SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development: high-bandwidth memory.The Icheon-based firm is investing more than $1 billion in South Korea this year to expand and improve the final steps of its chip manufacture, said Lee Kang-Wook, a former Samsung Electronics Co. engineer who now heads up packaging development at SK Hynix. Innovation with that process is at the heart of HBM's advantage as the most sought-after AI memory, and further advances will be key to reducing power consumption, driving performance, and cementing the company's lead in the HBM market.Lee specializes in advanced ways of combining and connecting semiconductors, which has grown in importance with the advent of modern AI and its digestion of vast troves of data via parallel processing chains. While SK Hynix has not disclosed its capital expenditure budget for this year, the average analyst estimate puts the figure at 14 trillion won ($10.5 billion). That suggests advanced packaging, which could take up a 10th of that, is a major priority."The first 50 years of the semiconductor industry has been about the front-end," or the design and fabrication of the chips themselves, Lee said in an interview. "But the next 50 years is going to be all about the back-end," or packaging.Credit: BloombergBeing the first to achieve the next milestone in this race can now catapult companies into industry-leading positions. SK Hynix was chosen by Nvidia Corp. to provide the HBM for its standard-setting AI accelerators, pushing the Korean firm's value up to 119 trillion won. Its stock gained about 1% in Seoul on Thursday, adding to a nearly 120% increase since the start of 2023. It is now South Korea's second most valuable company, outperforming Samsung and US rival Micron Technology Inc.Lee, now 55 years old, helped pioneer a novel method for packaging the third generation of the technology, HBM2E, which was quickly followed by the other two major makers. That innovation was central to SK Hynix winning Nvidia as a customer in late 2019.Stacking chips to derive greater performance has long been Lee's passion. In 2000, he earned his Ph.D. in 3D integration technology for micro-systems from Japan's Tohoku University, under Mitsumasa Koyanagi, who invented the stacked capacitor DRAM used in mobile phones. In 2002, Lee joined as principal engineer at Samsung's memory division, where he led the development of Through-Silicon Via (TSV)-based 3D packaging technologies.Credit: BloombergThat work would later become the foundation for developing HBM. HBM is a type of high-performance memory that stacks chips on top of one another and connects them with TSVs for faster and more energy-efficient data processing.But back in the pre-smartphone era, Samsung was making bigger bets elsewhere. The norm was for global chipmakers to outsource to smaller Asian nations the tasks of assembling, testing, and packaging chips.So when SK Hynix and US partner Advanced Micro Devices Inc. introduced HBM to the world in 2013, they remained unchallenged for two years before Samsung developed its HBM2 in late 2015. Lee joined SK Hynix three years later. They joked, with a measure of pride, that HBM stood for "Hynix's Best Memory.""SK Hynix's management had better insights into where this industry is headed and they were well prepared," said Sanjeev Rana, an analyst at CLSA Securities Korea. "When the opportunity came their way, they grabbed it with both hands." As for Samsung, "they were caught napping."ChatGPT's release in November 2022 was the moment Lee had been waiting for. By that time, his team had developed a new packaging method called mass reflow-molded underfill (MR-MUF), aided by his contacts in Japan. The process, which involves injecting and then hardening liquid material between layers of silicon, improved heat dissipation and production yields. SK Hynix teamed up with Namics Corp. in Japan for the material and a related patent, according to a person familiar with the matter.SK Hynix is pouring the bulk of its new investment into advancing MR-MUF and TSV technologies, Lee said.Samsung, which has for years been distracted by a succession saga at its very top, is now fighting back. Nvidia last year gave the nod to Samsung's HBM chips, and the Suwon-based company said on February 26 that it had developed the fifth generation of the technology, HBM3E, with 12 layers of DRAM chips and the industry's largest capacity of 36GB.On the same day, Boise, Idaho-based Micron surprised industry watchers by saying it had begun volume production of 24GB, eight-layer HBM3E, which will be part of Nvidia's H200 Tensor Core units shipping in the second quarter.With its big commitment to expanding and enhancing technology at home and a multibillion-dollar advanced packaging facility planned for the US, Lee remains bullish about SK Hynix's prospects in the face of intensifying competition. He sees the present investment as laying the groundwork to meet more demand to come with future generations of HBM.
