DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, today announced that it has partnered with Ambiq to distribute its ultra-low power semiconductors globally.Through the new partnership, DigiKey is now stocking Ambiq's Apollo4 Blue Plus. With one of the lowest dynamic powers for microcontrollers currently on the market, the new SoC allows designers of next-generation wearables and battery-operated smart devices to accelerate their innovation."DigiKey is pleased to add Ambiq to our core supplier line card," said David Stein, vice president of semiconductors at DigiKey. "As a leader in low-power SoC solutions, Ambiq has raised the bar with their new MCU & SoC, and we're excited to support designers, engineers, and builders globally as they work with these innovative solutions to accelerate progress."The Apollo4 Blue Plus is a 4th generation system processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT) platform. The device's complete hardware and software solution enables current and future battery-powered endpoint devices to achieve a higher level of intelligence without sacrificing battery life.The Apollo4 Blue Plus with Bluetooth Low Energy has more than enough computing and storage to handle complex AI algorithms and neural networks, always-on voice recognition, and display capability for smooth graphics."Ambiq shares the same value of meeting and exceeding customer's expectations with DigiKey," said Mike Kenyon, vice president of sales and business development at Ambiq. "We're excited to partner with DigiKey to offer our portfolio of ultra-low power, AI-enabled semiconductor solutions to help ease the customer's search for the best electronic components in one place."For more information about Ambiq and to order from their product portfolio, please visit the DigiKey website.DigiKey has partnered with Ambiq to offer their low-power IC solutions, including the Apollo4 Blue Plus, which enables Bluetooth Low Energy (BLE), graphics, and audio for always-connected IoT endpoints.

the TPCA Show and IMPACT Conference 2023 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 25th to 27th. The strategic brand presence of MKS, Atotech and ESI impressed visitors at the show. The crowded booth, the many paper presentations at the IMPACT conference and the specially hosted session on "AI advanced packaging" draw special attention to the company this year, a leader in Taiwan's PCB, IC Substrate and Semiconductor industries.MKS' teams on the show floorThe teams from both strategic MKS brands came together to represent the new combined company and its combined expertise in advanced PCB via drilling systems, lasers, optics and motion with process chemistry and equipment for current process and yield optimization, as well as next generation product development, e.g. for advanced material processing, via formation, glass package substrates, solar, batteries and more. One of the focal points at the show was on Optimize the Interconnect which can be achieved with Atotech and ESI products and services. Optimize the Interconnect is an MKS offering that provides printed circuit board (PCB) and advanced electronics packaging customers with a wide range of products and services for creating interconnects in the most advanced PCB and IC packaging designs. Services include PCB and advanced electronics packaging interconnect creation and evaluation services, access to the MKS Technology Centers for installation, setup and troubleshooting services, application development services, application labs and support, design and development services, and maintenance, repair and calibration services.This unique combination of MKS' via drilling and routing, and chemical plating expertise enables customers to accelerate their product roadmaps, solve the challenges associated with new materials and finer feature sizes, and thereby creating the interconnection more effectively with higher quality output and faster time to market.MKS' Management interviewed by GaryMKS' team with TPCA Mr. BaiWe offer a broad range of MKS' technologies and capabilities?Xsuch as lasers, precision optics, motion control, beam measurement, via drilling systems and process chemistry?Xto provide a unique solution for optimizing the manufacturing of PCB and advanced electronics packaging interconnects, a key part of the overall PCB and advanced electronics packaging manufacturing process."We understand the importance of providing our customers with the best solutions and services including sustainable products and energy-saving equipment to create win-win situations for our customers," said Daniel Schmidt, Global Marketing Director. Throughout the week, various local and international executives were available to meet with teams, customers, partners, and prospects to discuss the way forward with a special focus on the latest industry trends and challenges. The teams made special efforts to welcome and introduce the latest technologies and solutions to key industry participants and customers and the team demonstrated our new synergies and total solution package consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service to the Taiwanese PCB industry. After one year since the acquisition, the industry and especially our customers are expressing high confidence in our integration, and trust that we can provide them with more complete solutions to support their future product and manufacturing development roadmap.MKS' Industrial Forum and the audiencesPresenters of the MKS' Industrial ForumThe team also presented 8 papers at the IMPACT technical conference this year. A key event was the IMPACT industrial forum on October 25 from 1:30?V 3:30pm, where industry leaders in their respective fields were invited to speak about their contribution to the developments in AI to create a new era of advanced packaging. Daniel Schmidt, Global Marketing Director said: "The special industrial session helped our company to draw attention to industry trends, challenges, and possible solutions. Many questions were asked and discussed during the session, and it showed our contributions not only in our solutions, but also in the technology developments within our industries."

In a recent report, IDC revealed the transformative role of generative AI (GenAI) within IT operations (ITOps) across the Asia Pacific region. IDC's 2023 Future Enterprise Resiliency and Spending (FERS) Survey, Wave 6, highlights that almost half (43%) of organizations surveyed are currently exploring potential GenAI use-cases, with 55% of financial organizations and telecom firms investing in GenAI technology in 2023.With the digital-first mindset gaining momentum in Asia Pacific, businesses are seeking innovative solutions to enhance operations. GenAI stands out as a pivotal technology, offering companies the means to mitigate risks, boost efficiency, and improve overall productivity.Generative AI is gaining popularity in IT operations and IT service management, particularly in cost-sensitive Asia Pacific environments. This technology offers automation of ITOps tasks, reducing operational costs and optimizing resources. The region, which includes mature economies like Australia, Japan, and Singapore, and rapidly growing markets like India and China, has diverse IT requirements and issues. In growing economies, generative AI plays a vital role in facilitating scalable ITOps."Generative AI can increase the overall productivity of ITOps teams by streamlining ITOps workflows, lowering operational expenses, and increasing system dependability. However, GenAI systems must be properly implemented to ensure that they correspond with enterprise goals and that adequate guardrails are in place to manage unanticipated events," said Dhiraj Badgujar, Senior Research Manager, Digital Innovation Practice and xOps Program, IDC Asia/Pacific.In the report, IDC highlights ITOps trends that enterprises need to look out for as the GenAI revolution continues:• Rise of AIOps: AIOps solutions are becoming more popular in Asia/Pacific. ML and AI algorithms are being used by enterprises across the region to automate IT processes, monitor performance, and forecast and avoid IT disasters.• Predictive Analytics: AI-driven predictive analytics in ITOps helps enterprises anticipate IT issues and prevent disruptions.• Hybrid Cloud and Multicloud Management: As enterprises in the region embrace hybrid cloud and multicloud settings, GenAI will be used to manage these complex infrastructures.• Continuous Improvement: GenAI models will evolve in complexity and quality, likely integrating with IoT and edge computing to enhance data collection and analysis.Leading vendors are also diving into the GenAI wave. Notable implementations include Atlassian's Atlassian Intelligence, ServiceNow's generative AI capabilities for the Now Platform, New Relic's Grok, PagerDuty's generative AI for its Operations Cloud, and HCL Technologies Limited's BigFix 11.GenAI-driven ITOps can significantly impact business success for enterprises in the region. The IDC Asia Pacific Software Survey 2023 shows that over 50% of enterprises from countries like India, Indonesia, and Malaysia expect increased operational efficiency and automation from GenAI as part of their digital innovation strategy, highlighting the growing need for IT agility in these industries.

