Tescan Group in September 26, 2025  announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park. The new unit expands Tescan's correlative and multimodal portfolio for semiconductor, biomedical device manufacturing, and advanced research markets. FemtoInnovations brings to TESCAN a unique and disruptive laser platform-technology already proven in demanding workflows and attracting strong interest from leading global players across semiconductors, advanced manufacturing, and high-tech industries. "Bringing FemtoInnovations into the Tescan family is a strategic step that strengthens our ability to deliver end-to-end workflows. By combining ultrafast laser micromachining with our leading imaging and analysis platforms, we're enabling customers to move faster from problem to insight across failure analysis, sample preparation, R&D, and advanced manufacturing," said Jean-Charles Chen, Chief Executive Officer, Tescan Group.  Tescan will unveil the portfolio at ISTFA 2025 (Pasadena, CA) in November. "Our team has always been driven by the pursuit of innovation and the development of disruptive laser processing technologies. By combining our ultrafast laser systems with Tescan's leading imaging and analysis platforms, we are creating a powerful new dimension of integrated workflows. This partnership will accelerate discovery and redefine what's possible for our customers. We are excited to combine forces and contribute to Tescan's legacy of excellence and innovation," said Sina Shahbazmohamadi, Co-Founder, FemtoInnovations. The Laser Technology BU will be headquartered at the University of Connecticut Tech Park (UConn), tapping into its research ecosystem, talent and infrastructure. It will work in close synergy with Tescan's Electron Microscopy and Micro-CT business units to deliver integrated workflows beginning in 2026. A new FLAME Center (FemtoInnovations Laser Advanced Manufacturing & Engineering) will be established at the Innovation Partnership Building of UConn Tech Park to fast-track R&D, applications and workflow development. From a strategy standpoint, the decision centered on three things: the caliber of the FemtoInnovations team, the maturity of its ultrafast-laser platform for real-world workflows, and a clear cultural fit with customer-driven problem solving.  To learn more about Tescan, feel free to visit their website or subscribe their offcial LinkedIn account.Credit : Tescan

Digital innovations are detrimental to the growth of online entertainment platforms. The industry itself has seen an immense shift over the years, changing how people consume and create entertainment. Now, anyone can easily create a form of entertainment, monetize it, or opt to be an audience. Gaming's Digital TransformationThe gaming industry has one of the most noticeable growths over the years. Online platforms emerged, entirely changing how people can play and interact. Games become more accessible on multiple platforms, lowering the need for costly consoles. Even for casino games, which started as physical machines, are now more common online. As technology advances, players increasingly look for the best online casino that delivers seamless and secure experiences. Some online casinos have also offered apps that make the online betting experience easier and more flexible. Among all the digital innovations, Virtual Reality (VR) and Augmented Reality (AR) have become the trigger for developers to keep pushing. The industry wanted to broaden the digital world of gaming that blurs the lines between the physical and digital worlds. Meanwhile, Cloud gaming services eliminate hardware barriers. Esports has grown to become a billion-dollar industry. It's now housing professional leagues with massive audiences. In addition, social features are breaking into the gaming industry. It further ensures players can have social interaction while gaming. These features attract diverse demographics that extend beyond traditional gamers. The Streaming RevolutionStreaming platforms blew up and fully changed how content is distributed and consumed. Platforms like Netflix, Amazon Prime, and Disney+ lead the industry. They've equipped their platforms with features that can cater more to audiences. These include personalization capable of giving algorithm-driven recommendations. It has become easier for people to find entertainment catering to their preferences. Younger generations spend less time watching television. Some have completely left television for streaming platforms. This shows how networks must adapt to the changes and change their strategies to remain relevant. Now, streaming platforms are major content producers. They change how stories are told with billions invested in original programming. With the internet supporting streaming and smart TV technology delivering enhanced graphics quality, viewers can consume content that's of much better quality than traditional content. The Evolution of Music StreamingCassette tapes and MP3 players have been completely replaced by music streaming. At the beginning of the smartphone and the internet era, people needed specific software to play music. However, music streaming platforms have evolved into something that benefits the artists and listeners more. Platforms like Spotify and Apple Music are now the primary way people listen to music. The downside is that it's harder for artists to sell physical albums. To adapt to this change and innovation, they found new ways to monetize their music without sacrificing consumers' comfort. Artists now receive streaming revenue. As the landscape keeps changing, artists and fans will likely see more ways that they can engage with their favorite musicians and platforms, bringing new ways to make these artists flourish. Technologies on Live PerformancesBefore digital innovations, fans could only watch their favorite artists perform physically. They need to attend the concert venues and might struggle to do so if their idols are performing two countries away from where they live. Digital technologies bring live performances closer. Be it concerts or Broadway shows, artists can connect with more fans through live streaming or other technologies. Virtual Reality technology has also played a big part in enhancing live performances. It gives fans more dimension, a better online viewing experience than just watching on their device's screen. Virtual Reality amps up the immersion significantly. Despite not being physically present in the venue, fans can enjoy the live performance with a similar experience from the comfort of their home. Concert production also ensures that their stage settings in real life contribute to the online experience. They use elaborate lighting, better sound, and will edit the resulting video with effects that enhance the audience's overall experience. Social MediaSocial media has transformed into a place where various entertaining content is gathered. It's also now a place where people have the freedom to be creative and where fans can engage further with their favorite celebrities. Short-form video platforms open more paths for people to be creative. In addition, most social media platforms now allow users to live stream, enabling them to connect with people in real-time. This changes how people perceive creators and celebrities. They feel closer to their idols when they're active on their social media. With only one smartphone, anyone can build a brand for themselves and reach global audiences. Whether it's to promote themselves as an influencer or to open an online shop that's easy to access for everyone. New ways to enjoy content come from social media. There are Stories and Reels, which are innovations on how people can share or consume digital content. With built-in algorithms, social media ensures users remain engaged as they'll keep on finding content aligning with their interests. ConnclusionDigital innovation has fundamentally reshaped the landscape of online entertainment, empowering creators, enhancing audience experiences, and redefining how content is produced, distributed, and consumed. From gaming and streaming to music and live performances, technology continues to break barriers-making entertainment more immersive, accessible, and personalized. As platforms evolve and audiences diversify, the industry must remain agile, embracing innovation not just as a tool, but as a driving force behind the future of entertainment.The Role of Digital Innovation in Shaping Online Entertainment Platforms. Credit: Pixabay

Turkish President Recep Tayyip Erdogan met with Chinese President Xi Jinping at the Shanghai Cooperation Organization (SCO) summit in China. resulting in a multi-faceted agreement aimed at deepening cooperation across infrastructure, trade, and technology.A Key outcomes of the meeting was the alignment of China's Belt and Road Initiative with Turkey's Middle Corridor project. The plan features a southern branch of the China–Europe Railway Express, expanding freight routes via the South Caucasus. In addition, the two countries agreed to stimulate cooperation in 5G, renewable energy, and biomedicine. Ankara also reaffirmed its commitment to the one-China policy.Aligned with the summit, Turkey announced it will conduct a long-awaited 5G spectrum auction on October 16, 2025, with commercial services expected to launch to begin April 1, 2026.In the 700 MHz and 3.5 GHz bands, 400 MHz will be distributed among 11 frequency packages during the auction. Operators will pay in three installments, with a minimum total value of $2.125 billion.Eligible bidders include Vodafone Turkey, Turk Telekom, and Turkcell. Starting in 2029, operators will be required to remit 5% of their annual revenues to the Information and Communication Technologies Authority (BTK) 5% of their yearly revenues as part of the post-license consolidation process. Licenses will remain valid until the end of 2042.To strengthen its domestic technology sector and reduce reliance on foreign suppliers, the Turkish government mandates the use of locally produced infrastructure in the 5G rollout. Officials estimate the new network will deliver speeds 10 to 100 times faster than 4.5G.Machine-to-machine communications, smart city solutions, and industrial automation are great examples of enterprise applications. For consumers, the benefits will manifest as radically improved immersive experiences, such as lag-free cloud gaming, ultra-high-definition streaming, and seamless real-time interaction on low-latency online casino platforms. These advancements promise to make digital entertainment more responsive and engaging. Learn more about the latest developments in online casino technology, along with insights into current bonus structures.Turkey's move positions it as a regional telecom