions and needs. Data-driven above all else, Fusion can perform a root cause analysis on any shortage that occurs and provide customers with data that can help their organization accurately forecast supply and demand.Using Scout RMS enables a supply chain management strategy or vendor-managed inventory (VMI) to improve supply chain efficiency and visibility, reducing costs and increasing customer satisfaction. Whilst the benefits of VMI have been relevant for years, inventory management providers and manufacturers still struggle to identify the return on investment (ROI) associated with VMI programs.In many cases, the true ROI of inventory management gets lost in the confusion of delivery schedules, efficiency improvements, shortages, overstock, moving parts, and quality, amongst others. This results in the hesitation of manufacturers to implement a program.One of the customers of Fusion is a major embedded computer Original Direct Manufacturer (ODM) that was scaling up its sales activities, and recently completed several strategic acquisitions to capture more market share. The result was its supply chain becoming very complex, including difficulty with forecasting, and keeping the right levels of inventory in stock.Through the use of the Scout RMS system, Fusion worked closely with the ODM's supply chain team to obtain a detailed consumption file including high runners, constrained brands and references, forecasted usage, and the potential value of the inventory. A deep dive into ordering and distribution processes were also required to come up with an effective customized VMI solution.This allowed the ODM to focus on growth rather than being slowed down by its supply chain challenges, resulting in improved cash flow, optimized logistic processes, and significantly reduced administrative and inventory costs. The ODM was very pleased with the company's ability to tailor its services to the former's challenges and objectives.SBR International Business Awards honors foreign companies in Singapore and recognizes the outstanding projects that successfully earned them a foothold in the city-state.

As most nations worldwide bid farewell to the pandemic, Computex will make its post-pandemic debut this May 30. MEAN WELL, a world-leading standard power supply manufacturer will exhibit its latest innovations this year after a long absence since 2019.The family of solutions under active promotion includes major products such as its 3+N System Power Supply Solutions, DC High-voltage Centralized Power Supply Lighting Solutions, Security Monitoring Power Supply, and Power Supply Series Dedicated to Harsh Environments.MEAN WELL's power supply solutions are able to satisfy all kinds of demand from eco-friendly, IT and industrial automation applicationsFirst, the 3+N system power solutions from MEAN WELL can solve customers' problems by integrating power and smart control systems. The "3" in the 3+N solution refers to rack-mounted, modular, and system power supplies, while "N" refers to other products and controllers from MEAN WELL. MEAN WELL can integrate various elements into a cabinet according to customer needs. That means customers can easily control and monitor in whatever way they need.Integrating power supply with the control system to enhance digital, smart servicesMEAN WELL's rack-mounted products come mainly in two categories: system power supply and energy recycling. For system power supply, MEAN WELL will exhibit its iconic NCP-3200 series. This series can be used directly with MEAN WELL's Multi-Industry General-purpose Smart Controller CMU2. The NCP-3200 series incorporates 19-inch rack cabinets in parallel to provide up to 128kW smart cabinets. Or, the user can stack each cabinet in parallel to form a system power supply or charger with an even larger wattage for use with various power electronics, IC products, or energy system user equipment.MEAN WELL's system power solution integrates ultra-high power output with power management functions for use in ultra-high power consumption scenarios such as in communication and IT equipment, EV charging, and industrial automationFor energy recycling products, MEAN WELL currently provides DC to AC and bidirectional power conversion products, suitable for testing related equipment and applications for front-end manufacturing, production power, or batteries; other uses include end-user products, charging piles, energy storage systems (ESS), and various end-customer energy applications.Tony Hsieh, Section Manager of MEAN WELL's Technical Service Center, emphasized: "We can combine different power supplies, cabinets, and accessories to fit customer needs. And with PowerNex products, we can create the most suitable solutions for our customers." MEAN WELL integrates the resources of its group to provide customers with more flexible services. Also worth mentioning is the completion of MEAN WELL SuZhou Intelligent Campus, which can handle customer system verification and safety testing.Overall, MEAN WELL aims to transform customers' needs into standard models, thereby ensuring the stability and repeatability of services. This also helps better meet the price needs of small and medium-sized enterprises (SMEs).DC power supply and unique power supply for harsh environments, helping customers meet a variety of needsMEAN WELL, long committed to promoting DC high-voltage centralized power supply lighting, will exhibit its DALI-2 digital lighting control solution. The front end stage of this solution uses a 380V DC high-voltage power supply for centralized power supply, and the back end uses a DC-to-DC LED driver, greatly reducing the number of power supply device parts