VIA Technologies announced the Epia N700 Nano-ITX board, designed as a complete solution for compact industrial PC and embedded automation devices. Featuring a 1.5GHz VIA C7 or 500MHz VIA Eden processor, the VIA Epia N700 is the first Nano-ITX board to feature the latest VIA VX800 media system processor, offering system designers a balance of miniaturization and uncompromising functionality.The VIA Epia N700 uses additional onboard ports to make system design of compact PCs easier; two S-ATA ports, a Gigabit LAN port, a COM port, two USB 2.0 ports and a VGA port are provided, with additional COM, LVDS and IDE support available through onboard pin-headers. With the VX800 offering an integrated DirectX 9 graphics core and excellent hardware accelerated video playback, this compact, low heat, power-efficient board is the ultimate solution for designing low heat, compact systems.The addition of onboard VGA, USB, COM and Gigabit network ports on this compact board helps to reduce cluttered cabling, adding improved air-flow for enhanced stability in always-on systems and a further reduced system foot-print. The VIA Epia N700 requires only a single 4-pin power cable, which can save space, while the external CMOS battery allows flexible, efficient placement within the chassis.The VIA Epia N700 is equipped with the latest VIA VX800 media system processor, an all-in-one, highly integrated digital media IGP (integrated graphics processor) chipset featuring the latest video, graphics and connectivity performance in a single chip. Measuring just 33x33mm, the VIA VX800 features an integrated VIA Chrome 9 graphics core with full DirectX 9 support and the VIA Chromotion video engine.Security can be augmented by enabling the VIA PadLock Security Engine, a hardware based security technology that provides the latest military-grade encryption and protection with the world's fastest x86 security engine.The VIA Epia N700 board is available now for developers, and will be available through authorized distributors by mid-September. VIA EPIA N700 Nano-ITX board specifications Item Detail Model VIA Epia N700-15 VIA Epia N700-05E Processor 1.5GHz VIA C7 processor 500MHz VIA Eden ULV processor Chipset VIA VX800 unified digital media IGP chipset System memory 1 x DDR2 533/667 SODIMM socket Up to 2GB memory size VGA Integrated VIA Chrome 9 Expansion slots 1 x Mini PCI slot Onboard IDE 1 x UltraDMA 133/100/66/33 pin header (2.0mm/44P) Onboard LAN 1 x VIA VT6130 PCIe Gigabit Ethernet controller Onboard audio 1 x VIA VT1708B high definition audio codec Onboard I/O connectors 3 x serial port headers (RS-232) with one 5V/12V select jumper 2 x SATA port connectors 2 x fan connectors for CPU and system fans 1 x USB pin header for 2 additional USB 2.0 ports 1 x LVDS connector, for 24-bit dual channel LVDS panel 1 x backlight control connector for inverter power and brightness control 1 x CF (Compact Flash) type I connector (shared with IDE) 1 x SMBus pin header 1 x SPI pin header 1 x digital I/O pin header 1 x KB/MS pin header 1 x front audio pin header 1 x front panel pin header 1 x system temperature reading pin header 2 x +5V power header for 2.5'' SATA HDD 1 x +12V power connector 1 x power mode select connector Back panel I/O 1 x serial port with RS232/422/485 support 1 x VGA port 1 x RJ-45 LAN port 2 x USB 2.0 ports Operating system Windows XP, Linux, Win CE, XPe System monitoring & management CPU voltage monitoring, system temperature reading, fan speed monitor wake-on LAN, keyboard power-on, timer power-on, watch dog timer system power management, AC power failure recovery Form factor Nano-ITX (12 cm x 12 cm) Source: Company, compiled by Digitimes, August 2008VIA Epia N700 Nano-ITX boardPhoto: Company

Micron Technology announced introduction of its latest e-MMC embedded devices in 32GB of memory density, which are composed of 34nm multi-level cell (MLC) NAND flash chips. Customer samplings are expected in late August with mass production expected in the second half of 2008.Micron highlighted that it greatly simplified its e-MMC system design by removing the requirements of the host memory controller to support NAND software drivers and complex NAND management techniques, including error correction code (ECC), wear leveling, and bad block management – replacing all of this complexity with a simple and ubiquitous MMC interface.In addition to the impressive storage and feature options, Micron is providing e-MMC products qualified at extended temperatures, which makes them ideal for in-dash applications like navigation systems and other automotive applications that require a more robust operating range. Further, the JEDEC-standard interface minimizes the need for host software to accommodate process node migrations."Ultimately, because Micron manufactures NAND, we are able to capitalize on our outstanding process technology, well-established IP, and a deep commitment to forwarding NAND memory to bring products like this to market. In fact, we also have the capability to pair e-MMC devices with low-power DRAM in multi-chip packages (MCPs). Ultimately, our recent move to the 34nm process was a major accomplishment and these product lines directly benefit from that innovation," said Graham Robinson, director of segment marketing at Micron.

