iCatch Technology, a leading AI image processing IC design company, announced today a collaboration with Valens Semiconductor, a world leader in high-performance connectivity solutions, on an innovative AI-enhanced multi-channel surround view monitoring system based on Valens Semiconductor's MIPI A-PHY high-speed and long-range sensor connectivity technology. The live demonstration of this system will be featured at Automotive World Tokyo 2024 Booth E42-20 from January 24 to 26.Invitation to Automotive World Tokyo 2024 by iCatch Technology Photo: iCatch TechnologyThe multi-channel surround view monitoring system is designed to transmit four camera streams over extended distances, leveraging the capabilities of Valens Semiconductor's VA7000 chipset family which provides flexibility on a wide range of standardized cables to deliver a high bandwidth, zero latency, and cost-efficient connectivity solution for future automobiles. The four independent video streams are then received by iCatch Technology's CR3 Automotive AI Imaging SoC for image and Advanced Driver Assistance Systems (ADAS) processing to enable Blind Spot Detection (BSD) and Rear Collision Warning (RCW) features.Moreover, iCatch Technology will also unveil a wide range of Smart Cabin solutions at Automotive World Tokyo 2024, covering Euro NCAP compliant Driver Monitoring Systems (DMS) and Occupant Monitoring Systems (OMS), along with Camera Monitoring System (CMS). These solutions are designed to revolutionize the automotive industry by enhancing safety, comfort, and the overall driving experience.Weber Hsu, General Manager of iCatch Technology, expressed enthusiasm for the event, stating, "Our collaboration with Valens Semiconductor on the MIPI A-PHY Automotive SerDes Solution signifies a substantial step forward in reshaping the automotive connectivity landscape. Automotive World Tokyo provides us with a great opportunity to showcase the latest innovations in automotive AI imaging. Our recent acquisition of certifications in the ISO26262 FuSa and ISO21434 Cybersecurity design flow, emphasizes our dedication to penetrate the automotive OEM market, whether through existing SoC or Solution SoC."Gideon Kedem, Head of Automotive Business at Valens Semiconductor, said: "The superiority of MIPI A-PHY technology continues to attract interest from around the automotive market. A-PHY is the best way to deliver raw sensor data to centralized ECUs, where iCatch's AI algorithms can turn that data into unparalleled perception for ADAS systems. Because of these synergies between our companies, we are strong believers in our long-standing collaboration with iCatch."iCatch Technology invites all potential customers and business partners to explore our booth, engage with our experts, and experience pioneering innovations that are shaping the future of the automotive industry.For more information about our participation in Automotive World Tokyo 2024, visit us at Booth E42-20 or contact us at [request@icatchtek.com].

CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance. CXL, built upon PCIe interfaces, supports memory expansion beyond DIMM slots, overcoming the latency gap between main memory and SSD storage. It is crucial for AI applications, offering increased memory capacity and bandwidth, and contributing to high-performance computing.Recently, BIWIN successfully launched CXL 2.0 DRAM memory modules. BIWIN's CXL 2.0 DRAM adopts the EDSFF (E3.S) form factor with a memory capacity of up to 96 GB. It also supports a PCIe 5.0 × 8 interface, achieving a theoretical bandwidth of up to 32 GB/s. These modules can be directly connected to backplanes and server motherboards supporting the CXL specification and the E3.S interface, expanding server memory capacity and bandwidth. Additionally, BIWIN can provide CXL AIC adapter cards for server backplanes without E3.S.Features and Advantages:*Equipped with a high-performance memory expansion controller, compliant with CXL 2.0 Type 3 standards, supporting PCIe 5.0 x 8 interface with a theoretical bandwidth of up to 32 GB/s.*Premium DDR5 ICs and capacities of up to 96 GB.*Supports On-Die ECC, Side-Band ECC, SDDC, SECDED.*Allows up to 16 hosts to simultaneously access different sections of memory, and also supports pooling and sharing.