The integration of network technology has rapidly advanced the development of industrial automation systems, thereby changing the manufacturing value chain. The Human Machine Interface (HMI) is a quintessential technology. Today, HMIs integrate various on-site manufacturing processes, ensure equipment and machines transmit high-speed and reliable wireless data in harsh environments, and provide precise process control. HMIs are also crucial in collecting, controlling, and managing critical process data. Driven by the rise of smart manufacturing, the issues of digital transformation and green energy sustainability have become prominent. With the innovation of big data, machine learning, artificial intelligence, and industrial Internet of Things technology, the corporate world is now experiencing unprecedented technological innovation and environmental sustainability. At this time of transformation challenges, the most important thing is for enterprises to improve manufacturing efficiency and fuel continuous creativity.Originally from Sweden, Beijer Electronics is a global leader in HMI products. The CEO, Kristine Lindberg, accepted this exclusive interview. She joined Beijer Electronics as CEO in April 2023. The company Lindberg previously worked for was a significant customer of Beijer Electronics. As early as 2000, she developed a thorough understanding and command of the Asia-Pacific (APAC) market.A technology company that puts people first and aims to become an essential partner to its customers.Lindberg exemplifies the corporate vision of Beijer Electronics, emphasizing that it is a company whose mission is to become an essential partner to its customers. Beijer's primary customers include influential multinational companies such as equipment and machine manufacturers, system integrators, and marine industries. Providing technology to improve the efficiency of customers' products and creating the ability for sustainable development are two critical core capabilities of modern enterprises. Lindberg says: "Through technological innovations in visualization, digitization, and automation, Beijer Electronics continues to provide solid hardware equipment, programming, software expertise, and technical support services to help customers accelerate innovation, achieve their goals and ambitions, and gain competitive advantage."Beijer Electronics has thoroughly analyzed the market outlook and trends in 2024. Beijer Electronics has established a strong supply chain, sound management capabilities, and technical innovation to meet its commitments to customers and invest resources to further amplify software and hardware product capabilities and quality. Beijer Electronics provides visualization software solutions and a product portfolio based on web technology, and a new generation of HMI products will be launched in 2024. "These major growth areas put us in a favorable position. We are confident in grasping good growth opportunities in 2024 while the economic prospects are still uncertain.Embrace the pivotal business opportunities of digital transformation and green sustainability.The APAC market is an integral segment of the global automation system. Lindberg sees many opportunities for substantial growth, especially in the thriving semiconductor market, a manufacturing industry that has received significant attention from Taiwan and the Asia-Pacific region. Beijer Electronics' industrial-grade AIoT intelligent solution aims to optimize the availability of semiconductor process peripheral equipment and closely integrate business opportunities with back-end packaging and testing process equipment. Beijer utilizes the X2 series of HMIs and BoX2 series of IIoT gateways to quickly establish a solution that complies with SECS/GEM communication protocol standards to control the information management process between process equipment and computer-integrated manufacturing (CIM) control systems, improve production efficiency, reduce human operating errors, achieve increased production capacity utilization, and continue to strengthen competitive advantages. Consequently, Beijer Electronics obtained an invention patent certification from the Taiwan Intellectual Property Bureau and substantially contributed to the evolving semiconductor industry.The marine equipment industry is also a sector that has attracted much attention, especially under the global trend of pursuing green energy and emphasis on ESG indicators. The shipbuilding and maritime-related industries are all participating in the green transformation action in full swing. Beijer Electronics is also in the critical process of moving towards a green and sustainable transition. In addition to its manufacturing base in Taiwan, Beijer Electronics has established a new manufacturing base close to its headquarters in Sweden. The base is expected to be launched in the first quarter of 2024. This investment will meet sustainability needs and continue to meet customers' strong demand for HMI solutions. The challenges of digital transformation and net-zero carbon emissions will be an ongoing and long-term journey; Beijer Electronics will collaborate with customers to actively pursue growth and bring significant value.For more information, please visit Beijer Electronics.
