Shin-Etsu Polymer Co., Ltd, a leading critical material handling company listed in the Tokyo Stock Exchange, was signing an agreement to make a strategic investment in Mycropore Corporation Ltd. Mycropore is a pre-eminent player in micro-contamination control and filtration solutions for the microelectronics industry."We are excited about this partnership as it will improve our capabilities to meet growing demands for micro-contamination control in Japan," stated Mr. Mikio Furukawa, Shin-Etsu Polymer's Director."We are pleased to deepen the co-operation with Shin-Etsu Polymer and this is a positive step towards strengthening Mycropore shareholder base as the company prepares for the upcoming IPO. This partnership is win-win for Shin-Etsu, Mycropore and the microelectronics customer base we serve." said President of Mycropore Corporation, Mr Kenneth Wong.About Shin-Etsu PolymerShin-Etsu Polymer was established as the subsidiary of Shin-Etsu Chemical, an industry leader in PVC and semiconductor silicone products in 1960. With its core technologies of PVC and silicone rubber processing, Shin-Etsu Polymer develops and supplies a variety of products to leading companies in the consumer electronics, electric components, semiconductor, automotive, construction markets worldwide through an established corporate global network. Shin-Etsu Polymer is recognized as the premier business partner by industry leaders worldwide. Additional information may be found at http://www.shinpoly.co.jp/.About Mycropore CorporationMYCROPORE offers application-focus solutions enabling manufacturing competitiveness and economic sustainability for industries in a fast-changing environment demanding more responsive and adaptable solutions.With a combined global experience of more than 100 years among the core founders of the company, MYCROPORE works closely with key industries to offer innovative solution and technology development that are enhanced by know-how and intellectual property integrative solution for micro-contamination control issues between heterogeneous manufacturing and metrology processes; and competitive solution for lower costs alternatives.Additional information may be found at http://www.mycropore.com/.Signing ceremony. 4th from right, Mr. YOSHIAKI ONO, President of Shin-Etsu. 5th from right, Mr. KENNETH WONG, President of Mycropore

Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, and Cypress Semiconductor Corp. (NASDAQ: CY), a leading provider of embedded nonvolatile memory solutions, today announced the production of low power embedded flash, aimed at the growing market of IoT and the other low power micro-controller unit (MCU) applications, using HLMC's 55-nanometer(nm) low-power (LP) process technology with Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded flash memory intellectual property (IP).This embedded flash product has already entered risk production in 2016. The technology and IP will be available for full production by HLMC customers in the second half of 2017.HLMC 55nm LP embedded flash platform is optimized for low power, making it ideal for MCU and IoT applications. It is developed based on HLMC's mature 55nm LP technology. The corresponding proven solutions for this platform are also ready including cell library, memory, and the other fundamental IPs. Compared to other embedded NVM IP which need 9 to 12 additional masks, SONOS requires 3 mask layers only inserted into a standard CMOS process and delivers low wafer and die costs with unmatched scalability. SONOS process developed in HLMC has achieved best-in-class reliability, 10-year data retention with customer product proven, 200,000 program/erase endurance cycles, and robust resistance to soft errors. Based on this platform, HLMC can provide customers the differentiated solution with high performance, low power, and low cost advantages. HLMC has also been keeping on developing the embedded flash with smaller cell size , better performance and reliability."With the rapid growth in MCU, IOT, etc, and the strong demand for low cost and low power embedded flash , we are excited to reach this milestone and look forward to a fast production ramp to meet our customers' demand," said Jack Qi Shu, Vice President at HLMC. "HLMC and Cypress' SONOS is a cost-effective embedded nonvolatile memory that delivers proven high customer product proven yields. Its reliability and efficiency are ideal to those applications in mass production"The combination of HLMC's robust 55nm LP process technology and manufacturing expertise along with the high-performance and leading reliability of our SONOS flash memory enabled a smooth path to achieve production of these low power embedded flash products," said Sam Geha, Senior Vice President of the Memory Products Division at Cypress. "Our collaboration with HLMC is another example of how Cypress is working with the world's leading foundries to establish SONOS as the industry's top choice for an embedded nonvolatile memory platform."About CypressCypress (NASDAQ: CY) delivers high-performance, high-quality solutions at the heart of today's most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes NOR flash memories, F-RAM and SRAM, Traveo microcontrollers, the industry's only PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, and Wireless BLE Bluetooth Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, best-in-class support and exceptional system value. To learn more, go to http://www.cypress.com/.Cypress, the Cypress logo PSoC, CapSense and TrueTouch are registered trademarks and Traveo and F-RAM are trademarks of Cypress Semiconductor Corp. All other trademarks are property of their owners.About HLMCShanghai Huali Microelectronics Corporation (HLMC) is a leading pure-play foundry in mainland China. HLMC currently has a 300mm wafer fab with the capacity of 35000 wafers per month. The construction of fab 2 began at the end of 2016 and will expand the capacity of 40000 wafers per month. HLMC offers a variety of technologies covering 55nm-40nm-28nm logic processes and specialty technologies for a wide range of applications. HLMC is devoted to providing domestic and overseas customers with comprehensive foundry solutions and value-added services. Headquartered in Shanghai, China, HLMC extends its sales and technical supports to customers in Taiwan, Japan and North America. Learn more about HLMC online at http://www.hlmc.cn/.