*Simultaneously releases an open-source CXL DRAM software toolkit to ensure seamless deployment of CXL extended memory for users. Toolkit features: provides CXL display, implicit API, and allows customers to use it based on different application scenarios; offers application-level CXL NUMA tool usage methods to establish an intuitive understanding at the application level of the benefits of CXL.In terms of latency performance, during actual testing, the BIWIN CXL 2.0 DRAM, mounted on Node 2, exhibits a latency of 247.1 ns for CPU access compared to Node 0. With a bandwidth exceeding 21 GB/s, it demonstrates excellent latency performance, empowering high-speed data processing.Artificial Intelligence (AI) and Machine Learning (ML) continue to drive the growing demand for high-speed data processing. BIWIN CXL 2.0 DRAM combines features such as support for memory capacity and bandwidth expansion, memory pooling and sharing, high bandwidth, low latency, and high reliability, empowering AI high-performance computing. Currently, BIWIN offers functional prototypes of 32 GB to 96 GB CXL 2.0 DRAM for joint evaluation and testing by customers and partners. In the future, BIWIN will remain focused on CXL technology to meet the demands of high-performance computing.AIC Adapter CardFor server backplanes without E3.S, BIWIN provides Adapter-In-Card (AIC) adapter cards, enabling CXL RDIMM memory expansion for servers.BIWIN Launches CXL 2.0 DRAM to Empower Cutting-edge ComputingPremium DDR5 ICs and capacities of up to 96 GBLatency performance, empowering high-speed data processingCXL 2.0 DRAM, achieving a theoretical bandwidth of up to 32 GB/sFor server backplanes without E3.S, BIWIN provides Adapter-In-Card (AIC) adapter cards, enabling CXL RDIMM memory expansion for servers

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI.ECSIPC LIVA X3A with Android and 4 Displays for Rich Advertising & ContentDesigned for digital signage and self-service kiosks in the smart retail industry, or in large vehicles fitted with display-board advertising, this unique mini-PC offers up to 4 display outputs that can showcase a variety of rich and vibrant content. The highly flexible solution can display 4 different screens, mirror all screens the same, split one image across 4 displays, or splits of 3-and-1 or 2-and-2, affording maximum flexibility to cover wide areas of retail spaces that can easily plan and push a multitude of content to inform and advertise in attractive, dynamic, high-resolution visuals, all from a single device. The LIVA X3A mini-PC is ready to go right out the box, along with ECSIPC's own content management software to streamline product deployment.Powered by a highly efficient Rockchip octa-core featuring a 4x ARM Cortex-A76 and 4x ARM Cortex-A55 processors in this ARM-based CPU, the highly efficient, fanless design ensures a sustainable solution that accommodates many use-cases. In addition, 8GB of fast LPDDR5 and 64GB of internal storage is preinstalled, while dual GbE, Wi-Fi 6 and Bluetooth 5.3 provide a variety of internet connectivity built-in, which can be further expanded with optional PoE and 4G LTE to meet specific deployment requirements.ECSIPC LIVA P500 H610 Barebone System for Factory Automation and AOIFeaturing powerful Intel 12/13th Generation Core Processors up to Core i9 (up to 65W TDP), this high performance mini-PC enables efficient and reliable factory automation, AOI and transportation management (for example: rail/tram).The LIVA P500 supports large memory and storage capacity options, plus dual Ethernet networking and a 16X PCI-Express expansion slot for graphics cards or edge processing accelerators, such as visual processing or AI; ideally suited for GPUs such as the Nvidia Quadro T1000 8GB that offer an excellent balance of performance and power-efficiency.Three M.2 slots (M, E and B key) are available for storage, Wi-Fi/BT and LTE/5G respectively, providing a highly capable platform for wide-ranging deployment requirements. Six USB ports, plus RS232/422/485 are available for equipment, and three display outputs are available, including both 12V/19V LVDS for excellent flexibility. Using the VESA mount built into the chassis can act as a convenient method of securely attaching the LIVA P500 H610 in an application scenario.New IPC Motherboards for Smart Retail SolutionsECSIPC will showcase two new IPC motherboards – the ADLN-I3 (Mini-ITX) and H610H7-IM1 (Micro-ATX) – which are ideal for smart retail applications such as vending machines, kiosks, transportation management, and HMI applications.The ADLN-I3 features a highly efficient Intel Alder Lake-N SoC in a fanless design, with support for up to 16GB of DDR4 memory, plus SATA or M.2 PCI-Express SSD. Four display output options, including DP, HDMI, d-sub and LVDS, and 8-channel HD audio it provides plenty of audio-visual options to meet many smart applications with rich content and interactive ability. It features two