Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence. Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.

XIVER, 120 employees, located in High Tech Center of the Netherlands, a carve out from Philips Research started its business on January 2025.XIVER is unique in that they combine the strength of a pure-play foundry with more than 20 years of MEMS process development knowledge and experience in high tech micro systems solutions. A state-of-the art cleanroom of 2600m2 (28,000 sqf), independent positioning in the market and European ownership. XIVERs increasing share of wallet of its top-tier customers in medical, semiconductor equipment and defense are driving its initial growth and success. Secured by high barriers of entry and scarce availability of available manufacturing, make XIVER a first option for innovations in high tech market segments like data centers/AI and IR applications.  Further strategic investments in Photonics and Transducers will provide longevity and will be driving accelerated growth in mid to long term.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology. The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers product design support, prototyping, and manufacturing services for power modules used in electric vehicles, the energy industry, and industrial applications. The rapidly growing automotive industry is driving significant demand for compound semiconductors and back-end packaging to support the growth of power modules, creating a strong demand for power module packaging and manufacturing technologies. The company offers full support to allow power module manufacturers to predictably build quality products at the most competitive price.The Powertrim Flex Line, the flagship manufacturing platform, provides high performance handling, assembly and testing technology for automated power module manufacturing. With its modular architecture, the Flex Line covers the core trim and form processes as well as adjacent process steps like laser marking, laser de-flashing, optical inspection, quality control, testing, loading and unloading.The main focus of Powertrim Technologies is in providing power module back-end packaging equipment and tooling. Through different modular machine designs, they are assembled into production configurations that meet the customized needs of various power module products. The company also provides the well-designed tools to help customers implementing both prototyping, qualification and rapid serial or mass production of power modules.Furthermore, electrification of the automotive transmission system by either battery or hybrid electric motors, new industrial power applications and the massive growth of renewable energy solutions accelerate the need for power modules. With these, Powertrim provides manufacturing equipment, supporting a wide range of power electronics applications, and is strategically collaborating with supply chain partners to centralize services and resources for the EV market, a move designed to meet fluctuating demands efficiently.The existing flagship production line implements a system designed to adapt quickly to changes in product type and quantity, allowing for the efficient production of a variety of power module products on one single machine, hence Flex Line. With this concept, the company is capable of switching between complex product sizes in under 15 minutes. In addition, it can also provide a series of optional add-on units, including loading/offloading modules, laser marking & de-flashing, automatic optical inspection, MES integrated system, which providing software linking to ERP/MES enterprise software platforms. These different arrangements can be flexibly matched and assembled to meet the manufacturing needs.With a presence in the Netherlands, known for its cutting edge semiconductor front-end and back-end equipment, Powertrim Technologies combines precision engineering with scalable automation to unlock markets such as automotive, energy and industrial power applications. At Semicon Taiwan 2025, Powertrim aims to work together with Taiwanese customers to create new opportunities.

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients scalability and access to highly qualified Filipino engineers. Xinyx provides end-to-end semiconductor design solutions, spanning front-end architecture, circuit realization, and physical implementation for analog, digital, and mixed-signal domains.Xinyx offers comprehensive IC design services customized to meet each customer's unique requirements. The company's capabilities span digital, analog, and mixed-signal design and layout, enabling it to support projects across a wide range of applications and technologies. Xinyx provides flexible engagement models, from full turnkey solutions to project-based and specialized design services, allowing clients to leverage its expertise at any stage of the design process to achieve faster turnaround times and optimized results. With over 16 years of experience, Xinyx has grown from a 15-person team into a 400-strong engineering and service organization, operating across five sites in the Philippines and one in Eindhoven, the Netherlands. Built on the strength of its large pool of talented young Filipino engineers, the company helps customers bring innovative silicon solutions to market. As Xinyx continues to expand its global footprint, it is optimistic about the booming Taiwanese semiconductor industry and is eager to collaborate with Taiwanese IC design firms to broaden its reach and explore mutually beneficial opportunities.As part of its commitment to developing the IC design ecosystem, Xinyx actively drives its flagship Campus Connect Program, which focuses on nurturing IC design talent at the university level. The program bridges industry and academia by providing a pathway for Filipino students to enter the IC design field through collaborative learning opportunities, internships, and training programs. In line with this vision, Xinyx continues to explore strategic partnerships with universities abroad, including recent engagements with Chung Yuan Christian University in Zhongli District, Taoyuan City, Taiwan.

