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Monday 14 September 2009
InvenSense unveils digital dual-axis gyroscope for camera phones and DSCs
Sunnyvale, Calif., September 8, 2009 - InvenSense, Inc., the leading provider of MEMS-based motion processing products for consumer electronics, today announced the new IDG-2000 dual-axis MEMS gyroscope, its next-generation IDG family of MEMS gyros. The IDG-2000 family provides the market with a smaller and thinner gyroscope ideal for improving optical image stabilization (OIS) in digital still cameras and high-resolution, eight-megapixel and above camera phones. The IDG-2000 is fabricated on the larger 8-inch wafer to meet increased volume capacity and to further reduce the overall solution cost to meet competitive price requirements demanded by consumer electronics OEMs.The IDG-2000, housed in a 4x4x0.9 mm QFN plastic package, is the first digital dual-axis pitch and roll (X- and Y- axis) gyro with integrated 16-bit analog-to-digital converters that allow for direct communication to advanced image processors over an I2C or SPI serial bus, eliminating costly discrete components."Optical image stabilization is quickly becoming a standard key feature consumers look for in new cameras," said Chris Chute, IDC Research Manager in the Worldwide Digital Imaging Practice. "Even with millions of digital cameras still being sold worldwide, competition for product differentiation, coupled with lower price points are forcing camera vendors to manage costs more closely than ever. New technologies like the IDG-2000 can help camera vendors remain competitive in the market.""We advanced the IDG series with this new digital gyro to address a critical market need for an OIS system solution at a lower total cost in a smaller and thinner package to help OEMs reduce blur in images," said Joseph Jiang, vice president, Imaging Business Unit at InvenSense. "We are committed to delivering breakthrough technologies that meet the specific needs of next generation smart phone cameras and DSCs."By leveraging its patented and high volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the gyroscope package size down to the smallest system footprint, while providing the highest performance, lowest noise and the competitively priced solutions in the market.The IDG-2000 family features lower phase delay from the higher bandwidth of the programmable digital low-pass filter with integrated sigma-delta ADCs. Other key product features include automatic gain amplification control, anti-aliasing filters optimized for OIS applications, and an industry-leading cross axis sensitivity of less than ±1%. An integrated temperature sensor provides temperature compensated bias adjustment. The IDG-2000 measures hand jitter across a wide frequency range of 0.1Hz to 20Hz with exceptionally low noise at 0.033 °/s-rms. Furthermore, the operating frequency in the 30 KHz range is immune to ambient noise. These features are required when taking photos in low ambient light conditions with high resolution sensors or when using zoom at any resolution. Power consumption is reduced by 50% compared to analog gyros with a low 4mA maximum current at 2.1 volts in active mode and 5μA maximum current in sleep mode.The IDG-2000 family of digital dual-axis MEMS gyroscopes begins sampling in October 2009 to selected OEM partners.
Monday 14 September 2009
VIA Adopts Sequans mobile WiMAX chip technology for new VIA eNote turnkey solution
VIA Technologies has announced the availability of the new VIA eNote turnkey solution, a thin and light notebook that adopts Sequans Communications' mobile WIMAX chip and strikes the balance between netbook ultra-portability and notebook performance and functionality.The mobile WiMAX chip provided by Sequans delivers high throughput with low power consumption using Sequans mimoMAX technology, which combines a maximum likelihood decoder on the downlink with two transmitters (2Tx) on the uplink - a unique feature that can significantly improve link budget and greatly enhance coverage and capacity."The VIA eNote Turnkey Solution incorporates all the features one would expect in an ultra mobile product, plus all the connectivity options that users need to experience truly high speed connectivity anywhere they go," said Georges Karam, Sequans CEO.The 11.6-inch design incorporates both WiMAX and Wi-Fi connectivity, will be demonstrated from September 15-18 at 4G World in Chicago in Sequans' booth, number 423.