required. In contrast, the lamps' high-voltage series connection reduces power conversion loss. "This solution greatly simplifies system installation while reducing the need for wiring. This is particularly important in markets where labor costs steadily increase," Rex Lin, Product Manager of MEAN WELL's Product Strategy Center, explained.In addition, MEAN WELL also provides dedicated power supply products in its HEP series, which is especially designed for harsh outdoor environments. This series is waterproof and dustproof, rated at IP67, can withstand 10G of shock, and boasts a fanless design, instead adopting natural heat dissipation with its aluminum extruded shell. It is suitable for use with various outdoor industrial and communication equipment. Also, it provides multiple digital communications functions, which can be integrated into the HMI for control over a system.MEAN WELL launched its HEP 1000 series to address power needs for 5G small base station equipment and 5G mobile base stations. As the wattage requirements in power supplies for the new generation of base stations increased to over 2000 watts, MEAN WELL also launched the HEP-2300 series. The HEP-2300 series includes four output voltages, 55V, 115V, 230V, and 380V. The series is not limited to base stations but can also be used for many outdoor displays.New security monitoring power supply series drastically cuts system optimization costsTo address the demand for Security monitoring power supply, MEAN WELL devised highly integrated products to meet customer expectations. Frank Chen, Product Manager of MEAN WELL's Product Strategy Center, pointed out, "In the past, security monitoring customers only had the option of products that solely supplied power. Other functions need to be added by the customer separately. But it is different now. We have launched a new product series for the security monitoring field that integrates alarms, control logic, charging, battery backup, fire and emergency lighting, and central monitoring into a dedicated power solution. On top of that, product design complies with the regulations, so customers do not need to make additional modifications. These solutions can be introduced and put to use right away, which drastically brings down the costs of system optimization."MEAN WELL will exhibit its DRS-480 series (480W DIN Rail Type All-in-One Intelligent Security Power Supply), which complies with the safety regulations of security control and fire safety systems (EN54-4/ UL2524/GB17945). Its most significant feature is that it integrates a DC voltage power supply, battery charging, DC-UPS, and communications monitoring, all in one unibody design.MEAN WELL has been a leader in the standard power supply industry for many years, always staying ahead of the curve when it comes to industry trends, continuously making it a priority to consistently enhance the functionality and integration of the products to meet the unique needs of our customers.To discover more about the highlighted items, visit MEAN WELL Computex exhibit, K0204. Our team is readily available to address any inquiries you may have.

Wincomm Corp. welcomes your visit to Wincomm at Booth No. K1125a during Computex Taipei, on Mar 30 to June 2, 2023 at Nangang Exhibition Center Hall 1F, in Taipei, Taiwan.In 2023, Wincomm invites all our business partners and industrial decision makers to empower Industrial & Medical Computing Solutions including medical grade, food grade, full IP waterproof and explosion-proof grade ePlatforms, and to build IIoT to AIoT infrastructures together.Healthy Life from EMR, AI in Surgery and Seamless Integration for Smart Hospital Wincomm medical panel PC has proof its design value with excellent design for years. In 2023, we are pleased to announce brand-new series entering the up-front design from mobile medical cart AIO, WMP-22P/24P series, point of care traditional selection, WMP-15J/19J series, powerful medical AI panel pc, WMP-24K series and new box pc, WPC-789, and medical OR pc, WMP-22T/24T-PIS series, featuring on excellent power management, high computing power up to Intel 12th generation Alder Lake Core i, and fan-less solutions. With remote management IoT API platform, it is ready for most e-Healthcare solution makers to build infrastructure as best edge computing solutions. Besides, Imedtec, a leading innovative solutions provider that empowered by AIOT in medical industry, now released Telehealth Solution integrated with Wincomm medical cart AIO pc series, which combines patient information, video and vital signs data into a single platform, making it easier to have virtual consultations with various specialists and to provide timely, specialized care to patients.Better Life from Full Waterproof/Dustproof and Explosionproof HMI for Hygienic FactoryDedicated on highest quality industrial panel PC innovation, the Wincomm stainless panel PC series have granted full IP waterproof testing, 100% dustproof guarantee, wider temperature up to -20 to 60 degree C in shelf, sunlight readable and new explosionproof series for outdoor, food, extremely rugged environment applications. Ranging from Intel Celeron Processor J Series (code name: Elkhart Lake), WTP-8J66 series, low power solution, and up to 12th Generation Intel Core i5 Processors (code name: Alder Lake), WTP-9H66 series, high computing power solution, with 15", 19" and 22" panel size for selection. For IP66 front panel PC for various industrial applications, we demonstrate WLP-7J20 series with Intel Celeron Processor J Series (code name: Elkhart Lake) and WLP-7H20 series with12th Generation Intel Core i5 Processors offering 10.1", 10.4", 15", 15.6", 19", and 22" for selection. Enable with intelligent innovated management for power versus computing best utility and wireless remote device management system, Wincomm is proud to announce best solutions to build IIoT application toward better life.Welcome to Visit Wincomm Booth No. K1125a at Computex 2023

Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company's focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions for ensuring higher efficiency and lower manufacturing cost.Manz has built the industrial largest 700 x 700 mm process area FOPLP redistribution layer (RDL) production lines. Combined with this work, the company provides Total Fab planning from customized process development, equipment construction to the integration of upstream and downstream manufacturing production lines. The full range of service helps automotive chipmakers facing the critical technological challenges of fine-pitch copper line formation in redistribution layers of FOPLP process. These innovative solutions satisfy the demand for high production yields, excellent Cu-plating uniformity, and high-density packages to deliver high performance power management ICs for electric vehicles. With our full strength to drive FOPLP production solutions forward, we assist customers to pursue breakthrough production methodology as well as ESG targets by increasing energy efficiency, and waste reduction.Despite semiconductor market showing slowdown in 2023, automotive IC sector looks to sustain the strong growth. According to Prismark, Advanced Driver-Assistance Systems (ADAS) and electric powertrain systems both have expected to grow at CAGR of 13% and 18% from 2022 to 2027, respectively. In the past two-year, the automotive semiconductor market has experienced silicon chips shortage, IC substrates capacity constraints and the packaging material cost rising. Facing the new normal of post pandemic and geopolitical instability, the IDMs, OSAT, IC Substrates and PCB makers aggressively turn to lower cost and high Interconnect innovation for a novel boosting of scale. FOPLP gets attractive because it could save IC substrate usage, reach the design of fine-pitch patterning, meet the requirements of high electric conductivity, and improve high heat dissipation.FOPLP increases the performance of PMICs.Electric vehicle architectures are rapidly evolving to accommodate high power density devices, multiple power electronics and controller ICs. The RDL technology provides high density of fine pitch metal interconnects that redistribute the I/O access to integrate multiple dies into one single package. With the line width and spacing (L/S) specification of 5/5µm ranges, Manz RDL production solutions enable a significant reduction in thickness, weight, and manufacturing costs of the packaging while performing complex pattering and complicated layers design to satisfy high density packaging requirements.Build FOPLP RDL production lines with the largest 700 x 700 mm process area in the industry.Manz AG has drawn on its core competencies of wet chemistry, automation, metrology, and inspection technologies to develop the industrial largest process dimension of 700 x 700 mm RDL production lines. The RDL process takes one-third of the overall manufacturing cost of FOPLP technology. That's why Manz's equipment has a crucial role to play. Collaborating with key customers, Manz AG has already built complete production lines not only for a pilot run but also a ramp-up of mass production to verify the precision adjustment of the Cu-plating process applied in large area of redistribution layers and overcome the major technical challenges including uniformity of cu-plating pattering, high resolution and high electrical connectivity.Excellent uniformity, high thickness and fast speed of Cu-plating increase production yields plus assist customers for ESG targets.Cu-plating is an integral part of the RDL process. Manz integrates its own pre-and-post chemical wet processes to ensure excellent electroplating panel surface uniformity at 92%. The Cu thickness could reach 100 μm and above. These newly developed processes increase chip density, heat dissipation and a high current density of up to 5 ASD to ensure higher process speed to boost overall manufacturing capacity. The unique automatic gentle handling and jig-free vertical electroplating systems, which can save the material purchase cost, as well as reduce the consumption of electroplating chemicals and the cost of maintenance to help customers achieving ESG targets.Total Fab Solutions enable highly profitable business models for FOPLP.Manz actively expands the reach of its Total Production Solutions to provide the services to build from single equipment to automated production lines with the integration of upstream and downstream manufacturing lines. This approach enables the tight collaboration among Manz and the global IDM, OSAT and semiconductor foundry service providers to develop a comprehensive plan for success by increasing competitiveness and maintaining the strong positioning of supply chains.Manz AG, leveraging an open-architecture and modular design concept, provides a comprehensive technology portfolio fulfilling the requirements of RDL process optimization and the flexibility to fit different stages of FOPLP production expansion. Seeing the huge growth of global automotive chip demand, Manz AG's production solutions transform FOPLP as the prevailing technology in the advanced packaging market.Manz FOPLP RDL production solutions with proven records for mass productionManz Jig-free Vertical Electroplating ━ a key tool to optimize the productionPMIC Packaging by FOPLP production line

