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Tuesday 3 September 2024
BigGo refines shopping experience with an all-around price comparison platform
Many consumers find it difficult to navigate through today's flourishing e-commerce landscape and have trouble comparing prices across shopping websites...
Monday 2 September 2024
OmniEyes boosts fleet management efficiency with real-time Edge AI driver behavior analysis
Driver behavior management is a key part of logistics company operation. Unsafe driver behavior not only threatens road safety but also damages the company's reputation, and worse yet, it might incur large legal expenses.
Thursday 29 August 2024
Unlocking AI potential: Chenbro's AI tower server chassis product line optimized for machine learning and data analytics
Chenbro (TWSE: 8210), a pioneer in the design and manufacturing of own-brand rackmount systems, is thrilled to unveil the SR215 tower server chassis, meticulously designed to meet diverse market needs in artificial intelligence (AI), machine learning (ML), and data processing...
Thursday 29 August 2024
Brewer Science presents materials' impact in sustainable processes, AI, HPC
Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).
Thursday 29 August 2024
Morglory launches new single-crystal diamond disks
Global leading single-crystal diamond technology enters the CMP process application market
Thursday 29 August 2024
Enhanced semiconductor manufacturing capabilities showcased at SEMICON Taiwan 2024
In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan 2024. These innovations underscore ifm's formidable expertise in enhancing productivity and optimizing quality in semiconductor processes.
Thursday 29 August 2024
SK Hynix develops industry's first 1c DDR5
SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.
Wednesday 28 August 2024
3S Silicon will unveil its latest development of the 3S Open Lab Platform, helping RD teams turn smart concepts into valuable reality, for EV Power Modules packaging
Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.
Wednesday 28 August 2024
Reliya attends SEMICON 2024 along with gas equipment from ASDevices, Simpure, Tiger Optics
In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has been vigorously promoting its own brand and has also introduced three leading brands, ASDevices, Simpure, and Tiger Optics, to the local market.
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications...