Solid State Storage Technology Corp. (SSSTC), a leader in the design and manufacturing of data storage solutions, is set to unveil the ER3 SSD Series, featuring the world's first immersion cooling technology ideal for data centers, at Supercomputing 2023 in Denver, Colorado, from November 14-16.The enterprise-grade ER3 SATA SSD Series delivers superior reliability and durability to support intense workloads and massive write operations in large-scale data centers. With the growing prevalence of AI applications comes significant challenges to data center performance. These challenges extend beyond just computing power and also encompass thermal management, a critical factor in maintaining uninterrupted system operation. To tackle these issues, SSSTC has developed the ER3 series.Hardware requirements continuously change as computing power increases. GPUs and CPUs demand substantial, high-speed memory to handle tasks effectively, making the role of SSDs increasingly crucial. Currently, 4TB and 8TB SSD capacities have become the norm, with expectation of continuous expansion in the future. With increased computing power comes the challenge of cooling the SSD. Overheating leads to system instability. Although traditional air cooling technologies have matured and the costs have decreased, there are lingering concerns over long-term stability and sustainability. In this context, liquid cooling emerges as the cutting-edge thermal management solution for the new generation.Electricity expenses associated with cooling are a critical factor to consider. Large-scale air-cooled systems necessitate continuous operation of air conditioning systems around the clock, resulting in substantial energy costs. According to the global digital infrastructure authority Uptime Institute, 40% of data center energy consumption is attributed to cooling purposes.The ER3 SSD Series launched in Q4 2023 are completely submerged in non-conductive liquid to achieve a superior cooling effect compared to traditional air cooling and indirect liquid cooling. This ensures that the temperature remains in an ideal range even under intense workloads and optimizes the read/write performance and system reliability. The ER3 series is available in two form factors: 2.5-inch and M.2 2280. The 2.5-inch variant offers five capacities: 240GB, 480GB, 960GB, 1920GB, and 3840GB, whereas the M.2 2280 variant has three options: 240GB, 480GB, and 960GB.The ER3 series offers remarkable durability and reliability metrics including DWPD, Uncorrectable Bit Error Ratio (UBER) and Mean Time Between Failures (MTBF). Its DWPD rating indicates that the ER3 series' endurance remains uncompromised under heavy workloads such as AI computing. Its UBER value meets the JEDEC Enterprise requirements, enabling a significant reduction in data corruption and loss risks. Measured at an MTBF of 3 million hours, the ER3 series can help minimize unexpected system downtime and ensure continuous business operation. The high performance and optimal reliability of the ER3 series is built on SSSTC's robust technological strength accumulated through years of continued efforts toward enterprise-level storage. Many leading global network service companies trust SSSTC's products. These customers impose stringent requirements on the quantity and quality of the storage devices used at their data centers. SSSTC is among the very few SSD vendors that have supply capacity on par with the top three NAND flash manufacturers. Moreover, it has proprietary technologies and in-house R&D teams, allowing it to promptly respond to any SSD issues at data centers and deliver uninterrupted system operation. SSSTC keeps a careful balance between mainstream and long tail products. In addition to providing high-speed NVMe PCIe SSD, it offers products that support non-mainstream interfaces like SATA. SSSTC continues to support hardware and firmware upgrades and add new features.The company is also committed to upholding high product quality and reliability. It conducts 100% product inspections, including samples and all shipments even when inspecting thousands of units. While this practice demands significant time and effort, it is essential when supplying products to large-scale data centers with rigorous reliability requirements. This is also one of the reasons why SSSTC products are favored by large-scale network operators.Large-scale data centers will only have increasing demand for performance and reliability. SSSTC will stay committed to enterprise storage solutions, offering professional and refined customization services suited to customer needs.To learn more about the ER3 series enterprise-level SATA SSD, please drop by our booth (#2007) at SC23 and speak with one of our experts.SSSTC Displays Boot and Computing SSDs Tailored for Data Centers at Super Computing 2023(SC23)