Gigabit Ethernet sockets, with the option for Wi-Fi/Bluetooth connectivity via M.2 socket, plus eight USB ports, LPT and 10 COM ports required for various IPC peripherals.The H610H7-IM1 provides an LGA1700 socket for high performance Intel 12/13th Generation processors (up to 65W TDP), up to 64GB of memory, four SATA ports, plus high-performance PCI-Express M.2 SSD port. PCI-Express slots for GPUs and expansion cards are available, plus a PCI slot for legacy applications. Three display outputs plus 8-channel HD audio, dual Ethernet (2.5G + 1G) connectivity, plus a total of 12x USB ports and 10x COM ports give it excellent expansion and customization opportunities to meet all potential application requirements.Visit ECSIPC at ISE Barcelona 2024 Tue, 30 Jan 2024 – Fri, 2 Feb 2024: Venue: Fira Barcelona Booth: 2S220, Hall 2

In a strategic move aimed at expanding its presence in the Taiwan market, Crypto Quantique, a prominent quantum-safe cybersecurity solutions provider, has unveiled a strategic partnership with iMQ Technology, a leading innovator in MCUs (Microcontrollers) and security chips.The newly established commercial alliance intends to capitalize on the advanced capabilities offered by Crypto Quantique's QuarkLink platform. This platform is designed to facilitate secure connectivity for businesses seeking to integrate IoT (Internet of Things) products. The collaboration incorporates iMQ's cutting-edge security chip SQ7131, coupled with cloud services, providing a secure and streamlined approach for customers to integrate innovative features into their products. This includes the ability to conduct secure over-the-air updates throughout the entire lifecycle of their devices.Crucially, this achievement is realized without requiring substantial investment in engineering resources or in-depth knowledge of chip-to-cloud security. iMQ's security chip technology enables customers to significantly enhance the security of their products through the integration of a pre-provisioned SQ7131 security chip. This implementation instantaneously enables identity authentication, secure communication, and encrypted over-the-air software updates, aligning with forthcoming regulations.Anticipating the quantum computing era, Crypto Quantique is proactively enhancing the resilience of QuarkLink through the integration of post-quantum cryptography. These quantum-resistant techniques are crafted to ensure the sustained efficacy of security measures, even in the face of potential quantum-powered attacks.In a landscape where more than 20 countries worldwide are implementing stringent IoT security regulations, including the upcoming EU Cyber Resilience Act, mandating a baseline security level for compliance or risk financial penalties, Crypto Quantique's chip-to-cloud IoT security solution emerges as a crucial component. This not only ensures compliance with evolving regulations but also mitigates risks across global supply chains.The collaboration between Crypto Quantique and iMQ Technology represents a significant step forward in providing robust, future-proof solutions in the rapidly evolving landscape of quantum-safe cybersecurity and IoT connectivity.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane, the highest UCIe speed, for AI/HPC/xPU/Networking applications. UCIe 32G chiplet interface provides an industry-leading bandwidth density 10Tbps per 1mm of die edge (5Tbps/mm full duplex). The chip uses TSMC's N3P silicon process and CoWoSR advanced packaging technology.In recent years GUC has developed a family of chiplet interconnect IPs (GLink-2.5D) in TSMC N7, N5, and N3 process nodes. GLink-2.5D IPs were validated in silicon demonstrating robust operation up to 17.2 Gbps with raw BERThe UCIe Consortium has set a vision for the interoperability of chiplet interfaces. GUC's implementation of UCIe takes advantage of many silicon-proven generations of GLink-2.5D IPs, making the lowest risk path to UCIe with the highest performance parameters. GUC also developed bridges for AXI, CXS, and CHI buses using the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power, low data transfer latency, and efficient end-to-end flow control, facilitating a seamless transition from single-chip NoC to chiplets architecture. The bridges support Dynamic Voltage and Frequency Scaling (DVFS) allowing voltage and bus frequency change on the fly while ensuring uninterrupted data flow.GUC's UCIe IP supports UCIe-1.1 Preventive Monitoring functionality. It includes proteanTecs' I/O signal quality monitors which were already tested in the GLink-2.5D family. Signal quality is monitored in