Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate designcycles and reduce risk for high-performance, high-yield ASICs. The platform integrates TSMC's latest 3DFabric technologies and advanced process nodes, enable next-generation designs with a comprehensive solution that spans from silicon-proven IP to 2.5D/3D packaging.The new platform builds on GUC's first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in both logic processes and 3DFabric technologies. TSMC's evolution from FinFET-based N5/N3 nodes to next-generation nanosheet nodes-N2 and A16-has enabled unprecedentedintegration density and performance scaling. Simultaneously, TSMC's 3DFabric innovations, including CoWoS, TSMC-SoIC , and System-on-Wafer (TSMCSoWTM), allow for advanced 2.5D/3D integration of multiple dies across larger package substrates.Industry standards have also evolved. The latest HBM4 memory interface doubles I/O to 2,048 pins, unlocking significantly higher bandwidth. Meanwhile, the UCIe die-to-die interface has gained industry-wide adoption, advancing from 16Gbps to 24Gbps and now 32Gbps-and beyond.GUC Milestones and Technology HighlightsUCIe Die-to-Die IP: GUC offers UCIe-A 32G/36G IP in TSMC N3 and N5 processes, with a 64G version under development and scheduled for tape-out in late 2025. The UCIe-A IP in TSMC 2nm technology is also planned for 2026.Integration with TSMC SoIC-X: GUC successfully taped out UCIe Face-Up IP in TSMC N5 using TSVs for bottom die applications-enabling vertical die stacking in future nodes.HBM4 IP: GUC taped out its HBM4 PHY IP on TSMC N3P, achieving 12Gbps speeds. The IP supports CoWoS-L/R and SoW platforms, with porting to TSMC N2P underway for a 2026 tape-out.GLink/UCIe-3D IP: Building on its GLink-3D 1.0 success, GUC now offers UCIe/GLink-3D 2.0 IP delivering 50 Tbps/mm? bandwidth, architecture proven via TSMC N2P. A customized version has already been taped out by a lead customer for an N3 over N5 ASIC.Deep Collaboration with TSMCGUC has long worked with TSMC closely to develop silicon-proven IP and platform technologies. This ongoing collaboration ensures alignment with TSMC's latest process and 3DFabric packaging advances, enabling customers to reduce design risk while accelerating time-to-market."TSMC has been working closely with our Open Innovation Platform (OIP) partners like GUC to develop IP solutions for our advanced process and 3DFabric technologies," said Aveek Sarkar, Director of Ecosystem and Alliance Management Division at TSMC. "Our latest collaboration with GUC in enabling its 2.5D/3D platform will help customers accelerate product development cycles and deliver next-generation silicon using our advanced packaging and process technologies.""We were industry-leading with HBM3 PHY and Controller, and again with HBM4 in 2025," said Aditya Raina, CMO of GUC. "Our UCIe IP has demonstrated unmatched 32Gbps speed and is now moving to 64Gbps era. Our Custom GLink-3D 2.0 IP has achieved 40 Tbps/mm² through a lead customer. These achievements mark the dawn of true 3D ASICs."GUC's next-generation APT platform combines cutting-edge IP, TSMC-certified design flows, and high-volume production experience to enable rapid, low-risk development of next-generation AI, HPC, and networking chips.To learn more about GUC's solutions, please contact GUC sales representative via email.