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced that it has expanded its portfolio in the third quarter of 2023 by adding more than 40,000 new stocking parts including 19,000 newly introduced products across its core business."DigiKey is continually expanding its inventory to offer engineers and designers the industry's largest supplier portfolio and widest product offering," said Mike Slater, vice president of global business development for DigiKey. "All the products we have added in the third quarter are now regularly stocking devices that have enhanced our commitment to the global engineering community who purchase industrial automation, semiconductor, sensor, power, passive, and connector technologies."Some of the key new product highlights now available through DigiKey include:Allegro: The ASEK724LLC-30AB-T current sensor IC is an economical and precise solution for AC or DC current sensing in industrial, automotive, commercial, and communications systems. The small package is ideal for space-constrained applications while also saving costs due to reduced board area. Typical applications include motor control, load detection and management, switched-mode power supplies, and overcurrent fault protection.MPS: The MPM3695 - MPM3695-100 DC/DC Power Module with PMBus offers a complete power solution that achieves an output current of up to 100 A with excellent load and line regulation across a wide input voltage range. The device operates at high efficiency across a wide load range and can be paralleled to deliver up to 800 A of current.TE Connectivity: TE's RJ45 Industrial IP20 Connector Assemblies offer a robust and reliable solution for industrial Ethernet applications. This connector assembly extends the family of field-installable products that can be installed without any special tools. The industrial IP20 connector assembly complies with the IEC 60603-7-1:2011 and IEC 60603-7-3 standards, supports an industrial temperature range, and is available in both straight (180-degree) and angle (90-degree) versions.Vishay Dale: The HV-IBSS-USB Series Power Shunt reference design allows for easy integration and testing for BMS designs. With low TCR, USB-C connection for easy data access, high power and high accuracy at 0.2% of calibration, customers can utilize this design with confidence in battery management. The terminal emulation is suited for a wide variety of operating systems.ACL Staticide: The ACL 8900 StatIQ™ Armband Monitor state-of-the-art body voltage monitoring system is for companies requiring real-time traceability for their most on-the-go employees within electrostatic-protected areas (EPA). The monitor uses an electric field mill to measure the local surface charge density on an employee's arm and body voltage is measured and recorded in real-time in the software. The device has 12 hours of runtime battery life and recharges in one hour with the included USB-C® cable.DigiKey is an authorized distributor of electronic components for more than 2,800 industry-leading suppliers, ensuring engineers, designers, procurement professionals and builders that the products they order are authentic and come to DigiKey directly from the manufacturer.For more information about the suppliers in DigiKey's portfolio, please visit the DigiKey website.DigiKey has introduced more than 40,000 new stocking parts in Q3 of 2023

MEDICA 2023, one of the leading global medical industry events, is slated to occur between November 13-16 in Düsseldorf, Germany. As one of the key exhibitors at this event, Asian Power Devices (APD), a leading Taiwanese power supply manufacturer, is poised to unveil its comprehensive suite of medical power supplies at booth Hall 15/C38-1. APD has made significant advancements in terms of the overall efficiency, energy conservation, acoustic performance, size, and mobility of its products, making APD tech well-suited for medical applications.In the medical field, where reliable technology can quite literally be a life-and-death proposition, power supplies are a mission-critical technology. APD's offerings are rigorously designed and tested to align with international safety standards, including IEC 60601 and UL 60601. Adherence to these standards ensures global applicability to a variety of medical applications and covers specifications, output ranges, and voltage options tailored to the stringent requirements of the medical field. In general, APD's power supply solution mainly has the following core features: Reliability and Longevity:Reliability is best paired with longevity. With this in