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Friday 11 September 2009
MaxLinear delivers high performance DVB-T SoC
Carlsbad, Calif. - Sept...
Friday 11 September 2009
SiS announces SiS672 chipset adopted for Lenovo nettop
Silicon Integrated System (SiS) has announced the SiS672/968/307DV chipset supporting Intel's Atom 230 CPU has being adopted by Lenovo to develop its IdeaCentre Q100 nettop.
Thursday 10 September 2009
DALSA media advisory: Announcement of microelectronics innovation center in Bromont, Quebec
Bromont, Quebec, September 1, 2009 - Today the Governmenand the Government of Canada announced a $178 million grant to the Universite de Sherbrooke for the establishment of a state-of-the-art microelectronics innovation center to be located in Bromont, Quebec, the semiconductor manufacturing capital of Canada...
Thursday 10 September 2009
New cartridge filters from Gore dramatically improve liquid filtration performance in semiconductor applications
W. L. Gore & Associates are the inventors of expanded PTFE (ePTFE) and the makers of GORE-TEX fabric. Gore will be exhibiting new technology at SEMICON Taiwan (Booth 2024) that is important in the manufacturing of semiconductors and related products such as LCDs and LEDs.
Thursday 10 September 2009
Sony introduces new full HD home theater projector
ATLANTA, Sept. 9, 2008 (CEDIA Booth #1409) – Sony today announced a new high-contrast, high-definition projector, adding more options for those looking for a true cinematic home theater experience.
Thursday 10 September 2009
Sony adds ultra-slim edge-lit LED models to Bravia HDTV line
ATLANTA (CEDIA Booth # 1409), Sept. 9, 2009 – Sony today introduced a new line of ultra-thin Bravia LCD HDTVs featuring an advanced edge-lit LED backlight and exceptional contrast ratio of over 1,000,000:1.
Thursday 10 September 2009
Nuvoton introduces first in new generation of highly efficient CODEC/SLCC devices
SAN JOSE, Calif. – Sept. 9, 2009 – Nuvoton Technology, a leading worldwide provider of semiconductors for consumer and computing applications, today announced the first in its family of next-generation Pro-X Series (Programmable Extended) CODEC/SLCC devices...
Wednesday 9 September 2009
Black Sand announces 3G CMOS RF PA
Black Sand Technologies, a fabless semiconductor company specializing in advanced power amplifier (PA) technology for wireless applications, has announced that it has produced the world's first 3G CMOS RF PA. Black Sand's proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices such as mobile phones and datacards...
Wednesday 9 September 2009
Siano unveils multi-standard mobile TV chip
Siano Mobile Silicon, a mobile digital TV (MDTV) chip maker, has announced the launch of a new multi-standard mobile TV receiver chip, the SMS1230. The SMS1230 supports the major global broadcast mobile TV standards of DVB-T, T-DMB, and ISDB-T, and, in addition, digital radio (DAB/+) and FM Radio...
Tuesday 8 September 2009
HTC unveils new Android-powered Tattoo smartphone
HTC (High Tech Computer) has unveiled the new Android-powered smartphone, the Tattoo, targeting the consumer segment.