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Tuesday 16 June 2020
Winbond introduces a new unique and innovative product QspiNAND Flash for use with the Qualcomm 9205 LTE Modem
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a new version of QspiNAND Flash designed for use with the Qualcomm 9205 LTE Modem.The industry's first 1.8V, 512Mbits (64Mega Bytes) QspiNAND Flash from Winbond Electronics offers the right density for designers of New Cellular NB-IoT Modules."As the Internet of Things expands to 50 billion connected devices by 2020, Quad SPI-NAND adoption rate may increase 4-5 fold within a few years," said Alan Niebel, president of WebFeet Research, an independent market-research firm. "Winbond's 1.8V QspiNAND Flash is suitable for both Automotive and IoT segments. NB-IoT is poised to grow in this new connected world with shipments that may reach 685M units worldwide by 2023"."Winbond is proud and committed to innovate and differentiate by designing our QspiNAND Flash KGD solution for use with the Qualcomm 9205 LTE Modem from Qualcomm Technologies," said Syed S. Hussain, Director Segment Marketing, Winbond Electronics America Flash Business Group. "We continue to work closely with Qualcomm Technologies on the Memory components for the next-generation LTE Modem solutions for IoT applications."Winbond expands its reach from traditional QSPI-NOR Flash to QSPI-NAND Flash, giving customers the flexibility to choose their Code Storage Feature-Set to expand with minimal cost. This is done by using the same 6-pin signals and QSPI command-set for SLC NAND Flash densities without compromising performance by utilizing the new Continuous READ feature at 104MHz Read Speed."Qualcomm Technologies has tested and qualified the Winbond QspiNAND Flash as a stacked KGD solution with the Qualcomm 9205 LTE Modem, allowing our OEM customers to create extremely small form factor systems," said Vieri Vanghi, vice president, product management, Qualcomm Europe Inc. "We are proud of our long-standing collaboration with Winbond, and look forward to continuing to provide leading IoT technology solutions together."W25N QspiNAND Flash family devices are offered in space-saving 8-pin packages which was not possible in the past for typical SLC NAND Flash memory. W25N512GW is a 512M-bit memory array organized into 32,768 programmable pages of 2,112 bytes each. W25N512GW provides a new Continuous Read mode that allows for efficient access to the entire memory array with a single Read command that is ideal for code shadowing applications.Clock speeds of 104MHz allow equivalent 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, an on-chip feature is provided to perform bad block management.To ensure meeting the growing global demand for high-volume solutions, Winbond QspiNAND Flash memories are manufactured in the company's 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet and to ensure support for new business growth anticipated in both Automotive and IoT Segments."Expanding the SpiFlash family to include QspiNAND Flash will benefit the NOR market and SLC NAND Flash conversion from both QSPI-NOR Flash and Parallel NAND Flash," said J.W. Park, Technology Executive of Winbond Flash Memory. "Winbond jointly-developed this new 512Mb QspiNAND Flash with Baseband Engineering-Team in delivering high performance with cost-benefit in mind."The 1.8V QspiNAND Flash memories feature:Low Power, Wide Temperature Range*Single 1.75V - 1.95V supply*25mA active, 10μA standby, 1μA Deep Power Down*-40 degree C to +85 degree C operating range, Industrial GRADE*-40 degree C to +105 degree C operating range, Industrial plus and Automotive GRADEUnique Memory Architecture*Page Read Time with ECC Enabled: 60μs*Page Program Time: 250μs (typ.)*Block Erase Time: 2ms (typ.)*Fast Program/Erase performance*Supports OTP Memory AreaHigh-Performance QspiNAND Flash*QSPI implementation in 46nm process technology*More than 10-years data retention*104MHz clock frequency that can support up to 52MB/S continuous data transfer rate*Space Efficient Packaging*WSON8 6x8mm*WSON8 5x6mm*TFBGA24 6x8mm*KGD (Known Good Die)W25N512GW is available now. For QspiNAND Flash specific details, please contact www.winbond.com.Winbond QspiNAND
Tuesday 16 June 2020
Cybersecurity brings more opportunities