With a new wave of smart energy vehicles entering the market, competition in the global automotive semiconductor industry is changing. In light of this trend, WPG Holdings, a leading global semiconductor component distributor, together with its subsidiaries—WPI Group, SAC Group, AIT Group, and YOSUN Group—successfully held the Automotive Technology Application Exhibition in Shanghai and Shenzhen, China. The exhibition provided insight into the changes occurring in the industry's supply-and-demand chain and highlighted the company's main strategies with regard to horizontal integration of chip manufacturers and vertical integration of automakers to optimize up- and downstream cooperation in the automotive semiconductor supply chain. These strategies will significantly maximize chip supply efficiency and create a win-win situation among automakers, chip manufacturers, and WPG Holdings.Evolving competition in the automotive chip marketEric Ho, Chief Marketing Officer of WPI Group, pointed out that smart energy vehicles are very diverse, creating demand for differentiated components. Additionally, the continuous upgrading of component specifications has prompted automakers to require a wider range of chip solutions. Kevin Lin, Vice President of CN Business Group at AIT Group, explained that in the past automakers mainly purchased components that complied with vehicle regulations. With the development of smart and electric vehicles, however, demand for components that do not need to comply with vehicle regulations has been growing in the past two years. As a result, chip demand among automakers and tier-1 suppliers has become more intricate.Due to this development, as well as an acute awareness of the importance of stable chip supply following the disruptions of the COVID-19 pandemic, the industry's chip procurement methods are undergoing changes. Andrew Man, Chief Marketing Officer of SAC Group, explained that some automakers have started to bypass tier-1 suppliers and directly collaborate with MCU suppliers to shorten the design process, ensure stable supply, and achieve cost reduction goals.In response to increasing demand and different procurement patterns of downstream customers, upstream chip manufacturers have begun consolidating in order to expand product lines and increase chances of winning orders from automakers. Indeed, the entire automotive semiconductor industry supply chain is experiencing drastic change.Optimizing supply chain to create a win-win situationIn order to continue its role connecting up- and downstream sectors in the industry, WPG Holdings is integrating the resources and capacities of its four subsidiaries to promote two integration strategies and optimize cooperation models in the global automotive chip supply chain.Integrating horizontally with chip manufacturers and deploying diversified solutionsEric Ho stated that automotive chips have a wide range of applications and that WPG Holdings has been actively involved in many of them for more than 10 years, providing customers with comprehensive solutions. Among WPG Holdings' 250 product lines, more than 50 are automotive-related, covering almost all automotive applications, including ADAS, controllers, EIC systems, passive components, connectors, and others.Among YOSUN Group's nearly 60 product lines, 26 are related to automotive chips, with extensive technology coverage, said Jerry Chen, CEO Special Assistant at YOSUN Group. He pointed out that in response to the booming development of the new energy vehicle market in recent years, YOSUN Group has initiated an EV project to meet the changing needs of the market and customers. By consolidating the EV strategies of the sales, PM, FAE, and solution teams, as well as combining various technologies and chip requirements inside and outside the vehicle, YOSUN Group provides customers with rich and complete solutions. In addition, with the global service layout of WPG Holdings, the results that the company has achieved so far are remarkable. It has gained widespread recognition from automakers, customers, and the market. This has underlined the value of WPG Holdings to automakers, tier-1 and tier-2 manufacturers, and OEMs in the EV market.Integrating vertically with automakers and tier-1 manufacturers to provide customized technical servicesAndrew Man stated that SAC Group established an automotive electronics business team seven years ago and a technical team five years ago. Today, SAC Group has nearly 100 employees who are well-versed in the automotive industry. Among all its subsidiaries, WPG Holdings now boasts up to 300 engineers. These engineers not only have ISO-26262 certifications but also possess special skills and certifications related to MCU. They delve deeply into the needs of automakers and tier-1 manufacturers and provide customized technical services.Using AIT Group's business as an example, Kevin Lin further explained that it has many tier-1 customers, each with different requirements. Therefore, AIT Group leverages the collective strength of WPG Holdings to deliver optimal services to automakers and tier-1 suppliers through diversified solutions and customized technical support capabilities. This ensures that all the processes of the chips handed over by WPG Holdings can be completed smoothly and efficiently, from assembly to components and complete vehicles.As the automotive industry is transforming, WPG Holdings continues to serve as a critical distributor, aiming to provide automakers with the most suitable and diverse chip solutions and services, help chip manufacturers establish clear advantages in the changing market environment, and gain favor from automakers.

