According to statistics, the global number of connected devices reached 16 billion by 2023, more than double the global population! However, there are many device manufacturers who have yet to adopt security by design principles leading to hacking and privacy risks at the population level. To protect consumers many governments consider device security as a crucial national security issue and are in the process of legislating for its implementation. This trend will impact the entire electronics industry, from IP, chips, software and end devices, posing a challenge for stakeholders to comply with various security regulations and laws.In response, Arm has incorporated cybersecurity requirements mandated by different regulations, including those from the EU and the UK, into the new version of PSA Certified Level 1 v3.0 document. Leveraging its large security ecosystem, Arm assists stakeholders in preparing early for compliance.Irresistible Legislative Trends for StakeholdersPSA (Platform Security Architecture) Certified, initiated by Arm in 2018 to address various underlying security issues, has become a common security platform in the IoT industry, with a total of 200 PSA Certified products globally.Regarding the latest legislative trends in security, Rob Coombs, Security Director, Arm & PSA Certified (PSA JSA) Chair, mentioned that in Europe, governments are formulating baseline cybersecurity regulations. For Taiwanese companies operating in the European market, preparing before the laws are enforced is crucial.The UK's Product Security Telecommunications Infrastructure (PSTI) Act is the fastest approaching regulation, set to come into effect this April. Additionally, the EU's Radio Equipment Directive (RED) has cybersecurity requirements that will come into force in August 2025. A couple of years further out is the Cybersecurity Resilience Act (CRA) that is currently under legislation. In the United States, state laws have already banned default passwords, such as California's SB-327. PSA Certified brings all of these requirements together in a new section of PSA Certified Level 1. OEMs can answer the Level 1 requirements to see if they comply or assess the gap that needs to be fixed. They can optionally get a third party assessment from a test laboratory to get an impartial assessment."For PSTI, manufacturers can use the PSA Certified Level 1 certification to document whether their submitted chip/device/software designs comply with the security requirements, allowing third-party labs to review their answers. As for EU's RED and CRA, the new version of PSA Certified Level 1 document also includes the draft requirements from regulations, enabling companies to prepare this year without waiting for the regulations and standards to take effect. As PSA Certified is widely accepted in the industry as a security solution, using it as a design foundation will help companies address upcoming security regulatory issues in a more cost-effective and simpler manner."Assisting OEMs in Overcoming Challenges to Security DesignIn addition to various security standards, OEMs now face new regulatory issues, making security design for IoT devices more challenging. Rob Coombs believes that regulations will be a more significant concern for stakeholders because this involves whether products can be sold. Therefore, whether products can adhere to security principles from the outset will be the starting point for the design challenges that stakeholders face.However, on the other hand, the complexity of the entire OEM value chain is even more challenging. Chip manufacturers are responsible for providing Hardware Root of Trust (RoT), which includes security functions such as encryption and keys. The software layer, such as FreeRTOS LTS or one of the Linux platforms, is responsible for executing OTA updates and secure communication. Typically, OEMs combine the software platform of their choice with a main System on Chip (SoC), then add their own application code. It is challenging for OEMs to answer product level security requirements when they have not designed the chip or platform software.To overcome this issue, PSA Certified uses composition which means that the OEM can reuse a pre-certified chip or software platform. They only have to answer a smaller set of security questions that focuses on their device application code. Growing cybersecurity regulation will force all device makers to adopt security by design practices, PSA Certified makes that as easy as possible by dividing up the problem into chip + system software + deviceOne way that security is better on Arm is the availability to chip vendors of open source trusted firmware for MCUs and MPUs. This provides a consistent set of crypto and secure storage APIs available to OEMs from many chip manufacturers. Providers of key middleware components such as Other The Air (OTA) updates and Transport Layer Security (TLS) can use these standardized interfaces to the chip's hardware security to better protect devices and services.Rob Coombs likened it to, "Just as PCs have BIOS and TPM, chips based on the Arm architecture have a PSA Certified RoT to achieve secure boot and PSA Crypto API to standardize crypto functions."Building a Strong Security Ecosystem Starting from the Root of Trust (RoT)Anurag Gupta, Director Business Development, Platform