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Thursday 14 September 2023
BIWIN announces new PCIe Gen4 SSD for PC OEMs
PCIe SSD prices continue to drop in 2022, the cost of purchasing high-performance, high-capacity PCIe SSDs for PCs has also decreased. This has expanded the application of PCIe 4.0 SSDs in the PC OEM market, driving a significant increase in the market share of consumer PCIe 4.0 SSDs. BIWIN has extended a new DRAM-less PCIe 4.0 SSD-- AP860 for desktops, laptops, and all-in-one computers...
Wednesday 13 September 2023
Xiphera implements cryptographic algorithms on FPGAs and ASICs
Xiphera, founded in 2017 by Matti Tommiska and Kimmo Jarvinen, has designed hardware-based cryptographic algorithms that can be implemented directly on Field Programmable Gate Arrays (FPGAs) or Application Specific Integrated Circuits (ASIC). Xiphera has partnerships with Intel, AMD, Lattice, Microchip, Bittware, Spinnaker Systems, and Muspark.
Wednesday 13 September 2023
ASUS AICS and National Taiwan University Hospital build smart healthcare ecosystem with privacy protections
ChatGPT, the latest artificial intelligence (AI) trend, has continued to create surprises in our daily lives. The trend has naturally spread to the field of medicine which generates a wave of new smart healthcare applications that combine biomedicine with AI...
Tuesday 12 September 2023
Watasumi turns sugar from waste water into power for primary food producers in Asia
Okinawa-based startup Watasumi is utilizing its biological technological expertise to convert organic carbon from waste water into energy through bioelectrochemical systems (BES)...
Tuesday 12 September 2023
Thermalytica sees potential of high-end insulation materials for corporate ESG and consumer products
Thermalytica, a spin-off startup from Japan's National Institute of Materials Science (NIMS), has developed an ultra-low density and lightweight silica-based thermal insulation material. The material, TIISA, is revolutionary in its structure; its volume can expand up to ten times larger than traditional aerogel when compared at the same weight.
Monday 11 September 2023
Blumind targets sustainability in the chip industry, seeking long-term partnership with Taiwan
Blumind is pitching a farsighted approach of neural network processing using an all-analog architecture for AI applications to be more sustainable in the future. The company has completed the latest phase of R&D and is now looking to commercialize its high-performance, low-cost, and sustainable AI chips.
Friday 8 September 2023
DigiKey launches City Digital Season 3 video series
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has released the full Season 3 of its "City Digital" video series, which explores the evolution and future of IoT in the automotive industry.
Friday 8 September 2023
Musk said that the most profitable mining platform in the past three years is here
As more players enter the cryptocurrency space, mining becomes more complex and requires more computing power. As a result, many people who used to mine cryptocurrencies using their own hardware are now finding it unsustainable due to high electricity bills and hardware wear and tear. Therefore, cloud mining has become an attractive option.
Thursday 7 September 2023
Innovative technology and exclusive service mechanisms - Manz Taiwan helps customers adopt FOPLP
Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has matured and its scope of application has gradually expanded beyond vehicle-mounted applications. It has become a critical packaging process for next-generation RFIC used for low earth orbit satellites...
Wednesday 6 September 2023
GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps
Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC's 5nm process technology. The platform was demonstrated at the Partner Pavilion of the TSMC 2023 North America Technology Symposium. It contains a fully functional HBM3 Controller and PHY IP and vendor's HBM3 memory using TSMC's industry leading CoWoS® technology.