SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.HBM (High Bandwidth Memory) is a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed compared to conventional DRAM products. HBM3E, the extended version of HBM3, is the fifth generation of HBM following HBM, HBM2, HBM2E and HBM3.SK Hynix (or "the company", www.skhynix.com) being the first provider of HBM3E, a product with the best-performing DRAM chips, extends its earlier success with HBM3. The company expects successful volume production of HBM3E and its experiences as the industry's first provider of HBM3 to help cement its leadership in the AI memory space.To build a successful AI system that processes a huge amount of data quickly, a semiconductor package should be composed in a way that numerous AI processors and memories are multi-connected. Global big tech companies have been increasingly requiring stronger performance of AI semiconductors and SK Hynix expects its HBM3E to be their optimal choice that meets such growing expectations.The latest product is the industry's best in all the aspects required for AI memory including speed and heat control. It processes up to 1.18TB of data per second, equivalent to processing more than 230 full-HD movies (5GB each), in a second.As AI memory operates at an extremely high speed, controlling heat is another key qualification required for AI memories. SK Hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following the application of the advanced MR-MUF process.MR-MUF (Mass Reflow Molded Underfill) is the process of stacking semiconductor chips, injecting liquid protective materials between them to protect the circuit between chips, and hardening them. The process has proved to be more efficient and effective for heat dissipation, compared with the method of laying film-type materials for each chip stack. SK Hynix's advanced MR-MUF technology is critical to securing a stable mass production on the supply side of the HBM ecosystem as pressure on the chips being stacked can be reduced, while warpage control is also improved with the adoption of this process.Sungsoo Ryu, Head of HBM Business at SK Hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products. "With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider."SK Hynix begins volume production of the industry's first HBM3E

NEXCOM, a leading industrial computer manufacturer, has long been dedicated to edge computing and industrial IoT solutions. Its Mobile Computing Solutions Business Unit (MCS) focuses on the Edge AI railway and in-vehicle application fields.This week, NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA.NEXCOM will be showcasing at booth #339 its full range of IP67 Rating and high-performance AI-powered rugged edge railway and in-vehicle computing solutions focusing on the AI transportation market, including smart bus & rail transit, AI-aided public works, smart AI patrol, material-handling management, and earth-moving vehicles. Among the foregoing, NEXCOM's expertise in railway solutions powered by the NVIDIA Jetson platform for edge AI and robotics is a must-see. Its AI-ISV providers harness the NVIDIA Jetson modules and comprehensive NVIDIA JetPack software stack. Combined with NEXCOM railway computers and its NEXCOM Accelerator Linux (NAL), these capabilities have helped lead to the creation of several innovative railway applications like 3D sensor-based perception and predictive maintenance systems, pantograph inspection systems, and solutions for crowd/people counting management. These solutions contribute to safer, more efficient, and intelligent railway operations.Using the NVIDIA Jetson platform to help create a robust and high-performance railway and in-vehicle solutionIn recent years, NEXCOM has combined its solid hardware strength with the software technology of upstream computing partners to develop a variety of high-performance Edge AI computing platform products for smart railway and in-vehicle applications. In addition to meeting NVIDIA Partner Network requirements, NEXCOM was also selected as an NPN member due to its expertise in the design of its IP67 Rating Railway computer with the full line-up of NVIDIA Jetson Orin modules and high-performance computing platforms.Leo Chang, associate vice president of NEXCOM's MCS Business Unit, said that the company has incorporated a diverse product portfolio of NVIDIA technology that includes the NVIDIA Jetson AGX Orin, NVIDIA Jetson Orin NX, and NVIDIA Jetson Xavier NX. These products have been deployed in AI solutions in collaboration with international local railway operators and several cities across Europe and Asia, and NEXCOM is continuously expanding further.NEXCOM continues to strengthen the application of terminal Edge AI software-defined