Security Architecture at Arm, added that PSA Certified has three different levels of certification for the chip. PSA Certified Level 1 indicates that the chip has a hardware RoT and the chip vendors written assessment responses were passed by the lab. PSA Certified Level 2 involves chip testing in the lab for basic software attacks and is suitable for most connected devices. PSA Certified Level 3 demonstrates protection from substantial physical and software attacks on the RoT, assessed in the lab by passing penetration testing.Therefore, OEMs can choose the appropriate security level according to their needs, whether it only needs to pass software attacks or needs to pass both software and hardware attacks. "This is the first time in the industry that there is a common language for OEMs to tell chip manufacturers what security level chips they need, which is a significant step forward for security design."Moreover, since many software engineers are not familiar with hardware security technologies, defined PSA Certified APIs make it easier for developers to leverage the security features provided in chips. Developers who choose a chip that supports PSA Certified APIs can use hardware security functions on different chips with the same code, greatly simplifying product development.Rob Coombs stated that PSA Certified is independent of architecture, and certification is not exclusive to chips based on the Arm architecture; it is applicable to other architectures as well. However, Arm's various security offerings, such as TrustZone technology and availability of optimized trusted firmware with common APIs have been optimized for PSA, making chips based on the Arm architecture best suited to a security by design approach and PSA Certified.Therefore, under Arm's promotion for many years, PSA Certified has not only been adopted by leading chip manufacturers but has also been widely expanded to many software and device manufacturers, constructing a powerful security ecosystem.At the same time, Arm continues to strengthen its security technologies. In addition to adding Memory Tagging Extension (MTE) protection methods to newer Arm processors, which effectively reduce serious security errors such as memory security violations and memory corruption, significantly reducing the chances of being attacked, Arm will also later this year transition to Long Term Stable for Trusted Firmware, making security solutions on the Arm architecture even more attractive.*Visit the PSA Certified website: https://www.psacertified.org/ *Download the 2023 PSA Certified Security Report - Regulations and Security: The Multiplier Effects, to understand the insights from PSA Certified founders and partners on the security of connected devices amidst increasing security investment costs due to rising security demands.*Watch the video of the "Arm Security Summit 2024" to understand how Arm assists industries in designing a more secure world on Arm.*To learn more about certifying products, visit: https://www.psacertified.org/development-resources/certification-resources/The 2023 PSA Certified Security Report - Regulations and Security: The Multiplier Effects
With net zero carbon emissions becoming a global commitment, an automotive industry revolution gets well underway. TAIPEI AMPA and AUTOTRONICS TAIPEI 2024 will take place April 17-20 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) in concurrence with 2035 E-Mobility Taiwan at the same venue. The three joint exhibitions will cast a spotlight on Taiwan's all-round automotive industry ecosystem as well as local and foreign iconic manufacturers' product roadmaps and technological strengths to help event participants capture next-generation mobility market opportunities.Already a key event catching the attention of the global automotive industry as well as the mobility technology sector, TAIPEI AMPA and the joint exhibitions will gather close to 1,000 exhibitors hosting 2,700 booths. Centered on "RE:SHAPING THE AUTOMOTIVE INDUSTRY," the event will focus on four themes: "RE:DUCE," "RE:THINK," "RE:SECURE" and "RE:CONNECT." Not only will visitors gain a perspective on international industry trends but they will also see how Taiwan's innovations and achievements give a new look and feel to automobiles and motorcycles.RE:DUCE – a look into the automotive industry's carbon reduction and sustainable development strategiesWith ESG being at the center of the automotive industry's attention, leading automakers growingly choose to work with partners that make ESG a priority. In response to the trend, Taiwan-based manufacturers are also making efforts toward carbon reduction and sustainable development so as to capture preemptive green supply chain opportunities. Continuing to promote ESG, the Taiwan External Trade Development Council (TAITRA), organizer of TAIPEI AMPA and the joint exhibitions, will set up an alternative fuel vehicles and solutions pavilion at this year's event for hydrogen cars and new energy vehicle components. The aim is to uncover the development potential of clean energy sources for vehicles. Moreover, TAITRA also has a series of "ESG Achievement" activities planned, including the awarding of "Golden ESG Achievement" and "Green ESG Achievement" marks to exhibitors showing noteworthy EGS actions. There will also be a platform for companies