mission mode, during data transfer, without retraining or causing any data transfer interruption. Every signal lane is continuously monitored and reported separately, and power and signal integrity events are detected. Bumps and trace defects are identified before they cause the interface to fail. The repair algorithm then replaces marginal lanes- with redundant ones to prevent system operation failure, so the chip lifetime is extended."We are proud to announce the world's first UCIe IP supporting 32 Gbps," said Aditya Raina, CMO of GUC. "We have established a complete silicon-proven 2.5D/3D chiplet IP portfolio at TSMC's 7nm, 5nm, and 3nm technologies. Together with design expertise, package design, electrical and thermal simulations, DFT, and production testing for the TSMC 3DFabric offerings including CoWoS, InFO, and SoIC, we provide our customers with a robust and comprehensive solution, enabling fast design cycles and quick bring-up of their AI/HPC/xPU/Networking products.""We are committed to delivering the fastest and the lowest power 2.5D/3D chiplets and HBM interface IPs," said Igor Elkanovich, CTO of GUC. "Convergence of 2.5D and 3D packaging using HBM3/4, GLink-2.5D/UCIe and GLink-3D interfaces enables highly modular, much bigger than reticle size processors of the future."To learn more about GUC's UCIe IP portfolio, and CoWoS/3DIC total solution, please contact your GUC sales representative directly or email guc_sales@guc-asic.com.GUC UCIe Highlights

Lelon Electronics started as an OEM contract manufacturer of aluminum capacitors 47 years ago. It has since evolved into one of the world's top ten aluminum capacitor makers. Lelon recently embarked on constructing state-of-the-art production plants in Suzhou, China, and Thailand to satisfy the demand for automotive, high-performance computing, and other applications. The current expansion strategy will give Lelon more agility and flexibility in its business operations, enhancing its adaptability in response to recent changes in global politics and economics.Investment in New Thai and Suzhou Plants In Response to Geopolitical NeedsLelon Electronics Chairman Jimmy Wu stated that external factors such as COVID-19 and China-US tensions as well as the outbreak of the Russian-Ukrainian War have changed global politics and economics in substantial ways. The old globalized operating model can no longer be depended upon so many international customers are now pushing for their upstream supply chain to adopt a "China + 1" strategy. Consequently, it is imperative for upstream component sources not only to possess mass production capacity based in China but also to establish supply chains in other countries, mitigating operational risks from geopolitics. For this reason, Lelon Electronics has chosen to invest in a new plant in Thailand.In China, Lelon has a well-established and strategically positioned plant in Suzhou's Wujiang City. The successful development of the high-end market segment and the master development plan outlined by the local government prompted Lelon to make the decision, in 2018, to build a new plant in Wujiang City that would serve as the company's headquarters in China. The new plant has cutting-edge automotive capacitor production machinery and an automotive reliability lab. The plant is targeted at local automotive, industrial, transportation, and other applications in China.Will the successive construction of new plants in Suzhou and Thailand run the risk of over-production? Wu believes that, despite the growing number of countervailing factors in the current Chinese market, there is still room for further growth. In the past, Chinese customers tended to turn to European/US/Japanese suppliers in many premium application segments. However, Lelon's existing plant in Suzhou does give it a home advantage. Furthermore, continued improvements in product quality have led to a positive reception of Lelon's high-end products by customers. The current economic climate is still characterized by numerous variables but the outlook on automotive electronics remains positive.According to Wu, the new Thai plant will feature a full array of production lines. Construction will start in 2024 and the production lines will start coming online from 2025 Q3 onwards. Due to growing environmental and sustainability awareness in recent years, important concepts such as renewable energy, water management, smart manufacturing, and digital management will all be progressively introduced to the new plants. This approach aims to ensure that Lelon can shoulder its social responsibility for local ecology, carbon