infrastructure leader. The October auction aligns with Erdogan–Xi pledges to integrate 5G into transcontinental logistics and trade infrastructure.Turkey is testing advanced 5G industrial use cases in addition to telecom rollouts. Together with Argela and Etiya, Turk Telekom is creating local 5G network-slicing technologies to facilitate charging frameworks and industry-specific applications. The company used 5G-Advanced ISAC technology to test real-time ship detection in a first for Europe, showcasing its port automation capabilities.Separately, Turkcell and Ericsson demonstrated how to use 5G standalone and network slicing to enable AI-powered robotics in factories, completing the first industrial autonomous mobile robot (AMR) demonstration in Turkey. These trials underscore how Turkey is positioning 5G not only as a consumer technology, but as a keystone of Industry 4.0 transformation.Additionally, China-Turkey's larger transportation and digital infrastructure strategy aligns with the 5G push. As a digital layer on top of physical connectivity, 5G is enhanced by the rail and Belt and Road integration agreements at the SCO summit.5G is a key technology for intelligent logistics, freight tracking, and trade automation as Turkey expands its Middle Corridor and connects BRI routes. China-Turkey trade reached US$48.3 billion in 2024, according to official data, and digital infrastructure is a vital value-added along that corridor.As projects come to fruition, it will become clear whether the summit produces more than diplomatic headlines. In addition to altering the speed at which data travels, Turkey's 2026 5G rollout could also alter the flow of capital, influence, and goods throughout Eurasia if it coincides with new rail links to Europe. The Erdogan-Xi meeting is more than just a handshake because of that possibility.If Turkey delivers on its 5G timelines and deepens its role in Belt and Road logistics, the country could emerge as a rare case study. A mid-sized economy using digital infrastructure to punch above its weight in global trade.5G AMR demo shows Turkey's push toward Industry 4.0 transformation. Credit: Pexel

In an exclusive interview with DIGITIMES ASIA, the Czech-based electron microscope manufacturer Tescan Group detailed a significant strategic transformation. This profound shift aims to address the growing complexity of the semiconductor industry, particularly the transition from traditional monolithic integration to advanced 3D IC and chiplet architectures.This evolution has severely intensified the challenges of failure analysis (FA) and quality control, demanding a fundamental re-evaluation of conventional inspection and metrology processes. Tescan's new mission moves the company beyond its traditional role as an instrument provider. Instead of simply selling equipment, the company now aims to partner with customers in a shared mission: to shorten the distance between a question and an answer.Driving Change: The Workflow-Centric VisionTescan's strategic pivot is underpinned by a philosophical shift embodied in its new tagline, "Accelerating the Art of Discovery." Tescan APAC Managing Director Sean Lee explained that this new direction reflects a fundamental shift in the company's market approach. "The branding itself is really trying to embark and refocus on why customers would like to choose us," Lee noted.The answer to this "why" is no longer satisfied by the specifications of a single machine. The complexity of modern heterogeneous integration requires more. Tescan is focusing on providing a holistic capability that addresses the entire failure analysis process, spanning initial R&D and pathfinding through to production ramp-up and field return analysis. The goal is clear: to remove friction in the journey from a technical query to a business-critical insight.To achieve this, Tescan has shifted from a product-centric approach to a solution- and workflow-focused mindset. This involves the tighter integration of hardware, software, automation, and deep application expertise. This systematic approach aims to empower teams to localize issues more rapidly, prepare samples with high reliability, and ultimately deliver quality results that lead to confident decisions and a strong Return on Investment (ROI). Tescan stresses that conventional, siloed techniques are no longer sufficient to identify and resolve the intricate issues introduced by these dense, heterogeneous designs, making this workflow approach critical to success in the chiplet era.Tescan emphasized the urgency of this industry transition. The semiconductor market is shifting from traditional monolithic integration, where all functions were built into a single technology at one time, to an era defined by entirely new and innovative architectures. In this new landscape, one of the most pressing challenges lies in addressing field returns and zero-mile defects in advanced packaging. As a provider of failure analysis and metrology solutions, Tescan views its mission as bridging the gap between a question and an actionable insight, enabling customers to identify and resolve issues with greater speed and precision.Integrated Metrology Workflow: A Systematic Path to Root CauseThe core of Tescan's technical solution is a powerful, integrated inspection and metrology workflow designed to overcome the structural complexity of 3D ICs. As Hervé