UBI Research, a display specialist research company, will hold the international business conferences OLED Korea and eXtended Reality Korea in parallel at The-K Hotel in Yangjae, Seoul from March 27 to 29, 2024. This event is expected to be an opportunity for people from companies, academia, and research institutes related to the display industry around the world to attend, exchange the best information, and form a global network.eXtended Reality Korea is the first XR industry-related business conference held by UBI Research and will cover trends and outlook on microdisplay, XR Hardware/Software, materials, equipment, etc.This event aims to provide attendees with the opportunity to deeply explore the display and XR areas through a comprehensive program including tutorials, keynote presentations, and panel discussions.The tutorial on March 27th will feature presentations on the future of XR, micro LED display technology, and key technologies to realize the next-generation OLED display.In addition, keynote presentations by Samsung Display, LG Display, Hyundai Mobis, and Fortell Games are scheduled for the conference to be held on March 28th and 29th. In addition, it will be run by a total of 34 domestic and foreign speakers and programs, including AR/VR development and technology, automotive displays, OLED industry, backplane technology, and MicroLED display development.Because it is a parallel event, attendees can attend both events even if they register for one event, and registration is possible at a special discount price during the early bird period until February 29th.Detailed information can be found on the website (https://oledkoreaconference.com/, https://extendedrealitykorea.com/).2024 OLED Korea and 2024 eXtended Reality Korea
With geopolitics driving changes in the industrial environment, Southeast Asia has newly become a global center of manufacturing. Eternal Materials, a major, all-inclusive materials supplier with extensive experience in the fields of automotive electronics and PCB, has recently expanded its presence in Thailand in a move to improve its local service quality. While the current production capacity of Eternal Materials' separation plant in Thailand meets existing market demand, there has recently been an increase in customers from various countries establishing plants in Thailand. In response to this emerging market-derived demand, Eternal Materials has built a new separation plant in the Southeast Asian country that is expected to begin operations in Q4 of 2025.Founded in 1964, Eternal Materials has three major business divisions: High Performance Materials, Electronic Materials, and Resins Materials. Notably, its Electronic Materials division has solid capabilities in formula design, with the company being one of the world's leading suppliers of dry film photoresists. Furthermore, as one of the world's three largest suppliers of photo-curing raw materials and a frontrunner in synthetic resin technology in Asia, Eternal Materials has continued to combine its major advantages in service and technology over the years to offer unparalleled support to its customers.With rapid changes in the geopolitical landscape, global manufacturing has begun to strengthen its presence in Southeast Asia to mitigate risks, with Malaysia, Vietnam, and Thailand being key destinations. If we observe the industrial layout, we see that Malaysia has a high demand for PCB substrates, while Vietnam focuses on flexible printed circuit boards, and Thailand mainly focuses on automotive and consumer electronics. Thailand's share of demand in the Southeast Asian PCB market exceeds 60%, and the market is still growing rapidly.Eternal Materials currently operates a separation plant in Thailand, with a market share of more than 50% and a prominent market position. Its production capacity can already meet local market orders for 2026. The new separation plant that will begin operations in 2025 will be able to meet growing customer demand, enhance local service quality, mitigate geopolitical risks, and provide flexible responses to market fluctuations.Concerning technology, Eternal Materials leads the market in dry film photoresist PCB technology. With more than 30 years of core technologies in precision coating and resin synthesis and formulation, it can meet the various product requirements of its customers As for the automotive electronics sector, Eternal Materials' products have passed stringent automotive standards, helping automotive electronics customers expedite product development and capitalize on market opportunities.In addition to Thailand, Eternal Materials has also established a foothold in Malaysia and Vietnam. The Penang sales office in Malaysia is set to begin operations in the fourth quarter of 2024, and its Johor Bahru plant will go into production in Q4 of 2025. As for Vietnam, the company has a sales office in Ho Chi Minh City to serve the local customer base. Moving forward, Eternal Materials will make Thailand the cornerstone of its operations presence in the Southeast Asian market. Tailoring its approach to meet the needs of local customers, Eternal Materials will dynamically adjust production capacity and supply chains to ensure prompt and satisfactory responses to customer needs.Eternal Materials (booth number: 609) will also exhibit its various solutions at the inaugural Thailand Int'l PCB and Electronics Manufacturing Exhibition (which runs from 2/29 to 3/2) co-organized by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) and Taiwan Printed Circuit Association (TPCA). People from all sectors are welcome to visit the booth, where a service team can provide you with professional consultation.Eternal Materials provides flexible and immediate sales services for customers