CAYIN Technology, a professional digital signage provider, will be participating in InfoComm China 2017 with DSMA Taiwan (Digital Signage Multimedia Alliance Taiwan). Following the successful introduction of SMP-2100, the powerful compact digital signage player, CAYIN isproud to present it to the China market for the first time as a versatile competitor. From April 12th to 14th, CAYIN will be at booth CC1-01-D, at theChina National Convention Center in Beijing.SMP-2100 is the perfect choice for adurable and compact player with high performance. This fanless metal player comes with the new and improved software, SMP-NEO2. Not only is it equipped with 2 HDMI outputs, its built-in SSD for programs and content storage allowsit to withstand rough handling while being secureThough compact in size, SMP-2100 is one of the top performance and most fine-tuned players in the Digital Signage Player family. With SMP-NEO2, SMP-2100 has 4 display modes, Single, Clone, Expended, and Distinct, making it vastly versatile to all kinds of applications. Users may connect up to two displays to showcase a cloning of the same content, presenting one content across or two contents simultaneously on two screens.This solid metal build player is a perfect fit for almost all scenarios. Whether it's a burger joint down the street corner or an LED panel at an outdoor stadium, SMP-2100 redefines the quality of available compact Digital Signage player on the market."We are excited to return as an exhibitorat this year's InfoComm China," said David Wang, Greater China Division Deputy General Manager of CAYIN. "The technology advancement in China is astonishing, and CAYIN is ready to take on the challenge with SMP-2100. We would like to establish long term relationship with local vendors, and be a part of sophisticating the digital signage applications in such a booming digital era."CAYIN sincerely welcomes visitors to drop by and learn more about the powerful yet easy-to-use SMP-NEO2, and experience the visual effects the SMP-2100 will deliver.Exhibition Information: CAYIN @ InfoComm China 2017Date: 4/12 - 4/14/2017Venue: China National Convention Center,BeijingBooth: CC1-01-DCAYIN Technology in BriefCAYIN Technology is a 12-year professional digital signage solution and software developer from Taiwan. By offering a complete portfolio of appliance-based digital signage solutions, CAYIN dedicates itself to being a reliable partner to clients worldwide and has successfully set up various applications globally. In order to best facilitate the deployment of its products, the company also provides tailored services to satisfy the ever-growing market demand for almost limitless applications.CAYIN Technology will introduce compact solutions that redefine digital signage effectiveness at the upcoming InfoComm China 2017

VOICE, the annual developer conference hosted by leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857), will offer three diverse keynote addresses ranging from future trends to cyber security to the global semiconductor industry. VOICE U.S. -- May 16-17 in Palm Springs, California at the Hyatt Regency Indian Wells Resort & Spa -- will include two keynote speakers, one who not only worked for the FBI, but also helped take down some of the largest cyber criminals in history. In Shanghai, China on May 26, the keynote speaker will discuss the global semiconductor industry and market within China.The Palm Springs event's opening day will feature a talk by Advantest's own Hans-Juergen Wagner, senior vice president of the SoC Product Group, who will discuss "Future Trends for and Contributions of Test in the SoC Market." Wagner will detail the drivers, challenges and emerging trends of SoC device designs and the impact they have on test. The second day's keynote speaker, Chris Tarbell, will present a fast-paced keynote address on hacking and the dark net. Tarbell is one of the most successful cyber security law enforcement officials of all time. He is the man responsible for infiltrating the hacker group Anonymous and taking down the notorious dark web drug trafficking site Silk Road, called "the most sophisticated and extensive criminal marketplace on the Internet." Tarbell's stories contain sensitive information that can only be heard in person.The VOICE China keynote speaker will be Dr. Peter Chen, senior director, China Business Development, TSMC China Company Limited. Dr. Chen will share his insights into the global semiconductor industry landscape, technology trends, and especially the ecosystem and market in China.Attending VOICE 2017Online registration is open at https://voice.advantest.com/register.Registered VOICE 2017 attendees are encouraged to make