One aspect of the electronic supply chain that is unchanging is the effect emerging technologies have on the ebb and flow of the market. As technologies cycle in and evolve, they play a significant role in demand, supply, price, lead times, and manufacturing operations.Of course, this is dependent on consumer adoption as well, but as companies integrate more advanced technologies into end-user products, the market behavior all points in the same direction—up in demand and down in supply.Generative AI: The Emerging Technology that Continues to EvolveToday, generative artificial intelligence (AI) is the major stakeholder in technological advancement. With $1.3 trillion in growth expected by 2032, generative AI is the major driver of electronic component market activity, impacting supply, demand, pricing, and lead times.What Is Generative AI?*The term refers to the algorithms and models that identify the patterns and structures within the existing content.*The purpose is to create new content based on existing content (text, images, video, audio, and other media).*The intent is to deliver real-time, automated results for the end-user.Chipmakers and companies continue to see the rise in its applications with industries like automotive, consumer electronics, energy, healthcare, and more including it in end-user products. These industries apply AI for various use cases like customer communication, improved automation, and optimization.The "popularity" of generative AI stems from its usability, which chipmakers and companies are seeing with the adoption of chatbot programs like ChatGPT, DALL-E, and Bard. These programs rely on AI technologies like natural language processing (NLP), such as language models (LLMs), speech synthesis (SS), and computer vision (CV), which all create a user-friendly, convenient end-product.Demand for High-Performance ChipsThe speed of adoption and continued evolution of AI results in the need for high-performance chips like GPUs and FPGAs. As an example of how these chips are applied,*GPUs are specialized chips that can perform parallel computations for graphics and AI tasks.*FPGAs are reconfigurable chips that can be customized for specific AI tasks.While chipmakers update production lines to support the continued demand for supply, the companies continue to develop end-products to apply them. Among the companies increasing development and driving demand are Nvidia, Google, Amazon, and Microsoft, as they seek more market opportunities in AI applications.While these companies see revenue growth from this technology, it doesn't come without the challenges of competing for manufacturing support from the chipmakers.As Technologies Emerge, Manufacturers Pivot PlansProducing the chips that power AI applications comes with complex challenges. Nvidia leads the pack in the latest benchmark tests for chip speed, but competitors like Google and Advanced Micro Devices are attempting to carve out their own position. However, producing high-performing chips comes at a higher cost due to the design and fabrication requirements. As generative AI models become more advanced, chipmakers must pivot.Currently, manufacturers are allocating resources toward research and development (R&D) and implementing innovative manufacturing techniques. The balancing act between supporting the rise of AI and other verticals is tricky, especially considering Nvidia's head start. Today, Nvidia accounts for more than 70% of AI chip sales, a vast gap for other companies to bridge.Even with their popularity, Nvidia cannot keep up with all the demand, opening the window for other manufacturers to carve out market share. The same level of investment and support is needed in AI hardware and all the other parts of the technology stack, encompassing the data centers where AI applications occur. These centers include components from memory to interconnects, packing, and systems.It remains to be seen if manufacturers seeking unique solutions can allocate manufacturing support to keep up with demand.Strategic Supply Chain BuildingAmid the boon of generative AI, distributors encourage manufacturers and companies to think strategically to source the parts they need for the short and long term. As generative AI evolves, the market will move as it moves with the continued growth in demand and ways to manage supply over time.To learn how to get Out In Front of risks to your supply chain, reach out to Fusion Worldwide today to speak to a procurement specialist. Contact us today.Author: Tobey Gonnerman, President, Fusion WorldwideThe AI Effect: Supply, Demand, and Continued Adoption

When it comes to Field-Programmable Gate Arrays (FPGAs), the market often thinks of Xilinx under AMD, the PSG division under Intel, and Lattice Semiconductor as the major providers. However, in recent years, Chinese companies have started to emerge, gradually gaining ground in the FPGA field.Gowin Semiconductor is one of the few Chinese chip design firms capable of independently developing FPGAs. Since its establishment in 2014 nearly ten years ago, Gowin Semiconductor has grown to about 250 employees. Jason Zhu, the CEO of Gowin Semiconductor, said that the Company was founded in a period of rapid development in China's internet industry. Investors had less interest in the relatively obscure FPGA field. However, Gowin did not only aim to satisfy the Chinese market demand from the beginning; it also sought to meet the needs of other regional markets as part of its long-term strategy. Hence, the Company initially invested in FPGA products with TSMC's 55nm process. Although this process was not the most advanced at the time, TSMC had introduced various versions including low-power consumption and embedded flash memory in their 55nm process, enabling Gowin to launch different grades of product lines according to market demands.Despite Using TSMC's 55nm Process, Product Still Boasts Market Differentiation and CompetitivenessJason Zhu pointed out that Gowin tried to find a suitable product strategy for its positioning at the time. Even though the 55nm process was used, Gowin offered more than double the number of I/O counts compared with other competitors of the same class. Gowin's chip reliability was greatly improved coupled with the high stability of TSMC's process, which significantly outperforms other foundries in terms of process variation. The chip reliability enabled Gowin to easily gain AEC-Q100 