Macé, Global Business Development Director for Semiconductor, emphasized, the new process seamlessly connects distinct technologies to provide a complete analytical pathway from the micro to the nano scale, eliminating the gaps and delays associated with isolated tools.Mace elaborated that Tescan's historic focus on tools like the Focused Ion Beam (FIB) was insufficient on its own. "Tescan in the past was a company that focused on focused ion beam, so spot focus traditional techniques for cross-section and delayering, but as a kind of isolated technique. And that's it. That was not enough to provide a full response." This realization drove the decision to develop a fully integrated workflow that leverages the benefits of all Tescan technologies, considering analysis from the micro to the nano scale.Tescan's workflow provides a streamlined, end-to-end pathway for advanced semiconductor failure analysis. This approach empowers engineers to move from problem identification to actionable insights with unprecedented speed and accuracy, meeting the demands of increasingly complex chiplet and 3D IC architectures.The process of failure analysis (FA) on complex packaging, such as 3D ICs, demands an integrated, multi-stage approach, which Tescan structures across three progressive scales-micro, meso, and nano-to provide comprehensive insights. The workflow initiates with Non-Destructive Insight (Micro Scale), leveraging X-ray Computed Tomography (Micro-CT), a non-destructive technique crucial for preserving the sample's integrity during initial inspection. This technique generates a high-resolution 3D map of the entire package, thereby enabling engineers to pinpoint defects or specific regions of interest at the micrometer level.Once the exact defect location is identified, the workflow seamlessly transitions to the Rapid Access (Meso Scale) stage, which focuses on gaining physical access to the target. This is achieved using a standalone ultrashort pulse laser. This technology is a game-changer, dramatically accelerating the traditionally slow processes of cross-sectioning and delayering by a factor of 1,000 to 10,000 when compared to conventional mechanical or chemical methods. The laser performs clean, precise cuts across a wide array of materials, including the diverse structures found in modern semiconductor packages. Critically, its near-zero heat-affected zone minimizes thermal impact, ensuring the chemical and structural integrity of the sample remains preserved while significantly reducing the preparation time required for advanced analysis.The final stage of the integrated process is Precise Analysis (Nano Scale). The prepared sample is transferred to a Focused Ion Beam (FIB) system, often employing a Plasma FIB for necessary large-area milling. The FIB enables highly detailed, high-magnification characterization, revealing the material's structure at the nanometer and even atomic scale. This systematic, three-stage process ensures a seamless flow from non-destructive localization to rapid material preparation, and finally to high-fidelity data acquisition, providing the definitive, actionable insights required for root cause analysis in the highly demanding chiplet era.Strategic Imperative: Closer to the APAC Advanced Packaging HubTescan's decision to establish a direct presence in Taiwan and deepen its broader APAC strategy is a calculated move to align with the epicenter of the global semiconductor packaging market. The strategy is driven by the clear recognition that Taiwan is a renowned hub for semiconductor expertise and high-technology advancement in both wafer fabrication and packaging.The necessity is purely strategic: the company estimates that 70–80% of the world's semiconductor packaging market is concentrated in Asia, primarily across Taiwan and mainland China. As the advanced packaging segment continues to experience explosive growth, Tescan's direct presence is imperative to effectively serve this dense customer base and engage directly with the industry's top engineering talent.When asked by the DIGTIMES if geopolitical issues were the primary driver, Sean Lee was quick to offer clarity. "I think if we put away the geopolitical situation, you realize that Taiwan is definitely a place where it's been renowned for all the expertise and all the high-technology advancement in terms of wafer, in terms of packaging," Lee asserted. "Coming direct presence in Taiwan gave us the ability to get close to the customers... it is actually strategically designed to come in direct so that we can get closer to those users that we really like to get close to, and get faster feedback."Tescan views this move as a "no-brainer" for serving the industry's most critical region. Furthermore, Lee noted that this proximity will provide additional regional benefits. "When you have a lot of the big names from Taiwan exploring outside of Taiwan, it will also benefit places like Southeast Asia and mainland China." This comprehensive strategy extends beyond Taiwan, including enhanced support via subsidiaries in Singapore and Korea, increased presence in China, and the establishment of a new logistics hub in Asia. This entire network ensures seamless regional coverage and better support for Taiwanese companies expanding into Southeast Asia, strengthening Tescan's regional footprint.Reshaping Success: Standardization and Customer EnablementA final, critical component of Tescan's strategy is its strong focus on customer enablement. The company has moved beyond simply supplying high-performance equipment to ensuring customers achieve their desired outcomes. This approach emphasizes working closely with customers to maximize the value of their tools, focusing on application expertise and workflow efficiency rather than just specifications on paper.To combat the inefficiencies inherent in repeatedly tailoring failure analysis processes for individual customers, Tescan is prioritizing standardization, recognizing it as crucial for delivering consistent and reliable results in the chiplet era. This commitment is built upon a robust two-pillar framework. The first pillar is Standardization and Automation, where Tescan develops highly repeatable, standardized workflows. These workflows are codified into specific software recipes and automation systems, allowing processes to be easily replicated across different customer sites and various technology nodes, supporting scalability and consistency as semiconductor technologies rapidly evolve.The second, equally critical pillar focuses on Customer Training and Enablement. This involves implementing disciplined and structured training programs designed to significantly strengthen customer expertise and promote continuous improvement across the board. By providing comprehensive education on the best practices for using these integrated systems, Tescan enables customers to fully leverage the standardized workflows.Enhanced Service and Support: Delivering Tangible Local ValueThe direct APAC presence translates into immediate and tangible benefits for customers in Taiwan and the wider region. The most significant operational improvement lies in the robust support structure, which features a clearer and quicker escalation path for all technical issues. Tescan has ensured that customers no longer need to navigate complex external channels for assistance; instead, they are connected directly with the nearest partner or direct subsidiary in their locality.This localized approach guarantees end-to-end service coverage, encompassing everything from installation and crucial recipe setup to software updates, all managed by local teams. This streamlined, localized support is paramount in the fast-moving semiconductor industry, as it drastically reduces potential downtime and accelerates the time it takes to process data, providing a critical competitive advantage.Tescan stated that the customer should expect "closer collaboration, faster support, clearer guidance with really measurable improvements in daily workflows and not just on paper." By integrating non-destructive insight, precise preparation, and more innovative software, Tescan is making a clear commitment to reduce the time from technical query to business-critical decision, helping its customers accelerate their own art of discovery in the demanding chiplet era. For more information, please visit Tescan offcial website or subsribe LinkedIn account.Tescan Solaris X 2- xenon plasma FIB for advanced packaging. Tescan

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate designcycles and reduce risk for high-performance, high-yield ASICs. The platform integrates TSMC's latest 3DFabric technologies and advanced process nodes, enable next-generation designs with a comprehensive solution that spans from silicon-proven IP to 2.5D/3D packaging.The new platform builds on GUC's first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in both logic processes and 3DFabric technologies. TSMC's evolution from FinFET-based N5/N3 nodes to next-generation nanosheet nodes-N2 and A16-has enabled unprecedentedintegration density and performance scaling. Simultaneously, TSMC's 3DFabric innovations, including CoWoS, TSMC-SoIC , and System-on-Wafer (TSMCSoWTM), allow for advanced 2.5D/3D integration of multiple dies across larger package substrates.Industry standards have also evolved. The latest HBM4 memory interface doubles I/O to 2,048 pins, unlocking significantly higher bandwidth. Meanwhile, the UCIe die-to-die interface has gained industry-wide adoption, advancing from 16Gbps to 24Gbps and now 32Gbps-and beyond.GUC Milestones and Technology HighlightsUCIe Die-to-Die IP: GUC offers UCIe-A 32G/36G IP in TSMC N3 and N5 processes, with a 64G version under development and scheduled for tape-out in late 2025. The UCIe-A IP in TSMC 2nm technology is also planned for 2026.Integration with TSMC SoIC-X: GUC successfully taped out UCIe Face-Up IP in TSMC N5 using TSVs for bottom die applications-enabling vertical die stacking in future nodes.HBM4 IP: GUC taped out its HBM4 PHY IP on TSMC N3P, achieving 12Gbps speeds. The IP supports CoWoS-L/R and SoW platforms, with porting to TSMC N2P underway for a 2026 tape-out.GLink/UCIe-3D IP: Building on its GLink-3D 1.0 success, GUC now offers UCIe/GLink-3D 2.0 IP delivering 50 Tbps/mm? bandwidth, architecture proven via TSMC N2P. A customized version has already been taped out by a lead customer for an N3 over N5 ASIC.Deep Collaboration with TSMCGUC has long worked with TSMC closely to develop silicon-proven IP and platform technologies. This ongoing collaboration ensures alignment with TSMC's latest process and 3DFabric packaging advances, enabling customers to reduce design risk while accelerating time-to-market."TSMC has been working closely with our