Global Market Insights estimated the size of the cybersecurity market will reach US$300 billion by 2024, due to increasing cyber attacks and unprotected IoT devices.Morgan Hong, GM of Onward Security, said, "The speed of time to market for connected products is now accelerating, but the quality of cybersecurity is often ignored. With the increasing demand for teleworking, using products with cybersecurity vulnerabilities will expose customers to losses caused by cyber attacks, brand and business damages, and even lengthy legal proceedings. IoT device manufacturers should introduce the Secure Software Development Life Cycle (SSDLC) immediately to meet the cybersecurity requirements of governments, cybersecurity standards, and buyers.Cybersecurity is the key to the development of the Internet of Things, including the US, Europe, and Japan, which have successively legislated IoT related security policies and regulations. In the 5G environment, enterprises will face more complicated security patterns. Onward Security is the authorized third-party lab for device testing and security assessment for Amazon AVS (Alexa Voice Service), and Asia's only CTIA Authorized Test Lab for cybersecurity. Besides, Its "Automated Product Security Assessment Platform" is assisting firms to implement DevSecOps procedures and effectively meet security compliance and industry standards.Onward Security sincerely invites you to participate in the webinar of "Realize the Security. Win More Opportunities" where you will take IoT/IIoT product security insights away, as well as opportunities in the Asian market.Onward secures the IoT to gain business opportunities with global partners
Monday 15 June 2020
Digi-Key announces global partnership with Truphone to offer IoT connectivity
Digi-Key Electronics, a global electronic components distributor, announced that it has partnered with Truphone to bring cellular IoT connectivity services to manufacturers worldwide. The partnership will provide customers with connected cellular devices and a fully managed service.Digi-Key will use Truphone's state of the art SIM technology, allowing users to connect IoT devices to network providers from the moment they switch their device on. The technology requires no complicated activation process, it is simply connectivity from the touch of a button.The partnership will provide manufacturers of all sizes with industry-leading IoT connectivity services starting with device and application management. The Truphone network supports 2G, 3G, 4G and CAT-M1/LTE-M worldwide - with a single SIM card - and gives every customer access to its IoT Connectivity Management platform.Truphone's simple prepaid SMS and data plans (which provide coverage in multiple countries across a three-year period) simplify the connectivity process, so manufacturers can focus on what they do best - building their application."Both Truphone and Digi-Key share a common goal of bringing IoT into the mainstream," said Ralph Steffens, CEO at Truphone. "For us, the catalyst to spark the IoT starts with connectivity. The more we can streamline the process of connecting IoT devices, the easier it will be to reach its full potential. We're thrilled to be partnering with a business at the forefront of innovation, like Digi-Key, to make this happen." "We are excited to partner with a leader in cellular connectivity like Truphone," said Robbie Paul, director of IoT business development for Digi-Key. "The connectivity services industry is going through radical changes with the advent of 5G and the proliferation of IoT devices. Truphone allows for true worldwide coverage with one SIM card that can be purchased from Digi-Key along with the associated hardware, giving our customers the flexibility to monitor and manage their IoT devices in real-time, from anywhere in the world." For more information about Truphone and to order from their product portfolio, please visit the Digi-Key website.Truphone SIM card
Monday 15 June 2020
Reshaping production post COVID-19
As manufacturers re-open after COVID-19 related lockdowns, economic and supply chain disruptions may be felt beyond 2020. How companies shift in the short-term and plan for the long-term will be factors in defining "new normal" for the component industry.The pandemic caused the world to shut down quickly and, just as quickly, changed buying sentiment. For example, McKinsey & Company reported that demand in cloud and server computing sectors spiked as people started to work from home almost overnight. In contrast, demand for luxury goods plummeted."The automotive and cellphone industry have taken a hit as the world sits at a standstill," said Luke LeSaffre, director of sales, Americas, at Fusion Worldwide. "People's buying habits are focused on essential goods and services now because there is so much financial and employment uncertainty."As we approach the second half of 2020 and re-opening, some companies are shifting production to try to meet the new consumer needs while also mitigating the almost inevitable 2020 financial losses. In other cases, companies may move components to end-of-life quicker to offset waning demand with more profitable components.Looking beyond 2020, there are a few areas that could see significant change. As companies look back to evaluate how to be better prepared for future shocks, increasing efficiency and flexibility may be the themes.With factories starting up again, the "new normal" may result in permanently implementing the operational changes that were required to continue conducting business during the pandemic. For example, changes made to comply