mind, APD's medical power supplies boast an operational lifespan extending beyond 10 years. Adherence to the Mean Time Between Failures (MTBF) metric from Telcordia SR-332, with a remarkable benchmark of over 1 million hours, signifies unparalleled reliability in their power products.Peak Performance Metrics:APD power supplies are constructed to manage peak load capacities exceeding 300% of nominal loads, thereby providing a consistent power output even during periods of transient high-current demand typical of medical devices. Additionally, APD designs minimize acoustic noise, facilitating a tranquil environment conducive to patient care.Enhanced Safety Features:APD power supplies are adept for use in varied operational conditions, including environments with limited air circulation. Compliance with 2 x MOPP (Means of Patient Protection) standards and low leakage current specifications further underscores the emphasis on patient safety. Advanced thermal simulation techniques inform the design process, optimizing the heat dissipation architecture to assure safety and stability during operation. Furthermore, an optimized electromagnetic interference (EMI) structure bolsters the product's resistance to disruptive interference. A high degree of immunity to electrostatic discharge and electrical surges, coupled with safety mechanisms for overvoltage, overcurrent, and overtemperature scenarios, means APD products are built for even the toughest of medical applications.Durability and Resistance:Each unit carries an IP22 rating against ingress from dust and moisture, with enclosures fabricated from UL 94V-0 fire-resistant material -- going above and beyond conventional safety benchmarks. The patented output cable design ensures resilience against damage from repeated bending, meaning APD products will hold up even to repetitive use.With this comprehensive suite, APD not only demonstrates its leadership in the field but also its commitment to supporting and advancing medical technology through reliable, safe, and high-performance power solutions tailored to the critical needs of modern healthcare.APD launches highly stable medical power supply solutions at MEDICA 2023

AMICCOM Electronics Corporation (AMICCOM) announced a new generation of ultra-low-receiving current Sub-GHz RF transceivers, named A7149. The A7149's RF core follows the A7139's RF with a low receiving current, the A7149 operates with only half the current consumption compared to the A7139 when receiving and transmitting at maximum power. In addition, A7149 greatly reduces the bill of material (BOM). The operation mode of A7149 is similar to A7139, the external MCU can control the RF mode through the SPI interface and access the built-in FIFO. The supported data rate is 2Kbps ~ 250Kbps. The modulation scheme can be FSK and GFSK. A7149 supports license-free ISM Band applications below 1GHz, such as the 868MHz band used in Europe, the 433.92MHz used in Europe, America, and Asia, and the 915MHz allowed in the United States and Taiwan.The biggest advantage of A7149 is its excellent RF characteristics. In the 433MHz frequency band, A7149 has high sensitivity (-107.5dBm @ 100Kbps), low receiving current (1.65mA), and maximum +21dBm PA output (current 81mA). These specifications make it very suitable for low-power long-distance applications.In addition to long-distance transmission capabilities, the built-in RSSI of the A7149 can help software engineers detect clean channels for transmitting. The chip's internal Auto Calibration mechanism is used to overcome the variation of the semiconductor process and can work stably in various environments. AFC function can avoid the sensitivity degradation caused by RF frequency offset.There are many applications suitable for A7149, such as AMR -- wireless automatic meter reading (wireless heat meters, gas meters, etc.), long-distance two-way car alarms, industrial controllers, energy management for smart buildings, home automation, smart home, and security alarms. Especially it's suitable for applications that are powered by batteries and require a long life cycle. About power management, A7149 supports Deep sleep mode, Sleep, Idle mode, and WOR (Wake On RX), which supports periodic Sleep to RX mode to listen to incoming packets without MCU interaction to extend battery lifetime. Deep Sleep mode switches off all circuitry except SPI (wake-up purpose) with only 40nA consumption. Overall, A7149 is very easy to use to simplify system development and cost.Supply and packaging: A7149 is available in a QFN5x5 32L package and is now available from AMICCOM and its authorized distributors. Welcome to request IC samples and development kits and start development work.