Open Innovation Platform (OIP) partners like GUC to develop IP solutions for our advanced process and 3DFabric technologies," said Aveek Sarkar, Director of Ecosystem and Alliance Management Division at TSMC. "Our latest collaboration with GUC in enabling its 2.5D/3D platform will help customers accelerate product development cycles and deliver next-generation silicon using our advanced packaging and process technologies.""We were industry-leading with HBM3 PHY and Controller, and again with HBM4 in 2025," said Aditya Raina, CMO of GUC. "Our UCIe IP has demonstrated unmatched 32Gbps speed and is now moving to 64Gbps era. Our Custom GLink-3D 2.0 IP has achieved 40 Tbps/mm² through a lead customer. These achievements mark the dawn of true 3D ASICs."GUC's next-generation APT platform combines cutting-edge IP, TSMC-certified design flows, and high-volume production experience to enable rapid, low-risk development of next-generation AI, HPC, and networking chips.To learn more about GUC's solutions, please contact GUC sales representative via email.

Wise Integration, a pioneer in digital control for gallium nitride�]GaN�^and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer. Kaiser succeeds CEO and co-founder, Thierry Bouchet, who will continue to serve as Chief Technology Officer and General Manager, leading the worldwide R&D and driving the technological vision.A seasoned high-tech leader with a proven track record in growing and leading global teams in the semiconductor industry, Kaiser brings deep experience in scaling deep-tech ventures. In 2006, he cofounded Docea Power, a French EDA startup pioneering full-chip, system-level power and thermal modelling, with the vision of addressing the growing power-consumption and thermal challenges in IC and platform design.As CEO, he led the company to domain leadership and its acquisition by Intel in 2015. He then joined Intel, where for the next decade he held senior director roles, most recently overseeing system-simulation engineering and worldwide customer-enablement organization. Those programs tackled the most critical power, thermal, and performance challenges in designing consumer, data-center, and AI systems. Kaiser began his career at STMicroelectronics, where he held technical and leadership positions across test and product engineering, design, and architecture teams.Targeting Fast-Growing MarketsWith Kaiser’s appointment, Wise Integration is positioning itself to scale globally and capitalize on booming markets such as data centers powering artificial intelligence (AI), and electric vehicles (EV)-which demand more efficient, compact, and digitally controlled power architectures."I'm thrilled to join Wise Integration and build on its success in providing customers differentiated solutions in power electronics to meet their biggest challenges," Kaiser said. "This talented team has created an R&D-driven culture and a robust foundation to lead the GaN power electronics transformation globally."The Next Chapter"On behalf of the board of directors, I am pleased to welcome Ghislain Kaiser as Wise Integration's new CEO, and to compliment the team for their exceptional work," said Board Chairman Patrick Boulaud. "This marks a major milestone for the company as it transitions from a CEA�HLeti spinout into a pioneering force in GaN and digital power management innovation with strong growth potential. Ghislain's background makes him a natural choice as the CEO to guide the company through this next stage of growth.""Ghislain's arrival begins a new chapter for Wise Integration," Bouchet added. "With our WiseGan devices and WiseWare digital control, we've built a strong foundation in consumer markets. Now it's time to scale our innovations and tackle the next big challenges-bringing unmatched efficiency and power density to AI servers, data centers, and tomorrow's automotive systems."Selected Highlights (2020–2025)Spun out from CEA-Leti in 2020 using the institute's GaN-on-silicon R&D platform. Developed proprietary WiseGan IC and WiseWare microcontroller. Launched its fully digital controller, WiseWare 1.1. Opened a design center in Canada and established an Asian subsidiary in Hong Kong.Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth.WISE

The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While digital transformation greatly improves efficiency, it also exponentially expands the overall attack surface. In this model, risks are no longer isolated but systemic and cascading. Supply chain efficiency is built on an implicit digital trust model between partners, which is manifested through application programming interfaces (APIs), shared portals, and integrated software. However, this trust structure, built in pursuit of efficiency, has become a primary attack vector. Cybercriminals are no longer just breaking through firewalls—they are exploiting the fundamental fabric of digital collaboration. As a result, the traditional perimeter defense model is outdated; The new perimeter of defense is the entire supply chain ecosystem, and its security must be built on a zero-trust model enforced with cryptography.Third-party or fourth-party vulnerabilitiesAttackers often use the weakest link in the chain—often smaller, poorly secured vendors—as a springboard to infiltrate the network of their ultimate high-value target. This highlights a stark reality: an organization's