to share their sustainable development strategies and accomplishments, allowing visibility on the mobility industry's efforts and commitments toward sustainability and carbon neutrality. RE:THINK – a grasp on the latest international trendAutomotive industry transformation is something of great urgency as cars go electric and get smart. To help the industry prepare for the impact, TAITRA will hold an international forum during the event period. Keynote speakers from home and abroad will shed light on the development trends of automotive safety systems and new energy cars. There will also be an abundance of event activities. For example, the "guided tour" activity will have industry specialists or key opinion leaders (KOL) guide visitors on a tour of the exhibitions. The tours will be planned based on industry backgrounds to allow visitors to instantly grasp the key products and technologies at the exhibitions while broadening and deepening their understanding. RE:SECURE – a search for new automotive safety solutions Continuing automotive technology advances and supply chain changes introduce never-before-seen challenges to safety – the core of mobility. In line with the "RE:SECURE" theme, which highlights road and vehicle safety, an automotive safety equipment and system pavilion will be set up at the event, showcasing active and passive safety systems as well as solutions from iconic automotive cybersecurity firms. There will also be an automotive safety consultation service booth to help companies understand new generation automotive safety regulations and critical issues.RE:CONNECT – a reinvention of a value chain for the future mobility eraBurgeoning ICT developments allow automotive systems to incorporate more and more innovative materials and technologies. Procurement meetings between the traditional automotive industry and various industries have become a new business model. At this year's event, procurement meetings will more actively bridge exhibitors and international buyers, accelerating their connection with the global industry ecosystem and helping them tap worldwide opportunities. Vehicle modification is an art form that makes use of automotive components. The "Speed & Crafts" special exhibition will showcase winners of the motorcycle modification contest and present Taiwan's state-of-the-art modification craftsmanship. "Talent Transistors" will match young talents seeking career opportunities in the industry with potential employers, helping drive talent flow and boost market competitiveness.A global-scale mobility event for an all-round automotive industry ecosystemAn automotive industry revolution driven by sustainability, smartization and safety is well underway. Joint industry-government-academia efforts worldwide will speed up the revolution. The TAIPEI AMPA, AUTOTRONICS TAIPEI and 2035 E-Mobility Taiwan 2024 event will cast a spotlight on the new global supply chain and shape a 360º mobility ecosystem. Visitors of the event will explore cutting-edge automotive industry developments.For more information visit https://www.taipeiampa.com.tw/en/TAIPEI AMPA, AUTOTRONICS TAIPEI and 2035 E-Mobility Taiwan 2024 – an annual global-scale automotive industry eventPhoto: TAITRA
Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024. Cincoze will display its range of world-class industrial embedded computing products around the theme of "Comprehensive AI Edge Computing Solutions," encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Fanless Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.Rugged Embedded ComputersRugged Embedded ComputersCincoze Rugged Computing – DIAMOND product line is for harsh industrial environments where many computers would struggle. The seven computers in the range have wide temperature, wide voltage, and industrial-grade protections, while each model offers different performance, expandability, size, power efficiency, and industry certifications. Every model supports additional I/O and functions through Cincoze's exclusive modular expansion technology for maximum application flexibility.Industrial Panel PCs & MonitorsIndustrial Panel PCs & MonitorsCincoze Display Computing – CRYSTAL product line consists of six different series, including industrial panel PCs (CV-100/P series) and monitors (CV-100/M series) for general use in harsh industrial environments, sunlight-readable panel PCs (CS-100/P series) and monitors (CS-100/M series) for use in high brightness environments or outdoors, and open frame panel PCs (CO-100/P series) and monitors (CO-100/M series) for seamless integration in advanced machine equipment. The CRYSTAL line offers a range of screen sizes, display ratios, touch methods, resolution, brightness, and other options to provide a complete and comprehensive selection.Embedded GPU ComputersEmbedded GPU ComputersCincoze GPU Computing – GOLD product line is for rapidly evolving AI technologies by providing the computing power needed for machine learning and AIoT in industrial environments. Cincoze will showcase the GM-1000 and GP-3100 series in the GPU Computing – GOLD product line. The GM-1000 is a high-performance computer that supports an MXM GPU and is best suited for machine vision applications with limited installation space. The GP-3100 is Cincoze's flagship model that supports up to two full-length graphics