their hotel reservations early. The deadline for the Hyatt Regency Indian Wells Resort & Spa in Palm Springs is April 14, 2017. Additional hotel information for both venues is available on the VOICE website at https://voice.advantest.com/hotel-reservations.Sponsoring VOICE 2017For companies interested in supporting VOICE 2017, a limited number of sponsorship opportunities are still available for both locations. Details are posted at https://voice.advantest.com/opportunities.Follow #VOICE2017 on Twitter @Advantest_ATE.About VOICE 2017 Developer ConferenceManaged by a steering committee of volunteer representatives from Advantest and its customers, VOICE is the leading conference for the growing international community of users and strategic partners involved with Advantest's V93000 and T2000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions. The conference offers a unique opportunity to take part in making semiconductor testing operations as efficient and cost-effective as possible. Attendees gain and share valuable insights, build long-lasting relationships and learn what's new about Advantest test equipment, handlers and applications.About Advantest CorporationA world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as a groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at http://www.advantest.com/.

QSAN, enterprise data storage manufacturer, today announced the launch of the XCubeSAN 3200 series, the product range that meets SMB and Enterprise needs. The XS3200 series is the most advanced QSAN product to date, offering state-of-the-art hardware and the new SANOS 4.0 SAN storage operation system.The XCubeSAN 3200 series products come in a wide range of form factors and host connectivity options, all fully modular and includes redundant feature. The XS3200 range of SAN's includes the world's first 2U 26 bay, small form factor XS3226 in both dual active/active and single controller (upgradeable). QSAN's host interface cards allow the XS3200 range to offer outstanding flexibility with 10Gb ports built in, and additional 16Gb Fibre Channel and 10Gb iSCSI (SFP+ & RJ45)options. The XS3200 allows hybrid interfaces, so can mix any two host connectivity types into a single chassis, allowing for maximum flexibility.QSAN's new SANOS 4.0 is equipped with a refreshingly simple to use web GUI and easily deployableinto any infrastructure. SANOS 4.0 is packed with alarge selection of value-added features, including optional QCache 2.0, QSAN's SSD cache technology. QCache 2.0 is a pool-based read/write cache, allowing for up to 32TB of SSD cache on up to 4 storage pools,resulting in an impressive 128TB of SSD cache capability.QSAN's XS3200 comes with several key features:Sterling performance – The XCubeSAN 3200 series can deliver an astounding 12,000MB/s sequential read and 8,000MB/s sequentialwrite in throughput. Using SAS SSD storage, theXS3200 product is capable of up to 1.1 Million sequential IOPS.Advanced RAID level Technology – SANOS 4.0supports all RAID levels including RAID 0, 1, 0+1, 3, 5, 6, 10, 30, 50, 60, and N-way mirror.QThin – QSAN'sefficient thin provisioning technology is built-in XCubeSAN products, allowinguser to allocate disk storage space in a flexible manner based on the minimum space required.QTiering – QSAN's intelligent automated data tiering technology is now available onXCubeSAN products, allowing users to intelligently assign data to the right disk for the level of access.Backup Features – Snapshot, Local Volume Clone, and Remote Replication are all free of charge with the XCubeSAN XS3200 product range, allowing secure data for less.Integrated Virtualization – The XS3200 is highly integrated with leading hypervisor platforms of VMware VAAI, Windows Hyper-V ODX, and Citrix XenServer. These make the XS3200 an ideal primary storage system for virtualized datacenters to help provision, migration and management of VM storage both faster and more efficiently.Scale-up Solution – The XCubeSAN XS3200 storage capacity can cascade with XCubeDAS XD5300 12Gb SAS expansion enclosures, allowing up to 10 expansion units and support up to 286 drives for future data growth.Super Capacitor M.2 – The XCubeSAN now offers BBM and Super Capacitor cache protection modules to protect dataagainst power loss.Built with interoperability for the most popular operating systems, the XS3200 can be used for datacenter storage, archiving, cold storage, backup, large-scale surveillance, video streaming and editing. The XCubeSAN XS3200 range is thea ffordable and reliable storage solution, starting at only $7,499. Compared to its Tier1 competitors, the XCubeSAN solution can be a more affordable alternative for all primary and secondary