Pegatron 5G joins the Mobile World Congress (MWC) to showcase its end-to-end and interoperable 5G portfolio. The products include CPE, Dongle, and Camera, eCPRI disaggregated cell site switches, 5G ORAN RU, DU, CU, UPF, and OSS including SMO, RIC, xApps, and rApps. Pegatron 5G was initiated in 2018 and has since developed a comprehensive suite of E2E 5G ORAN products.Pegatron 5G has a full range of User Equipment products, such as CPE, Dongle, and Camera. Each of these device types provides both standard full 5G bandwidth SKUs and RedCap SKUs for more cost-constrained requirements.Pegatron 5G offers a range of radio products to meet various customer needs.*Indoor/Outdoor 5G NR FR1 4T4R Integrated Small Cell based on Qualcomm FSM20056.*Indoor/Outdoor 5G NR FR1 4T4R O-RU based on Gen2 SoC to reduce power consumption and weight.*Outdoor 5G NR FR2 2T2R O-RU, a mmWave ORU based on the same SoC and main board hardware design as the FR1 product series. *Each comes in a range of frequency-based SKUs to support various market deployments.Switches include Fronthaul Multiplexer and Cell Site Router. Fronthaul Multiplexer helps users to economically expand coverage by adding additional RUs and multiplexing the existing DU capacity. Later, as traffic growth increases, additional DU capacity can be added as needed for a pay-as-you-grow expandable solution. Cell Site Router supports PTP timing and is disaggregated hardware that can be integrated with multiple software vendors.DU/CU, MEC, and AI servers will also be showcased, DU/CU servers are purpose-built for Telco requirements such as extended temperature range, and short rack depth. MEC and AI servers offer dense computing capability for AI applications.Pegatron 5G's 3GPP O-RAN architecture is designed to enhance network flexibility for 5G private network operators. Our product suite embodies key principles: disaggregation to reduce costs, cloud-native for efficient resource pooling, and scalability for easy upgrades. Our solutions are designed to meet your specific needs.All of Pegatron 5G's factories are strategically located for in-country or near-shoring manufacturing, meeting the highest standards of clean network designed and produced by our own manufacturing centers in Taiwan, Vietnam, Indonesia, India, and Mexico.Pegatron 5G's products are enabling digital transformation solutions in many different domains including:*Smart manufacturing*Digital resilience networks*Disaster rescue and relief*Transportation and logistics*Oil & GasVisit our MWC booth at Hall 5, Stand 5K9, or visit our webpage https://5g.pegatroncorp.com/ for an immersive experience where connectivity meets innovation.
Newhaven Display is an American company specializing in the design and production of a wide range of LCD, TFT, OLED, and VFD displays. The manufacturer is continuously looking for new solutions and is dedicated to developing convenient tools and easily implementable solutions, and to providing support to engineers and programmers.All these factors have contributed to the creation of two interesting series of displays by Newhaven Display, which are now available straight from our stock.2.7" OLED touchscreen displaysA new series of graphic OLED displays includes 2.7" modules featuring 128x64 pixel resolution. They are equipped with a factory-installed capacitive touchscreen. As multipurpose products, they can be connected to a control system via a 20-pin flexible flat cable (FFC) or a 20-pin socket. In both cases, the user can construct devices that are capable of communication through a parallel or serial peripheral interface (SPI), compliant with e.g. Arduino modules, as well as almost all, even the least advanced, models of modern microcontrollers. The maximum image contrast ratio reaches up to 10000:1 and is programmable. The color emitted by the monochromatic display can be yellow or white.The clear display and the responsive touchscreen are a perfect match.The capacitive touchscreen boasts an incredibly short response time and can detect up to 5 points of contact simultaneously. While designing the module, the manufacturer made sure to reduce the emissions and impact of electromagnetic interference (EMI). The products are mainly intended for industrial control panels, Internet of Things (IoT) applications, smart devices, etc.SpecificationItemDetailType of displayOLEDKind of displaygraphicScreen size2.7"Display resolution128x64Dimensions*82x47.5x7.2 mm or 82x47.5x8.1 mmViewing area (H x W)63.31x32.59 mmEmitted colourwhite or yellowNumber of pins26Kind of controllerSSD1322Connector pinout layout1x6, 1x20Contact pitch*1 mm or 2.54 mmOperating temperature-40...85°CType of touchscreencapacitive* depending on the model3.5" TFT displays with an MIPI interfaceThe displays are ideal for building handheld gaming consolesWhen it comes to compact TFT displays, the 3.5" display size has become a standard. There are many variants of these modules available on the market, however, the solutions from Newhaven Display offer several