certification and quickly enter the automotive market. Jason Zhu also noted that Gowin has been widely accepted by many customers in recent years due to the shortage caused by the pandemic. Customers became aware of Gowin while seeking for alternatives and were further attracted by shorter delivery times. Effective technical support from various dealers also played a crucial role. These factors have gradually led to market recognition of Gowin's technical capabilities. To date, Gowin has shipped over 3 million automotive products.Diversified Collaboration in the Automotive Sector, Open to Any Cooperation PossibilitiesSpeaking of developments in the automotive market, Jason Zhu revealed that China's electric car market has been thriving in recent years. Car manufacturers have a high degree of control over power transmission systems and often opt for independent development rather than relying on other suppliers. Under the premise, SAIC Motor of China once utilized Gowin's FPGA for gearbox development. In regard to IGBT-related system design, some Chinese car manufacturers have adopted Gowin's FPGA chips instead of the traditional designs using automotive MCUs (Micro Control Units) to reduce overall system costs.For vehicle cockpit system applications, Gowin collaborates with well-known processor companies such as MediaTek and UNISOC. Jason Zhu pointed out that traditional automotive processors have a relatively limited number of MIPI design channels. However, the current development of vehicle cockpit systems has moved towards multi-screen output. As processors from MediaTek and other SOC vendors struggle to effectively respond to multi-screen output, Gowin's FPGA can overcome this problem. Playing a similar bridging role in the development of ADAS and autonomous vehicles, how can signals from automotive sensors like cameras, radar, and LiDAR be processed by NVIDIA's GPU? In fact, most early automotive FPGA products did not include a MIPI interface; but Gowin's FPGA comes equipped with the MIPI interface, supporting at least six camera image inputs.Moreover, automotive screen manufacturers are beginning to introduce miniLED technology, featuring local dimming that can instantly react to different brightness areas on the screen. Based on this demand, large car screen manufacturers like BOE and LG have started to cooperate with Gowin. Jason Zhu candidly stated that Gowin plans to attend an exhibition in Japan in the upcoming November, and BOE is willing to lend Gowin the design samples developed cooperatively for the exhibition.The digital rearview mirror is another automotive system with great emphasis on instant reaction. Jason Zhu mentioned that the system design is complex, involving optical imaging technology for image capture from automotive cameras, to screen output in digital rear-view mirrors. Image correction on its own, which enables the driver to identify the objects instantly, already entails different professional fields and considerable technical difficulty. Not to mention the various weather changes that must be dealt with, such as rain and fog. Clear display on digital rearview mirrors is imperative in all these conditions. Thus, Gowin maintains a close cooperative relationship with relevant solution providers.Actively Expanding into the Global Automotive Market Beyond Satisfying China's Domestic DemandRegarding the future development of Gowin Semiconductor and the automotive electronics market, Jason Zhu clearly states that Gowin not only aims to meet the demand of the domestic market in China, but also has considerable ambitions for regions such as Europe, America, Japan, and Taiwan.In Taiwan, for example, Gowin collaborates with local distributors and has substantial cooperation with leading providers of power supply and green energy solutions. In Japan, there are ongoing collaboration plans with top-tier car manufacturers. In the European and American markets, Gowin is currently working with German TÜV Rheinland to further obtain ISO 26262 functional safety certification for its products, facilitating quick entry into the supply chains of international car manufacturers.Gowin also has a next-generation automotive FPGA, Arora V, set to launch soon. It's expected to adopt TSMC's 22nm automotive process, representing a significant upgrade from the previous 55nm technology. Naturally, this brings substantial improvements in terms of power consumption and performance. Jason Zhu candidly stated that the launch of Arora V aims to follow the successful formula of the previous generation while carving out a unique market position different from traditional FPGA giants, aiming to address many pain points in the development of secondary automotive systems. Moreover, Arora V has made significant advancements in SerDES (Serializer/Deserializer) technology, which may have the opportunity to disrupt the dominance of traditional IDM companies in high-speed signal transmission for automotive applications. In the field of electric vehicles, as the next-generation SiC power semiconductors gradually become mainstream in the market, Gowin does not rule out collaborating with leading international SiC component manufacturers in the fields of inverter and OBCs.In summary, although Gowin Semiconductor is a rare Chinese FPGA chip design company with a history of only about ten years and a market share that is still not as substantial compared to international giants, Gowin's ambition in automotive and diverse vertical applications is still evident. The advent of its new 22nm product is expected to gradually strengthen its position in the FPGA market and provide more visibility.Jason Zhu, CEO of Gowin Semiconductor, stated that the forthcoming next-generation automotive FPGA Arora V will likely use TSMC's 22nm automotive-grade process, hoping to follow the successful formula of the previous generation to address many pain points in the development of secondary vehicle systems.Gowin Semiconductor's latest 22nm FPGA product series, Arora V, supports high-performance DSP for AI computations, high-speed LVDS interfaces, and ample BSRAM memory resources. Arora V simultaneously integrates an independently developed DDR3 interface and 12.5Gbps SERDES which supports various protocols, along with diverse packaging choices. It is highly suitable for applications in various industries, such as netcom, servers, industrial, medical, automotive, and power systems needs, etc.