cards with the addition of a GPU Expansion Box and can perform sophisticated and complex visual inspection or autonomous driving. The GP-3100 has three patents for its heat dissipation, expansion, and GPU card mounting bracket designs, not only solving customer pain points but also winning many awards.New ProductsThe New Products Zone will showcase a number of the latest products with the latest Intel Raptor Lake processor. The biggest highlight is the new Machine Computing – DIN RAIL PC (MD Series) product line, specially tailored for control cabinets, further filling out Cincoze's range for smart manufacturing. In addition to its excellent processing performance, expansion capabilities allow adding I/O, storage, and expansion sockets according to application needs, providing more options and flexibility.Embedded World Exhibition InformationItemDetailDateTue. – Thu., April 9 - 11, 2024PlaceExhibition Center, Nuremberg, GermanyStandHall 1, Stand 1-260TimeApril 9: 09:00-18:00April 10: 09:00-18:00April 11: 09:00-17:00
Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is set to make a significant debut at Embedded World 2024 (Hall 3, Booth 3-230) in Nuremberg, Germany from April 9th to 11th, 2024. With a thematic focus on 'Embedded Solutions for Resilient Guidance and Steady Progress', Darveen presents a comprehensive display across three exhibition areas, showcasing a diverse range of industrial embedded product solutions meticulously designed for various industrial applications.Visit Darveen's booth and check out our latest products at the exhibition, including:Vehicle Mount ComputersAt the forefront of port terminal digitization, Darveen introduces its latest vehicle mount computers featuring high-performance Intel 12th-generation processors. Additionally, ARM-based Android vehicle mount computers and all-in-one vehicle computers for railways equipped with M12 waterproof and lockable connectors will be showcased. These cutting-edge solutions promise to revolutionize fleet management or machinery for ports, forklifts, trucks, mining vehicles, and agricultural vehicles to a new level.Rugged TabletsDarveen's rugged tablet computers epitomize exceptional durability and stability, complying with stringent testing standards such as IP67 and MIL-STD-810H military specifications. Building upon a year of innovation, Darveen introduces high-performance models powered by Intel 12th generation processors and boasting 1,000 nits brightness, significantly enhancing operational efficiency for law enforcement, public sector entities, and field workforce operations.IoT Automation SolutionsDarveen also showcases the latest embedded computers and industrial panel PCs, serving as the cornerstone of IoT-driven automation. These solutions cater to diverse applications in smart factories, industrial automation, warehouse management, and smart city infrastructure.Join us at Booth 3-230 at Embedded World from April 9th to 11th, 2024!Explore Darveen's Cutting-Edge Embedded Computing Solutions for Industrial Applications
SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.HBM (High Bandwidth Memory) is a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed compared to conventional DRAM products. HBM3E, the extended version of HBM3, is the fifth generation of HBM following HBM, HBM2, HBM2E and HBM3.SK Hynix (or "the company", www.skhynix.com) being the first provider of HBM3E, a product with the best-performing DRAM chips, extends its earlier success with HBM3. The company expects successful volume production of HBM3E and its experiences as the industry's first provider of HBM3 to help cement its leadership in the AI memory space.To build a successful AI system that processes a huge amount of data quickly, a semiconductor package should be composed in a way that numerous AI processors and memories are multi-connected. Global big tech companies have been increasingly requiring stronger performance of AI semiconductors and SK Hynix expects its HBM3E to be their optimal choice that meets such growing expectations.The latest product is the industry's best in all the aspects required for AI memory including speed and heat control. It processes up to 1.18TB of data per second, equivalent to processing more than 230 full-HD movies (5GB each), in a second.As AI memory operates at an extremely high speed, controlling heat is another key qualification required for AI memories. SK Hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following the application of the advanced MR-MUF process.MR-MUF (Mass Reflow Molded Underfill) is the process of stacking semiconductor chips, injecting liquid protective materials between them to protect the circuit between chips, and hardening them. The process has proved to be more efficient and effective for heat dissipation, compared with the method of laying film-type materials for each chip stack. SK Hynix's advanced MR-MUF technology is critical to securing a stable mass production on the supply side of the HBM ecosystem as pressure on the chips being stacked can be reduced, while warpage control is also improved with the adoption of this process.Sungsoo Ryu, Head of HBM Business at SK Hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products. "With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider."SK Hynix begins volume production of the industry's first HBM3E