significant features that are not commonly exhibited by other products.Above all, the displays are made with the use of IPS TFT technology, which allows for a shorter response time, higher contrast, and a wider viewing angle while displaying more accurate colors (in contrast to "classic" modules). It is also important to mention the resolution of the displays, which is as high as 640x480 pixels. All of these features guarantee that the image is sharp and of exceptional quality.The manufacturer has also made sure that the displays are convenient to use – the built-in controller makes it easier to control the display via a microcontroller and provides additional EMI shielding to reduce the risk of electromagnetic interference.The main difference between the old and the new products offered by the supplier involves the implementation of the MIPI DSI bus (Mobile Industry Processor Interface Display Serial Interface), which is a new and fast interface used for communication with microcontroller systems. The standard was designed with these exact display modules in mind. It uses four data lanes for fast transmission of data to the display, ensuring a high refresh rate. Thanks to this, the users can enjoy smoother animations, deeper colors, and improved comfort of use. The MIPI DSI interface also offers reduced image compression and requires less cache memory (buffer).The display is available in two variants: standard or with a built-in capacitive touchscreen. The products are intended for demanding applications, medical and industrial equipment, and multimedia devices such as video game consoles (e.g. for retrogaming) based on SoC circuits or single-board computers.SpecificationItemDetailType of displayTFTKind of displaygraphic, IPS matrixTouchscreen*none or capacitiveScreen size3.5"Display resolution640x480BacklightLEDViewing area (H x W)52.56x70.08 mmDimensions*76.9x63.9x3.2 mm or 76.9x63.9x4.95 mmOperating temperature-20...70°CEmitted colourRGBInterfaceMIPILuminosity808 cd/m2 or 950 cd/m2Connector pinout layout*1x40 (+ 1x6)Number of pins*40 or 46Ribbon cable pitch0.5 mmBacklight colourwhiteKind of controller*FL7703NI, FT5426-003*depending on the model
Rugged embedded computer brand - Cincoze, announces the upcoming release of new Intel Alder Lake models in the Rugged Computing - DIAMOND and Display Computing - CRYSTAL product lines. The release, set for early February, will strengthen the overall lineup and provide the processing performance boost that the latest industrial applications need. The Rugged Computing - DIAMOND product line gets the DI-1200, a compact, high-performance industrial computer with low 15W power consumption specifically crafted for applications with limited space and power supply. The Display Computing - CRYSTAL product line adds over 30 panel PC models, including industrial panel PCs for HMI in harsh industrial environments, sunlight-readable panel PCs with 1,800 nits max brightness for outdoor use, and open frame panel PCs for integration in control cabinets or equipment machinery, providing a rich and diverse selection that covers the display application needs in various fields.Cincoze DI-1200 Industrial ComputerHigh-Performance and Power-Saving DI-1200 Industrial ComputerThe DI-1200 is an industrial computer with a 12th-gen Intel Core i7/i5/i3 (Alder Lake-P) U-series processor and support for up to 32GB of DDR5 4800MHz memory, combining exceptional processing performance with only 15 watts power consumption. Smaller than a sheet of A5 paper, its compact size suits applications in confined spaces and limited power supply, such as mobile devices, in-vehicle, or outdoor environmental monitoring. The built-in M.2 Key E Type 2230 and M.2 Key B Type 3052 slots can support wireless communication needs like 5G, Wi-Fi, Bluetooth, and GNSS. The DI-1200 makes hard disk retrieval and data extraction simple, with a slot on the front panel that provides easy access to a hot-swappable 2.5-inch SATA HDD/SSD. The DI-1200 also inherits the rugged features consistent in the Cincoze lineup, including wide temperature and wide voltage adaptability, industrial environmental EMC standard (EN 61000-6-2 & EN61000-6-4), and U.S. military shock vibration standard MIL-STD-810H standard, ensuring stable operation even in extreme environments.Cincoze panel PC seriesThree Panel PC Series for Any ApplicationThe three Cincoze panel PC series based on the new platform include an industrial panel PC (CV Series + P1301) for general industrial applications, a sunlight-readable panel PC (CS Series + P1301) for outdoor use, and an open frame panel PC (CO Series + P1301) for seamless installation into equipment machinery. Performance-wise, all the panel PCs have an Intel Alder Lake-N quad-core processor based on the Intel 7 process, which improves CPU single-thread performance by up to 130% and multi-thread performance by 109% compared to the Elkhart Lake platform. The processor's built-in UHD Graphics display chip gives 6.85 times the AI inference performance for object recognition. In addition to rich native I/O, they also have built-in M.2 Key B Type 3052 and M.2 Key E Type 2230 expansion slots providing 5G, WIFI, Bluetooth, and other wireless transmission expansion options. Cincoze's exclusive CFM expansion modules facilitate effortless customization, adding functionalities such as PoE/IGN to meet a diverse range of application needs.