Wise Integration, a pioneer in digital control for gallium nitride�]GaN�^and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer. Kaiser succeeds CEO and co-founder, Thierry Bouchet, who will continue to serve as Chief Technology Officer and General Manager, leading the worldwide R&D and driving the technological vision.A seasoned high-tech leader with a proven track record in growing and leading global teams in the semiconductor industry, Kaiser brings deep experience in scaling deep-tech ventures. In 2006, he cofounded Docea Power, a French EDA startup pioneering full-chip, system-level power and thermal modelling, with the vision of addressing the growing power-consumption and thermal challenges in IC and platform design.As CEO, he led the company to domain leadership and its acquisition by Intel in 2015. He then joined Intel, where for the next decade he held senior director roles, most recently overseeing system-simulation engineering and worldwide customer-enablement organization. Those programs tackled the most critical power, thermal, and performance challenges in designing consumer, data-center, and AI systems. Kaiser began his career at STMicroelectronics, where he held technical and leadership positions across test and product engineering, design, and architecture teams.Targeting Fast-Growing MarketsWith Kaiser’s appointment, Wise Integration is positioning itself to scale globally and capitalize on booming markets such as data centers powering artificial intelligence (AI), and electric vehicles (EV)-which demand more efficient, compact, and digitally controlled power architectures."I'm thrilled to join Wise Integration and build on its success in providing customers differentiated solutions in power electronics to meet their biggest challenges," Kaiser said. "This talented team has created an R&D-driven culture and a robust foundation to lead the GaN power electronics transformation globally."The Next Chapter"On behalf of the board of directors, I am pleased to welcome Ghislain Kaiser as Wise Integration's new CEO, and to compliment the team for their exceptional work," said Board Chairman Patrick Boulaud. "This marks a major milestone for the company as it transitions from a CEA�HLeti spinout into a pioneering force in GaN and digital power management innovation with strong growth potential. Ghislain's background makes him a natural choice as the CEO to guide the company through this next stage of growth.""Ghislain's arrival begins a new chapter for Wise Integration," Bouchet added. "With our WiseGan devices and WiseWare digital control, we've built a strong foundation in consumer markets. Now it's time to scale our innovations and tackle the next big challenges-bringing unmatched efficiency and power density to AI servers, data centers, and tomorrow's automotive systems."Selected Highlights (2020–2025)Spun out from CEA-Leti in 2020 using the institute's GaN-on-silicon R&D platform. Developed proprietary WiseGan IC and WiseWare microcontroller. Launched its fully digital controller, WiseWare 1.1. Opened a design center in Canada and established an Asian subsidiary in Hong Kong.Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth.WISE

The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While digital transformation greatly improves efficiency, it also exponentially expands the overall attack surface. In this model, risks are no longer isolated but systemic and cascading. Supply chain efficiency is built on an implicit digital trust model between partners, which is manifested through application programming interfaces (APIs), shared portals, and integrated software. However, this trust structure, built in pursuit of efficiency, has become a primary attack vector. Cybercriminals are no longer just breaking through firewalls—they are exploiting the fundamental fabric of digital collaboration. As a result, the traditional perimeter defense model is outdated; The new perimeter of defense is the entire supply chain ecosystem, and its security must be built on a zero-trust model enforced with cryptography.Third-party or fourth-party vulnerabilitiesAttackers often use the weakest link in the chain—often smaller, poorly secured vendors—as a springboard to infiltrate the network of their ultimate high-value target. This highlights a stark reality: an organization's security posture is only as strong as its least secure partners. This risk stems from the pursuit of supply chain efficiency, as the smooth operation of business processes requires granting partners a considerable degree of access. This expansion of access rights, without corresponding strict security controls, constitutes a systemic vulnerability based on excessive trust.The fundamental role of traditional cryptography and its limitationsCurrent supply chain security relies heavily on traditional public key cryptography (such as RSA, ECC) to protect data in transit and at rest. Mitigation strategies such as data encryption (using AES), risk assessment, and incident response plans are crucial, but their effectiveness is built on the strength of these underlying cryptographic