Lanner Electronics has announced the launch of the FW-7570 network appliance, a high-performance compact rackmount appliance built on the Intel EP80579 Integrated Processor with QuickAssist Technology system-on-chip (SoC). The system is designed as a platform for a wide range of network communication applications such as gateway security, antivirus, anti-spam, load balancing and unified threat management, highlighted the company.At the core of FW-7570 is a 1.2GHz Intel SoC, which provides improved efficiency and lower power consumption as well as a smaller footprint, and includes an onboard encryption engine that offloads security functions from the core, further reducing the load on CPU resources."Intel's integration of security accelerators in their new SoC has provided Lanner with excellent performance and power efficiency versus multi-chip solutions for our latest FW-7570 security appliance, providing many capabilities such as bulk encryption, hashing and public/private key generation," said Will Chen, CTO, Lanner.The Lanner FW-7570 supports up to eight Gigabit networking ports, two DDR2 sockets to support up to 4GB of memory, and one 3.5-inch or two 2.5-inch SATA drive bays. It also comes equipped with multiple I/O interfaces and expansion slots including PCIe, mini-PCI, two USB 2.0 ports and one RJ45 administration console port.The FW-7570 is available today, further product information is available at the Lanner website.Lanner FW-7570 network appliancePhoto: Company

AMD announced its latest high-end ATI Radeon HD 4870 X2, delivering 2.4 teraflops of processing power. Also announced today is the ATI Radeon HD 4850 X2 graphics card.These cards comprise the ATI Radeon HD 4800 X2 series, combining two ATI Radeon HD 4800 series GPUs (graphics processing units) with a more advanced cross-GPU connection based on the PCIe 2.0 standard, plus two gigabytes of memory.Based on an advanced 55nm design and DirectX 10.1 support, the ATI Radeon HD 4800 X2 series delivers engineering elegance and the industry's most compelling feature set. The ATI Radeon HD 4870 X2 is immediately available from vendors worldwide priced at US$549, while the ATI Radeon HD 4850 X2 is scheduled to be available in September at an estimated price of US$399.The ATI Radeon HD 4800 X2 series provides support for ATI CrossFireX. Enthusiast gamers can now run the most demanding games smoothly in at the highest settings, enabling modes that were not playable before. With the efficient use of all four GPUs in a dual ATI Radeon HD 4870 X2 CrossFireX configuration, gamers will enjoy more than 3 times the performance of a single ATI Radeon HD 4870 card in many games.The ATI Radeon HD 4870 X2 features 2GB ultra-high bandwidth GDDR5 memory and clocked at 750 MHz, with a combined 1600 stream processors.Setting a new performance standard in graphics cards priced under US$400, the ATI Radeon HD 4850 X2 provides the power to play today's most demanding titles at ultra-high settings. The ATI Radeon HD 4850 X2 features 1600 stream processors, and two GPUs clocked at 625MHz. The ATI Radeon HD 4850 X2 features 2GB of GDDR3 memory.Asustek EAH4870X2 series graphics card with ATI Radeon HD 4870 X2 GPUPhoto: CompanyGigabyte GV-R487X2-2GH-B graphics card powered by ATI Radeon HD 4870 X2 GPUPhoto: CompanyGeCube GC-HD4870X2-G3 graphics card with ATI Radeon HD 4870 X2 GPUPhoto: Company

Elpida Memory announced that it had developed a 1Gb DDR3 SDRAM that delivers a speed up to 2.5Gbps. The new copper interconnect-based DDR3 SDRAM is targeted for servers and high-end PCs. Sample shipments are scheduled to begin by the end of August.The new DDR3 SDRAM uses a copper interconnect process that is superior to aluminum in terms of transmission characteristics, Elpida highlighted. By taking maximum advantage of these characteristics during the design phase new circuitry can be developed that enables even faster products that continue to need little power.The new DDR3 SDRAM supports data rate ranging from 667Mbps to 2.5Gbps. It can also meet DDR3 standard 1.5V as well as ultra-low 1.35V and 1.2V voltage requirements. In addition, it achieves data rates of 2.5Gbps at 1.5V and 1.8Gbps at 1.2V, considerably faster than the current industry standard of 1.6Gbps at 1.5V.As a result, the new product's ability to operate at an ultra low voltage of 1.2V can contribute to lower power consumption, which is especially important in the case of large-memory capacity extended-use server applications. Also, for high-end PCs geared to high-speed operations an operational speed of 2.5Gbps enables a significant system performance upgrade.Photo: Company, August 2008.