with work from home and social distancing mandates may continue as manufacturers see more benefit in keeping these changes for the long-term.One such area is the use of robotics and remote monitoring, which has allowed companies to gain more control of their operations and processes. According to Omdia, by incorporating the use of automation in various steps of the manufacturing processes, companies have the ability adjust their production and shipping schedules immediately.Diversification of the supply chain to avoid similar disruptions is another area to mitigate future risk. Because manufacturers often depend on a single region to produce components or a single product in a buildout, it has hindered their ability to weather the pandemic. This practice has resulted in multiple supply chain gaps, possibly resulting in far reaching impacts.Paul Romano, COO at Fusion Worldwide, said, "With the technology industry, expect to see work done to help build foundations in other areas, like Vietnam, India, and the Philippines to support highly increased production. This, however, is a long-term solution and will be a challenging shift."The United States, in particular, is looking to jump-start the development of new chip factories throughout the country. The creation of cutting-edge factories in the U.S. could reshape the industry as companies' source less from Asia.However, it will be nearly impossible to eliminate the reliance on China in manufacturing - at least for the foreseeable future. The country's size, raw material access and prominence is unparalleled. These fundamentals will prevent any large-scale shift away from China any time soon.A medium-term tactic, however, is diversifying vendor partnerships. With reliance on an exclusive vendor and limited alternative products in builds, companies are left scrambling to fill shortages or reduce excess in tumultuous times. Mitigating this risk by having partnerships in the open market will make for a healthier supply chain.Tobey Gonnerman, EVP of trade at Fusion Worldwide, says "The OEMs and sectors that approach the open market as a 'last resort' are the ones most severely impacted when supply chains are disrupted. Just like any financial planner likes to point out, if you wait until it starts to rain to start thinking about your rainy-day fund, then it's too late. You're going to get wet."While the COVID-19 pandemic has wreaked havoc on the world, many manufacturers will be able to benefit, in the future, by taking the lessons they've learned as an opportunity to enhance their supply chains.Reshaping production post COVID-19
Thursday 11 June 2020
Winbond leads the era of wearable devices with the launch of HyperRAM WLCSP package
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications.HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which makes the circuit board layout simpler and the wiring area relatively small. Several IC design service companies have launched HyperBus related IP, which makes it easier for main chip manufacturers to design memory controllers, and there are more and more main chip manufacturers whose products support this interface. In response to this trend, Winbond Electronics has successively launched related HyperRAM series products.Comparing to the existing 3.0V HyperRAM products operating at 100MHz / 200Mbps and 1.8V HyperRAM products operating at 166MHz / 333Mbps, Winbond HyperRAM 2.0 products can operate at a maximum frequency of 200MHz and provide a maximum data-transfer rate of 400Mbps with either 3.0V or 1.8V operation voltage.In terms of memory density, Winbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications.In terms of package type, Winbond also provides a variety of options, including:*24-ball, 8mm x 6mm TFBGA for automotive and industrial applications *49-ball, 4mm x 4mm WFBGA for consumer applications *15-ball, 1.48mm x 2mm Wafer Level Chip Scale Package (WLCSP) *Known Good Die (KGD)Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer. The key advantages of the WLCSP are the minimum inductance of die to PCB, enhanced thermal conduction, reduced package size, weight and smaller foot print. These characteristics make WLCSP the best solution to meet the requirements of mobile products like cellular phones, smart watches, and other wearable electronics. Winbond HyperRAM series products with WLCSP will be the best memory solution for these applications.HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applicationsWinbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications
Wednesday 10 June 2020
APD stands together with global medical device and network equipment suppliers against COVID-19