edge computing solutions to create a more convenient and safe smart living environment for human society.Through continuous focus on improving edge computing technology and using AI computing power to assist partners in building efficient and stable AI railway and in-vehicle transportation systems in harsh environments, NEXCOM's solutions have spread to several cities overseas. At the beginning of the year, NEXCOM signed a cooperative agreement on intelligent transportation applications for railways with solution application providers in Germany and Hong Kong. By participating in the NVIDIA GTC conference, NEXCOM aims to build more international transportation project cooperation.In the face of the intelligent trend that will be developed in multiple aspects of edge applications, NEXCOM's Edge AI computing product line covers multiple fields such as AI transportation, smart retail, urban governance, and manufacturing. NEXCOM will continue to strengthen the layout of AI technology in vertical fields in the terminal Edge AI software-defined edge computing solution, and continue to use NVIDIA technology, to expand the Edge AI computing platform product items, improve the diversity and performance of AIoT solutions, assist customers in quickly building efficient AI application systems, and successfully promote digital transformation. NEXCOM aims to bring humans a more convenient and safer smart living environment.NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has launched season 3 of its "Farm Different" video series.DigiKey's season 3 of its "Farm Different" video series is sponsored by Analog Devices, Inc. (ADI) and Amphenol Industrial.Season 3 features three episodes that provide a look into the future of farming to determine what innovations will power the next generation of global food production. The series explores how robotics and autonomous vehicles are coming to the farm and also dives deeper into the integral data necessary to identify local strategies, maximize yield, and help farmers sustainably feed the planet.DigiKey launched Season 3 of its "Farm Different" video series with ADI and Amphenol Industrial."The agricultural community has never backed down when facing sustainability challenges," said Josh Mickolio, supplier business development manager at DigiKey. "Navigating reduced labor pools, unpredictable weather, and rising costs threatens growth in production and the survivability of small and large farming operations alike. This season highlights the fertile future of smart farming, showcasing solutions that leverage the creativity, ingenuity, and resilience this industry is known for.""With factors such as population growth and climate change, the future will require us to achieve much more with far less, and technology has a key role to play in precision agriculture," said Tzeno Galchev, marketing director at ADI. "Our technology is helping enable efficiencies across the board. This includes smart edge applications like livestock management and tracking that use our ultra-low power technologies, all the way to automating, electrifying, and navigating the machinery that feeds the planet using our inertial measurement units, connectivity, and battery management solutions.""In the realm of agriculture innovation, our connectivity solutions are at the heart of empowering farmers to 'Farm Different,' ushering in a new era of precision, efficiency, and sustainability," shared Mark Cunningham, general manager at Amphenol Industrial. "At Amphenol, we are committed to enabling the transformation of agriculture, where technology and data converge to cultivate a brighter future for farming."The first of three videos in the series, "Agriculture's Tech Revolution," explores how farms are incorporating new technologies to transform the way they plant, monitor, and harvest crops. Learn how today's agricultural technology innovators are making the latest solutions and the benefits they provide accessible to farming operations of all sizes.The second video, "Planting the Seeds of Future Farms," dives into new forms of energy management, connectivity, and electrification that are laying the groundwork for tomorrow's farming solutions. Discover how new innovations will leverage this foundational infrastructure well into the future.The third and final video, "Exploring Intelligent Agriculture Solutions," details the latest advancements in everything from drones to autonomous tractors, crop monitoring, and precision farming methods. Delve into the ways new solutions are improving efficiency, yields, and sustainability.To learn more about the video series, sustainable production, and how DigiKey is supporting the rapidly changing agricultural sector, please visit the DigiKey website.

