PC demand in the first half of 2020 has been strong, thanks to stay-at-home needs, but PC vendors and their ecosystem partners are wary of weakening momentum in the second half of the year, with some brand clients reportedly starting to cut orders. The handset market is set to end 2020 with disappointment, but component suppliers expect demand to pick up in 2021...
The coronavirus pandemic is disrupting 5G deployments at chipmakers, telecom carriers and end markets. Qualcomm previously was keen on gaining an upper hand in the 5G market, but has now found it necessary to devote more efforts to defend its share in the 4G segment...
Global shipping lines have been plagued by substantial empty container repositioning costs, but now such costs can be drastically reduced through a container sharing platform set up by Taiwan-based startup Neptune Container Swap (NCS), according to company executives.
IoV (Internet of vehicle) data collected from ADAS (advanced driver assistance system), OBUs (on-board units) and RSUs (roadside units) have to be screened to extract information to serve different purposes, according to Roger Cheng, president for intelligent transportation solution provider Maxwin Technology.
Deep01, a developer of artificial intelligence (AI) software designed to help physicians interpret computerized tomography (CT) images of the brain, has raised US$2.7 million in financing, with Asustek Computer leading the round of fundraising.
Electric scooter sharing service operator WeMo Scooter has completed series A fund raising, obtaining investment of over NT$100 million (US$3.36 million), according to the Taiwan-based company.
TSMC is expected to the start production of A14 processor on 5nm process later this month for Apple's upcoming iPhone, which sources say will adop Qualcomm's X60 modem, allowing the 5G iPhone to support both mmWave and sub-6GHz bands...
Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged with its Foveros technology, TSMC is looking to commercialize its SoIC technology for 3D heterogeneous integration next year. Meanwhile, Nan Ya PCB is looking to boost its profits by focusing more on high-value products, such as ABF and SiP substrates...
The games console market is expected to see vendors launch new devices, intensifying competition against each other later this year. The keen competition means strong demand for NAND flash to support the consoles' large storage. Meanwhile, silicon wafer supplier GlobalWafers remain upbeat about the long-term demand for 12-inch wafers...
To demonstrate its smart city solutions to other cities worldwide, the local government of Taoyuan, Taiwan signed contracts with Local Governments for Sustainability (ICLEI), a network of more than 1,750 local and regional governments committed to sustainable urban development, to become the chair for ICLEI's first international EcoLogistics community in 2019...