security posture is only as strong as its least secure partners. This risk stems from the pursuit of supply chain efficiency, as the smooth operation of business processes requires granting partners a considerable degree of access. This expansion of access rights, without corresponding strict security controls, constitutes a systemic vulnerability based on excessive trust.The fundamental role of traditional cryptography and its limitationsCurrent supply chain security relies heavily on traditional public key cryptography (such as RSA, ECC) to protect data in transit and at rest. Mitigation strategies such as data encryption (using AES), risk assessment, and incident response plans are crucial, but their effectiveness is built on the strength of these underlying cryptographic algorithms. While these methods are still effective against today's threats, the entire security foundation is fragile and faces an existential threat that will be the focus of the next section.Quantum Horizons: A Paradigm Shift in Cryptographic ThreatsQuantum computers use quantum mechanical principles such as superposition and entanglement to solve mathematical problems (e.g., integer factorization, discrete logarithms) that form the security basis of today's public key cryptography (RSA, ECC, Diffie-Hellman). This is not a purely theoretical deduction, but a major engineering challenge that is making rapid progress. Once a quantum computer with sufficient scale and stability comes out, the current encryption system that protects global digital communications will fail in an instant."Get First, Decrypt Later" (HNDL): An imminent dangerThe Harvest Now, Decrypt Later (HNDL) attack transforms the quantum threat from a futuristic problem to a present reality. The mechanism is that attackers, especially state-state actors, are actively intercepting and storing large amounts of today's encrypted data. These attacks target information with long-term value, such as intellectual property, government secrets, financial records, medical data, and personally identifiable information (PII).This means that by the time a "Cryptographically Relevant Quantum Computer" (CRQC) appears that can crack current encryption algorithms (known as "Q-Day", which is expected to arrive as early as 2035), these obtained data will be retroactively deciphered. Therefore, the security of any sensitive data transmitted today that requires long-term confidentiality is already at risk.This attack pattern transforms a company's data retention policy into a huge potential security liability. Regulations such as the Health Insurance Portability and Accountability Act (HIPAA) or the General Data Protection Regulation (GDPR) often require organizations to retain data for an extended period. The HNDL attack vector turns this legal compliance requirement into a potential ticking time bomb. Organizations are legally required to encrypt data stored for years, making it an ideal target for HNDL attacks. This creates a direct conflict between compliance and security: the act of adhering to data retention regulations inadvertently creates vulnerabilities for future quantum decryption threats. Therefore, risk management and legal teams must be immediately involved in the migration strategy of post-quantum cryptography. This is no longer just an IT issue, but a simmering corporate governance and compliance crisis.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Post-Quantum Cryptography (PQC): Laying the foundation for quantum resilienceDefinition of post-quantum cryptographyPost-quantum cryptography (PQC) refers to traditional algorithms that are designed to run on today's classical computers but are resistant to attacks from both classical and quantum computers. This distinguishes PQC from quantum cryptography, which requires specialized hardware, such as quantum key distribution, or QKD. PQC's goal is to develop a new generation of public-key cryptographic systems based on mathematical problems that are equally difficult for quantum computers.NIST PQC Standardized Process: A globally recognized markThe National Institute of Standards and Technology (NIST) has led a multi-year, transparent, and collaborative global process to select and standardize the next generation of public key algorithms. This process is crucial in building trust in the new standard. The process began in 2016 with a public call for proposals, receiving 82 proposals from 25 countries and undergoing multiple rounds of rigorous public review and analysis in the global cryptography community.The finalization of NIST standards is the starting gun that triggers a massive technology update cycle across the tech industry. This was not only an academic milestone but also a turning point in business and logistics. It directly prompted government agencies such as CISA and the National Security Agency (NSA) to issue migration directives, which in turn pushed major software vendors and hardware manufacturers such as Microsoft and Google to integrate these specific algorithms into their products. This ripple effect ultimately extends to enterprises, who must plan their migrations to maintain compatibility and security. NIST standards are the core domino that initiates PQC adoption worldwide.Secure the edge: Protect IoT and operational technology equipment in the supply chainInternet of Things (IoT) and operational technology (OT) devices face the biggest challenges in PQC migration for the following reasons:*Long life cycle: The device may be used in the field for 10-20 years without replacement.