iCatch Technology, a leading AI image processing IC design company, has recently launched the V77 AI Imaging SoC capable of recording 4K 60fps videos. Despite its enhanced system performance, the V77 maintains low power consumption, delivering a richer user experience for sports cameras and drone applications.V77, AI Imaging SoC designed for wearable camera applications. Photo: iCatch TechnologySports cameras have become increasingly popular for travelers, evolving from traditional digital cameras and smartphones. In recent years, various products such as drones, panoramic cameras, and gimbal cameras have emerged with demands for low power consumption, high image quality, and high frame rates, posing significant challenges for conventional Imaging SoCs. Since its inception, iCatch Technology has been dedicated to providing solutions primarily for Japanese digital camera applications. Over the past two decades, the company has witnessed the continuous evolution and development of sports cameras, demonstrating a profound understanding of product experience and customer needs. From video dimensions of visibility (high dynamic range imaging), clarity (low-noise high-definition imaging), and understanding (AI image recognition) to audio dimensions of audibility (real-time listening), clarity (noise cancellation), and understanding (AI voice recognition), iCatch Technology has been advancing the wearable imaging application, accumulating a solid reputation for its products. With solutions tailored to product needs and high integration, the company has facilitated rapid mass production for its customers.The V77 AI Imaging SoC integrates iCatch Technology's 8th-generation dual-core AI Image Signal Processor (AI-ISP), supporting low-latency AI noise reduction and low-light full-color technology. Equipped with 120dB High Dynamic Range processing comparable to human vision, coupled with Local Tone Mapping (LTM) technology, the V77 supports multiple camera inputs, real-time image distortion correction and stitching, and includes the 3rd-generation high-precision multi-axis Electronic Image Stabilization (EIS) engine. Additionally, it features a 1.5 TOPS efficient AI Neural Processor Unit (NPU) accelerator, complemented by low-power Smart H.265 codec for high-definition streaming applications. Moreover, the V77 supports continuous shots up to 48 Megapixels at 10 frames per second, integrates an audio signal processor DSP supporting audio 3A (AGC, ANS, AEC) algorithms, and features USB3.2 Host/Device dual-function interface and SDIO 3.0 expansion interface with speeds of up to 208MHz, significantly enhancing external data transfer rates for USB, LTE Dongle, Wi-Fi and other applications. With advanced memory compression and access technology, as well as LPDDR4 support, it further enhances memory bandwidth for image processing and AI computing. Employing an industry-leading 8-bit Dual Transfer Rate (DTR) Serial Peripheral Interface (SPI) and Fast Boot technology, the V77 doubles the system's cold boot speed, ensuring a seamless product experience of instant capture upon boot-up.As consumer demands for photography continue to diversify, and product applications become increasingly specialized, iCatch Technology is committed to developing more efficient and intelligent imaging SoCs. Through continuous technological innovation and product research and development, the company aims to continually empower intelligent imaging products and applications.

SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development: high-bandwidth memory.The Icheon-based firm is investing more than $1 billion in South Korea this year to expand and improve the final steps of its chip manufacture, said Lee Kang-Wook, a former Samsung Electronics Co. engineer who now heads up packaging development at SK Hynix. Innovation with that process is at the heart of HBM's advantage as the most sought-after AI memory, and further advances will be key to reducing power consumption, driving performance, and cementing the company's lead in the HBM market.Lee specializes in advanced ways of combining and connecting semiconductors, which has grown in importance with the advent of modern AI and its digestion of vast troves of data via parallel processing chains. While SK Hynix has not disclosed its capital expenditure budget for this year, the average analyst estimate puts the figure at 14 trillion won ($10.5 billion). That suggests advanced packaging, which could take up a 10th of that, is a major priority."The first 50 years of the semiconductor industry has been about the front-end," or the design and fabrication of the chips themselves, Lee said in an interview. "But the next 50 years is going to be all about the back-end," or packaging.Credit: BloombergBeing the first to achieve the next milestone in this race can now catapult companies into industry-leading positions. SK Hynix was chosen by Nvidia Corp. to provide the HBM for its standard-setting AI accelerators, pushing the Korean firm's value up to 119 trillion won. Its stock gained about 1% in Seoul on Thursday, adding to a nearly 120% increase since the start of 2023. It is now South Korea's second most valuable company, outperforming Samsung and US rival Micron Technology Inc.Lee, now 55 years old, helped pioneer a novel method for packaging the third generation of the technology, HBM2E, which was quickly followed by the other two major makers. That innovation was central to SK Hynix winning Nvidia as a customer in late 2019.Stacking chips to derive greater performance