storage. Moreover, the XCubeSAN series can provide more than a 50% increase in performance, thanks to QSAN's revolutionary technology and the 24/7 free technical support. Click here for more information on XS3200.AboutQSANQSANTechnology, leading storage technology designer and manufacturer, was founded in July 2004. Building on our vast experience in the industry, QSAN strives tobuild enterprise class storage systems that pride ourselves with outstanding performance, secure data protection and comprehensive data management. QSAN endeavors to provide the industry with high quality data storage systems that are simple, secure, scalable and reliable. For more information, please visit http://www.qsan.com/XCubeSAN XS3226

Synopsys, Inc. (Nasdaq: SNPS) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC) today announced that the two companies have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's14-nanometer (nm) FinFET process. The enablement collaboration included creating and validating a UMC 14-nm industry-standard iPDK.This iPDK enables full support of the Custom Compiler visually-assisted layout flow, including groundbreaking features that reduce the time it takes for users to layout and connect FinFETdevices. The Custom Compiler solution integrates with Synopsys circuitsimulation, physical verification and digital implementation tools to provide UMC14-nm process users with a complete custom design solution."We have a long history of working with Synopsys to provide iPDKs for our customers," said T.H. Lin, director of the IP Development and Design Support division at UMC. "This new 14-nanometer iPDK enables layout designers, including our own internal team, to use Synopsys' custom design tools for FinFET layout productivity. We are pleased to offer this resource to help customers streamline their design-in process on our volume-production 14-nanometer technology.""FinFET process technology is becoming very popular with our customers, but FinFET layout can be a challenge," said Bijan Kiani, vice president of product marketing at Synopsys. "We collaborated with UMC to enable Custom Compiler for their 14-nanometer process, so UMC customers can use Custom Compiler's visually-assisted layout to improve FinFET layout productivity."AvailabilityThe 14-nm and other process iPDKsfor Synopsys Laker and Custom Compiler design tools are available on request from UMC.About Custom CompilerCustom Compiler provides anopen environment spanning schematics, simulation analysis and layout. Unified with Synopsys' circuit simulation, physical verification and digital implementation tools, Custom Compiler provides a comprehensive custom design solution. Custom Compiler shortens the time it takes to complete FinFET design tasks from days to hours. Its visually-assisted automation leverages the graphical use model familiar to layout designers while eliminating the need to write complicated code and constraints. With Custom Compiler, routine and repetitive tasks are dealt with automatically without extra setup. Custom Compiler's visually-assisted automation provides four types of assistants: Layout, In-Design, Template and Co-Design. Layout Assistants speed layout with user-guided automation of placement and routing. In-Design Assistants reduce design iterations by catching physical and electrical errors before signoff verification. Template Assistants help designers reuse existing know-how by making it easy to apply previous layout decisions tonew designs. Co-Design Assistants combine the IC Compiler place-and-route solution and Custom Compiler into a unified solution for custom and digital implementation. Custom Compiler is based on the industry standard Open Access database. For more information about Custom Compiler, visit http://www.customcompiler.info/About SynopsysSynopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software partner for innovative companies developing the electronic products and software applications we rely on every day. As the world's 15 largest software company, Synopsys has a long history of being a global leader inelectronic design automation (EDA) and semiconductor IP and is also growing itsleadership in software security and quality solutions. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at http://www.synopsys.com/.About UMCUMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include high volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry's highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICsfound in cars. UMC's 11 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs nearly 19,000 people worldwide, with offices in Taiwan, China, Europe, Japan,Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com/.