inventory, and other issues.Growing Demand for Electric Vehicles Drives Expansion into Charging SectorLelon has already established a close working relationship with the local automotive supply chain in China, but its involvement extends beyond the surface. Wu revealed that Lelon's aluminum capacitor products have already entered the supply chain of tier-1 international automotive suppliers. Lelon now participates in the design-in process of customers during product development. An in-depth understanding of customer expectations allows Lelon to provide the customer with refined aluminum capacitor solutions. Lelon's 2022 financial report indicated that automotive electronics accounted for up to 22.8%, followed by power supply/green energy at 13.9%, then telecommunications and network communications at 11.5%. Wu suggested that automotive use would exceed 30% this year, underscoring the sector's critical importance to Lelon.This significance prompted the planning of the two all-new plants in Suzhou, China, and Thailand will follow the planning approach for professional aluminum capacitor plants. The plants will not only have more production lines but also all the testing equipment required by the automotive sector. Wu said that while aluminum capacitor products can be found in consumer electronics like computers, communication devices, consumer electronics, and notebook computers, the products are relatively easy to supply so the competition is very intense. Automotive products by comparison have more requirements. For example, during extreme polar weather events, how can the car body transition from minus 30 degrees to 70 degrees in an instant? Therefore, a wide temperature range is an important attribute of electronic components. As vehicles in motion are subject to constant vibration, vibration resistance is another key factor for distinguishing between good and poor aluminum capacitors. Therefore, the material selection and professional expertise in aluminum capacitors become pivotal in meeting automotive specifications.Wu added that as cars become more electrified the demand for aluminum capacitors naturally begins to rise. The rapid growth of electric vehicles has notably contributed to improvements in charging power. Wu said that the two main approaches for coping with the continued rise in charging power consist of high voltage or high current. Lelon is already engaging in co-development with customers to supply customers with sound products and services customized to their requirements. This approach has always been a cornerstone of Lelon's business philosophy. For instance, Lelon works closely with a leading Japanese audio system maker to supply customized products. Other than the electric vehicles sector, server systems used for AI and high-performance computing now have their specifications for aluminum capacitor products, and Lelon is actively targeting this market.In summary, Lelon, one of the world's top ten aluminum capacitor suppliers, is now progressively building new plants in Suzhou (China) and Thailand in response to increased vehicle electrification, growing demand for electric vehicles, and geopolitical issues. Lelon is forging strong partnerships with tier-1 automotive suppliers and establishing a presence in other high-end applications. The company is very optimistic about the future development of the high-end market segment and aims to elevate operations to the next level.Official opening of the new Lelon Electronics plant in SuzhouPhoto: Lelon Electronics

SK Hynix held a press conference titled "Memory, the Power of AI" on the sidelines of CES 2024 in Las Vegas where its CEO Kwak Noh-Jung laid out the company's vision in the AI era.At the press conference, attended by both domestic and international media, Kwak said that the importance of memory will grow further as generative AI becomes widespread. He also said that "SK Hynix is providing products from the world's best technologies to the ICT industry, leading the "Memory-Centric AI Everywhere."Kwak laid out the company's plan to introduce the "Custom Memory Platform" to provide customized AI memory solutions as demands for diverse memory products are growing.Below are the key points mentioned during the press conference.The ICT industry evolved dramatically through the PC, mobile, and now cloud-based AI era. Throughout, data in diverse types and massive amounts are being generated and communicated.Now we enter a new era of AGI built on all that data amassed. The new era will thus move towards a market where AGI constantly generates data and repeats learning and evolution.In the