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced the launch of its new MedTech Beyond video series.Sponsored by NXP Semiconductors and RECOM Power, the MedTech Beyond is a three-part video series that dives into how medical devices are evolving and allowing for faster and more accurate diagnosis and treatment. From wearables to immersive tech and AI-powered innovations, the series explores how medical technology is creating opportunities to live longer, more fulfilling lives."As healthcare needs and technology both rapidly advance, DigiKey is proud to support the needed technology advancements," said Josh Mickolio, supplier business development manager – wireless and IoT for DigiKey. "Medtech advancements are enhancing every aspect of healthcare and ultimately leading to longer, more fulfilling lives.""Our power supplies play a pivotal role in enabling cutting-edge medical devices to operate flawlessly, ensuring precision and reliability," said Chris Wolf, president, RECOM Power. "At RECOM, we take pride in contributing to the advancement of medical technology, and we remain dedicated to powering a healthier and more connected world.""An important change in the medtech landscape is the 'scale' of care, as we see an increased need to manage healthcare in the home," said Luca Difalco, senior vice president, global sales offerings for NXP Semiconductors. "Our technology enables the democratization of health monitoring and diagnostics while helping to ensure the security of the data and device. The ability to offer advanced quality, long product lifecycles and a wide portfolio of offerings positions NXP well to help advance the medtech industry."The first of three videos in the series, "Holistic Health," is now live on DigiKey's website, and investigates the evolution of tech-assisted personal wellness and patient care. Personal wellness tech is no longer limited to counting steps. A new generation of patient care and personalized medical devices are using the latest technology to provide a better patient experience and a more holistic look at daily health.The second video, "Engineering Better Health Outcomes," explores how innovation happens behind the scenes with industry leaders. Given the critical importance of patient safety and security, medical device engineers, designers and supply chains face more pressure than most.The third and final video in the first season of the series, "Curing Tomorrow," examines the big thinkers investigating the next medtech breakthrough. From AI-powered diagnostics to predictive analytics, investigate how today's innovations are helping diagnose and treat the diseases of tomorrow.To learn more about the video series and how DigiKey is supporting the rapidly evolving medtech sector, visit the DigiKey website.

Prosemi Pte Ltd Singapore, a leading provider of electronic testing services, is proud to announce that it has been approved for ISO/IEC 17025:2017 and AS6171 (Detection of Suspect/Counterfeit Parts) accreditation from the ANSI National Accreditation Board (ANAB), Certification No. AT-3240. This accreditation is the international standard for the competence of testing and calibration laboratories. It is a prestigious accreditation that demonstrates Prosemi's commitment to providing high-quality testing services."We are very proud to have been awarded ISO 17025 accreditation," said Mr. Sheng Chuan Lee, Quality Director of Prosemi Pte Ltd Singapore. "This accreditation demonstrates our commitment to providing our customers with the highest quality testing services. We are confident that our ISO 17025 accreditation will give our customers the peace of mind of knowing that their products are being tested by a competent and accredited laboratory."To achieve ISO 17025 accreditation, Prosemi underwent a rigorous assessment by ANAB. The assessment included an evaluation of Prosemi's technical competence, management system, and quality assurance procedures. ANAB found that Prosemi meets all the requirements of ISO/IEC 17025.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is holding its first-ever ST Taiwan Tech Day at the Taipei New Horizon on November 2. The event is designed to provide valued customers and partners with the most up-to-date information on ST products and solutions to facilitate innovation and achieve success.With the theme "Our Technology Starts with You," this extensive technology event, ST Taiwan Tech Day, will offer insightful speeches and showcase over 40 demonstrations centered around four mega trends: Smart Mobility, Power & Energy, IoT & Connectivity, and Sensing the World. Attendees can experience first-hand the latest innovations and learn how ST's technologies are contributing to a safer, greener, and more connected world. It will also be a great opportunity to help developers and innovators stay ahead of the curve in today's rapidly evolving market.Innovation highlightsSmart MobilityZonal Gateway: Zonal Gateway acts as a bridge between the automotive central computer and traditional signal-based ECUs. This technology is supported by ST's wide range of automotive-grade products and enables Service-Oriented Architecture (SOA) with Data Distribution Service (DDS) protocol and Firmware Over-The-Air (FOTA). The Zonal Gateway offers a solution for modernizing automotive systems, allowing for seamless communication between different components and enabling efficient and secure