In today's swiftly evolving digital landscape, businesses are confronted with an unending array of threats from cybercriminals who are ceaselessly seeking to exploit vulnerabilities and compromise sensitive data. We present an exclusive interview with RuoJian, the General Manager of CloudCoffer. RuoJian introduces us to the revolutionary Web Application Firewall (MatrixShield) and the cutting-edge Sandbox technology (SandSphere). CloudCoffer, trusted by banks, corporations, and governments globally, has played a pivotal role in enabling customers to detect malicious code and prevent cyber threats. Their platform facilitates customized customer features, ensuring holistic protection in the ever-changing realm of cyber threats.In the ongoing battle against cyber criminals, time holds paramount significance. CloudCoffer's cloud-based WAF harnesses the power of advanced artificial intelligence, empowering organizations to promptly counter emerging security vulnerabilities without any lag. With a cadre of adept researchers, a repository of top-tier threat intelligence, and a network of global honeypots, CloudCoffer maintains ceaseless vigilance over the worldwide threat landscape. This proactive approach permits real-time scrutiny against the latest threats and blocks attacks in the cloud, so malicious traffic is not sent to the systems of clients. CloudCoffer's track record boasts the identification and thwarting of both well-known and zero-day issues, thereby averting potential security breaches. On an average scale, at MatrixShield, their monthly detection encompasses hundreds of zero-day attacks.Their malware detection system–SandSphere, capitalizes on advanced machine learning algorithms and a blend of static and dynamic analysis, exhibiting prowess in pinpointing and neutralizing zero-day malicious codes even before it's officially recognized. Clients can place their trust in the cutting-edge technology of CloudCoffer, safeguarding their mission-critical systems against the most intricate cyber intrusions by scanning their codes with SandSphere.Besides, CloudCoffer has unearthed a prevalent issue. Despite banks' earnest endeavors to mitigate security risks, many face challenges in verifying security concerns within their source codes. The three foremost challenges are as follows:Infiltrated Backdoors:Certain backdoors originate from external vendors and supply chains, while others stem from open-source contributions.Leaked Testing Systems:In live production environments, confidential intranet system details like domain names and IP addresses are inadvertently exposed, furnishing attackers with essential information to target and breach critical systems.Compromised 3rd-Party Systems:Banking application codes often incorporate elements from third-party sites, but a fraction of these sites could be compromised. This presents a scenario where banks inadvertently invoke malicious code during dynamic interactions.After scrutinizing 50 banking applications from around the world, the findings reveal that 28% are vulnerable to Issue #1, 20% are vulnerable to Issue #2, and 84% are vulnerable to Issue #3RuoJian highlights that modern attackers are smart enough to conceal malicious codes to bypass most antivirus solutions. When developers include codes from open sources, malware may be packed into the codes already, but there are very few effective solutions to identify these types of issues. To secure systems effectively, it is a must to review critical systems codes. CloudCoffer also offers a campaign to check for codes. This initiative serves as a resounding testament to CloudCoffer's unwavering commitment to fortifying digital landscapes against evolving threats.

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, today announced that it has partnered with Ambiq to distribute its ultra-low power semiconductors globally.Through the new partnership, DigiKey is now stocking Ambiq's Apollo4 Blue Plus. With one of the lowest dynamic powers for microcontrollers currently on the market, the new SoC allows designers of next-generation wearables and battery-operated smart devices to accelerate their innovation."DigiKey is pleased to add Ambiq to our core supplier line card," said David Stein, vice president of semiconductors at DigiKey. "As a leader in low-power SoC solutions, Ambiq has raised the bar with their new MCU & SoC, and we're excited to support designers, engineers, and builders globally as they work with these innovative solutions to accelerate progress."The Apollo4 Blue Plus is a 4th generation system processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT) platform. The device's complete hardware and software solution enables current and future battery-powered endpoint devices to achieve a higher level of intelligence without sacrificing battery life.The Apollo4 Blue Plus with Bluetooth Low Energy has more than enough computing and storage to handle complex AI algorithms and neural networks, always-on voice recognition, and display capability for smooth graphics."Ambiq shares the same value of meeting and exceeding customer's expectations with DigiKey," said Mike Kenyon, vice president of sales and business development at Ambiq. "We're excited to partner with DigiKey to offer our portfolio of ultra-low power, AI-enabled semiconductor solutions to help ease the customer's search for the best electronic components in one place."For more information about Ambiq and to order from their product portfolio, please visit the DigiKey website.DigiKey has partnered with Ambiq to offer their low-power IC solutions, including the Apollo4 Blue Plus, which enables Bluetooth Low Energy (BLE), graphics, and audio for always-connected IoT endpoints.