The electronic component industry enters 2024 at an inflection point. Various market segments are recalibrating accordingly after facing hardships brought on by inescapable geopolitical events over the past few years. From major shortages to a current state of influx, Fusion Worldwide evaluates the state of the electronic component industry in our latest report. Following an in-depth look at the market, we identify the following key themes:*The collective reaction to extreme shortages, record-high lead times, and significant pricing fluctuations that plagued 2022 are still salient. Consequently, overbuying was a significant factor for 2023, resulting in massive volumes of excess inventory in various sectors across the electronic component market.*Artificial intelligence continues to advance at a rapid pace. As it evolves, so does the technology that makes up its building. This technology—which is expected to reach $1.3 trillion in growth by 2032—is a major driver in general market activity since it impacts many industries under our purview.*Palpable uneasiness between the U.S. and China continues, stemming from the initial tariffs targeting chipmaking and trade, dating back to Since then, we've witnessed a tit-for-tat of who will restrict whom or what next. This has become even more of a balancing act for the two powers as China tries to avoid a recession.*The ongoing conflicts in Israel and Ukraine pose many threats to the electronic component supply chain. Electronic devices require manufacturing, machinery, and expertise from across the globe. Not only does conflict threaten the continuity of these factors, it impacts investment and consumer confidence.While these over-arching themes are our general outlook for 2024, we can also identify key data points, trends, and developments in the many segments that make up the broader market for semiconductors, chips, memory modules, and the like:*Aerospace & Defense: We see a healthy funnel for components needed to support both aerospace and defense builds. Commercial airplanes, for example, are developing exponentially in terms of electrical complexity, which translates to reliable demand.*Automotive: Automotive struggled to keep up with the global chip shortage, but they're now back in the driver's seat and enjoying a generally favorable long-term outlook. However, a few speedbumps along the way – including pricing volatility – must be navigated en route.*Contract Manufacturers: Contract Manufacturers will continue to be a mainstay of the industry conversation in 2024 and beyond. We can look to an increase in offshoring, especially in emerging countries, and increasingly positive changes in the regulatory landscape as primary drivers of expected growth.*Enterprise Computing & Servers: Enterprise computing is at the forefront of our most exciting opportunities. The ever-growing need for data and computing will rely on this sector to reach its full potential. It is consequently uniquely positioned to dictate the terms of the wave that we'll all be riding when it comes to AI, IoT, graphics, multimedia, telecommunications, and beyond.*Telecom & Networking: AI, IoT, and Edge computing are, naturally, significant demand drivers for this sector. None are possible without telecom and networking. Overall, we feel that this high-margin space, which by its nature commands big investment, won't experience any challenges in the long run.*Gaming: The sector experienced some high-profile obstacles in 2020 and 2021, but the industry has gotten back on track more recently. The #1 commodity for gaming has always been graphics cards and GPUs. But games are changing, and cloud gaming, virtual reality, augmented reality, and artificial intelligence are becoming increasingly popular, sparking demand for more advanced parts.*Healthcare: Few healthcare centers can afford significant operational expenses every year, and when it's time to replace equipment, they want a modest number of units. However, disruptive technology holds great implications for the field – will new applications change the paradigm? AI has huge potential, as does the increasing use of remote patient monitoring devices and digitized diagnostic equipment.Favorable forecasts and long runways across many sectors bode well for our general outlook, with federal legislation and disruptive technologies building positive momentum. However, multiple red flags cannot be ignored. In many ways, navigating 2024 and beyond will be a balancing act – especially when it comes to achieving resiliency in the face of mounting geopolitical and economic challenges.Enter Fusion Worldwide – always Out in Front of the latest developments, news, and trends in the electronic component industry – and our State of the Industry report, available now for download. This timely piece is a synthesis of market intelligence from Fusion Worldwide insiders, as well as market research highlights, earnings reports snippets, and essential worldwide news – providing you with a roadmap as you journey through 2024.<Download the report here>Fusion Worldwide's 2024 Report