COVID-19 is changing everything about our lives, seriously threatening our health and safety. It has also redefined business and thrusted the economy into a recession. Despite the disruptions, the market is seeing a significant increase in demand for some products, including medical devices, such as ventilators, oxygen concentrators and respiratory humidifiers, as well as network equipment to meet the needs arising from the stay home economy and work-from-home lifestyle.Having been committed to the development of customized power solutions for medical devices and network equipment for years, APD is exerting all efforts to meet the urgent needs of global medical device and network equipment suppliers to help make their products available to markets, doing its part in the global fight against COVID-19.The expert in customized power solutions with critical technologiesAccording to Mark Tang, sales vice president, APD's power system business group, manufacturers impose rigorous requirements on medical power supply systems as medical device quality is a matter of life and death. They must maintain a long-lasting, uninterrupted and stable power supply. Building high-performance and high-reliability power solutions is the goal that APD has insisted on in its decade-long efforts toward strengthening its capabilities on critical technologies.Citing ventilators currently with a surging demand as an example, Tang noted that there is a risk of overvoltage due to backfeeding during peak load operating conditions, especially when a ventilator for critical care pumps air with a high pressure into a patient's lungs. In view of this, power supply units (PSU) must be able to support higher peak loads for longer periods to ensure the system maintains stable operation. APD's unique peak power design can effectively reduce power loss, lower PSU operating temperature and boost reliability. Moreover, its patented overvoltage protection circuit safeguards the system and PSU from damage caused by excess voltage from PSU output.APD's medical power solutions are compliant with IEC 60601 Safety Requirement for Medical Equipment. They have also been certified to meet Radio Frequency interference requirements in accordance with Radio Technical Commission for Aeronautics DO-160G for Airborne Equipment, which is more stringent than medical equipment standards. This means their leakage current is minimal even under normal operating conditions so the PSU is protected from failure resulting from high-frequency 4G/5G signal interference.More importantly, APD has abundant experience in designing power solutions for medical ventilators. Its customized power solutions for global medical ventilator suppliers fully meet their EMI, temperature and peak load requirements.Leading network equipment manufacturers opt for APD for its expertise in addressing peak load and heat dissipation challengesWorking from home, online conferencing and distance learning have become the new normal in the face of the COVID-19 pandemic. This has spurred a surge in network use and an urgent need to expand switch and router capacity, giving rise to burgeoning stay-home economy opportunities. APD underwent business transformation in 2008, shifting target from general-purpose power supply market to niche segments with higher technological barriers. Apart from medical power solutions, APD is also focusing efforts toward network equipment power solutions. In other words, APD has developed robust capabilities in network equipment power solutions. It specializes in designing high-performance and high-reliability open frame power supplies for leading network equipment manufacturers, providing strong support helping them tap stay-at-home economy opportunities.Commenting on the critical technology to network equipment power solutions, Tang pointed out the ability to sustain peak loads remains crucial. On top of that, the miniaturization trend of power supplies imposes great challenges on suppliers' caliber in heat dissipation and component selection to effectively address the heat problem of network equipment. These are right up APD's alley."We are committed to sustainable growth and aspire to become a technology pioneer as well as market leader in niche power solution markets," highlighted Tang. APD set the goal to target power solutions for medical devices and network equipment and later was able to successfully win heavyweight customers in these fields. The enablers of APD's success include its ability to do custom-design and offer leading-edge technology at continuingly lower costs, its supply chain stability, as well ‎as its collaborations with top academic institutions. It is also distinguished by its high-quality production and R&D capabilities built through the Design For Six Sigma (DFSS) initiative. All these are what allow APD to engage in long-standing partnerships with global network equipment and medical device suppliers.Mark Tang, sales vice president, APD's power system business group
Tuesday 9 June 2020
Touch Cloud AI-based image recognition solution expands into Singapore through partnership with WPI and Intel