the TPCA Show and IMPACT Conference 2023 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 25th to 27th. The strategic brand presence of MKS, Atotech and ESI impressed visitors at the show. The crowded booth, the many paper presentations at the IMPACT conference and the specially hosted session on "AI advanced packaging" draw special attention to the company this year, a leader in Taiwan's PCB, IC Substrate and Semiconductor industries.MKS' teams on the show floorThe teams from both strategic MKS brands came together to represent the new combined company and its combined expertise in advanced PCB via drilling systems, lasers, optics and motion with process chemistry and equipment for current process and yield optimization, as well as next generation product development, e.g. for advanced material processing, via formation, glass package substrates, solar, batteries and more. One of the focal points at the show was on Optimize the Interconnect which can be achieved with Atotech and ESI products and services. Optimize the Interconnect is an MKS offering that provides printed circuit board (PCB) and advanced electronics packaging customers with a wide range of products and services for creating interconnects in the most advanced PCB and IC packaging designs. Services include PCB and advanced electronics packaging interconnect creation and evaluation services, access to the MKS Technology Centers for installation, setup and troubleshooting services, application development services, application labs and support, design and development services, and maintenance, repair and calibration services.This unique combination of MKS' via drilling and routing, and chemical plating expertise enables customers to accelerate their product roadmaps, solve the challenges associated with new materials and finer feature sizes, and thereby creating the interconnection more effectively with higher quality output and faster time to market.MKS' Management interviewed by GaryMKS' team with TPCA Mr. BaiWe offer a broad range of MKS' technologies and capabilities?Xsuch as lasers, precision optics, motion control, beam measurement, via drilling systems and process chemistry?Xto provide a unique solution for optimizing the manufacturing of PCB and advanced electronics packaging interconnects, a key part of the overall PCB and advanced electronics packaging manufacturing process."We understand the importance of providing our customers with the best solutions and services including sustainable products and energy-saving equipment to create win-win situations for our customers," said Daniel Schmidt, Global Marketing Director. Throughout the week, various local and international executives were available to meet with teams, customers, partners, and prospects to discuss the way forward with a special focus on the latest industry trends and challenges. The teams made special efforts to welcome and introduce the latest technologies and solutions to key industry participants and customers and the team demonstrated our new synergies and total solution package consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service to the Taiwanese PCB industry. After one year since the acquisition, the industry and especially our customers are expressing high confidence in our integration, and trust that we can provide them with more complete solutions to support their future product and manufacturing development roadmap.MKS' Industrial Forum and the audiencesPresenters of the MKS' Industrial ForumThe team also presented 8 papers at the IMPACT technical conference this year. A key event was the IMPACT industrial forum on October 25 from 1:30?V 3:30pm, where industry leaders in their respective fields were invited to speak about their contribution to the developments in AI to create a new era of advanced packaging. Daniel Schmidt, Global Marketing Director said: "The special industrial session helped our company to draw attention to industry trends, challenges, and possible solutions. Many questions were asked and discussed during the session, and it showed our contributions not only in our solutions, but also in the technology developments within our industries."