Innodisk, the embedded storage and peripheral solution provider, is announcing its vision to bring software and hardware integration to the next level, and is bringing a wide suite of innovative products, including our new 3ME4 SSD series and DDR4 2666 DRAM series, to Embedded World 2017 in Nuremberg. With and a deep knowledge of the needs of the various vertical markets, Innodisk offers tailor-made and cost-efficient solutions for embedded and industrial system integrators.AutomationThe automation industry is characterized by the need for tight-fit and robust solutions. With this in mind, Innodisk offers customizable SSDs on small-sized form factors that can operate in extreme temperatures and are resistant to shock and vibration. Adding on the option of conformal coating and side fill, performance is ensured even during the harshest operating conditions. Recognizing the necessity of data integrity, Innodisk brings together innovative software, firmware and hardware to offer the world's most compact RAID 1 solution. And if the system in an unlikely event were to crash, the iCover system recovery software will ensure a swift restart.The newest addition to the Innodisk SSD roster is the 3ME4 series with an integrated Marvell controller, is the perfect fit automation appliances. Our in-house designed L3 architecture integrates LDPC error correction code which further bolsters product longevity and reliability.For those interested in more information on automation solutions, there will be a live demo at the Innodisk booth.Aerospace and defenseTo ensure the safety of confidential data, Innodisk offers an integrated suite of security features for SSDs, spearheaded by the new iSecurity concept. This package combines software, firmware and hardware to allow operators to easily execute Data Erase, Data Destroy and Physical Data Destroy functions. The SSDs comes in a wide variety of form factors, ensuring a smooth integration in limited-space applications. To address the tough operating conditions, Innodisk's DRAM modules are designed to tolerate wide temperature, and comes with the value-added options of conformal coating and side fill for an even more robust performance.There will be a live demo of Innodisk's aerospace and defense solutions at our booth for those more interested.In-vehicleIn-vehicle applications are often subject to unstable power sources and harsh environments. To address these issues, Innodisk's modules are qualified for wide temperature operation and are resistant to shock and vibration. Taking data integrity a step further, all communication modules are securely isolated, withstanding any surges and other electromagnetic interference. With Innodisk's EMUC-B201 CANBus communication module, the operator can easily expand in-vehicle systems.To satisfy the need for isolated expansion cards, Innodisk's modules are certified and compliant with E-Mark, SAE J1113 and ISO 7637-2 standards.SurveillanceTwo things come to mind when assessing the needs for a surveillance system; ample storage capacity, and system integrity. Large amounts of data needs to be stored quickly, efficiently and often for longer durations of time. Innodisk can provide a comprehensive solution with high memory SSDs, VLP DRAM modules and isolated power over Ethernet (PoE) extension cards. With this package, interference from the environment and other systems are mitigated and system performance is ensured.For more information, please visit http://www.innodisk.comInnodisk at Embedded World 2017:Date: March 14-16Booth: Hall 1, Stand 211Venue: Nuremberg, GermanyAbout InnodiskInnodisk is a service-driven provider of flash memory, DRAM modules and embedded peripheral products for the industrial and enterprise applications. With satisfied customers across the embedded, aerospace and defense, cloud storage markets and more, we have set ourselves apart with a commitment to dependable products and unparalleled service. This has resulted in products, including embedded peripherals, designed to supplement existing industrial solutions and high IOPS flash arrays for industrial and enterprise applications. The expanded business lines are leading our next step in being a comprehensive solution and service provider in the industrial storage industry. Founded in 2005 and headquartered in Taipei, Taiwan, Innodisk supports clients globally with engineering support and sales teams in mainland China, Europe, Japan, and the United States. With abundant experience and an unrivaled knowledge of the memory industry, Innodisk develops products with excellent quality, remarkable performance, great cost-efficiency, and the highest reliability. For more information about Innodisk, please visit http://www.innodisk.com.