Biostar Microtech International has launched the T-Series TA790GX A2+, an integrated motherboard based on AMD's 790GX chipset with an integrated ATI Radeon HD 3300 GPU. The motherboard supports AMD Phenom-series multi-core processors and dual-channel DDR2 1066 memory, and provides optimized overclocking ability, according to the company.The T-Series TA790GX A2+ offers dynamic power management which can be switched between performance and power savings when using everyday applications. Biostar TA790GX A2+ motherboard specifications Item Detail CPU Support Supports AMD Phenom series/Athlon 64 X2, 64, FX and Sempron processors FSB 1066MHz Chipset AMD 790GX+SB750 Socket AM2+ Memory DDR2 667/800/1066 Sideport Memory DDR2 64MB PCIe x16 Gen. 2 2 PCIe x1 Gen. 2 2 SATA 3Gb/s 6 e-SATA 3Gb/s 6 GbE 1 USB 2.0 10 Integrated video ATI Radeon HD 3300 Audio 7.1 Channel HD Audio DVI/HDMI 1/1 Source: Company, compiled by Digitimes, August 2008Biostar TA790GX A2+ motherboardPhoto: Company

Toshiba announced the launch of 32GB embedded NAND flash memory modules that the company claims are the largest density yet announced, with the modules also having full compliance with the e-MMC and eSD standards. Samples will be available in September 2008, and mass production will start in the fourth quarter. The new 32GB embedded devices combine eight 32Gbit NAND chips fabricated with Toshiba's 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA version 4.3 and SDA version 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association (MMCA) and SD Card Association (SDA), respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers. Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NAND memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1GB to 32GB, supports application in a very wide range of products. Toshiba: e-MMC and e-SD specifications roundup Item e-MMC e-SD Interface JEDEC/MMCA Ver 4.3 standard HS-MMC interface SDA Ver 2.0 standard SD interface Power Supply Voltage 2.7 to 3.6V(memory core)/ 1.7V to 1.95V (interface) 2.7 to 3.6V Bus width x1 / x4 / x8 x1 / x4 Writing speed Target 10 MB/s (Sequential mode) Target 18 MB/s (Sequential/Interleave Mode) SDA standard Class 4 Reading speed Target 20 MB/s (Sequential mode) SDA standard Class 4 Temperature -25 degrees - +85 degees celsius -25degrees - +85 degees celsius Package 153-ball FBGA (+16 support Ball�^ 153-ball FBGA �]+16 support Ball�^ Source: Company Toshiba introduces new embedded NAND flash in high densitiesPhoto: Company

Elpida Memory announced today that it is ready to launch a 16GB Fully Buffered DIMM (FB-DIMM) that is composed by 2Gb of DDR2 components. Sample shipments of the new B-DIMM will begin later this month. Mass production is expected to get underway in the fourth quarter of 2008.In addition to achieving greater memory density and multiple-rank function to significantly upgrade system performance, Elpida said it has applied 2Gb DR2 low-power DRAMs and Integrated Device Technology (IDT)'s low-power advanced memory buffer (AMB) device to achieve a level of power consumption comparable to existing 8GB products and to contribute to lower system power requirements."The inclusion of the IDT low power AMB device helps Elpida achieve twice the capacity without impacting power consumption, which is critically important for today's power-hungry computing platforms," said Sean Fan, vice president and general manager of memory interface division at IDT.Elpida intends to complement its presence in existing markets by using its new large-capacity FB-DIMM as a vehicle to enter new markets, such as FB-DIMM for ultra high-end servers and work stations, the company stated.Elpida prepares to volume produce 16GB FB-DIMM in the fourth quarter of 2008Photo: Company

Micron Technology has announced the introduction of its next-generation RealSSD solid-state drives (SSDs) for enterprise computing (P200) and notebook applications (C200).Both SSDs are sampling now with mass production expected in the fourth quarter of 2008. Additionally, Micron's Lexar Media subsidiary plans to bring this latest RealSSD architecture to consumers in the fourth quarter of 2008.P200 drives are available from 16GB to 128GB capacities in a standard 2.5-inch form factor. Using single-level cell (SLC) NAND technology, the P200 provides 3Gb/s SATA-based sequential read and write speeds up to a maximum of 250MB/s.In addition to the performance leap over conventional HDDs, Micron highlighted the power and reliability advantages of P200. The drive operates at 2.5W in active mode and under at 0.3W when idle. It also provides improved wear-leveling capabilities across its high-performance SLC write cycles, offering a mean time between failure (MTBF) rate of approximately two million hours compared to 300,000 to 500,000 MTBF of an HDD.Designed using Micron's multi-level cell (MLC) NAND process technology, C200 drives will be available in 2.5- and 1.8-inch form factors. The 2.5-inch C200 will be offered up to 256GB and 1.8-inch versions range from 32GB to 128GB. Using a 3Gb/s SATA interface, the C200 products provide a read speed of up to 250MB/s and a write speed of up to 100MB/s.The new RealSSD lineup from MicronPhoto: Company

Toshiba has unveiled Toshiba iSense, a 2.5-inch external HDD series with storage capacities of 160GB, 250GB and 320GB, which will launch in the Taiwan market this month, according to Toshiba Digital Media Network Taiwan.Toshiba iSense features shock sensor and ramp loading technologies, dimensions of 81×16.6×127mm (W×H×D) and a weight of 171g, Toshiba Taiwan indicated. Toshiba plans to offer a 400GB version in the future, Toshiba Taiwan noted.Toshiba's iSense 2.5-inch external HDDsPhoto: Jimmy Hsu, Digitimes, July 2008