In a recent report, IDC revealed the transformative role of generative AI (GenAI) within IT operations (ITOps) across the Asia Pacific region. IDC's 2023 Future Enterprise Resiliency and Spending (FERS) Survey, Wave 6, highlights that almost half (43%) of organizations surveyed are currently exploring potential GenAI use-cases, with 55% of financial organizations and telecom firms investing in GenAI technology in 2023.With the digital-first mindset gaining momentum in Asia Pacific, businesses are seeking innovative solutions to enhance operations. GenAI stands out as a pivotal technology, offering companies the means to mitigate risks, boost efficiency, and improve overall productivity.Generative AI is gaining popularity in IT operations and IT service management, particularly in cost-sensitive Asia Pacific environments. This technology offers automation of ITOps tasks, reducing operational costs and optimizing resources. The region, which includes mature economies like Australia, Japan, and Singapore, and rapidly growing markets like India and China, has diverse IT requirements and issues. In growing economies, generative AI plays a vital role in facilitating scalable ITOps."Generative AI can increase the overall productivity of ITOps teams by streamlining ITOps workflows, lowering operational expenses, and increasing system dependability. However, GenAI systems must be properly implemented to ensure that they correspond with enterprise goals and that adequate guardrails are in place to manage unanticipated events," said Dhiraj Badgujar, Senior Research Manager, Digital Innovation Practice and xOps Program, IDC Asia/Pacific.In the report, IDC highlights ITOps trends that enterprises need to look out for as the GenAI revolution continues:• Rise of AIOps: AIOps solutions are becoming more popular in Asia/Pacific. ML and AI algorithms are being used by enterprises across the region to automate IT processes, monitor performance, and forecast and avoid IT disasters.• Predictive Analytics: AI-driven predictive analytics in ITOps helps enterprises anticipate IT issues and prevent disruptions.• Hybrid Cloud and Multicloud Management: As enterprises in the region embrace hybrid cloud and multicloud settings, GenAI will be used to manage these complex infrastructures.• Continuous Improvement: GenAI models will evolve in complexity and quality, likely integrating with IoT and edge computing to enhance data collection and analysis.Leading vendors are also diving into the GenAI wave. Notable implementations include Atlassian's Atlassian Intelligence, ServiceNow's generative AI capabilities for the Now Platform, New Relic's Grok, PagerDuty's generative AI for its Operations Cloud, and HCL Technologies Limited's BigFix 11.GenAI-driven ITOps can significantly impact business success for enterprises in the region. The IDC Asia Pacific Software Survey 2023 shows that over 50% of enterprises from countries like India, Indonesia, and Malaysia expect increased operational efficiency and automation from GenAI as part of their digital innovation strategy, highlighting the growing need for IT agility in these industries.

One aspect of the electronic supply chain that is unchanging is the effect emerging technologies have on the ebb and flow of the market. As technologies cycle in and evolve, they play a significant role in demand, supply, price, lead times, and manufacturing operations.Of course, this is dependent on consumer adoption as well, but as companies integrate more advanced technologies into end-user products, the market behavior all points in the same direction—up in demand and down in supply.Generative AI: The Emerging Technology that Continues to EvolveToday, generative artificial intelligence (AI) is the major stakeholder in technological advancement. With $1.3 trillion in growth expected by 2032, generative AI is the major driver of electronic component market activity, impacting supply, demand, pricing, and lead times.What Is Generative AI?*The term refers to the algorithms and models that identify the patterns and structures within the existing content.*The purpose is to create new content based on existing content (text, images, video, audio, and other media).*The intent is to deliver real-time, automated results for the end-user.Chipmakers and companies continue to see the rise in its applications with industries like automotive, consumer electronics, energy, healthcare, and more including it in end-user products. These industries apply AI for various use cases like customer communication, improved automation, and optimization.The "popularity" of generative AI stems from its usability, which chipmakers and companies are seeing with the adoption of chatbot programs like ChatGPT, DALL-E, and Bard. These programs rely on AI technologies like natural language processing (NLP), such as language models (LLMs), speech synthesis (SS), and computer vision (CV), which all create a user-friendly, convenient end-product.Demand for High-Performance ChipsThe speed of adoption and continued evolution of AI results in the need for high-performance chips like GPUs and FPGAs. As an example of how these chips are applied,*GPUs are specialized chips that can perform parallel computations for graphics and AI tasks.