The rising popularity of generative AI is spurring demand for high-performance computing. This in turn fuels demand for edge system components and related applications, all of which bring along stringent testing requirements. Chroma ATE, an industry leader in the power test & measurement industry, has also secured a prominent position in the increasingly critical field of semiconductor component testing. To address the continually rising testing needs of domestic and international customers, Chroma recently hosted the Chroma ATE Semiconductor Test Seminar in Hsinchu, Taiwan, one of Asia's premier tech hubs. The event focused on sharing Chroma's next-generation solutions for GaN and RF component testing, all set to provide customers with exceptional test performance.Continued Excellence in ATE Market, Focusing on AI, IoT, GaN/SiC Power Component Testing DemandsGeorge Chang, President of Chroma's Semiconductor Test Equipment BU, stressed the significance of this event—the second of its kind—during his introductory remarks. He explained that the challenging journey Chroma ATE has undertaken in the global semiconductor test equipment field for over two decades was a major reason for hosting this seminar. As of December 2023, Chroma had over four thousand semiconductor test systems deployed globally, firmly establishing itself in the top four of the global semiconductor Automated Test Equipment (ATE) market.Eugene Lin, Vice President of Chroma's Semiconductor Test Equipment BU, discussed the recent growth in the markets of AI, IoT, and third-generation semiconductors (GaN/SiC). With the expanding demand for semiconductor components, particularly in AI and IoT applications, he highlighted the complementary relationship between these two markets. As IoT devices and AI applications become more widespread, Edge AI, enabling real-time computation directly from endpoint devices, is proving to be a vital emerging technology. Chroma's advanced SoC test system, the 3680, is well-suited for Edge AI and IoT communication chip testing, meeting the high-speed and high-precision mixed-signal testing requirements of AI chips. When coupled with the wireless/RF function board HDRF2, it can perform tests on RF chips for satellite-based navigation such as GPS, BeiDou, and Galileo, as well as common wireless network technologies like Bluetooth, Wi-Fi, and LPWAN. Catering specifically to GaN/SiC component testing, the Chroma 3650-S2 is purpose-built to meet the high-power needs of these applications.Power Performance Comparison, Precise Measurement of Leakage Current Emerges as KeySpancer Lee, Senior Manager of Product Marketing at Chroma's Semiconductor Test Equipment BU, delved into the challenges of testing GaN components. As power levels continue to escalate, the leakage current in GaN components increasingly impacts the power performance of the overall system. Achieving precise measurements at the scale of nanoamperes (nA) is crucial, especially given the rapid switching speeds involved. This is why for engineers, precise measurement capabilities are indispensable when it comes to automated test equipment (ATE). Mr. Lee highlighted that the Chroma 3650-S2 addresses the need for accurate measurement of small currents. To handle the high-frequency characteristics of GaN components, the pulse signals provided by the test platform meet the requirements of being small, precise, and fast. This capability enables engineers to observe the overall performance of the component. Since its launch in 2022, the tester has been capable of handling voltage levels of 3000V, which had already been upgraded to 3750V in 2023. Anticipations are set for the system to surpass the 4000V milestone in 2024, thereby fully meeting the test requirements for high-power applications.Addressing IoT and 5G Demands, Introducing New HDRF2 RF Test Module Lenskin Tsai, Director of Business Development at ADIVIC Technology, a Chroma Group subsidiary, shared insights into wireless and RF signal measurement. ADIVIC specializes in wireless communication measurement and is a key subsidiary within the Chroma Group. Mr. Tsai explained that the Chroma 3680 test platform, when paired with the HDRF2 module, assists customers in meeting their wireless and RF testing requirements even with limited resources. In recent years, the high cost of testing has significantly impacted the 5G sector, leading to fewer investments by industry players. However, based on Chroma's observations, this challenge has been acknowledged on a global level by the 3rd Generation Partnership Project (3GPP), the global mobile communications standards organization. As part of future spectrum planning, the organization plans to open up the 7-24GHz frequency band in a bid to reduce testing costs. At the same time, Chroma ATE has initiated the development of its next generation of RF test modules to continue meeting the wireless signal testing needs of both domestic and international service providers.Beyond Hardware – Chroma ATE Provides Customers with Platform Conversion ToolsShih-Fang Zeng, Technical Support Manager at Chroma's Semiconductor Test Equipment BU, approached the topic from the angle of a very tangible customer need: platform conversion. He explained to the audience how to transition from competitors' semiconductor test platforms to the 3680. Mr. Zeng pointed out that traditionally, platform conversions could take around three to six months, potentially causing missed market opportunities. The conversion process does indeed present numerous challenges. However, by adopting Chroma's comprehensive conversion solution, customers can complete the transition in about a month, with relatively simple steps. Relevant information during the conversion process is displayed directly on the system to aid customers in making adjustments, enhancing efficiency while reducing conversion costs.As a key player in the global ATE market, Chroma ATE remains proactive in responding to market trends and customer demands. By targeting applications with high-growth potential in the semiconductor market, Chroma is poised to expand its market footprint, with efficient platform conversion support as a crucial asset. The company is well-positioned to sustain stable performance and maintain its leadership in AI, IoT, and third-generation semiconductor testing.Chroma ATE's Semiconductor Test Equipment BU General Manager, George Chang, stated that as of December 2023, Chroma had shipped over four thousand semiconductor test equipment units globally. In terms of global ATE market rankings, Chroma sits among the top four playersLive demonstration of the Chroma 3680 Advanced SoC Test System and HDRF2 RF Test ModuleThe Chroma ATE Semiconductor Test Seminar attracted nearly 200 industry expertsLive demonstration of the Chroma 3650-S2 High-Performance Power IC Test Platform