Artificial intelligence (AI) has become a key operation strategy across different industries. With the wide-ranging possibilities of AI application, enterprises have difficulty finding system developers that meet their needs and system developers can hardly have sector-specific expertise to develop platforms to suit individual customer needs. To bridge the gap, Touch Cloud partners with WPI and Intel to build a solution that has been certified by Intel's Market Ready Solutions (MRS) program. Also through WPI's help, Touch Cloud has successfully marketed its AI Application Box in Singapore.Founded in 2016, Touch Cloud is a startup focusing on AI technology development, including cloud architecture, machine learning and deep learning. Its AI-based image analysis technology has been put to use in smart manufacturing, smart city and construction site safety. Touch Cloud's AI Application Box that it brings to Singapore through collaboration with WPI and Intel is a construction site safety solution. It leverages AI-based analysis of images captured on surveillance cameras to check if workers are wearing required protective gear, such as helmets and safety boots, to ensure labor safety.In addition to construction sites, Touch Cloud's image analysis technology can also be used in smart manufacturing and smart city applications. For example, for COVID-19 prevention, employers can use it to track employees who have just returned from overseas business trips to find out where they have been and whom they have come in contact with. It can also detect whether people maintain 1.5-meter social distancing in group gatherings.Thanks to the partnership with Intel and WPI, Touch Cloud's AI Application Box has been put to practical use. Touch Cloud has been engaged in project-based development to customize systems for customers. However, this was challenging during the company's early stage development. First of all, it requires industry-specific know-how and repeated testing to build tailored systems for specific use scenarios. Furthermore, despite the slew of AI software and hardware platforms available on the market, it is not easy to find an optimal software and hardware combination. Last but not least, customers may not have sufficient AI knowledge, so a lot of back-and-forth communication is needed to figure out their pain points and needs. To address all these challenges requires tremendous time and effort and thus the development cycle can easily go over six months.Touch Cloud turned to Intel for help in addressing these challenges. Intel has long committed to AI research and has introduced OpenVINO - an AI inference platform for image analysis. Based on OpenVINO, Touch Cloud developed its hardware-software integrated AI Application Box. Featuring an optimal combination of hardware and software, AI Application Box can be installed and ready to use in 10 minutes without compatibility issues. Moreover, OpenVINO allows Touch Cloud's AI-based image analysis program to run on customers' existing Intel x86 platforms. There is no need for customers to purchase additional hardware to build the AI system, thereby increasing their return on past investment.Having long engaged in the high-tech sector, WPI has built a broad and deep industry ecosystem in Southeast Asia and Northeast Asia. It is able to help Touch Cloud quickly find suitable users for its products. Going forward, Touch Cloud, Intel and WPI will continue to work together to replicate the success with Singapore in additional markets and sectors while bringing more applications to reality.Simon Lee, Co-founder and CEO, Touch Cloud
Friday 5 June 2020
ARBOR introduces high-accuracy smart temperature screening solution for epidemic prevention
COVID-19 goes on a global rampage as 2020 unfolds. As part of the efforts to prevent the spread of the coronavirus, health screening stations are set up at entrances to government buildings, medical institutions, and office complexes to check people's temperatures with forehead thermometers or thermal imaging cameras. However, most thermal imaging systems on the market are not intelligent enough and are susceptible to false alarms.Their accuracy may degrade when they have been in use for an extended period of time. Furthermore, a professional team may be required to set up a thermal imaging system. These all prevent enterprises and institutions from painlessly incorporating temperature screening systems. To help relieve these headaches, ARBOR recently introduced E-Guardian S408, a thermal imaging solution for epidemic prevention. Featuring a smart design to effectively reduce false alarm rate and boost screening rate, plus a small footprint and diverse mounting options, E-Guardian S408 grabbed market attention as soon as it made a debut.According to ARBOR general manager Clark Lien, in the wake of the COVID-19 pandemic, temperature screening systems have virtually become standard equipment of large buildings but most systems currently in use leave a lot to be desired. The problem of false alarms is the most common complaint. Temperature