*FPGAs are reconfigurable chips that can be customized for specific AI tasks.While chipmakers update production lines to support the continued demand for supply, the companies continue to develop end-products to apply them. Among the companies increasing development and driving demand are Nvidia, Google, Amazon, and Microsoft, as they seek more market opportunities in AI applications.While these companies see revenue growth from this technology, it doesn't come without the challenges of competing for manufacturing support from the chipmakers.As Technologies Emerge, Manufacturers Pivot PlansProducing the chips that power AI applications comes with complex challenges. Nvidia leads the pack in the latest benchmark tests for chip speed, but competitors like Google and Advanced Micro Devices are attempting to carve out their own position. However, producing high-performing chips comes at a higher cost due to the design and fabrication requirements. As generative AI models become more advanced, chipmakers must pivot.Currently, manufacturers are allocating resources toward research and development (R&D) and implementing innovative manufacturing techniques. The balancing act between supporting the rise of AI and other verticals is tricky, especially considering Nvidia's head start. Today, Nvidia accounts for more than 70% of AI chip sales, a vast gap for other companies to bridge.Even with their popularity, Nvidia cannot keep up with all the demand, opening the window for other manufacturers to carve out market share. The same level of investment and support is needed in AI hardware and all the other parts of the technology stack, encompassing the data centers where AI applications occur. These centers include components from memory to interconnects, packing, and systems.It remains to be seen if manufacturers seeking unique solutions can allocate manufacturing support to keep up with demand.Strategic Supply Chain BuildingAmid the boon of generative AI, distributors encourage manufacturers and companies to think strategically to source the parts they need for the short and long term. As generative AI evolves, the market will move as it moves with the continued growth in demand and ways to manage supply over time.To learn how to get Out In Front of risks to your supply chain, reach out to Fusion Worldwide today to speak to a procurement specialist. Contact us today.Author: Tobey Gonnerman, President, Fusion WorldwideThe AI Effect: Supply, Demand, and Continued Adoption

When it comes to Field-Programmable Gate Arrays (FPGAs), the market often thinks of Xilinx under AMD, the PSG division under Intel, and Lattice Semiconductor as the major providers. However, in recent years, Chinese companies have started to emerge, gradually gaining ground in the FPGA field.Gowin Semiconductor is one of the few Chinese chip design firms capable of independently developing FPGAs. Since its establishment in 2014 nearly ten years ago, Gowin Semiconductor has grown to about 250 employees. Jason Zhu, the CEO of Gowin Semiconductor, said that the Company was founded in a period of rapid development in China's internet industry. Investors had less interest in the relatively obscure FPGA field. However, Gowin did not only aim to satisfy the Chinese market demand from the beginning; it also sought to meet the needs of other regional markets as part of its long-term strategy. Hence, the Company initially invested in FPGA products with TSMC's 55nm process. Although this process was not the most advanced at the time, TSMC had introduced various versions including low-power consumption and embedded flash memory in their 55nm process, enabling Gowin to launch different grades of product lines according to market demands.Despite Using TSMC's 55nm Process, Product Still Boasts Market Differentiation and CompetitivenessJason Zhu pointed out that Gowin tried to find a suitable product strategy for its positioning at the time. Even though the 55nm process was used, Gowin offered more than double the number of I/O counts compared with other competitors of the same class. Gowin's chip reliability was greatly improved coupled with the high stability of TSMC's process, which significantly outperforms other foundries in terms of process variation. The chip reliability enabled Gowin to easily gain AEC-Q100 certification and quickly enter the automotive market. Jason Zhu also noted that Gowin has been widely accepted by many customers in recent years due to the shortage caused by the pandemic. Customers became aware of Gowin while seeking for alternatives and were further attracted by shorter delivery times. Effective technical support from various dealers also played a crucial role. These factors have gradually led to market recognition of Gowin's technical capabilities. To date, Gowin has shipped over 3 million automotive products.Diversified Collaboration in the Automotive Sector, Open to Any Cooperation PossibilitiesSpeaking of developments in the automotive market, Jason Zhu revealed that China's electric car market has been thriving in recent years. Car manufacturers have a high degree of control over power transmission systems and often opt for independent development rather than relying on other suppliers. Under the premise, SAIC Motor of China once utilized Gowin's FPGA for gearbox development. In regard to IGBT-related system design, some Chinese car manufacturers have adopted Gowin's