updates.3rd-Generation SiC Modules: The industry leader in Silicon Carbide (SiC), ST offers a wide range of solutions to help developers improve the power efficiency and reduce the size and weight of automotive inverters with its 3rd-generation SiC modules. The traction inverter is a critical component in electric vehicles as it converts energy from the battery to drive the motors in the drivetrain. These converters must handle high power and currents, provide fail-safe operation, and handle EMC challenges. Alongside the SiC modules, ST's range of solutions includes AEC-Q101 qualified IGBTs, silicon and silicon-carbide MOSFETs and diodes, AEC-Q100 qualified galvanically isolated IGBT and MOSFET gate drivers, and SPC5 32-bit automotive microcontrollers. These offerings enable scalable, cost-effective, and energy-efficient EV traction inverter solutions.Power & EnergyDigital Power: ST's digital power solution is a comprehensive set of reference designs that empower designers to create efficient, feature-rich power supplies for a wide range of applications. The demo highlights two powerful solutions: the 25kW DAB DC/DC converter with ST's ACEPACK module, a highly efficient and reliable power converter ideal for industrial and automotive applications, and the 30kW Gen3 SiC MOSFET three-phase interleaved LLC solution with an STM32G4 MCU for ultra-high voltage EV charger -- a cutting-edge power supply designed to provide ultra-fast charging for electric vehicles.With these solutions, designers can create custom power systems that are efficient, reliable, and tailored to their specific needs.Precision Position Control: ST is a leading technology provider for motor control and servo drives, offering power device technologies, computational processing, isolated devices, industrial safety, ecosystem for industrial automation, connectivity, and predictive maintenance. With ST's state-of-the-art motor-control technologies, the motor can precisely control movement to a specific position. The demo consists of two small BLDC motors that can hold two shapes that do not fit together when they are in phase. The precision motor-control algorithm enables the rotation and movement of the shapes towards each other at any time, offsetting the relative position of the two shapes by 90 degrees while rotating. This unique position allows coupling between the shapes, with a rotation speed that ensures the phase shift is not noticeable, demonstrating precision position control in a harmonic movement coordinated simultaneously with other shapes.IoT & ConnectivityEdge AI Washing Machine Solution: This solution utilizes artificial intelligence (AI) to achieve unparalleled levels of energy and water efficiency by accurately measuring the weight of clothes inside the machine. The AI model generated by ST's NanoEdge AI Studio significantly improves measurement accuracy compared to traditional algorithms by analyzing and learning the features of current signals. This technology can advance the washing-machine industry to a next level by optimizing energy and water consumption while providing more accurate measurements.Compact Production Line with IO-Link System: The IO-Link automated product line demonstrates ST's total solution application in a smart factory, utilizing IO-Link technology to manage digital input/output, sensors, and solenoid air valve drivers. The demos include digital IO boards, sensor boards, and actuator boards from ST's Automation Competence Center's reference demo boards. The IO-Link products simplify the installation, setup, maintenance, and repair of factory automation systems, enhancing system flexibility to produce different product models. The IO-Link diagnostic function enables smarter and more reliable factory operations.Sensing the World3D Sensing Solutions: ST showcases the advanced imaging capabilities of the 3D stereo-vision camera solutions for machine-vision applications. The eYs3D stereo camera reference design features ST's high-performance, near-infrared VD56G3 global-shutter image sensors, ensuring the highest quality depth sensing and point-cloud creation. Additionally, the VD55H1 low-noise, low-power, indirect Time-of-Flight (iToF) sensor die, manufactured using advanced backside-illuminated, stacked-wafer technology, enables the creation of a small form-factor 3D camera capable of producing high-definition depth maps with a typical ranging distance of up to 5 meters in full resolution and beyond 5 meters with patterned illumination. This demo highlights ST's commitment to providing cutting-edge technology for machine-vision applications.ISPU for personal electronics: ISPU (Intelligent Sensor Processing Unit) is a new processing category embedded in ST's LSM6DSO16IS MEMS module. It is an ultra-low-power, high-performance programmable core that can execute signal processing and AI algorithms in real-time. The ISPU offers C programming and an enhanced ecosystem with libraries and 3rd-party tools/IDE, making it a state-of-the-art feature for any personal electronics.In addition to the insightful speeches and exciting technology showcase, more than 20 in-depth technical presentations covering Smart Mobility, Power and Energy, and IoT and Connectivity will provide a close look at the cutting-edge technologies that are shaping our world.To learn more about the exciting demos and program, please visit the ST Taiwan Tech Day event page.