has long been Lee's passion. In 2000, he earned his Ph.D. in 3D integration technology for micro-systems from Japan's Tohoku University, under Mitsumasa Koyanagi, who invented the stacked capacitor DRAM used in mobile phones. In 2002, Lee joined as principal engineer at Samsung's memory division, where he led the development of Through-Silicon Via (TSV)-based 3D packaging technologies.Credit: BloombergThat work would later become the foundation for developing HBM. HBM is a type of high-performance memory that stacks chips on top of one another and connects them with TSVs for faster and more energy-efficient data processing.But back in the pre-smartphone era, Samsung was making bigger bets elsewhere. The norm was for global chipmakers to outsource to smaller Asian nations the tasks of assembling, testing, and packaging chips.So when SK Hynix and US partner Advanced Micro Devices Inc. introduced HBM to the world in 2013, they remained unchallenged for two years before Samsung developed its HBM2 in late 2015. Lee joined SK Hynix three years later. They joked, with a measure of pride, that HBM stood for "Hynix's Best Memory.""SK Hynix's management had better insights into where this industry is headed and they were well prepared," said Sanjeev Rana, an analyst at CLSA Securities Korea. "When the opportunity came their way, they grabbed it with both hands." As for Samsung, "they were caught napping."ChatGPT's release in November 2022 was the moment Lee had been waiting for. By that time, his team had developed a new packaging method called mass reflow-molded underfill (MR-MUF), aided by his contacts in Japan. The process, which involves injecting and then hardening liquid material between layers of silicon, improved heat dissipation and production yields. SK Hynix teamed up with Namics Corp. in Japan for the material and a related patent, according to a person familiar with the matter.SK Hynix is pouring the bulk of its new investment into advancing MR-MUF and TSV technologies, Lee said.Samsung, which has for years been distracted by a succession saga at its very top, is now fighting back. Nvidia last year gave the nod to Samsung's HBM chips, and the Suwon-based company said on February 26 that it had developed the fifth generation of the technology, HBM3E, with 12 layers of DRAM chips and the industry's largest capacity of 36GB.On the same day, Boise, Idaho-based Micron surprised industry watchers by saying it had begun volume production of 24GB, eight-layer HBM3E, which will be part of Nvidia's H200 Tensor Core units shipping in the second quarter.With its big commitment to expanding and enhancing technology at home and a multibillion-dollar advanced packaging facility planned for the US, Lee remains bullish about SK Hynix's prospects in the face of intensifying competition. He sees the present investment as laying the groundwork to meet more demand to come with future generations of HBM.

The integration of network technology has rapidly advanced the development of industrial automation systems, thereby changing the manufacturing value chain. The Human Machine Interface (HMI) is a quintessential technology. Today, HMIs integrate various on-site manufacturing processes, ensure equipment and machines transmit high-speed and reliable wireless data in harsh environments, and provide precise process control. HMIs are also crucial in collecting, controlling, and managing critical process data. Driven by the rise of smart manufacturing, the issues of digital transformation and green energy sustainability have become prominent. With the innovation of big data, machine learning, artificial intelligence, and industrial Internet of Things technology, the corporate world is now experiencing unprecedented technological innovation and environmental sustainability. At this time of transformation challenges, the most important thing is for enterprises to improve manufacturing efficiency and fuel continuous creativity.Originally from Sweden, Beijer Electronics is a global leader in HMI products. The CEO, Kristine Lindberg, accepted this exclusive interview. She joined Beijer Electronics as CEO in April 2023. The company Lindberg previously worked for was a significant customer of Beijer Electronics. As early as 2000, she developed a thorough understanding and command of the Asia-Pacific (APAC) market.A technology company that puts people first and aims to become an essential partner to its customers.Lindberg exemplifies the corporate vision of Beijer Electronics, emphasizing that it is a company whose mission is to become an essential partner to its customers. Beijer's primary customers include influential multinational companies such as equipment and machine manufacturers, system integrators, and marine industries. Providing technology to improve the efficiency of customers' products and creating the ability for sustainable development are two critical core capabilities of modern enterprises. Lindberg says: "Through technological innovations in visualization, digitization, and automation, Beijer Electronics continues to provide solid hardware equipment, programming, software expertise, and technical support services to help customers accelerate innovation, achieve their goals and ambitions, and gain competitive advantage."Beijer Electronics has thoroughly analyzed the market outlook and trends in 2024. Beijer Electronics has established a strong supply chain, sound management capabilities, and technical innovation to meet its commitments to customers and invest resources to further