screening systems detect the temperature of the subject using thermal imaging technology and present the distribution of the temperatures on the display. Most systems on the market are unable to target a specific detection area so a false alarm most often occurs when a person holding a hot drink passes the screening station. When such cases keep occurring and there is no temperature calibration reference, the systems will raise false alarms again and again. The cry wolf effect will cause the operators to let their guard down, thus failing to keep the virus out.Aside from the problem of false alarms, current temperature screening systems lack user-friendly interface. They are generally categorized into two types of systems. One comes with powerful functions but requires the supplier to install the system due to a high level of complexity. The other comes with simple functions but can be installed by the user. Both types of systems have their shortcomings. The former needs professional engineers to configure system parameters, while the latter offers no flexibility in their functions.In view of this, ARBOR introduces E-Guardian S408, featuring robust advantages to solve these pain points. According to Lien, ARBOR started out as an industrial PC supplier and has developed strong capability in thermal imaging technology, which is often used in industrial applications. On top of its experience in developing thermal imaging sensors for inspection instruments used at power or petrochemical plants, ARBOR combines factory automation, ICT and thermal imaging sensor technologies to design pioneering epidemic prevention products with an emphasis on enhancing user experience and value-added features. As a result of such efforts, E-Guardian S408 delivers higher-than-expected reliability and quality. As a premium quality product with a competitive price, E-Guardian S408 has been enthusiastically embraced by the market since its launch.ARBOR not only offers E-Guardian S408 at a compelling price, but also designs it to address the problems of existing systems on the market, noted Lien. Featuring quick and easy installation, E-Guardian S408 can be set up using a rack mount or magnetic mount onto a door frame, wall, or other metal surfaces. It also comes with a built-in Human-Machine Interface (HMI) so there is no need for an external display. Following the installation guide, users can get the system up and running within five minutes.Enhanced with AI-based image recognition, E-Guardian S408 can intelligently detect the human body and locate the forehead and temple for temperature measurement. This way, it can avoid checking temperatures of a non-human object and thus reduce the chance of raising a false alarm. It also comes with a built-in calibration unit that can automatically correct temperature parameters to eliminate the problem of degraded accuracy when existing systems are in extended use.Although COVID-19 is gradually getting contained through joint efforts from the public and private sectors, Lien thinks some organizations will continue to have temperature screening systems operating at the entrance. They will become part of people's daily lives. Temperature screening systems that are smarter and easier to configure and operate will help safeguard the world against the virus.Featuring painless usability, smart design, flexible mounting options and compelling pricing, ARBOR's E-Guardian S408 helps safeguard the world against virus.
Wednesday 3 June 2020
Making strongest reliable signal connectivity for IPTV application in IoV
The mobile vehicles are required high-speed bandwidth and better network coverage for streaming media services in wireless IPTV (Internet Protocol Television) application, however this situation is hard to achieve through IP-based wireless networks, specifically for recreational vehicles (RVs), trucks, and fleets. Proscend's 4G LTE WiFi Cellular Router M330-W has been applied into IPTV solutions in European cities for RVs to enable sufficient bandwidth and to improve better network coverage.The IPTV digital multimedia box through WiFi signal is built inside in the RVs, which made of metal to cause shielding problem and weak signal, because a wireless signal is not easily pass through metal. Moreover, the installation space is strictly limit because many devices are integrated together in a space, including a cellular router, an IPTV digital multimedia player, and a TV display screen. Therefore, designed for ultra-compact and cost-effective features, Proscend's Compact Industrial Cellular Router M330-W is adopted by the customers and integrated with their IPTV digital multimedia box to get stable signal and reliable bandwidth for RVs.Stable SignalProscend's Compact Industrial Cellular Router M330-W is connected with the customized 5-in-1 outdoor magnetic mount roof-top antenna to receive LTE, WiFi, and GPS for combining multiple functions, like playing video streaming over