Friday 11 September 2009
MaxLinear delivers high performance DVB-T SoC
Carlsbad, Calif. - Sept. 10, 2009 - MaxLinear Inc., a fabless semiconductor company at the forefront of developing all-CMOS broadband radio-frequency (RF) & mixed-signal IC solutions for consumer markets, today announced availability of its MxL1x1SF family, the industry's highest performance tuner and demodulator system on chip (SoC) for DVB-T applications and hybrid multi-mode applications combining DVBT & other analog/digital terrestrial TV & cable TV standards including ATSC, ISDBT13, DTMB, NTSC, PAL, SECAM, DVB-C, & DOCSIS.The product family provides complete frequency coverage from 44 to 1GHz and delivers exceptional performance. MxL1x1SF devices consume ~450 mW of power, making them an ideal choice for a wide array of applications including television sets, PCTV, IPTV and terrestrial set-top boxes (STBs).The two products currently available are MxL101SF and MxL111SF. Both parts are available in a 7mm x 7mm QFN 48 package and represent a reduction in size of over 50% compared to competitive offerings in most applications. These highly integrated devices reduce the external BOM to minimal standard value components, the cost of which is estimated to be less than $0.20 in high volumes.In addition to integrating all functionality required to receive and demodulate DVB-T signals, MxL1x1SF parts also provide access to the IF output signal of the tuner, enabling hybrid implementations by connecting a discrete analog or digital demodulator to the tuner IF output interface. This configuration leverages the built-in tuner to enable DVB-T/DVB-C or DVB-T/analog applications at a very low cost and in a very small footprint. The IF output frequency of MxL1x1SF devices is software configurable, which provides a seamless interface to all commonly available demodulators on the market today.The MxL101SF SoC integrates MaxLinear's market proven MxL5007T and MxL201RF tuner cores combined with the company's third-generation "home grown" NORDIG/DTG compliant DVB-T demodulator technology. A fully integrated loop-through function is also integrated on MxL101SF.The MxL111SF device not only has the full functionality of MxL101SF, but it also provides integrated USB 2.0 connectivity and allows a second external demodulator or analog video decoder to share its USB interface. The MxL111SF provides input and output options for serial and parallel transport streams and supports configurable BT656 and I2S inputs to interface with external analog video decoders. The ability to input transport streams as well as BT656 and I2S signals through the USB2.0 interface while simultaneously demodulating a DVB-T signal makes the MxL111SF uniquely suitable for multi-channel applications and multi-standard designs. An integrated IDAC provides flexibility to drive external LEDs or other discrete devices."By combining our market leading RF tuner technology with our high performance home-grown 3rd generation DVB-T OFDM demodulator platform, MaxLinear is setting a new standard in performance, power, integration and cost," said Kishore Seendripu, Chief Executive Officer of MaxLinear. "These parts will enable a whole host of new innovative products while reducing system complexity and improving performance."MxL1x1SF parts utilize MaxLinear's unique API-based software architecture, reducing the programming of the device to a few simple commands and eliminating the need for complicated register calls. Additionally, MxL1x1SF parts require no firmware download or complicated spur avoidance algorithms commonly required by other solutions. This software simplicity enables quick and easy implementation of the driver source code on any software platform.Both SoCs have been extensively field tested and proven in more than 12 individual field trials under difficult real-world signal conditions.Both parts are monolithic ICs, enabling superior reliability and manufacturability compared to discrete and SiP (silicon in package) implementations. The cost advantages of MaxLinear's standard digital CMOS enable MxL1x1SF devices to be the most competitive solutions in any digital TV application.AvailabilityMass production samples are available now. MaxLinear will demonstrate the MxL1x1SF family during IBC (Amsterdam, Sept. 10-14) and production quantities will be available in Q4 2009.
Friday 11 September 2009
SiS announces SiS672 chipset adopted for Lenovo nettop
Silicon Integrated System (SiS) has announced the SiS672/968/307DV chipset supporting Intel's Atom 230 CPU has being adopted by Lenovo to develop its IdeaCentre Q100 nettop.The Q100 features a size of only 0.5-liter, and supports DDR2 667 memory up to 1GB.The PC features the SiS Mirage 3 graphics engine to deliver 2D and 3D images.Lenovo IdeaCentre Q100 nettopPhoto: Company
Thursday 10 September 2009
DALSA media advisory: Announcement of microelectronics innovation center in Bromont, Quebec
Bromont, Quebec, September 1, 2009 - Today the Governmenand the Government of Canada announced a $178 million grant to the Universite de Sherbrooke for the establishment of a state-of-the-art microelectronics innovation center to be located in Bromont, Quebec, the semiconductor manufacturing capital of Canada. The purpose of the project, supported by $83 million from the Canadian Government and $95 million from the Quebec government, is to create a global center of excellence for research and innovation in 200mm based microelectromechanical systems (MEMS) and 3D Wafer Level Packaging (WLP) as well as advanced technologies associated with the assembly and packaging of silicon chips. DALSA is excited to be a founding partner in the innovation center along with IBM Canada and Université de Sherbrooke. The initial founding partners, along with various semiconductor equipment suppliers, and others that may join at a later date, will provide financial and in-kind support to the project for ongoing operations.As a founding institution, DALSA, one of the world's fastest growing suppliers of MEMS foundry services, will assist in the design of the center, and take a lead role in the specification and installation and ongoing operational responsibility for the MEMS and WLP related equipment, which will be among the most advanced in the world for 200 mm MEMS and 3D WLP processing. The prime purpose of the innovation center is to leverage the best from the Canadian and international research community to address industry's most challenging problems. The end goal is technology transfer as well as development of spinoffs. The center has already received letters of interest from universities, research centers and other industrial partners from across Canada and around the world.