amplify software and hardware product capabilities and quality. Beijer Electronics provides visualization software solutions and a product portfolio based on web technology, and a new generation of HMI products will be launched in 2024. "These major growth areas put us in a favorable position. We are confident in grasping good growth opportunities in 2024 while the economic prospects are still uncertain.Embrace the pivotal business opportunities of digital transformation and green sustainability.The APAC market is an integral segment of the global automation system. Lindberg sees many opportunities for substantial growth, especially in the thriving semiconductor market, a manufacturing industry that has received significant attention from Taiwan and the Asia-Pacific region. Beijer Electronics' industrial-grade AIoT intelligent solution aims to optimize the availability of semiconductor process peripheral equipment and closely integrate business opportunities with back-end packaging and testing process equipment. Beijer utilizes the X2 series of HMIs and BoX2 series of IIoT gateways to quickly establish a solution that complies with SECS/GEM communication protocol standards to control the information management process between process equipment and computer-integrated manufacturing (CIM) control systems, improve production efficiency, reduce human operating errors, achieve increased production capacity utilization, and continue to strengthen competitive advantages. Consequently, Beijer Electronics obtained an invention patent certification from the Taiwan Intellectual Property Bureau and substantially contributed to the evolving semiconductor industry.The marine equipment industry is also a sector that has attracted much attention, especially under the global trend of pursuing green energy and emphasis on ESG indicators. The shipbuilding and maritime-related industries are all participating in the green transformation action in full swing. Beijer Electronics is also in the critical process of moving towards a green and sustainable transition. In addition to its manufacturing base in Taiwan, Beijer Electronics has established a new manufacturing base close to its headquarters in Sweden. The base is expected to be launched in the first quarter of 2024. This investment will meet sustainability needs and continue to meet customers' strong demand for HMI solutions. The challenges of digital transformation and net-zero carbon emissions will be an ongoing and long-term journey; Beijer Electronics will collaborate with customers to actively pursue growth and bring significant value.For more information, please visit Beijer Electronics.​ ​

UBI Research, a display specialist research company, will hold the international business conferences OLED Korea and eXtended Reality Korea in parallel at The-K Hotel in Yangjae, Seoul from March 27 to 29, 2024. This event is expected to be an opportunity for people from companies, academia, and research institutes related to the display industry around the world to attend, exchange the best information, and form a global network.eXtended Reality Korea is the first XR industry-related business conference held by UBI Research and will cover trends and outlook on microdisplay, XR Hardware/Software, materials, equipment, etc.This event aims to provide attendees with the opportunity to deeply explore the display and XR areas through a comprehensive program including tutorials, keynote presentations, and panel discussions.The tutorial on March 27th will feature presentations on the future of XR, micro LED display technology, and key technologies to realize the next-generation OLED display.In addition, keynote presentations by Samsung Display, LG Display, Hyundai Mobis, and Fortell Games are scheduled for the conference to be held on March 28th and 29th. In addition, it will be run by a total of 34 domestic and foreign speakers and programs, including AR/VR development and technology, automotive displays, OLED industry, backplane technology, and MicroLED display development.Because it is a parallel event, attendees can attend both events even if they register for one event, and registration is possible at a special discount price during the early bird period until February 29th.Detailed information can be found on the website (https://oledkoreaconference.com/, https://extendedrealitykorea.com/).2024 OLED Korea and 2024 eXtended Reality Korea

With geopolitics driving changes in the industrial environment, Southeast Asia has newly become a global center of manufacturing. Eternal Materials, a major, all-inclusive materials supplier with extensive experience in the fields of automotive electronics and PCB, has recently expanded its presence in Thailand in a move to improve its local service quality. While the current production capacity of Eternal Materials' separation plant in Thailand meets existing market demand, there has recently been an increase in customers from various countries establishing plants in Thailand. In response to this emerging market-derived demand, Eternal Materials has built a new separation plant in the Southeast Asian country that is expected to begin operations in Q4 of 2025.Founded in 1964, Eternal Materials has three major business divisions: High Performance Materials, Electronic Materials, and Resins Materials. Notably, its Electronic Materials division has solid capabilities in formula design, with the company being one of the world's leading suppliers of dry film photoresists. Furthermore, as one of the world's three largest