*Limited resources: Limited processing power, memory, and energy budgets.*Lack of Updability: Many devices are not designed to be conducive to easy firmware or cryptography updates.The application of PQC in these areas will be gradual and there will be significant differences between the old and new systems. For "greenfield" systems, such as new IoT product lines, PQC can be integrated from the outset. For "brownfield" systems, such as existing factory OT equipment, the challenge is enormous, often requiring the entire hardware to be replaced. This means that the PQC migration of the supply chain will be a two-speed process. Businesses must prioritize the adoption of PQC in new systems while developing long-term, potentially costly, retirement or retrofit capital plans for existing assets that are not quantum-safe.Use cases for PQC include:*Industrial automation: Protecting communication between sensors, controllers, and management systems in factories and processing plants.*Smart Infrastructure and Logistics: Protecting smart grid equipment, traffic control systems, and connected logistics sensors.*Automotive V2X Communication: Secure vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications to ensure security and prevent malicious manipulation.*Healthcare Supply Chain: Ensuring the integrity and privacy of data from connected medical devices.Conclusion and recommendationsWinbond's W77Q Secure Flash Memory is a robust solution to address the PQC threats mentioned above. Key PQC-Safe features of the W77Q Secure Flash include:*Platform Resilience: In accordance with NIST 800-193 recommendations, the system automatically detects unauthorized program changes and can automatically restore to a secure state to avoid potential cyberattacks. *Security Software Update and Fallback Protection: Supports remote security software updates while preventing fallback attacks, ensuring that only legitimate updates can be executed. To maintain the highest level of security and integrity, the W77Q adopts the quantum-secure Leighton-Micali signature (LMS) algorithm recommended by NIST Special Publication 800-208 to ensure the authenticity and integrity of updated software, providing additional security*Secure Supply Chain: Secure Flash ensures the origin and integrity of flash content at every stage of the supply chain. The W77Q implements LMS-OTS-based remote authentication (NIST 800-208). This advanced method effectively prevents content tampering and misconfiguration during assembly, transportation, and configuration, protecting the platform from cyberattacks.Winbond's secure flash solutions help system manufacturers meet industry regulatory compliance requirements, improve platform security, and improve supply chain information and communication security during production, shipping, and construction and operation.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.Credit: Smiths InterconnectThis strategic contract supports the customer's upcoming global launch of their next-generation AI semiconductor chips, designed for data center GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.Smiths Interconnect's DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect's test socket technology.The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer's previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect's position as a trusted technology partner in the semiconductor industry.Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown-and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel. GMIF2025, themed "AI Applications, Innovation Empowered", will bring together leading enterprises, technology experts, and industry leaders across the global memory industry chain to explore the evolution of storage technologies and emerging opportunities in the AI era.The Fourth GMIF2025 Innovation Summit is scheduled to be held on September 25, 2025. Credit:GMIFThe summit will feature executives and experts from School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Maxio Technology, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage Technology, iFlytek, OKN Technology, GreaTech Substrates, and more than 19 other top global companies and universities. The keynotes will cover topics ranging from storage and memory technology roadmaps and market strategies to AI application practices and ecosystem collaboration, empowering innovation across AI scenarios from cloud to edge.GMIF2025 Innovation Summit Keynote Agenda - Part 1. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 2. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 3. Credit:GMIFIn the exhibition zone, over 27 exhibitors will present more than 200 innovations, spanning the entire storage ecosystem-including leading IDMs, controller vendors, solution providers, packaging and testing companies, platform providers, and AI terminal enterprises. Attendees will experience immersive interactions, gain first-hand insights into the latest industry trends, and witness the evolving global storage ecosystem landscape.Register now by clicking the link to secure your GMIF2025 pass and join global storage industry leaders in shaping the future of AI-driven innovation!For more information about GMIF, please visit.