MEAN WELL, the leading global supplier of Standard Power Supply (SPS), announces it will be participating in the 2023 Hong Kong International Lighting Fair Autumn Edition and showcasing its latest XLN series and theXLC series Compact Size LED Drivers, of which the power current output can be adjusted through NFC configuration. The company will also display an upgraded version of the XLG series with tunable digital light adjustments and new DALI-2 features, the LCM-40TW series of DT8 LED power supply driver, and the DC Centralized Bus Lighting Solutions. Visitors of the Lighting Fair will experience firsthand the systemic perfection of MEAN WELL's DALI and KNX lighting solutions.New product alert: XLN series and the XLC series Compact Size LED DriversBefore it officially goes to the market in November 2023, MEAN WELL's latest XLN and XLC series of miniature interior LED driver power supply will be shown at the Hong Kong International Lighting Fair. The new products have plastic coverings designed for Class II/2 and dual insulation. They are suitable for both interior lighting and commercial lighting with outstanding characteristics, including a constant power output, tunable power adjustments through NFC on the MEAN WELL App, 3-in-1 digital light adjustments, DALI-2, and other light adjustments through KNX, Bluetooth, Matter, and so on.MEAN WELL XLN and XLC series miniature interior LED driver power supply, featuring Class II/2 and dual insulation design and suitable for both interior lighting and commercial lightingThe XLN series are all wire types, and the XLC series are terminals either with a side covering (which makes them wire types) or without a side covering. Rex Lin, the product manager of MEAN WELL's Product Strategy Center, said the new series is meant to satisfy the diverse needs of MEAN WELL's customers. Miniature lighting, for example, requires an independent power supply due to the lack of space for an internal power supply and the need to meet regulations and make repairs. The new series ensures user safety and product quality by complying with IEC 61347 and UL 8750 specifications for lighting.DALI-2 features for higher product compatibilityMEAN WELL highlights the new DALI-2 features of its tunable XLG power supply series, allowing its customers to integrate with smart lighting controls. DALI, which stands for Digital Addressable Lighting Interface, is an international protocol for digital lighting controls in compliance with IEC 62386. As the DiiA association continues to work on new specifications of DALI-2 applications, the protocol provides clear and thorough specifications.MEAN WELL XLG power supply series covers constant current or voltage lighting applications, providing IP67 water-proof, 3-in-1 light adjustments, DALI-2 digital light adjustments functionalities for customers to perform integration on their smart lighting control systems."Standardization has brought many benefits. As of today, all products aligned with the DALI-2 protocol are compatible and interchangeable. That has solved many incompatibility issues we used to see," Lin said.While complying with the latest safety requirements, the XLG-DA2 series provides distinctive pairing applications with constant current or voltage lighting. With iron coverings, they allow for systemic integrations of DALI light controls with different types of interior and exterior LED lightings and are pairable with constant current lightings, such as streetlamps and projection lights, and constant-voltage light strips at 12V, 24V, and 48V.Tunable color temperature for a user-centric experienceBesides DT6 LED light control, MEAN WELL is adding DT8 features to the LCM-40TW series, aiming to create a more human-centric user experience. In compliance with the DALI association's IEC 62386-209 (DT8) standards, the series provides an automatic tunable color temperature based on users' lifestyles. The new feature makes lighting a part of the users' lives, creates a high-end ambiance, and helps improve users' wellness and work efficiency.The LCM-40TW series has two output circuits for two sets of LED lights with different color temperatures. They can pair with multiple power currents falling within 500 to 1050 mA. In addition, the series can change the color temperature of the lighting through DALI ports. Users can change the color temperature with a push button without connecting the lighting to a DALI master cable.Seamless integration of the DC Centralized Bus Lighting SolutionsAt the 2023 Hong Kong International Lighting Fair Autumn Edition, visitors