algorithms. While these methods are still effective against today's threats, the entire security foundation is fragile and faces an existential threat that will be the focus of the next section.Quantum Horizons: A Paradigm Shift in Cryptographic ThreatsQuantum computers use quantum mechanical principles such as superposition and entanglement to solve mathematical problems (e.g., integer factorization, discrete logarithms) that form the security basis of today's public key cryptography (RSA, ECC, Diffie-Hellman). This is not a purely theoretical deduction, but a major engineering challenge that is making rapid progress. Once a quantum computer with sufficient scale and stability comes out, the current encryption system that protects global digital communications will fail in an instant."Get First, Decrypt Later" (HNDL): An imminent dangerThe Harvest Now, Decrypt Later (HNDL) attack transforms the quantum threat from a futuristic problem to a present reality. The mechanism is that attackers, especially state-state actors, are actively intercepting and storing large amounts of today's encrypted data. These attacks target information with long-term value, such as intellectual property, government secrets, financial records, medical data, and personally identifiable information (PII).This means that by the time a "Cryptographically Relevant Quantum Computer" (CRQC) appears that can crack current encryption algorithms (known as "Q-Day", which is expected to arrive as early as 2035), these obtained data will be retroactively deciphered. Therefore, the security of any sensitive data transmitted today that requires long-term confidentiality is already at risk.This attack pattern transforms a company's data retention policy into a huge potential security liability. Regulations such as the Health Insurance Portability and Accountability Act (HIPAA) or the General Data Protection Regulation (GDPR) often require organizations to retain data for an extended period. The HNDL attack vector turns this legal compliance requirement into a potential ticking time bomb. Organizations are legally required to encrypt data stored for years, making it an ideal target for HNDL attacks. This creates a direct conflict between compliance and security: the act of adhering to data retention regulations inadvertently creates vulnerabilities for future quantum decryption threats. Therefore, risk management and legal teams must be immediately involved in the migration strategy of post-quantum cryptography. This is no longer just an IT issue, but a simmering corporate governance and compliance crisis.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Post-Quantum Cryptography (PQC): Laying the foundation for quantum resilienceDefinition of post-quantum cryptographyPost-quantum cryptography (PQC) refers to traditional algorithms that are designed to run on today's classical computers but are resistant to attacks from both classical and quantum computers. This distinguishes PQC from quantum cryptography, which requires specialized hardware, such as quantum key distribution, or QKD. PQC's goal is to develop a new generation of public-key cryptographic systems based on mathematical problems that are equally difficult for quantum computers.NIST PQC Standardized Process: A globally recognized markThe National Institute of Standards and Technology (NIST) has led a multi-year, transparent, and collaborative global process to select and standardize the next generation of public key algorithms. This process is crucial in building trust in the new standard. The process began in 2016 with a public call for proposals, receiving 82 proposals from 25 countries and undergoing multiple rounds of rigorous public review and analysis in the global cryptography community.The finalization of NIST standards is the starting gun that triggers a massive technology update cycle across the tech industry. This was not only an academic milestone but also a turning point in business and logistics. It directly prompted government agencies such as CISA and the National Security Agency (NSA) to issue migration directives, which in turn pushed major software vendors and hardware manufacturers such as Microsoft and Google to integrate these specific algorithms into their products. This ripple effect ultimately extends to enterprises, who must plan their migrations to maintain compatibility and security. NIST standards are the core domino that initiates PQC adoption worldwide.Secure the edge: Protect IoT and operational technology equipment in the supply chainInternet of Things (IoT) and operational technology (OT) devices face the biggest challenges in PQC migration for the following reasons:*Long life cycle: The device may be used in the field for 10-20 years without replacement.*Limited resources: Limited processing power, memory, and energy budgets.