NEXCOM, a leading industrial computer manufacturer, has long been dedicated to edge computing and industrial IoT solutions. Its Mobile Computing Solutions Business Unit (MCS) focuses on the Edge AI railway and in-vehicle application fields.This week, NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA.NEXCOM will be showcasing at booth #339 its full range of IP67 Rating and high-performance AI-powered rugged edge railway and in-vehicle computing solutions focusing on the AI transportation market, including smart bus & rail transit, AI-aided public works, smart AI patrol, material-handling management, and earth-moving vehicles. Among the foregoing, NEXCOM's expertise in railway solutions powered by the NVIDIA Jetson platform for edge AI and robotics is a must-see. Its AI-ISV providers harness the NVIDIA Jetson modules and comprehensive NVIDIA JetPack software stack. Combined with NEXCOM railway computers and its NEXCOM Accelerator Linux (NAL), these capabilities have helped lead to the creation of several innovative railway applications like 3D sensor-based perception and predictive maintenance systems, pantograph inspection systems, and solutions for crowd/people counting management. These solutions contribute to safer, more efficient, and intelligent railway operations.Using the NVIDIA Jetson platform to help create a robust and high-performance railway and in-vehicle solutionIn recent years, NEXCOM has combined its solid hardware strength with the software technology of upstream computing partners to develop a variety of high-performance Edge AI computing platform products for smart railway and in-vehicle applications. In addition to meeting NVIDIA Partner Network requirements, NEXCOM was also selected as an NPN member due to its expertise in the design of its IP67 Rating Railway computer with the full line-up of NVIDIA Jetson Orin modules and high-performance computing platforms.Leo Chang, associate vice president of NEXCOM's MCS Business Unit, said that the company has incorporated a diverse product portfolio of NVIDIA technology that includes the NVIDIA Jetson AGX Orin, NVIDIA Jetson Orin NX, and NVIDIA Jetson Xavier NX. These products have been deployed in AI solutions in collaboration with international local railway operators and several cities across Europe and Asia, and NEXCOM is continuously expanding further.NEXCOM continues to strengthen the application of terminal Edge AI software-defined edge computing solutions to create a more convenient and safe smart living environment for human society.Through continuous focus on improving edge computing technology and using AI computing power to assist partners in building efficient and stable AI railway and in-vehicle transportation systems in harsh environments, NEXCOM's solutions have spread to several cities overseas. At the beginning of the year, NEXCOM signed a cooperative agreement on intelligent transportation applications for railways with solution application providers in Germany and Hong Kong. By participating in the NVIDIA GTC conference, NEXCOM aims to build more international transportation project cooperation.In the face of the intelligent trend that will be developed in multiple aspects of edge applications, NEXCOM's Edge AI computing product line covers multiple fields such as AI transportation, smart retail, urban governance, and manufacturing. NEXCOM will continue to strengthen the layout of AI technology in vertical fields in the terminal Edge AI software-defined edge computing solution, and continue to use NVIDIA technology, to expand the Edge AI computing platform product items, improve the diversity and performance of AIoT solutions, assist customers in quickly building efficient AI application systems, and successfully promote digital transformation. NEXCOM aims to bring humans a more convenient and safer smart living environment.NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has launched season 3 of its "Farm Different" video series.DigiKey's season 3 of its "Farm Different" video series is sponsored by Analog Devices, Inc. (ADI) and Amphenol Industrial.Season 3 features three episodes that provide a look into the future of farming to determine what innovations will power the next generation of global food production. The series explores how robotics and autonomous vehicles are coming to the farm and also dives deeper into the integral data necessary to identify local strategies, maximize yield, and help farmers sustainably feed the planet.DigiKey launched Season 3 of its "Farm Different" video series with ADI and Amphenol Industrial."The agricultural community has never backed down when facing sustainability challenges," said Josh Mickolio, supplier business development manager at DigiKey. "Navigating reduced labor pools, unpredictable weather, and rising costs threatens growth in production and the survivability of small and large farming operations alike. This season highlights the fertile future of smart farming, showcasing solutions that leverage the creativity, ingenuity, and resilience this industry is known for.""With factors such as population growth and climate change, the future will require us to achieve much more with far less, and technology has a key role to play in precision agriculture," said Tzeno Galchev, marketing director at ADI. "Our technology