can experience MEAN WELL's smart DC Centralized Bus Lighting Solutions integrated with DALI or KNX lighting systems. Designed for interior lighting, the DC Centralized Bus Lighting Solutions reduces power waste and saves power costs for users. The installation costs of the overall lighting system are also significantly lower.Tony Hsieh, Section Manager of MEAN WELL's Technical Service Center, said his team has completed many successful use cases over the years. For example, a boutique watch store at the Taipei 101 shopping mall has adopted DALI digital lighting. As demand for green buildings and carbon-neutral operations increases, MEAN WELL's distributors have contacted many property developers to expand sales of the solution, according to Hsieh. He pointed out that the remote software configurations of MEAN WELL's products make the set-up of lights, groups, scenarios, and sequences much easier and faster.Follow MEAN WELL's Virtual Expo, LinkedIn account, and YouTube channel for the latest product information if you cannot visit the 2023 Hong Kong International Lighting Fair Autumn Edition.

SK hynix Inc. announced today that it has started commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo)*, the world's fastest DRAM for mobile with 9.6Gbps speed.SK hynix (or "the company", www.skhynix.com) said that it has obtained the validation that the LPDDR5T is compatible with Qualcomm Technologies' new Snapdragon® 8 Gen 3 Mobile Platform, marking the industry's first case for such product to be verified by the U.S. company.*LPDDR: Low power DRAM for mobile devices, including smartphones and tablets, aimed at minimizing power consumption and that features low voltage operation. The latest specifications are for the 7th generation, succeeding the series that end with 1, 2, 3, 4, 4X, 5 and 5X. LPDDR5T is a newly developed version by SK hynix, and an upgraded product of the 7th generation (5X), prior to the development of the 8th generation LPDDR6.SK hynix has proceeded with the compatibility validation of the LPDDR5T, following the completion of the development in January, with support from Qualcomm Technologies. The completion of the process means that it is compatible with Snapdragon 8 Gen 3.With the validation process with Qualcomm Technologies, a leader in wireless telecommunication products and services, and other major mobile AP(Application Processor) providers successfully completed, SK hynix expects the range of the LPDDR5T adoption to grow rapidly.The company plans to provide 16GB-capacity product, a combination of multiple single LPDDR5T chips, of which data processing speed is 77GB per second, equivalent to processing 15 Full-HD movies within a second.The LPDDR5T product also holds an edge in power consumption, performing at the lowest voltage of the 1.01~1.12V standards stipulated by the Joint Electron Device Engineering Council, or JEDEC.SK hynix applied the HKMG (High-K Metal Gate)** process to bring a remarkable improvement in both speed and power efficiency. With the adoption of this technology, the company expects the LPDDR5T to gain a large share of the market before the next-generation LPDDR6 is introduced.**HKMG: A next-generation process that uses a material with a high dielectric constant (K) in the insulating film inside DRAM transistors to prevent leakage currents and to improve capacitance. It reduces power consumption, while increasing speed. SK hynix was the industry's first to integrate the process in mobile DRAM in November."Generative AI applications running on our new Snapdragon 8 Gen 3 enables exciting new use cases by executing LLMs and LVMs on device with minimal latency and at the lowest power," said Ziad Asghar, Senior Vice President of Product Management at Qualcomm Technologies, Inc. "Our collaboration with SK hynix pairs the fastest mobile memory with our latest Snapdragon mobile platform and delivers amazing on-device, ultra-personalized AI experiences such as AI virtual assistants for smartphone users.""We are thrilled that we have met our customers' needs for the ultra-high performance mobile DRAM with the provision of the LPDDR5T," said Sungsoo Ryu, head of DRAM Product Planning at SK hynix.Ryu said that smartphones are expected to grow their presence as the key devices where the AI technologies are fully applied onto in coming years. "I believe the smartphone functions, backed by excellent DRAM for mobile, should continue to improve. We will continue to work toward strengthening our collaboration with Qualcomm Technologies to advance the technology in this space."