*Lack of Updability: Many devices are not designed to be conducive to easy firmware or cryptography updates.The application of PQC in these areas will be gradual and there will be significant differences between the old and new systems. For "greenfield" systems, such as new IoT product lines, PQC can be integrated from the outset. For "brownfield" systems, such as existing factory OT equipment, the challenge is enormous, often requiring the entire hardware to be replaced. This means that the PQC migration of the supply chain will be a two-speed process. Businesses must prioritize the adoption of PQC in new systems while developing long-term, potentially costly, retirement or retrofit capital plans for existing assets that are not quantum-safe.Use cases for PQC include:*Industrial automation: Protecting communication between sensors, controllers, and management systems in factories and processing plants.*Smart Infrastructure and Logistics: Protecting smart grid equipment, traffic control systems, and connected logistics sensors.*Automotive V2X Communication: Secure vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications to ensure security and prevent malicious manipulation.*Healthcare Supply Chain: Ensuring the integrity and privacy of data from connected medical devices.Conclusion and recommendationsWinbond's W77Q Secure Flash Memory is a robust solution to address the PQC threats mentioned above. Key PQC-Safe features of the W77Q Secure Flash include:*Platform Resilience: In accordance with NIST 800-193 recommendations, the system automatically detects unauthorized program changes and can automatically restore to a secure state to avoid potential cyberattacks. *Security Software Update and Fallback Protection: Supports remote security software updates while preventing fallback attacks, ensuring that only legitimate updates can be executed. To maintain the highest level of security and integrity, the W77Q adopts the quantum-secure Leighton-Micali signature (LMS) algorithm recommended by NIST Special Publication 800-208 to ensure the authenticity and integrity of updated software, providing additional security*Secure Supply Chain: Secure Flash ensures the origin and integrity of flash content at every stage of the supply chain. The W77Q implements LMS-OTS-based remote authentication (NIST 800-208). This advanced method effectively prevents content tampering and misconfiguration during assembly, transportation, and configuration, protecting the platform from cyberattacks.Winbond's secure flash solutions help system manufacturers meet industry regulatory compliance requirements, improve platform security, and improve supply chain information and communication security during production, shipping, and construction and operation.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.Credit: Smiths InterconnectThis strategic contract supports the customer's upcoming global launch of their next-generation AI semiconductor chips, designed for data center GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.Smiths Interconnect's DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect's test socket technology.The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer's previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect's position as a trusted technology partner in the semiconductor industry.Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown-and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel. GMIF2025, themed "AI Applications, Innovation Empowered", will bring together leading enterprises, technology experts, and industry leaders across the global memory industry chain to explore the evolution of storage technologies and emerging opportunities in the AI era.The Fourth GMIF2025 Innovation Summit is scheduled to be held on September 25, 2025. Credit:GMIFThe summit will feature executives and experts from School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Maxio Technology, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage Technology, iFlytek, OKN Technology, GreaTech Substrates, and more than 19 other top global companies and universities. The keynotes will cover topics ranging from storage and memory technology roadmaps and market strategies to AI application practices and ecosystem collaboration, empowering innovation across AI scenarios from cloud to edge.GMIF2025 Innovation Summit Keynote Agenda - Part 1. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 2. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 3. Credit:GMIFIn the exhibition zone, over 27 exhibitors will present more than 200 innovations, spanning the entire storage ecosystem-including leading IDMs, controller vendors, solution providers, packaging and testing companies, platform providers, and AI terminal enterprises. Attendees will experience immersive interactions, gain first-hand insights into the latest industry trends, and witness the evolving global storage ecosystem landscape.Register now by clicking the link to secure your GMIF2025 pass and join global storage industry leaders in shaping the future of AI-driven innovation!For more information about GMIF, please visit.

Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access to learning and measurable results across groups dispersed in different locations.Flexible working models give employees greater control over where and how they learn. However, they also create challenges around consistency, engagement, and measuring results. The solution lies in a blended approach: combining online and in-person training with a corporate LMS.Training Issues in Hybrid WorkplacesConsistency remains a significant issue. Hybrid workforces include both in-office and remote employees, and both sides need the same access to learning for both to be fair and productive. Skewed opportunities can quickly ruin employee trust and retention.Disengagement is another issue. Online sessions that last extended periods tend to cause fatigue, making learning less effective.Measuring effectiveness is also a challenge. Virtually based teams complicate monitoring skill acquisition, and organizations are left solely reliant on analytics and online tests as a fair gauge of results. Without effective systems in place, organizations often offer programs that are difficult to measure, thereby limiting their long-term impact.Corporate LMS as a Central FrameworkTo address these needs, a corporate LMS can serve as the central hub for all training content. It combines live classes, self-paced resources, and microlearning modules into one blended system. This approach gives employees the flexibility to learn in ways that fit their schedules, while still keeping development aligned with company goals.A business LMS also incorporates gamification elements, interactive modules, and certification tools that retain motivation. Integration with workflow systems, such as Slack or Microsoft Teams, allows training within everyday workflows.Just as important, corporate LMS platforms provide visibility. Progress tracking makes it easier to spot skill gaps, measure outcomes, and consistently meet objectives across the workforce. But their true value goes further: connecting business strategy with individual performance. In doing so, they transform learning from a functional process into a growth driver—for employees and the organization.Opportunities in Hybrid Training ModelsDespite the challenges, hybrid work presents new opportunities for business training.One is scalability since corporate LMSs can reach employees in various locations without logistical issues. Another is customized learning paths, which are also on the rise. These paths enable employees to progress at their own pace and focus on specific skills.Dynamic access to course materials provides added flexibility. Users can access or navigate modules at will again, boosting retention. Data-driven insights through analytics add a new level of value, providing organizations with a precise understanding of training results.Beyond talent development, training has since been used to maintain organizational culture, and long-distance teams can maintain a sense of shared mission and identity.Skill-building in the Hybrid WorldHybrid work environments demand more than technical know-how. They call for a renewed focus on soft skills. Today's training programs strike that balance, offering flexibility and efficiency while nurturing the human abilities that keep teams connected.A corporate LMS plays a central role in making this possible. Online learning sessions, quizzes, and exercises bring interactivity into virtual spaces, recreating the energy of face-to-face sessions and helping counter "Zoom fatigue." Scenario-based modules and group projects encourage peer learning, turning abstract concepts into real-world behaviors.What makes this even more effective is the insight behind it. Data gathered through the LMS highlights where learners struggle and where they thrive, allowing trainers to adjust and keep people engaged.Best Practices in Hybrid Workforce TrainingA corporate LMS makes it possible to turn hybrid training into a consistent and engaging experience. The most effective programs share a few standard best practices: flexibility and modularity allow training to adapt to shifting workloads and varied schedules, so learning becomes part of the flow of work rather than a disruption. Peer-to-peer learning fosters collaboration and community, helping employees stay connected even when they're physically apart. Accessibility is prioritized, with mobile-friendly design and multilingual content ensuring every team member can access training without barriers. Certifications and recognition keep motivation high by rewarding progress and giving learners a sense of achievement.The Final OutlookThe hybrid model is here to stay, and training strategies must evolve alongside it. Centralized systems, like a corporate LMS, are now the baseline. What sets organizations apart is how they weave flexibility, personalization, and engagement into every learning experience.Corporate Training for Hybrid Workforces. Pexels

OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console. Equipped with BIWIN mini SSD, the X1 Air achieves a “dual-drive” architecture that delivers superior data transfer speeds and flexible capacity expansion, supporting smooth performance across work, creation, and gaming scenarios. Meanwhile, with a modular, slot-in form factor, the mini SSD is user-installable, offering instant storage expansion with true plug-and-play convenience.Mini SSD vs. Traditional Storage SolutionsUFS: As a soldered-to-board solution, UFS is not user-expandable. Over time, limited capacity often leads to performance bottlenecks and slowdowns. For terminal manufacturers, maintaining multiple SKUs for different capacities increases supply chain complexity and after-sales maintenance costs, as faulty units often require full motherboard replacements.microSD Express: In spite of its expandability and flexibility, microSD Express card suffers from compatibility challenges that demand extra certification and validation efforts by device makers. Bandwidth limitations also prevent it from meeting today’s high-performance application needs.Mini SSD vs. Traditional Storage Solutions. Credit: BIWINIn comparison, mini SSD shows all-around excellence in performance, dimension and expansion. And its balance between total cost efficiency and user experience for terminal brands earns it the ultimate storage solution for portable intelligent terminal.Mini SSD shows all-around excellence in performance, dimension and expansion. Credit: BIWINHigh-Speed Read/Write, Ultra-Fast ResponseEngineered with scenario-specific firmware optimizations, BIWIN mini SSD supports PCIe Gen4 ×2, with its 4K random read/write speed up to 850K/750K IOPS by using the dynamic SLC cache technology. The low latency and fast response in data processing empower the X1 Air to handle high workloads and seamless mode switching across handheld, tablet, and notebook use. From multitasking and heavy software loading to instant 3A game rendering, the mini SSD unlocks the full potential of the X1 Air’s AI-ready processors, big-core CPU, and integrated GPU—delivering instant app launches, lightning-fast file transfers, and near-instant boot-ups for a fluid experience across all scenarios.Mini SSD: An Innovative Storage Expansion Solution for the Edge AI Era. Credit: BIWINUltra-Small, Lightweight, and ThinWithin a sleek 252mm x 163.5mm x 13.5mm chassis weighing just about 835g, the X1 Air delivers portability without compromise. Every component equipped has been rigorously tested and precisely integrated to achieve this level of compact efficiency. Built on innovative LGA packaging, BIWIN mini SSD achieves ground-breaking small size, with its volume only 40% of a traditional M.2 2230 SSD and its weight of only 1g (roughly equal to a paperclip). This ultimate miniaturized design frees valuable space for battery and cooling, perfectly satisfying the pursuit of both lightweight body and superior performance of X1 Air.As a 3-in-1 terminal designed for portable uses, X1 Air is built for on-the-go resilience, such as commuting vibrations or travel shocks. Featured with high-quality NAND and advanced controllers, BIWIN mini SSD delivers superior shock & vibration resistance, IP68-rated dust and water protection and 3-meter drop resistance, ensuring data safety during mobile office work, outdoor creative tasks, or handheld gaming.Meanwhile, BIWIN mini SSD comes equipped with intelligent power management technology, demonstrating high-speed responses while significantly lowering power consumption. In this way, not only is the device battery life extended, but heat generation is minimized, enabling the X1 Air to achieve “lightweight and always-on” mobile experience.Plug-and-Play, Ready in a SnapFor X1 Air, portability doesn’t come at the expense of capacity and performance. Benefited from the newly-designed expandable mini SSD slot, users are allowed to additionally add mini SSD to the device based on the standard M.2 PCIe 4.0 SSD. The maximum capacity expansion is up to 1TB (2TB to be launched soon), so the device is able to realize a total capacity of 3TB, more than enough for gaming libraries, creative projects, and productivity workflows.Plug & Play Slot Design. Credit: BIWINThe modular slot-in design supports safe hot-swapping and modular upgrades after power-down, requiring no disassembly or tools. Just like swapping an SD card, users can expand capacity or transfer data on the fly—whether refreshing a game library during travel or quickly loading project files in the studio. Built with premium TLC NAND and fortified by Wear Leveling, ECC, and LDPC error correction, the BIWIN mini SSD ensures data reliability and endurance even under frequent swaps, multi-mode usage, and mobile conditions.Infinite Storage, Unlimited SolutionsAs users demand greater performance, responsiveness, and immersive experiences from portable intelligent devices, storage has become a critical enabler and a key differentiator for competitiveness in edge AI systems. The collaboration between BIWIN and OneXPlayer exemplifies the perfect synergy of technological innovation and exceptional product philosophy.Looking ahead, BIWIN remains committed to its vision of “Infinite Storage, Unlimited Solutions”. By strengthening partnerships across the ecosystem, BIWIN will continue to drive innovation and accelerate the adoption of AI at the edge, unlocking new possibilities for the next generation of intelligent devices.

Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International, which is now rebranding as AsiaStrategy following its merger with Sora Ventures.The deal, finalized on August 15, marks the first instance of a publicly traded company in Taiwan investing directly in a firm whose strategy centers on holding Bitcoin as a treasury reserve.Top Win, previously known for trading luxury watches, is now listed on Nasdaq under the ticker SORA. In May, the company began shifting toward digital assets by adopting a model that blends traditional retail with Bitcoin-focused capital allocation. By holding Bitcoin on its balance sheet and investing in similar firms, AsiaStrategy aims to emulate the trajectory of its Japanese counterpart, Metaplanet. Metaplanet has accumulated over 7,800 Bitcoin and experienced a stock price increase of more than 3,600% over the past year.WiseLink contributed $2 million through a three-year convertible note, with the remaining funds provided by U.S. investor Chad Koehn and four private investors. Company executives described the transaction as a strategic integration of Bitcoin with cross-border financial operations. This hybrid model may offer both asset protection and new avenues for business development.WiseLink CEO Tsai Kun Huang referred to the investment as a timely opportunity to explore long-term innovation in decentralized and inflation-resistant assets.The investment strategy is similar to trends seen in North America and Europe. Here, companies like MicroStrategy have built multibillion-dollar Bitcoin treasuries. For Asia, however, Taiwan's move could be the beginning of a wave of corporate adoption. Market analysts state that the region's growing interest in digital assets reflects global monetary easing and a search for hedges against geopolitical uncertainty. The idea of a 1000x crypto opportunity, which is often discussed in investment circles, shows why firms are increasingly looking for exposure to high-upside, technology-driven financial assets like cryptocurrencies.Taiwan's initiative is not solely financial—it also reflects a technological shift. In July, the government launched a blockchain-based payment system, underscoring its commitment to digital innovation.This direction is evident in WiseLink's operations, which span fintech, SaaS, and a longstanding partnership with smartphone developer OPPO. The company is integrating crypto treasury management with tech platforms, positioning Bitcoin reserves as both passive holdings and potential enablers of new financial models.Top Win's evolution from luxury retail to digital assets represents a significant change in corporate identity. The rebrand to AsiaStrategy and its merger with Sora Ventures establish a broader regional footprint, with expansion plans targeting Thailand and South Korea.Sora Ventures has pledged to deploy a $150 million fund to support at least ten public companies with Bitcoin treasury strategies by the end of 2025. Co-founder Jason Fang stated that the goal is to "anchor Asia in the global Bitcoin treasury movement."Nonetheless, the transition carries risks. Top Win has previously reported issues in financial disclosures and had only $3.8 million in working capital prior to the deal. Its balance sheet remains modest compared to Western peers.Asia's tech sector is increasingly converging with blockchain and decentralized finance. Taiwan's first public Bitcoin treasury may be an early indicator of broader changes ahead. Stakeholders across the region are now exploring not whether Bitcoin belongs on corporate balance sheets, but how significant its role may become in shaping Asia's financial landscape.

Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high performance AI, mass production for the world's first time.SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production to lead the AI era. Through this momentum, the company has once again proven the AI memory leadership in the global market.“Completion of HBM4 development will be a new milestone for the industry,” Joohwan Cho, Head of HBM Development at SK hynix, who has led the development, said. “By supplying the product that meets customer needs in performance, power efficiency and reliability in timely manner, the company will fulfill time to market and maintain competitive position.”With recent dramatic increase in AI demand and data processing, the needs for high bandwidth memory for faster system speed are surging. In addition, securing memory power efficiency has emerged as a key requirement for customers as power consumption for data center operation has increased. SK hynix expects HBM4, with increased bandwidth and power efficiency, to be the optimal solution to meet customers' needs.HBM4, of which mass production system has been readied, has the industry's best data processing speed and power efficiency with the bandwidth doubled through adoption of 2,048 I/O terminals, double from the previous generation, and power efficiency improved by more than 40%. The company expects to improve AI service performance by up to 69% when the product is applied, which will lead to solve data bottleneck and significantly reduce data center power costs.The company has far exceeded the JEDEC standard operating speed(8Gbps) by implementing over 10Gbps(Gigabit per second) operating speed in HBM4.In addition, the company adopted the Advanced MR-MUF process in HBM4, which has been proven to be reliable in the market, and the 1bnm process, or the fifth-generation of the 10-nanometer technology, to minimize the risk in mass production.“We are unveiling the establishment of the world's first mass production system of HBM4,” Justin Kim, President & Head of AI Infra at SK hynix, said. “HBM4, a symbolic turning point beyond the AI infrastructure limitations, will be a core product for overcoming technological challenges.” “We will grow into a full-stack AI memory provider by supplying memory products with the best quality and diverse performance required for the AI era in a timely manner.”Credit: SK HynixSK hynix develops world's first HBM4, doubling bandwidth and boosting efficiency for AI memory. SK Hynix