is helping enable efficiencies across the board. This includes smart edge applications like livestock management and tracking that use our ultra-low power technologies, all the way to automating, electrifying, and navigating the machinery that feeds the planet using our inertial measurement units, connectivity, and battery management solutions.""In the realm of agriculture innovation, our connectivity solutions are at the heart of empowering farmers to 'Farm Different,' ushering in a new era of precision, efficiency, and sustainability," shared Mark Cunningham, general manager at Amphenol Industrial. "At Amphenol, we are committed to enabling the transformation of agriculture, where technology and data converge to cultivate a brighter future for farming."The first of three videos in the series, "Agriculture's Tech Revolution," explores how farms are incorporating new technologies to transform the way they plant, monitor, and harvest crops. Learn how today's agricultural technology innovators are making the latest solutions and the benefits they provide accessible to farming operations of all sizes.The second video, "Planting the Seeds of Future Farms," dives into new forms of energy management, connectivity, and electrification that are laying the groundwork for tomorrow's farming solutions. Discover how new innovations will leverage this foundational infrastructure well into the future.The third and final video, "Exploring Intelligent Agriculture Solutions," details the latest advancements in everything from drones to autonomous tractors, crop monitoring, and precision farming methods. Delve into the ways new solutions are improving efficiency, yields, and sustainability.To learn more about the video series, sustainable production, and how DigiKey is supporting the rapidly changing agricultural sector, please visit the DigiKey website.
iCatch Technology, a leading AI image processing IC design company, has recently launched the V77 AI Imaging SoC capable of recording 4K 60fps videos. Despite its enhanced system performance, the V77 maintains low power consumption, delivering a richer user experience for sports cameras and drone applications.V77, AI Imaging SoC designed for wearable camera applications. Photo: iCatch TechnologySports cameras have become increasingly popular for travelers, evolving from traditional digital cameras and smartphones. In recent years, various products such as drones, panoramic cameras, and gimbal cameras have emerged with demands for low power consumption, high image quality, and high frame rates, posing significant challenges for conventional Imaging SoCs. Since its inception, iCatch Technology has been dedicated to providing solutions primarily for Japanese digital camera applications. Over the past two decades, the company has witnessed the continuous evolution and development of sports cameras, demonstrating a profound understanding of product experience and customer needs. From video dimensions of visibility (high dynamic range imaging), clarity (low-noise high-definition imaging), and understanding (AI image recognition) to audio dimensions of audibility (real-time listening), clarity (noise cancellation), and understanding (AI voice recognition), iCatch Technology has been advancing the wearable imaging application, accumulating a solid reputation for its products. With solutions tailored to product needs and high integration, the company has facilitated rapid mass production for its customers.The V77 AI Imaging SoC integrates iCatch Technology's 8th-generation dual-core AI Image Signal Processor (AI-ISP), supporting low-latency AI noise reduction and low-light full-color technology. Equipped with 120dB High Dynamic Range processing comparable to human vision, coupled with Local Tone Mapping (LTM) technology, the V77 supports multiple camera inputs, real-time image distortion correction and stitching, and includes the 3rd-generation high-precision multi-axis Electronic Image Stabilization (EIS) engine. Additionally, it features a 1.5 TOPS efficient AI Neural Processor Unit (NPU) accelerator, complemented by low-power Smart H.265 codec for high-definition streaming applications. Moreover, the V77 supports continuous shots up to 48 Megapixels at 10 frames per second, integrates an audio signal processor DSP supporting audio 3A (AGC, ANS, AEC) algorithms, and features USB3.2 Host/Device dual-function interface and SDIO 3.0 expansion interface with speeds of up to 208MHz, significantly enhancing external data transfer rates for USB, LTE Dongle, Wi-Fi and other applications. With advanced memory compression and access technology, as well as LPDDR4 support, it further enhances memory bandwidth for image processing and AI computing. Employing an industry-leading 8-bit Dual Transfer Rate (DTR) Serial Peripheral Interface (SPI) and Fast Boot technology, the V77 doubles the system's cold boot speed, ensuring a seamless product experience of instant capture upon boot-up.As consumer demands for photography continue to diversify, and product applications become increasingly specialized, iCatch Technology is committed to developing more efficient and intelligent imaging SoCs. Through continuous technological innovation and product research and development, the company aims to continually empower intelligent imaging products and applications.
SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development: high-bandwidth memory.The Icheon-based firm is investing more than $1 billion in South Korea this year to expand and improve the final steps of its chip manufacture, said Lee Kang-Wook, a former Samsung Electronics Co. engineer who now heads up packaging development at SK Hynix. Innovation with that process is at the heart of HBM's advantage as the most sought-after AI memory, and further advances will be key to reducing power consumption, driving performance, and cementing the company's lead in the HBM market.Lee specializes in advanced ways of combining and connecting semiconductors, which has grown in importance with the advent of modern AI and its digestion of vast troves of data via parallel processing chains. While SK Hynix has not disclosed its capital expenditure budget for this year, the average analyst estimate puts the figure at 14 trillion won ($10.5 billion). That suggests advanced packaging, which could take up a 10th of that, is a major priority."The first 50 years of the semiconductor industry has been about the front-end," or the design and fabrication of the chips themselves, Lee said in an interview. "But the next 50 years is going to be all about the back-end," or packaging.Credit: BloombergBeing the first to achieve the next milestone in this race can now catapult companies into industry-leading positions. SK Hynix was chosen by Nvidia Corp. to provide the HBM for its standard-setting AI accelerators, pushing the Korean firm's value up to 119 trillion won. Its stock gained about 1% in Seoul on Thursday, adding to a nearly 120% increase since the start of 2023. It is now South Korea's second most valuable company, outperforming Samsung and US rival Micron Technology Inc.Lee, now 55 years old, helped pioneer a novel method for packaging the third generation of the technology, HBM2E, which was quickly followed by the other two major makers. That innovation was central to SK Hynix winning Nvidia as a customer in late 2019.Stacking chips to derive greater performance has long been Lee's passion. In 2000, he earned his Ph.D. in 3D integration technology for micro-systems from Japan's Tohoku University, under Mitsumasa Koyanagi, who invented the stacked capacitor DRAM used in mobile phones. In 2002, Lee joined as principal engineer at Samsung's memory division, where he led the development of Through-Silicon Via (TSV)-based 3D packaging technologies.Credit: BloombergThat work would later become the foundation for developing HBM. HBM is a type of high-performance memory that stacks chips on top of one another and connects them with TSVs for faster and more energy-efficient data processing.But back in the pre-smartphone era, Samsung was making bigger bets elsewhere. The norm was for global chipmakers to outsource to smaller Asian nations the tasks of assembling, testing, and packaging chips.So when SK Hynix and US partner Advanced Micro Devices Inc. introduced HBM to the world in 2013, they remained unchallenged for two years before Samsung developed its HBM2 in late 2015. Lee joined SK Hynix three years later. They joked, with a measure of pride, that HBM stood for "Hynix's Best Memory.""SK Hynix's management had better insights into where this industry is headed and they were well prepared," said Sanjeev Rana, an analyst at CLSA Securities Korea. "When the opportunity came their way, they grabbed it with both hands." As for Samsung, "they were caught napping."ChatGPT's release in November 2022 was the moment Lee had been waiting for. By that time, his team had developed a new packaging method called mass reflow-molded underfill (MR-MUF), aided by his contacts in Japan. The process, which involves injecting and then hardening liquid material between layers of silicon, improved heat dissipation and production yields. SK Hynix teamed up with Namics Corp. in Japan for the material and a related patent, according to a person familiar with the matter.SK Hynix is pouring the bulk of its new investment into advancing MR-MUF and TSV technologies, Lee said.Samsung, which has for years been distracted by a succession saga at its very top, is now fighting back. Nvidia last year gave the nod to Samsung's HBM chips, and the Suwon-based company said on February 26 that it had developed the fifth generation of the technology, HBM3E, with 12 layers of DRAM chips and the industry's largest capacity of 36GB.On the same day, Boise, Idaho-based Micron surprised industry watchers by saying it had begun volume production of 24GB, eight-layer HBM3E, which will be part of Nvidia's H200 Tensor Core units shipping in the second quarter.With its big commitment to expanding and enhancing technology at home and a multibillion-dollar advanced packaging facility planned for the US, Lee remains bullish about SK Hynix's prospects in the face of intensifying competition. He sees the present investment as laying the groundwork to meet more demand to come with future generations of HBM.