AGI era, memory will play a pivotal role in processing data.The role of memory is even more crucial from a computing system perspective. Before, systems were basically an iteration of dataflows from the CPU to memory and then back to the CPU in a sequential manner, but such a structure is not suitable to handle the massive data generated through AI.Now, AI systems are connecting large counts of AI chips and memory in a parallel fashion to accelerate massive data processing. This means that AI system performance depends on stronger and faster memory.The direction for memory in the AI era should be handling data at the fastest speed, in the most effective way, and in higher volume. That aligns with the past century of memory development that has improved density, speed, and bandwidth.The memory-centric AGI era has a clear leader: SK Hynix. We are providing diverse products with ultra-high performance such as HBM3 and HBM3E, the world's best and widest sought-after products, to markets and industries, TSV DIMM, the industry's largest-capacity server memory, LPDDR5 Turbo, the world's fastest mobile memory, and DIMM, the best-in-class performance server.SK Hynix is leading the "Memory-Centric AI Everywhere" in various industries ranging from AGI, conventional data centers, mobile, and PC systems.Building on our lineup, we will deliver a bandwidth-focused HBM4 and HBM4E, a power-improved LPCAMM, a capacity-expanding CXL and QLC storage, as well as compute-capable PIM and hone our technological leadership in the AI era.SK Hynix's AI memory solutions are delivering customers a new experience.Yet, AI systems are advancing at a breathtaking pace, leading to customer demands for diverse forms of memory performance.While some customers require ever larger capacities or more power-efficient products, others want higher bandwidth and the addition of data computing capabilities.So, we are planning to launch SK Hynix's proprietary "Custom Memory Platform."We will bring to AI systems our memory-specialized technology and R&D expertise for optimal convergence with customers' needs.This platform will transcend conventional ways and deliver an entirely new value proposition, catering to every customer with the most optimal memory solution for their needs.SK Hynix is preparing over 4.15 million square meters of a new memory manufacturing base worth over 120 trillion won (92.7 billion USD) investment.This massive capacity will allow us to continue serving existing customers while responding to the explosive growth of AI memory demand with the world's best products delivered in time.Today, I took the opportunity to share SK Hynix's readiness for a total AI memory provider with a clear plan for technology, customers, and production base.Please join us in the new AGI future we shall open and expand with you.SK Hynix CEO Kwak Noh-Jung at the Press Conference

ThroughTek Co., Ltd. (TUTK), a solution provider of AI-IoT cloud platform services, will be exhibiting at CES in Las Vegas from January 9, 2024, to January 12, 2024, at booth 50342 in the Venetian Expo. With the theme "Cloud Services for IoT Device Community," TUTK will showcase a series of IoT products and smart PaaS solutions at CES 2024, focusing on P2P Connection, Hausetopia App, Cloud Recording (VSaaS PaaS), DMP (Data/Device Management Platform), Cloud VMS (Video Management System), and more. These products and solutions can help businesses swiftly implement cloud management of videos, data, and IoT devices, and establish an interconnected IoT device community facilitated by TUTK.The key highlights of the showcase are as follows:P2P ConnectionTUTK's patented P2P Connection technology provides fast and secure connections directly between IoT devices and end-user clients. The P2P Connection can identify the network environment and establish the optimal route for the connection. Additionally, TUTK offers self-hosting server options for its customers. With a high P2P penetration rate, customers can achieve cost reductions in video streaming and data transmission.Hausetopia AppHarnessing TUTK's exclusive technologies, the Hausetopia App, a pre-built and user-friendly application, seamlessly accommodates a variety of IoT devices using diverse communication protocols. After receiving TUTK certification, the IoT devices become readily accessible and controllable via the Hausetopia App. Additionally, the Hausetopia App offers easy customization, enabling brands to create branded applications tailored to their specific requirements.Cloud Recording (VSaaS PaaS)TUTK's Cloud Recording (VSaaS PaaS) is a cloud-based platform equipped