Thursday 10 September 2009
New cartridge filters from Gore dramatically improve liquid filtration performance in semiconductor applications
W. L. Gore & Associates are the inventors of expanded PTFE (ePTFE) and the makers of GORE-TEX fabric. Gore will be exhibiting new technology at SEMICON Taiwan (Booth 2024) that is important in the manufacturing of semiconductors and related products such as LCDs and LEDs.GORE Filters for Semiconductor Applications are a major advancement in semiconductor process filtration technology. They allow flow rates 2-3X superior to those of all previously available membranes without sacrificing retention.Gore's new ePTFE membranes are much more than a simple replacement part in the processing line. They enable numerous benefits: - Improved Particle Retention in Existing Fluid (Chem and UPW) streams - Reduced Particle Counts in Recirculation Baths - Reduced Processing TimeThe company has announced a major breakthrough in membrane filtration technology. This has resulted in GORE Filters for Semiconductor Applications, 30nm- to 100nm-rated cartridge filters for chemicals, dilute chemicals and ultrapure water in wet process tools.GORE Filters enable semiconductor fabs to realize both improved performance and lower cost of ownership. The drop-in substitution of GORE Filters can enable upgraded retention performance and reduced particle counts while maintaining desired flow rate, the same flow rate with as few as one-third the number of filters, reduced capital costs associated with process upgrades, significant capital reduction when building new fabs, reduced processing times, higher flow rates and faster bath turnovers.Gore is the inventor of ePTFE and the world technical leader in engineering PTFE materials. GORE® Filters benefit from Gore technology, used for decades in the world's best-performing filters for semiconductor, electronics, high-purity chemical and pharmaceutical applications.With approximately US$2.5 billion in sales and more than 8,500 employees worldwide, W. L. Gore & Associates, Inc. specializes in innovations that improve the quality of life. In more than 50 years of product development, Gore has applied its world-renowned expertise to thousands of products for high-volume, cost-sensitive markets, such as automotive, energy, electronics, and industrial filtration. The company operates more than 45 facilities worldwide with headquarters in Newark, Delaware, USA.New GORE Filters Dramatically Improve Liquid Filtration Performance in Semiconductor ManufacturingPhoto: Company
Thursday 10 September 2009
Sony introduces new full HD home theater projector
ATLANTA, Sept. 9, 2008 (CEDIA Booth #1409) – Sony today announced a new high-contrast, high-definition projector, adding more options for those looking for a true cinematic home theater experience.The new VPL-VW85 projector features a full HD 1920x1080 progressive Silicon X-tal Reflective Display (SXRD) and 24p True Cinema technology, delivering a true film-like performance. The new model also has an exceptionally high dynamic contrast of 120,000:1 and brightness of 800 ANSI lumens.Specifically designed with the custom installation market in mind, the VPL-VW85 has a motorized, fully adjustable, 'lens shift' function that offers more options in terms of installation and projector placement, without any image distortion. Additionally, the lens offers a 1.6x motorized zoom with horizontal and vertical adjustment, making it easy to set up in a variety of environments.The VPL-VW85 projector also adds Sony's Motionflow 120Hz with black frame insertion technology, providing exceptional clarity and resolution for fast moving images. The model also features Sony's Anamorphic Zoom Mode that, when paired with an external anamorphic lens (sold separately), allows users to enjoy a true big screen home theater experience.The new projector also offer RS-232C control, as well as two HDMI inputs, single component and composite inputs, and a PC input. In addition, the VPL-VW85 includes access to a dedicated CEDIA certified technical support hotline for all troubleshooting and is eligible for Sony's advance exchange program. This minimizes downtime for exchanges if a customer experiences any problems within 90 days of original purchase.The VPL-VW85 will be available in October for about US$8,000.00, and will be offered direct at Sony Style retail stores nationwide and authorized installation dealers around the country.For those looking to upgrade their home theater at a value, Sony also introduced the VPL-HW15 SXRD projector. The full HD 1080p model features 24p True Cinema technology, a 60,000:1 dynamic contrast ratio and a brightness of 1,000 ANSI lumens. It offers RS-232 control, two HDMI inputs and single component and composite inputs, as well as a PC input.This VPL-HW15 projector will also be available in October, for about US$3,000.00, and will be offered direct at Sony Style retail stores nationwide and authorized installation dealers around the country.Sony full HD home theater projector - the VPL-VW85Photo: Company
Thursday 10 September 2009
Sony adds ultra-slim edge-lit LED models to Bravia HDTV line
ATLANTA (CEDIA Booth # 1409), Sept. 9, 2009 – Sony today introduced a new line of ultra-thin Bravia LCD HDTVs featuring an advanced edge-lit LED backlight and exceptional contrast ratio of over 1,000,000:1.The XBR10-series models also deliver full 1080p wireless transmission of high definition signals from a separate media box to a receiver embedded in the TV, allowing source components to be placed out of sight."Bravia is on the cutting edge of television technology and the XBR10 series pushes the limits of industry-leading, innovative features," said Jeff Goldstein, vice president of the television business for Sony Electronics. "Not only will this TV look striking when hanging on a wall, the wireless feature clears the clutter of components and messy tangles of unsightly wires, allowing you to hide components away across the room."The XBR10 models also feature an Ethernet connection allowing them to directly access Sony Bravia Internet video content using an existing broadband network. The platform offers one of the largest selections of free and premium movies, TV shows, sports, music and more from an array of partners like, Amazon Video on Demand, YouTube, Slacker Internet Radio, and, later this fall, Netflix.Bravia Internet Widgets, powered by the Yahoo! Widget engine, also expand and personalize the TV experience by adding on-screen applications that provide such information as weather reports, stock information, financial news, Twitter, and additional content.The full HD 1920x1080 progressive (1080p) models also feature Sony's Motionflow 240Hz technology, which delivers exceptionally crisp and detailed images with natural motion. The Motionflow algorithm goes beyond traditional 120Hz technology by quadrupling the frame rate of conventional LCD TVs and interpolating three new frames.The models are digital living network alliance (DLNA) compliant, enabling easy access to digital photos, music, and video stored on a PC or other DLNA server using the XMB interface and the TV's remote control. They also offer a USB input for displaying digital photos or playing digital video and music files from a USB storage device.Other notable features include, Bravia Engine 3, 24p True Cinema, xross media bar (XMB) with enhanced 3D favorites mMenu, Internet powered TV Guide Onscreen, Bravia Sync, 4 HDMI inputs, RS232CSingle PC, component, composite and component/composite selectable inputs.The XBR10 models exceed Energy Star 3.0 guidelines for energy efficiency and use Sony's Light Sensor technology to adjust backlight intensity based on ambient room light helping to save energy and reduce the user's overall carbon footprint.The KDL-52XBR10 and KDL-46XBR10 models will be available this October at Sony Style retail stores, http://www.sonystyle.com/ and at similar authorized Sony retail outlets across the country, for about US$5,000 and US$4,500, respectively.Sony new Bravia HDTV super slim edge-lit LED modelPhoto: Company
Thursday 10 September 2009
Nuvoton introduces first in new generation of highly efficient CODEC/SLCC devices
SAN JOSE, Calif. – Sept. 9, 2009 – Nuvoton Technology, a leading worldwide provider of semiconductors for consumer and computing applications, today announced the first in its family of next-generation Pro-X Series (Programmable Extended) CODEC/SLCC devices. The new N681386 supports one foreign exchange station (FXS), combining programmable CODEC, SLCC (subscriber line control circuit) and DC-to-DC controller on a single CMOS circuit. Pin-to-pin-compatible N681387 adds wideband capability (16kHz) operation, unleashing VoIP audio advantages over traditional telephony systems.These next generation CODECs are the industry's first to feature an innovative new architecture designed to reduce power consumption across all operation states - particularly, in the On-Hook state - by as much as 65% of the previous generation. This reduction enables designers to develop more energy-conscious customer premises equipment (CPE) with longer battery lifetimes. Additionally, the new architecture distributes temperature evenly across the design, ensuring that no hot spots develop within end-user systems, keeping the complete FXS solution below 30 degrees C for a typical configuration - even in the most demanding operating mode. As a result, designers struggling to incorporate FXS ports into products with minimal ventilation will realize significant advantages by using the N681386 or N681387.These advantages, however, have been achieved without sacrificing audio performance. Nuvoton's industry-leading audio performance benchmarks