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive manufacturing technology that allows for parallel transfers high-resolution conductive patterns to enable the rapid and precise printing of micrometer scale interconnections. This technology offers high-speed low-cost manufacturing, is well suited for process equipment to create complex 3D structures and achieve further miniaturization of electronic devices. The rapidly growing opportunities in AI-driven electronics push the technology forward. These unique solutions have considerable potential, and on May 16, 2025, Fonontech received the good news of a $9.5 million seed round investment.Currently, Fonontech equipment is being used to address wire bonding speed issues in chip packaging. Wire bonding is a viable solution for connecting chips to external pins or for silicon interlayer structures in advanced packaging. This process is typically used in back-end chip manufacturing, particularly flip-chip bonding. Fonontech equipment offers higher pin density, optimized electrical performance, and smaller package sizes.While conventional wire bonders can only print one line at a time, Fonontech Impulse Printing technology is much faster. Because its parallel printing solution can transfer contacts covering an entire area at a time, the speed increase is astonishing. According to on-site testing and monitoring, Fonontech Impulse Printing technology can achieve speeds up to 100 times faster than wire bonders.Currently, Fonontech equipment can successfully bonding with a minimum size of 20 micrometers, and in the future it will further achieve a dimensional accuracy down to a few micrometers. In the booth of Fonontech showcased the Impulse Printing demo kit, a scaled down version of the industrial equipment. In addition to selling the equipment itself, the company also integrates Impulse Printing print head modules into customers' production lines for special tailored applications.The equipment can be used for transfer printing onto wafers, PCBs, or other manufacturing processes, such as connecting signal pins on the side of a display chip to the signal contacts on the back side of the display panel. The bestselling point of this equipment is speed and cost effectiveness to reduce material waste and carbon emissions. The company's product is marketed as a replacement for wire bonding machines. Furthermore, the company currently is developing Taiwan market and running ongoing collaborative projects through testing and verification with potential clients.

Invest in Holland /Netherlands Foreign Investment Agency (NFIA) is the national investment promotion service of the Netherlands. It operates as part of the Dutch Ministry of Economic Affairs, supporting foreign companies in establishing and expanding their businesses in the Netherlands. The organization works with a network of regional partners and has a global presence through its worldwide network of offices, including one in Taipei, to facilitate foreign investment and economic development.  With 25 offices worldwide, Invest in Holland has over 40 years of service experience. The Taipei office assists Taiwanese companies in developing their businesses and R&D IN EUROPE and expanding the opportunities in the Netherlands. The services include to provide customized information on the Netherlands, relevant business locations, Dutch legislation and tax regulations, labor law, permit procedures, government incentives and much more through in-person or digital meetings. With a population of over 18 million people, the Netherlands economy relies on international trade. It is highlighting the importance of foreign investment to strengthen its innovation ecosystems and achieve future economic goals. The network of Invest in Holland actively promotes this idea by focusing on sectors like high-tech industries, and sustainable energy, where collaborations between companies, government, and knowledge institutions drive innovation and economic resilience. Right now, more than 230 Taiwanese companies have setup their European headquarter or R&D center in the Netherlands. Many of which companies are in the Semiconductor and ICT-related sector, eg CHROMA, DELTA ELECTRONICS, MIC, ADVANTECH, and etc.Invest in Holland actively creates opportunities for industrial clusters to develop in the Dutch market by attracting Taiwanese companies and fostering collaboration between businesses, high-tech research institutions, and government, enabling Taiwanese companies to quickly integrate into the local operation and accelerate business development. One important thing, Invest in Holland's services are entirely free for all foreign companies, both new and established, that are looking to expand their operations into the Netherlands. This is a benefit provided by the Netherlands government and its network of partners. These public services offer guidance, practical solutions for establishment, and connections to the right resources and partners to help international businesses succeed in the European market.

Axelera AI is a startup targeting Edge AI applications. Leveraging its Metis AI Processing Unit (AIPU) chip, embedded hardware AI inference acceleration cards, and Voyager SDK software solutions, the company specializes in imaging application solutions for applications in edge nodes. Unlike AI systems developed in high-density cloud data centers, Edge AI computing offers energy efficiency, information security, low latency, and fast speed of response, rapidly powering real-time vision and smart detection applications for embedded AI systems. Axelera AI's technology offerings span 4K/8K image resolution real-time image recognition, security surveillance, campus safety, and drone imaging, pioneering a new model for the development of high-performance AI inference in diverse fields. The company's Metis chip boasts a computing performance of up to 214 TOPS (TeraOPS) of inference performance at INT8 precision. For example, using ResNet-50 Convolutional Neural Network (CNN) model doing object segmentation and analysis, a single Metis chip can achieve a high processing speed of 3200 frames per second (FPS), providing stable, real-time analysis capabilities while consuming only approximately 10W. This balance of performance and environmental benefits has attracted significant market attention.Meanwhile, the AI inference acceleration cards integrated with Metis chips are also a major product line. There are two types of accelerator cards that support M.2 and PCIe interfaces, which can quickly meet the needs of system integrators, OEM customers and industrial PC (IPC) makers. With these flexible connection interface, Axelera could engage the business with various embedded AI system makers.In addition to the hardware lineups, Axelera's software support is also a key factor in its success. The Voyager SDK software suite facilitates hardware and software integration for system integrators. There are open source software framework currently available on GitHub for computer vision and enabling customers to solve their AI business requirements. This Voyager SDK comes with a Model Zoo, a catalog of turnkey AI models, allowing customers either to import their own AI models or choose from Model Zoo models. These offerings significantly reduce developing time and excels in functional completeness and efficiency.Axelera AI's business model is based on collaboration with system integrators and OEM clients, encompassing joint development of AI projects and customized data architectures, providing clients with one-stop, high-performance Edge AI solutions. Axelera AI is working closely with major Taiwanese industrial PC vendors and OEM/ODM clients to develop key applications for financial and research institutions, medical solution providers and other public facilities that prioritize data security, privacy, and safety. This initiative aims to create emerging applications for Edge AI and unlock its significant value.

SCIL Nanoimprint Solutions is a provider of nanoscale imprinting equipment for patterning wafers leveraging its unique technology of Substrate Conformal Imprint Lithography (SCIL). The company is targeting the creation of optical structures on wafers for emerging applications in silicon photonics modules and smart glasses. Active in the market since 2015, SCIL Nanoimprint Solutions, originally a business unit of Philips, utilizes patented stamp transfer technology to create process equipment and processes for creating specialized optical structures on wafers. For example, it can create lightguide structures on wafers to enable direct chip-to-fiber connections, driving the fabrication of high-speed optical communication structures.Following the internal installation and testing of the first AutoSCIL tool in 2016, the company officially began mass production and delivered equipment to customers from 2017 onwards. In 2023, with investment from venture capital funds and other investors, the company was officially spun out from Philips to become an independent operating company. The company is targeting applications in optical communication semiconductors, including high-speed optical communication chips for data centers, advanced packaging silicon photonics systems, and ultra-compact optical elements for smart glasses and augmented reality devices. The product portfolio spans advanced imprint equipment, tailored optical materials, and optimized processes. As these are all key areas of focus for the next phase of AI-related applications, the company is attracting significant industry attention.These nanostructures and precision structures utilize processes such as imprinting precise patterns onto wafers using glass materials, serving as light-guiding structures for fiber-optic communication systems. Furthermore, some are manufactured as lens modules, imprinting optical components onto wafers. The existing equipment can achieve optical structures with critical dimensions down to 10 nanometersand sub-nanometer surface roughness.The company's process equipment is differentiated by wafer size, supporting 4-inch, 6-inch, 8-inch, and 12-inch sizes. The process includes resist deposition, overlay alignment, nano-imprinting, , and curing to complete the 2D or 3D patterning process. Targeting two key and highly anticipated applications, smart glasses and CPO (co-packaged optics), Taiwan is a high potential market for SCIL Nanoimprint Solutions, with the Taiwanese semiconductor industry focused on optoelectronic chips, high-speed communications, and advanced heterogeneous packaging technologies.

Mecal High-Tech Systems is an independent global high end contracting engineering company that specializes in anti-vibration and shielding technologies for high-precision semiconductor equipment and optical measurement systems. Mecal is in control of critical conditions, in and around high end equipment, co-developing with customers and with its own IP and OEM product base. Take the well-known Extreme Ultraviolet (EUV) lithography technology as an example. Since EUV equipment uses highly precise optical lithography technology with accuracy reaching the nanometer level. These high sophisticated machines are generally extremely sensitive to vibration, need to have corresponding solutions.A complete anti-vibration system must be designed to meet the standard operation of EUV machines and achieve high production yields. Therefore, any semiconductor foundry service vendors who purchases EUV equipment becomes an important target customer for Mecal. The company provides solutions including problem analysis, consulting, engineering design, technology R&D, installation deployment and operation services. It integrates cutting-edge technologies to develop engineering solutions and create optimal economic value for customers, such as improving production yields to generate significant revenue incomes. It also enables even more sophisticated production of next generation technologiesMecal currently provides a vibration-proof platform and technology designed for EUV process needs. Every aspect of design and installation requires detailed planning by the engineering teams of the company. Mecal has more than 170 five-star ranking senior professional engineers certified by customers and works in Taiwan from established service bases in countries including the Netherlands, the United States, South Korea, and Japan.Mecal implements successful approach involving to foster strong communication, a deep technical understanding of semiconductor manufacturing, and a collaborative strategy to diagnose and solve these root problems by being located near where customers stay. For example, with major Taiwanese foundry customers, Mecal not only provides the solutions to solve key challenges of EUV operation, but also team-up with customers to transfer technology to different regions within their global footprint where EUV technology is deployed, thereby creating mutually beneficial business opportunities.The main purpose of Mecal in participating in Netherlands Pavilion is to expand its visibility in the Taiwanese market. The company believes that Taiwanese semiconductor ecosystems can increase the development speed and improve production yields and solve problems caused by vibration in process equipment through Mecal solutions.As semiconductor chips become smaller and more sophisticated, the technical challenges of anti-vibration are also increasing. With 35 years of accumulated industry experience and technical capabilities, Mecal plays the role of co-developer and problem solver in high-precision production, optoelectronic systems, advanced packaging systems and new projects that aims to be of relevance and to contribute to innovation that tackles major challenges in industries. Mecal is looking forward to finding appropriate partners and customers to create high economic value for high-tech industries.