The organization behind the sustainability certification TCO Certified is TCO Development. TCO Development works globally towards a future where all IT products have a sustainable life cycle. The international team is headquartered in Stockholm, Sweden, with team members working remotely at several continents around the world.Soren Enholm, the CEO at TCO Development, has, once again, been named one of Sweden's most influential people in sustainability. The list of 101 people is put together every year by the Swedish magazine Aktuell Hallbarhet.It is a great honor to be on the list to highlight the importance of more sustainable IT products. And with a record high interest in certified products it is satisfying to see that purchasers' demand for TCO Certified push the IT industry in the right direction. Together we drive progress toward sustainable IT products and circular solutions, says Sören Enholm.The story of TCO Certified began more than 30 years ago. Sören has led the work since 2009 and it is the second year in a row he is on the list. The sustainability requirements of TCO Certified affect how more than 100 million IT products are manufactured each year. The requirements are tightened every three years — towards a more circular design, safer chemicals, a reduced product carbon footprint and better working conditions in factories. To challenge the industry and drive the development of more sustainable IT products, the criteria go beyond legislation and industry standards.TCO Certified is available for 12 product categories, including computers, mobile devices, display products, imaging equipment and data center products. Compliance is independently verified, both pre- and post-certification. All product models can be found at Product Finder.

Taiwan's leading retail equipment manufacturer, DataVan (3521.TWO), has been actively implementing intelligentization strategies in recent years. By introducing new technologies, improving software and hardware integration, and expanding research and development capabilities, DataVan provides clients with comprehensive smart solutions for operation and management, presented at this year's COMPUTEX, one of the largest computer and technology trade shows in the world.In response to the surge in outbound tourism since the Chinese New Year holidays this year due to the lifting of travel restrictions, DataVan will create a "Smart Airport" on-site at COMPUTEX to optimize the travel and outbound experience with its latest AI retail technologies and equipment. According to DataVan, the reason for choosing "airport" as the scene to showcase its AI solutions is not only to respond to current events, but also because airports include areas such as travel information, duty-free shops, and lounges, which traditionally require a large amount of manpower for reception. By introducing more smart retail solutions with AI technologies, not only can the manpower shortage problem be effectively solved, but the shopping experience of passengers can also be highly optimized. In addition, it can provide store owners with more data analysis, allowing them to formulate more precise marketing strategies, and it is conducive to the successful implementation of more applications.DataVan states that the focus of smart airport is on the integration of hardware and software, highlighting three major features: The first one is DataVanGPT, an AI recommendation system that utilizes innovative GPT (Generative Pre-trained Transformer) technology, combined with the latest slim kiosk "Genius" by DataVan, which provides travel, navigation, and recommendation information services through voice queries. It also incorporates e-commerce and membership management system applications, creating greater commercial value. Secondly, AI Vision, which utilizes AI eye-tracking analysis technology, can analyze the direction and time of customers' eye focus in front of the store shelves, and can convert the attention hot zone data into accurate marketing applications with advertising benefits. Thirdly, AI Waiter, a smart voice ordering service system that uses AI voice and intelligent recommendation systems, will be integrated with DataVan's kiosk "Venus", demonstrating an innovative interactive self-service ordering system that can simultaneously use voice recognition and touchscreen.In addition to the AI systems, DataVan will also showcase a variety of innovative retail application software and hardware, including several new platform-based desktop POS systems, mobile payment terminals, Kitchen Display Systems (KDS), smart beer dispenser, and the cloud POS management platform "DataVan Central" that supports both Windows and Android systems, providing clients with a one-stop-shop service to meet their diverse needs. Welcome to explore DataVan's solutions at K0802 booth.DataVan provides clients with comprehensive smart solutions for operation and management, presented at COMPUTEX 2023.