FPGA chips instead of the traditional designs using automotive MCUs (Micro Control Units) to reduce overall system costs.For vehicle cockpit system applications, Gowin collaborates with well-known processor companies such as MediaTek and UNISOC. Jason Zhu pointed out that traditional automotive processors have a relatively limited number of MIPI design channels. However, the current development of vehicle cockpit systems has moved towards multi-screen output. As processors from MediaTek and other SOC vendors struggle to effectively respond to multi-screen output, Gowin's FPGA can overcome this problem. Playing a similar bridging role in the development of ADAS and autonomous vehicles, how can signals from automotive sensors like cameras, radar, and LiDAR be processed by NVIDIA's GPU? In fact, most early automotive FPGA products did not include a MIPI interface; but Gowin's FPGA comes equipped with the MIPI interface, supporting at least six camera image inputs.Moreover, automotive screen manufacturers are beginning to introduce miniLED technology, featuring local dimming that can instantly react to different brightness areas on the screen. Based on this demand, large car screen manufacturers like BOE and LG have started to cooperate with Gowin. Jason Zhu candidly stated that Gowin plans to attend an exhibition in Japan in the upcoming November, and BOE is willing to lend Gowin the design samples developed cooperatively for the exhibition.The digital rearview mirror is another automotive system with great emphasis on instant reaction. Jason Zhu mentioned that the system design is complex, involving optical imaging technology for image capture from automotive cameras, to screen output in digital rear-view mirrors. Image correction on its own, which enables the driver to identify the objects instantly, already entails different professional fields and considerable technical difficulty. Not to mention the various weather changes that must be dealt with, such as rain and fog. Clear display on digital rearview mirrors is imperative in all these conditions. Thus, Gowin maintains a close cooperative relationship with relevant solution providers.Actively Expanding into the Global Automotive Market Beyond Satisfying China's Domestic DemandRegarding the future development of Gowin Semiconductor and the automotive electronics market, Jason Zhu clearly states that Gowin not only aims to meet the demand of the domestic market in China, but also has considerable ambitions for regions such as Europe, America, Japan, and Taiwan.In Taiwan, for example, Gowin collaborates with local distributors and has substantial cooperation with leading providers of power supply and green energy solutions. In Japan, there are ongoing collaboration plans with top-tier car manufacturers. In the European and American markets, Gowin is currently working with German TÜV Rheinland to further obtain ISO 26262 functional safety certification for its products, facilitating quick entry into the supply chains of international car manufacturers.Gowin also has a next-generation automotive FPGA, Arora V, set to launch soon. It's expected to adopt TSMC's 22nm automotive process, representing a significant upgrade from the previous 55nm technology. Naturally, this brings substantial improvements in terms of power consumption and performance. Jason Zhu candidly stated that the launch of Arora V aims to follow the successful formula of the previous generation while carving out a unique market position different from traditional FPGA giants, aiming to address many pain points in the development of secondary automotive systems. Moreover, Arora V has made significant advancements in SerDES (Serializer/Deserializer) technology, which may have the opportunity to disrupt the dominance of traditional IDM companies in high-speed signal transmission for automotive applications. In the field of electric vehicles, as the next-generation SiC power semiconductors gradually become mainstream in the market, Gowin does not rule out collaborating with leading international SiC component manufacturers in the fields of inverter and OBCs.In summary, although Gowin Semiconductor is a rare Chinese FPGA chip design company with a history of only about ten years and a market share that is still not as substantial compared to international giants, Gowin's ambition in automotive and diverse vertical applications is still evident. The advent of its new 22nm product is expected to gradually strengthen its position in the FPGA market and provide more visibility.Jason Zhu, CEO of Gowin Semiconductor, stated that the forthcoming next-generation automotive FPGA Arora V will likely use TSMC's 22nm automotive-grade process, hoping to follow the successful formula of the previous generation to address many pain points in the development of secondary vehicle systems.Gowin Semiconductor's latest 22nm FPGA product series, Arora V, supports high-performance DSP for AI computations, high-speed LVDS interfaces, and ample BSRAM memory resources. Arora V simultaneously integrates an independently developed DDR3 interface and 12.5Gbps SERDES which supports various protocols, along with diverse packaging choices. It is highly suitable for applications in various industries, such as netcom, servers, industrial, medical, automotive, and power systems needs, etc.