Cellular/WiFi, and guiding the route via GPS simultaneously as well as enhancing more stable signal and better sensitivity. The Cellular Router M330-W can be also connected your digital multimedia box via a RJ45 Ethernet cable for backup support.Reliable BandwidthThe Compact Industrial Cellular Router M330-W supports LTE cellular technology, WiFi wireless connection and Ethernet network to make multiple Internet connections for combined high-quality speed and reliability. With long-distance wireless connectivity and secure VPN tunnels, the Cellular Router M330-W ensures dependable communications and improves the whole RV Internet experience to give you secure, fast and reliable connections.Affordable DeviceThe Compact Industrial Cellular Router M330-W with slim size and lightweight design meets tiny space and easy installation. Compared to expensive satellite TV devices, the Cellular Router M330-W provides competitive price-to-performance ratios to integrate with the IPTV digital multimedia box flexibly and save your cost.Proscend's Cellular Router M330-W with an outdoor 5-in-1 antenna enhances stable signal in IPTV application for RVs
Tuesday 2 June 2020
Winbond's leadership in Flash innovation continues with introduction of flexible new Sequential Read function in high-speed QspiNAND Flash
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry's innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products.Automotive and IoT device manufacturers are increasingly adopting high-performance Single-Level Cell (SLC) NAND Flash as a low-cost alternative at densities of 512Mbits and higher to the NOR Flash traditionally used for code storage.Previous Winbond innovations in high-performance NAND Flash include the Quad SPI-NAND interface, which shares the same 6-pin signals and QSPI command set as Quad SPI-NOR, and the Continuous Read function, which achieves up to a 52MB/s continuous data transfer rate at a 104MHz clock frequency.Now Winbond has created another innovation in high-performance NAND Flash with the introduction of the Sequential Read function in its latest high-performance W25NxxxJW QspiNAND Flash devices. In Sequential Read mode, the QspiNAND Flash products achieve the same 52MB/s maximum data rate at 104MHz as in Continuous Read mode, but with new flexibility to configure the chip's operation. The most important new options are:* Freedom to apply the user's own ECC engine. In Continuous Read mode, a Winbond W25N device only supports its own on-chip 1-bit ECC engine. In Sequential Read mode, users can implement 4-bit, 8-bit or any-bit error correction when enabled by an external ECC engine.* Access to the entire memory array - both the Main Area and the Spare Area - with a single Read command. This is ideal for code shadowing applications in which low latency and fast boot time are particularly important.* Greater flexibility to configure the data arrangement to suit the user's application."By providing for high-speed operation with its Continuous Read function, Winbond had already made QspiNAND Flash a viable option for use in code storage applications, including for code shadowing and execute-in-place operations," said Syed S. Hussain, Director Segment Marketing, Winbond Electronics America Flash Business Group. "Now the addition of Sequential Read means that users can benefit from the same high Read speed of up to 52MB/s while implementing their chosen ECC engine and data access arrangements."The new 1.8V QspiNAND Flash products are available in densities of 512Mb, 1Gb and 2Gb. The 3.0V versions are available in densities of 2Gb and 4Gb. All are manufactured in the company's 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet new demand expected in both the automotive and IoT market segments.The new W25N QspiNAND Flash devices are offered in compact 8-pin packages - a space-saving format which was not possible for SLC-NAND Flash memory products before Winbond's development of an effective QspiNAND Flash interface. Clock speeds of 104MHz allow the equivalent of 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, the devices perform on-chip bad block management.Key features of the Winbond W25N family of NAND Flash memory products are:Wide Temperature Range* -40 degree C to +85 degree C operating range in Industrial GRADE* -40 degree C to +105 degree C operating range in Industrial plus and Automotive GRADEUnique Memory Architecture* Page Read Time with ECC Enabled: 60μs* Page Program Time: 250μs (typ.)* Block Erase Time: 2ms (typ.)* Fast Program/Erase performance* Supports OTP Memory AreaHigh-Performance QspiNAND Flash* QSPI implementation in 46nm process technology* More than 10-years data retention* 104MHz clock frequency that can support up to 52MB/S continuous data transfer rateSpace Efficient Packaging* WSON8 6x8mm* WSON8 5x6mm* TFBGA24 6x8mm* KGD (Known Good Die)For more information, please visit www.winbond.com.Winbond QspiNAND FlashSequential read, more flexibility