include typical idle channel noise (ICN) as low as 4dBRNC and typical return loss of 40dB, which directly translate into superior voice quality test (VQT) scores for end-user systems.The N681386 and N681387's introduction will be followed within weeks by two more members of Nuvoton's next-generation CODECs: the N682386 and N682387. The N682386 and N682387 provide narrowband and wideband operation, respectively, and support two FXS ports each. All four devices can operate with an external low-cost discrete front-end or be combined with Nuvoton's forthcoming N681622 SLFC device (subscriber line feed circuit), which will integrate all front-end transistors into a single low-cost package."By developing a unique architecture that enables the combination of dramatically lower power consumption and temperature with impeccable audio performance, Nuvoton is empowering designers to create highly efficient yet powerful systems to meet stringent demands of their end-user customers," said Saleel Awsare, president, Nuvoton Technology America. "These next-generation solutions will enable those designers to achieve their design targets quickly and cost-effectively."N681387, N681387, N682386 and N682387 will support programmable worldwide impedance matching and trans-hybrid balancing. The DC-to-DC controller features power tracking features in On-Hook, Off-Hook and Ringing states to help minimize power consumption. Enhanced diagnostics for metallic loop testing/GR-909 implementation, as well as system level control features - such as tight system and chip temperature monitoring - facilitate extensive remote diagnostics and reduce the total cost of ownership.Evaluation boards for performance testing, along with low-level device drivers for rapid prototyping and easy migration, are available now. The N681386 and N681387 are available in LQFP-48 and QFN-48 packages, while the dual-channel N682386 and N682387 will be available in a TQFP-64 package. Pricing for all four begins at US$1.30 per channel in volumes of 10K.
Wednesday 9 September 2009
Black Sand announces 3G CMOS RF PA
Black Sand Technologies, a fabless semiconductor company specializing in advanced power amplifier (PA) technology for wireless applications, has announced that it has produced the world's first 3G CMOS RF PA. Black Sand's proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices such as mobile phones and datacards. The company also announced that it has received US$10 million in its second round of funding. The round was led by Northbridge Venture Partners and joined by Austin Ventures, bringing the total investment in the company to US$18.2 million. Black Sand will use the funding to bring its power amplifiers into mass production and accelerate development of additional products.Black Sand's RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks. Mobile phones and wireless products today use power amplifiers based on gallium arsenide (GaAs) semiconductor technology. Replacing GaAs with CMOS silicon technology improves manufacturing yield, performance, cost, battery life, and call quality.Over time CMOS has replaced GaAs technology in many other applications from audio chips to DVD decoders. However, CMOS does not lend itself easily to use in power amplifiers, so a revolutionary architecture was required. "By leveraging our breakthrough PA architecture, Black Sand, as the first company to deliver 3G PAs in CMOS, is ready to capitalize on the historic shift from GaAs to CMOS, and benefit from the explosion in demand for new 3G devices appearing on the market today," said John Diehl, CEO of Black Sand Technologies."The RF front end of mobile phones is continuing to grow in complexity and with the development of linear, 3G CMOS PA technology, enabling advances such as integrated digital control circuits, Black Sand is in a unique position to profit from this technological shift as the market moves from 2G to 3G," added Brian Modoff, senior wireless equipment analyst at Deutsche Bank."We were impressed to see that Black Sand delivered working samples of their new PA architecture much sooner than expected," said Basil Horangic, partner at Northbridge Venture Partners. "This is a very competitive market and Black Sand's linear PA architecture puts them out in front. Their unique offering will provide the basis for a broad portfolio of products from 2G to 4G." Krishna Srinivasan, partner at Austin Ventures, added, "Since inception this team has executed in hitting milestones and developing new, world-class IP, and we are delighted to continue our support for the company as they enter a new phase of growth.""Black Sand is extremely pleased with this up-round of financing that we've received. Our company is now well positioned to take these products to market by providing a new level of integrated cost and performance to our customers," concluded Diehl.