with API documentation and servers. It provides a cost-effective alternative to traditional video surveillance solutions by eliminating the need for on-site server installation and system configuration. The Cloud Recording service offers a diverse range of subscription plans for cloud recording and storage. Brand manufacturers can select plans that suit their specific requirements or create customized plans. Furthermore, brand manufacturers have the flexibility to offer plans for their customers to choose from.DMP (Data/Device Management Platform)TUTK's DMP (Data/Device Management Platform) automatically gathers, processes, and analyzes data from IoT devices, presenting it in a visualization dashboard. With this platform, businesses gain real-time monitoring capabilities over their IoT devices. Moreover, businesses can customize their data analysis criteria, including frequency, scheduling, and formulas, and visualize IoT device performance with graphs and charts, offering valuable insights and enabling faster, informed decision-making.Cloud VMS (Video Management System)TUTK's Cloud VMS (Video Management System) is a web-based platform that allows System Integrators (SIs), etc. to seamlessly integrate video management features into their solutions. The Cloud VMS directs IP Cameras, NVRs, XVRs, and sensor data to the cloud, enabling seamless management on a single platform. The Cloud VMS boasts a diverse array of practical features, such as the "Dashboard," "Smart Search," "Share View," "Cloud Recording," and more.The "Dashboard" provides convenient access to vital information such as device status, event count, alert count, and event footage. "Smart Search" allows for swift retrieval of specific details, such as gender and outfit, significantly reducing search time. Each channel within the Cloud VMS is equipped with a share link, facilitating the easy sharing of camera footage with authorized individuals. Lastly, the Cloud VMS offers secure cloud recording and storage for crucial event footage, eliminating concerns about video loss due to device damage.The exhibition highlights will only showcase a fraction of TUTK's dedication to harnessing IoT technology for enhancing the intelligence of diverse hardware devices. TUTK remains steadfast in collaborating with ecosystem partners to foster the growth of the IoT device community associated with TUTK.

SK Hynix Inc. announced today that it will showcase the technology for ultra-high performance memory products, the core of future AI infrastructure, at CES 2024, the most influential tech event in the world taking place from January 9 through 12 in Las Vegas.SK Hynix (or "the company," www.skhynix.com) said that it will highlight its future vision represented by its Memory Centric* at the show and promote the importance of memory products accelerating the technological innovation in the AI era and its competitiveness in the global memory markets.*Memory Centric: An SK Hynix vision where memory products play a pivotal role in ICT devicesThe company will run a space titled SK Wonderland jointly with other major SK Group affiliates including SK Inc., SK Innovation, and SK Telecom, and showcase its major AI memory products including HBM3E.SK Hynix plans to provide HBM3E, the world's best-performing memory product that it successfully developed in August, to the world's largest AI technology companies by starting mass production in the first half of 2024.At SK Group's space with an amusement park theme, SK Hynix will display an AI Fortuneteller where the generative AI technology based on HBM3E is applied. The AI fortuneteller is expected to give visitors fresh fun by creating an image of their cartoon characters based on their own faces and reading New Year fortunes.SK Hynix's leading AI technology will also be displayed at the SK ICT Family Demo Room jointly run by other SK ICT companies. The company will showcase Compute Express Link (CXL**), a next-generation interface, a test product of Computational Memory Solution (CMS), a memory solution that integrates the computational functions of CXL, and Accelerator-in-Memory based Accelerator (AiMX***), a processing-in-memory chip-based accelerator card with low-cost and high-efficiency for generative AI.