AMD has released the first three models of its next-generation high-performance AMD Ryzen desktop processor. Ryzen is the first processor based on the entirely new AMD Zen core microarchitecture, bringing multi-core performance for PC gamers, creators, and hardware enthusiasts.Three 8-core Ryzen 7 models are available initially. Beginning in the second quarter, AMD expects to launch 6- and 4-core Ryzen 5 processors followed later in 2017 by Ryzen 3, which is designed to bring more performance to mainstream applications. All Ryzen processors support the new AM4 infrastructure, with motherboard designs becoming available from major players.Alongside Ryzen 7 processors, AMD also announced the product specifications for two Ryzen 5 processors, and demonstrated the flagship Ryzen 5 1600X outmatching Intel's flagship Core i5 7600K by more than 60% in multi-threaded CPU testing.In addition to being available to DIY builders and boutique PC vendors, in the coming months, consumers will also be able to purchase Ryzen-based systems from top PC vendors. AMD Ryzen desktop processor lineup: Specifications Product Line Model Cores Threads Base clock Boost clock Cooler TDP On sale Ryzen 7 1800X 8 16 3.6 4.0 N/A 95W Now Ryzen 7 1700X 8 16 3.4 3.8 N/A 95W Now Ryzen 7 1700 8 16 3.0 3.7 Wraith Spire 65W Now Ryzen 5 1600X 6 12 3.6 4.0 Wraith Spire 95W 2Q17 Ryzen 5 1500X 4 8 3.5 3.7 Wraith Spire 65W 2Q17 Source: Company, compiled by Digitimes, March 2017AMD Ryzen CPUPhoto: Monica Chen, Digitimes file photo

Recent product line expansion now makes more than 37,500 Analog Devices products available for shipment from Digi-KeyElectronics, a global electronic components distributor. Digi-Key has increased their ADI stocking portfolio by 20% in the last few months to support engineersworldwide.The newest product additions, including precision signal conditioning solutions, high frequency wideband components, and dataconverters, are easily accessed online at http://www.digikey.com/en/supplier-centers/a/analog-devices?WT.mc_id=PressRelease."As both companies increasingly grow and innovate within our industry,this announcement underscores the strong relationship ADI has with Digi-Key," according to Martin Cotter, Senior Vice President, Worldwide Sales and Digital Marketing at Analog Devices. "We anticipate continuous collaboration throughout the year as we work closely together on new product introductions, design assistance, and providing the newest innovationsand technologies to engineers in our mutual customer base around the world."Analog Devices designs and manufactures semiconductor products and solutions. They enable customers to interpret the world around us by intelligently bridging the physical and digitalwith unmatched technologies that sense, measure and connect."We are committed to fueling innovation which we do by stockingthe broadest selection of cutting-edge components and technologies. We are ableto accomplish that thanks to the remarkable relationships we have with oursupplier partners," says David Stein, VP, Global Semiconductors at Digi-KeyElectronics.Engineers can peruse hundreds of videoson ADI devices housed on Digi-Key's website.About Digi-KeyElectronicsDigi-KeyElectronics, based in Thief River Falls, Minn., is a global, full-service distributor of both prototype/design and production quantities of electronic components, offering more than five million products from over 650 quality name-brandmanufacturers. With over 1.3 million products in stock and an impressiveselection of online resources, Digi-Key is committed to stocking the broadestrange of electronic components in the industry and providing the best servicepossible to its customers. Additionalinformation and access to Digi-Key's broad product offering is available at http://www.digikey.com/?WT.mc_id=PressRelease.

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) and W2BI, Inc., an Advantest Group company whose test automation products help customers quickly launch new high-quality smart devices, will showcase their newest test and test automation products for the wireless electronics market at the Mobile World Congress (MWC), running February 27 through March 2 at the Fira Gran Via in Barcelona, Spain."Under the banner of long-time MWC exhibitor W2BI, we will display two of our leading-edge products designed to measure the connected world and everything in it," said Judy Davies, vice president of global marketing communications at Advantest. "Our diverse array of technologies is united behind the common goal of helping our customers to reduce their costs of test and get their products to market faster."Product ExhibitsStand #6K37 in Hall 6 will feature exhibits of Advantest's IC measurement platform as well as the latest test automation product from W2BI.Advantest's EVA100 tester is designed for highly efficient evaluation and measurement of analog/mixed-signal ICs. It uses the same test sequences for both design and production measurements, allowing users to establish a standardized measurement environment throughout their operations. By freeing semiconductor manufacturers from the need to invest time and resources in correlating test data from different systems, the EVA100 helps to achieve much shorter time to market for new IC designs.Also at the stand, W2BI will demonstrate its new capability to support testing of LTE-M devices using the portable MicroLTE system, which leverages cloud technology to test smart devices and IoT-based technologies. The system lowers the cost of testing during the development and production life cycles and provides a high level of scalability. The MicroLTE system supports 4G, 3G/2G, Wi-Fi, BT and NFC test features.About W2BIW2BI, Inc. is an Advantest Group company and a global leader in wireless device test automation products. Serving the world's top wireless operators, suppliers and labs, W2BI's software helps customers to significantly improve their device quality and time-to-market. W2BI remains at the forefront of device test applications, addressing the increased complexities brought by the volume of data services and by rapidly developing technology. W2BI added to its portfolio network emulation hardware and software, bringing to the marketplace complete systems for IoT and smart phone testing, encompassing R&D, conformance, production and device returns applications. For more information, visit http://www.w2bi.com/.About Advantest CorporationA world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at http://www.advantest.com/.