The integration of network technology has rapidly advanced the development of industrial automation systems, thereby changing the manufacturing value chain. The Human Machine Interface (HMI) is a quintessential technology. Today, HMIs integrate various on-site manufacturing processes, ensure equipment and machines transmit high-speed and reliable wireless data in harsh environments, and provide precise process control. HMIs are also crucial in collecting, controlling, and managing critical process data. Driven by the rise of smart manufacturing, the issues of digital transformation and green energy sustainability have become prominent. With the innovation of big data, machine learning, artificial intelligence, and industrial Internet of Things technology, the corporate world is now experiencing unprecedented technological innovation and environmental sustainability. At this time of transformation challenges, the most important thing is for enterprises to improve manufacturing efficiency and fuel continuous creativity.Originally from Sweden, Beijer Electronics is a global leader in HMI products. The CEO, Kristine Lindberg, accepted this exclusive interview. She joined Beijer Electronics as CEO in April 2023. The company Lindberg previously worked for was a significant customer of Beijer Electronics. As early as 2000, she developed a thorough understanding and command of the Asia-Pacific (APAC) market.A technology company that puts people first and aims to become an essential partner to its customers.Lindberg exemplifies the corporate vision of Beijer Electronics, emphasizing that it is a company whose mission is to become an essential partner to its customers. Beijer's primary customers include influential multinational companies such as equipment and machine manufacturers, system integrators, and marine industries. Providing technology to improve the efficiency of customers' products and creating the ability for sustainable development are two critical core capabilities of modern enterprises. Lindberg says: "Through technological innovations in visualization, digitization, and automation, Beijer Electronics continues to provide solid hardware equipment, programming, software expertise, and technical support services to help customers accelerate innovation, achieve their goals and ambitions, and gain competitive advantage."Beijer Electronics has thoroughly analyzed the market outlook and trends in 2024. Beijer Electronics has established a strong supply chain, sound management capabilities, and technical innovation to meet its commitments to customers and invest resources to further amplify software and hardware product capabilities and quality. Beijer Electronics provides visualization software solutions and a product portfolio based on web technology, and a new generation of HMI products will be launched in 2024. "These major growth areas put us in a favorable position. We are confident in grasping good growth opportunities in 2024 while the economic prospects are still uncertain.Embrace the pivotal business opportunities of digital transformation and green sustainability.The APAC market is an integral segment of the global automation system. Lindberg sees many opportunities for substantial growth, especially in the thriving semiconductor market, a manufacturing industry that has received significant attention from Taiwan and the Asia-Pacific region. Beijer Electronics' industrial-grade AIoT intelligent solution aims to optimize the availability of semiconductor process peripheral equipment and closely integrate business opportunities with back-end packaging and testing process equipment. Beijer utilizes the X2 series of HMIs and BoX2 series of IIoT gateways to quickly establish a solution that complies with SECS/GEM communication protocol standards to control the information management process between process equipment and computer-integrated manufacturing (CIM) control systems, improve production efficiency, reduce human operating errors, achieve increased production capacity utilization, and continue to strengthen competitive advantages. Consequently, Beijer Electronics obtained an invention patent certification from the Taiwan Intellectual Property Bureau and substantially contributed to the evolving semiconductor industry.The marine equipment industry is also a sector that has attracted much attention, especially under the global trend of pursuing green energy and emphasis on ESG indicators. The shipbuilding and maritime-related industries are all participating in the green transformation action in full swing. Beijer Electronics is also in the critical process of moving towards a green and sustainable transition. In addition to its manufacturing base in Taiwan, Beijer Electronics has established a new manufacturing base close to its headquarters in Sweden. The base is expected to be launched in the first quarter of 2024. This investment will meet sustainability needs and continue to meet customers' strong demand for HMI solutions. The challenges of digital transformation and net-zero carbon emissions will be an ongoing and long-term journey; Beijer Electronics will collaborate with customers to actively pursue growth and bring significant value.For more information, please visit Beijer Electronics.