Chenbro, recognized as a global leader in server chassis products and solutions, achieved two Gold Awards at the 2023 MUSE Design Awards together with three Gold Awards at the 2023 TITAN Innovation Awards, in recognition of its innovative product design of Tri-load high-density storage server chassis series.Following the success of the RM25324 2U Dual-load high-density storage server chassis, honored with the 2022 iF Design Award and COMPUTEX Best Choice Award, Chenbro introduces the 4U Tri-load series. The tri-load design is optimized for easy maintenance and operation stability of data center servers, with exceptional thermal management and load-bearing mechanisms. The user-oriented product design has earned wide acclaim from international design awards and gained recognition from global customers. Flexible Configurations of High-Density Server Storage Meet Diverse Demand of Data CenterTypically, it may take two or three 2U storage servers to support 36 3.5-inch hard drives. With Chenbro's new Tri-load series, users can install up to 36 or 48 hard drives in a 4U server chassis, supporting interfaces such as SAS, SATA, and NVMe Gen4. This product series fulfills the high-capacity storage needs of the data centers, optimizing server cabinet rack space to maximize efficiency and reduce costs.To address various application scenarios, the Tri-load series offers three different configurations. The RM43736 server chassis accommodates 36x 3.5 drive bays for storage while the RM43736 8T4S model supports 28 3.5-inch and eight 2.5-inch hard drives (with NVMe Gen 4 interface for flash devices). The upcoming RM43748 model, set to launch in 2024, can host 24 3.5-inch and 24 2.5-inch hard drives. Chenbro also provides customization services catering to diverse application needs based on clients' requirements.Moreover, the Chenbro RM25324 Dual-load product will further support EEB motherboard installation and the ATX motherboard. With ATX and EEB motherboard accommodation, Chenbro provides more flexibility for diverse market demand.Innovative Tri-Load Design Enables Front-Side and Dual-Side Access to Hard DrivesChenbro innovatively redefines the accessibility of server HDD by adopting a Tri-load setup with front and dual-side configurations. The motherboard placement is moved to the rear of the server, complemented by an exclusive airflow-guided thermal mechanism for optimal temperature control. Internal tests have shown stable working temperatures for front and dual-side hard drives, around 35-40 degrees Celsius, enhancing operation stability and the overall system lifespan.Considering the front and dual-side hard drive installation, which concentrates the chassis weight in the front half, Chenbro collaborated with partners to design an exclusive server slide rail capable of supporting the entire system's weight of 25 kilograms. Even under the load of installing up to 48 HDDs in the Tri-load products, maintenance personnel can effortlessly and safely pull out the chassis from the cabinet for HDD replacement without the risk of tilting. The tri-load access and toolless design ensures convenient maintenance when repairing or installing a new HDD.Exclusive Design for Improved Thermal Performance and Safer Server MaintenanceWith the rapid growth of data created, consumed, and stored, there is a simultaneous surge in demand for high-density storage servers in data centers. To maximize storage capacity within limited server space, designs in 2U and 4U products often adopt a front and rear hard drive configuration strategy. Front-access hard drives feature an easily replaceable hot-swappable design. In contrast, rear-access hard drives, constrained by structural limitations, require opening the top cover or accessing the narrow rear of the cabinet for replacement in case of malfunction.The traditional design may present two usage limitations. Firstly, due to inadequate cooling in such server chassis, the air temperature inside the server rises to around 40 degrees Celsius after passing through the front-access hard drives and mid-section motherboard. The rear hard drives operate at approximately 55 to 59 degrees Celsius, nearing the upper 60-degree Celsius limit. Secondly, replacing rear-access hard drives is more challenging, increasing time and effort for equipment maintenance.Aligning with AI Applications for Server Deployment in Data CentersAdapting to changing industry demands, Chenbro continuously innovates product design based on user needs, offering diverse server chassis solutions. Chenbro offers flexible, stable, and compatible server enclosure solutions for various motherboard brands. Customers can deploy server products or solutions based on specific hard drive configuration requirements in data centers or AI applications.In response to the Generative AI applications, servers must install more GPGPU cards than general-purpose servers. The market is gradually installing 8 to 10 GPGPU cards as a standard. Chenbro is also focused on the product development of advanced AI server chassis solutions to align with diverse AI applications to help customers in their AI journey.Chenbro Tri-load Family won the MUSE Design Awards and TITAN Innovation AwardsWith Chenbro's new Tri-load series, users can install up to 36 or 48 hard drives in a 4U server chassis, supporting interfaces such as SAS, SATA, and NVMe Gen4