**CXL (Compute Express Link): a PCIe-based next-generation interconnect protocol, on which high-performance computing systems are based***AiMX (Accelerator-in-Memory based Accelerator): SK Hynix's accelerator card product that specializes in large language models using GDDR6-AiM chipsParticularly, CXL memory, along with HBM, is one of the core products in the limelight with the rise of AI technology. SK Hynix plans to commercialize 96GB and 128GB CXL 2.0 memory solutions based on DDR5 in the second half for shipments to AI customers."We are thrilled to showcase our technology, which has risen to the core of the AI infrastructure in the U.S., home to AI technology," said Justin Kim, President (Head of AI Infra) at SK Hynix. "SK Hynix will step up its efforts for collaboration with global players while seeking to accelerate a turnaround in business with its leadership in the AI memory space."SK Hynix showcases its future AI infrastructure at CES 2024 with the SK Wonderland booth, featuring the Memory Centric vision in collaboration with SK Group affiliates

Chenbro (TWSE: 8210), a leading professional server chassis giant, announced that its Tri-load Series high-density storage server chassis had won the 2023 MUSE Design Awards & 2023 TITAN Innovation Awards. Being able to stand out in the fierce competition among tens of thousands of works worldwide proves that Chenbro's product design philosophy of user experience optimization has been recognized internationally.The Tri-Load Design Makes Server Maintenance Easy, Improving Thermal and Operation StabilityAfter the 2U Dual-load server chassis product won the international award last year, Chenbro continued to optimize user experience in the patented 4U Tri-load storage server chassis design. The Tri-load product design allows users to easily replace or install front-load and dual side-load hard drives, which improves the convenience and safety of maintenance personnel and significantly improves server thermal performance to achieve 24/7 rock-solid stability.Generally, servers are usually configured with hard drives on the front or rear. Chenbro's innovative Tri-load hard-drive configurations allow the motherboard to be moved to the rear side of the server chassis. It matches with the exclusively developed airflow guide for the mechanism to create the best thermal effect and improve the server load stability, helping to extend the product's service life. In addition, Chenbro further cooperated with partners to design exclusive slide rails that can withstand the weight of the entire machine, which is 55.1 lbs. (25 kilograms). Even if the Tri-load product loads with up to 48 hard drives, maintenance personnel can pull it out from the cabinet to replace the hard drives most efficiently and safely.4U High-Density Storage Server Meets the Needs of Large-Capacity Storage for Data CentersIn the past, enterprises might have to consider purchasing multiple storage devices to plan the storage space for 36 3.5-inch hard drives. However, Chenbro Tri-load products can install 36 hard drives directly in a 4U height chassis. In the future, Chenbro also plans to launch a new product equipped with 48 hard drives, which can support SAS, SATA, NVMe Gen4, and other interfaces to meet the needs of data centers for large-capacity storage. The RM43736 can install 36 3.5-inch hard drives, and the RM43736 8T4S can install an NVMe flash device, while the RM43748, which is expected to be launched in 2024, can be equipped with 24 3.5-inch hard drives and 24 2.5-inch hard drives. As for hard drives, RM43848 can even install 48 3.5-inch hard drives. Chenbro can also provide customized services to meet the needs of diverse application scenarios.The AI ​​server market is booming, driving the demand for high-density storage servers. Chenbro is actively developing OTS (Off-the-Shelf) server chassis, constantly innovating products based on customer needs, and providing various enclosure solutions with the highest thermal quality and continuous, uninterrupted operation stability. With the goal of "Whatever's inside, Chenbro outside," Chenbro will continue to provide customers with high-quality products and services as the leading brand of mechanical and electrical integration enclosure solutions for the global cloud industry.MUSE Design Award – Chenbro Tri-load SeriesGold Winner of Industrial https://design.museaward.com/winner-info.php?id=18508 Gold Winner of Computer & Information Technology https://design.museaward.com/winner-info.php?id=18507TITAN Innovation Award – Chenbro Tri-load SeriesGold Winner of Product Design https://titaninnovationawards.com/winner-info.php?id=143Gold Winner of User Experience Design https://titaninnovationawards.com/winner-info.php?id=144 Gold Winner of Innovation in Design / Others https://titaninnovationawards.com/winner-info.php?id=145Chenbro's innovative server chassis once again receives international recognition, winning 2023 MUSE design award and TITAN Innovation Awards