suppliers of photo-curing raw materials and a frontrunner in synthetic resin technology in Asia, Eternal Materials has continued to combine its major advantages in service and technology over the years to offer unparalleled support to its customers.With rapid changes in the geopolitical landscape, global manufacturing has begun to strengthen its presence in Southeast Asia to mitigate risks, with Malaysia, Vietnam, and Thailand being key destinations. If we observe the industrial layout, we see that Malaysia has a high demand for PCB substrates, while Vietnam focuses on flexible printed circuit boards, and Thailand mainly focuses on automotive and consumer electronics. Thailand's share of demand in the Southeast Asian PCB market exceeds 60%, and the market is still growing rapidly.Eternal Materials currently operates a separation plant in Thailand, with a market share of more than 50% and a prominent market position. Its production capacity can already meet local market orders for 2026. The new separation plant that will begin operations in 2025 will be able to meet growing customer demand, enhance local service quality, mitigate geopolitical risks, and provide flexible responses to market fluctuations.Concerning technology, Eternal Materials leads the market in dry film photoresist PCB technology. With more than 30 years of core technologies in precision coating and resin synthesis and formulation, it can meet the various product requirements of its customers As for the automotive electronics sector, Eternal Materials' products have passed stringent automotive standards, helping automotive electronics customers expedite product development and capitalize on market opportunities.In addition to Thailand, Eternal Materials has also established a foothold in Malaysia and Vietnam. The Penang sales office in Malaysia is set to begin operations in the fourth quarter of 2024, and its Johor Bahru plant will go into production in Q4 of 2025. As for Vietnam, the company has a sales office in Ho Chi Minh City to serve the local customer base. Moving forward, Eternal Materials will make Thailand the cornerstone of its operations presence in the Southeast Asian market. Tailoring its approach to meet the needs of local customers, Eternal Materials will dynamically adjust production capacity and supply chains to ensure prompt and satisfactory responses to customer needs.Eternal Materials (booth number: 609) will also exhibit its various solutions at the inaugural Thailand Int'l PCB and Electronics Manufacturing Exhibition (which runs from 2/29 to 3/2) co-organized by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) and Taiwan Printed Circuit Association (TPCA). People from all sectors are welcome to visit the booth, where a service team can provide you with professional consultation.Eternal Materials provides flexible and immediate sales services for customers

Pegatron 5G joins the Mobile World Congress (MWC) to showcase its end-to-end and interoperable 5G portfolio. The products include CPE, Dongle, and Camera, eCPRI disaggregated cell site switches, 5G ORAN RU, DU, CU, UPF, and OSS including SMO, RIC, xApps, and rApps. Pegatron 5G was initiated in 2018 and has since developed a comprehensive suite of E2E 5G ORAN products.Pegatron 5G has a full range of User Equipment products, such as CPE, Dongle, and Camera. Each of these device types provides both standard full 5G bandwidth SKUs and RedCap SKUs for more cost-constrained requirements.Pegatron 5G offers a range of radio products to meet various customer needs.*Indoor/Outdoor 5G NR FR1 4T4R Integrated Small Cell based on Qualcomm FSM20056.*Indoor/Outdoor 5G NR FR1 4T4R O-RU based on Gen2 SoC to reduce power consumption and weight.*Outdoor 5G NR FR2 2T2R O-RU, a mmWave ORU based on the same SoC and main board hardware design as the FR1 product series. *Each comes in a range of frequency-based SKUs to support various market deployments.Switches include Fronthaul Multiplexer and Cell Site Router. Fronthaul Multiplexer helps users to economically expand coverage by adding additional RUs and multiplexing the existing DU capacity. Later, as traffic growth increases, additional DU capacity can be added as needed for a pay-as-you-grow expandable solution. Cell Site Router supports PTP timing and is disaggregated hardware that can be integrated with multiple software vendors.DU/CU, MEC, and AI servers will also be showcased, DU/CU servers are purpose-built for Telco requirements such as extended temperature range, and short rack depth. MEC and AI servers offer dense computing capability for AI applications.Pegatron 5G's 3GPP O-RAN architecture is designed to enhance network flexibility for 5G private network operators. Our product suite embodies key principles: disaggregation to reduce costs, cloud-native for efficient resource pooling, and scalability for easy upgrades. Our solutions are designed to meet your specific needs.All of Pegatron 5G's factories are strategically located for in-country or near-shoring manufacturing, meeting the highest standards of clean network designed and produced by our own manufacturing centers in Taiwan, Vietnam, Indonesia, India, and Mexico.Pegatron 5G's products are enabling digital transformation solutions in many different domains including:*Smart manufacturing*Digital resilience networks*Disaster rescue and relief*Transportation and logistics*Oil & GasVisit our MWC booth at Hall 5, Stand 5K9, or visit our webpage https://5g.pegatroncorp.com/ for an immersive experience where connectivity meets innovation.

Newhaven Display is an American company specializing in the design and production of a wide range of LCD, TFT, OLED, and VFD displays. The manufacturer is continuously looking for new solutions and is dedicated to developing convenient tools and easily implementable solutions, and to providing support to engineers and programmers.All these factors have contributed to the creation of two interesting series of displays by Newhaven Display, which are now available straight from our stock.2.7" OLED touchscreen displaysA new series of graphic OLED displays includes 2.7" modules featuring 128x64 pixel resolution. They are equipped with a factory-installed capacitive touchscreen. As multipurpose products, they can be connected to a control system via a 20-pin flexible flat cable (FFC) or a 20-pin socket. In both cases, the user can construct devices that are capable of communication through a parallel or serial peripheral interface (SPI), compliant with e.g. Arduino modules, as well as almost all, even the least advanced, models of modern microcontrollers. The maximum image contrast ratio reaches up to 10000:1 and is programmable. The color emitted by the monochromatic display can be yellow or white.The clear display and the responsive touchscreen are a perfect match.The capacitive touchscreen boasts an incredibly short response time and can detect up to 5 points of contact simultaneously. While designing the module, the manufacturer made sure to reduce the emissions and impact of electromagnetic interference (EMI). The products are mainly intended for industrial control panels, Internet of Things (IoT) applications, smart devices, etc.SpecificationItemDetailType of displayOLEDKind of displaygraphicScreen size2.7"Display resolution128x64Dimensions*82x47.5x7.2 mm or 82x47.5x8.1 mmViewing area (H x W)63.31x32.59 mmEmitted colourwhite or yellowNumber of pins26Kind of controllerSSD1322Connector pinout layout1x6, 1x20Contact pitch*1 mm or 2.54 mmOperating temperature-40...85°CType of touchscreencapacitive* depending on the model3.5" TFT displays with an MIPI interfaceThe displays are ideal for building handheld gaming consolesWhen it comes to compact TFT displays, the 3.5" display size has become a standard. There are many variants of these modules available on the market, however, the solutions from Newhaven Display offer several significant features that are not commonly exhibited by other products.Above all, the displays are made with the use of IPS TFT technology, which allows for a shorter response time, higher contrast, and a wider viewing angle while displaying more accurate colors (in contrast to "classic" modules). It is also important to mention the resolution of the displays, which is as high as 640x480 pixels. All of these features guarantee that the image is sharp and of exceptional quality.The manufacturer has also made sure that the displays are convenient to use – the built-in controller makes it easier to control the display via a microcontroller and provides additional EMI shielding to reduce the risk of electromagnetic interference.The main difference between the old and the new products offered by the supplier involves the implementation of the MIPI DSI bus (Mobile Industry Processor Interface Display Serial Interface), which is a new and fast interface used for communication with microcontroller systems. The standard was designed with these exact display modules in mind. It uses four data lanes for fast transmission of data to the display, ensuring a high refresh rate. Thanks to this, the users can enjoy smoother animations, deeper colors, and improved comfort of use. The MIPI DSI interface also offers reduced image compression and requires less cache memory (buffer).The display is available in two variants: standard or with a built-in capacitive touchscreen. The products are intended for demanding applications, medical and industrial equipment, and multimedia devices such as video game consoles (e.g. for retrogaming) based on SoC circuits or single-board computers.SpecificationItemDetailType of displayTFTKind of displaygraphic, IPS matrixTouchscreen*none or capacitiveScreen size3.5"Display resolution640x480BacklightLEDViewing area (H x W)52.56x70.08 mmDimensions*76.9x63.9x3.2 mm or 76.9x63.9x4.95 mmOperating temperature-20...70°CEmitted colourRGBInterfaceMIPILuminosity808 cd/m2 or 950 cd/m2Connector pinout layout*1x40 (+ 1x6)Number of pins*40 or 46Ribbon cable pitch0.5 mmBacklight colourwhiteKind of controller*FL7703NI, FT5426-003*depending on the model