The subscription economy has become the pulse of the online entertainment business. Netflix was the first to popularize the international binge-watching model, and Spotify followed suit by making monthly music access the standard. Although Twitch functions differently and is based on live streaming, it has created a system in which recurring payments through subscriptions and donations have become one of the key factors in the platform's success.This dependence on subscriptions has enabled these companies to become highly advanced financial operators. They must cope with periodic billing schedules in numerous currencies, fluctuating exchange rates, and international financial regulations. They are, in a sense, mini banks, moving billions of dollars a month through their systems. On the consumer side, the ease of having one button to subscribe or unsubscribe hides the complex financial plumbing that goes behind the scenes.Payments as Core Platform FeaturesPayment innovation has become integral to the entertainment experience, extending beyond subscriptions. Twitch introduced direct consumer-to-creator payments through bits, tips, and memberships. Spotify added paid fan subscriptions, and Netflix has experimented with ad-supported tiers, altering its revenue model.These payment systems are no longer peripheral—they are central. When users regularly send small payments to creators or platforms, the service functions similarly to financial platforms that facilitate microtransactions. Unlike traditional banks, however, these processes are gamified and embedded within entertainment, leading analysts to increasingly view them as hybrid entertainment-finance ventures.Lessons Learned in Finances in Other Digital ArenasStreaming companies share similar financial goals with those in the digital world. Online gaming, for example, has long shown that the boundary between play and payment is blurred. The emergence of the new MGA casino environment demonstrates how entertainment companies can serve as financial agents, handling deposits, withdrawals, and regulatory oversight, all while maintaining a focus on the user experience. Equally, Netflix, Spotify, and Twitch are getting to grips with the need to combine smooth entertainment with high-end financial architecture.The moral of the story is that people no longer distinguish between entertainment and payments. They want the process of spending money to feel normal and as frictionless as possible when they are funding a favorite streamer, purchasing access to an exclusive playlist, or upgrading to an ad-free tier. This anticipation is driving platforms to expand their financial capacities, positioning them more like banks that deal with consumers.Creator-Centric EconomiesStreaming platforms also resemble financial institutions in their relationships with creators. Twitch supports millions of streamers earning income through the platform. Spotify, despite ongoing debates about royalty structures, pays billions annually to artists. Netflix has taken a more direct role by financing original productions rather than solely licensing content.In these cases, platforms collect payments from consumers and distribute earnings to creators—mirroring how financial institutions manage deposits and withdrawals. These large-scale financial flows require robust payment networks, compliance systems, and fraud prevention tools. As creators demand faster payouts and greater transparency, platforms are under pressure to match the efficiency of fintech startupsThe Future of Financial InnovationLooking ahead, the financial dimension of entertainment platforms is poised to expand. Spotify may explore blockchain-based royalty tracking, Netflix could introduce micro-subscriptions for individual shows, and Twitch might adopt stablecoins for cross-border tipping. These developments would further solidify their dual roles as entertainment providers and financial facilitators.Moreover, these platforms possess a significant advantage: data. Their deep understanding of user spending habits positions them to create personalized financial products. Netflix could offer loyalty credits, Spotify might launch fan investment plans, and Twitch could develop financial planning tools for creators. The boundaries between streaming, gaming, and fintech will continue to blurThe Bankers of Digital CultureNetflix, Spotify, and Twitch are not traditional banks with vaults or branches, but they increasingly perform similar functions. They process billions in payments, manage complex financial relationships with creators, and continually innovate how money flows through their ecosystems. While users are drawn by content, they stay for the seamless integration of finance and entertainment.In the future, online entertainment will encompass not only what we watch, listen to, or play—but also how platforms manage and monetize financial interactions. The roles of banker and entertainer are converging in the digital age.

SK hynix Inc. announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound material for the first time in the industry.The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.The structure of package on package, or PoP, that most flagship smartphones adopt and stacks DRAM onto the application processor, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.With thermal conductivity improved by 3.5 times and thermal resistance in the vertical course of the heat improved by 47%, the new technology is expected to contribute to a longer battery runtime and product lifespan by improving performance of a smartphone and reducing power consumption."It's a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had," Lee Gyujei, Head of Package Product Development, said. "We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials."Credit: SK HynixSK hynix develops the industry's first mobile DRAM with High-K EMC, enabling advanced thermal management for next-gen on-device AI. SK Hynix

Energy efficiency is often described as the "first fuel" of the global energy transition, as it offers some of the fastest and most cost-effective ways to reduce CO2 emissions. It not only helps lower energy bills but also strengthens energy security by reducing dependence on fossil fuels. However, the energy transition, particularly in industries, remains a complex challenge with a myriad of barriers slowing the adoption of energy-efficient technologies.One often-overlooked opportunity can be found in electric motors, which account for over 45% of global electricity consumption and power a vast range of industrial applications. Improving the efficiency of these motors present significant energy savings with the potential to reduce global electricity consumption by up to 10%.In this interview, Mike Umiker, Managing Director of the Energy Efficiency Movement (EEM), shares insights on global efforts to accelerate energy efficiency progress and the opportunities it presents for Taiwan. The EEM, founded by ABB in 2021, serves as a collaborative platform that unites like-minded stakeholders committed to driving innovation and action toward a more energy-efficient future. Today, the Movement has grown to include over 600 organizations and companies worldwide.Barriers to energy efficiency adoptionWhile the benefits of energy efficiency are widely acknowledged, its adoption is not universally straightforward. The logic behind adopting energy-efficient practices may not resonate across all sectors and regions. Different drivers influence adoption in different ways, and what works in one context may not be effective in another.Despite the availability of numerous energy efficiency solutions and technologies, their widespread and rapid implementation continues to face significant obstacles. In the interview, Umiker highlights findings from the Energy Efficiency Movement's recent survey in a report titled "Efficiency NOW". He explains that many companies, although aware of the advantages, encounter internal barriers that hinder progress. These include financial constraints, infrastructure limitations, a lack of skilled personnel, strategic gaps and challenges related to data and control systems.The survey highlights 5 main barriers to adopting energy efficiency measures. The first is financing with 43% of respondents citing it as the highest barrier and stating uncertain returns on investment as a key challenge. Second is infrastructure, with 19% of companies being affected. Interestingly, about 1 in 2 companies struggle with shortage of skilled workers, hindering energy efficiency ideation and implementation.Responding to these key obstacles, Umiker suggests three targeted action to accelerate energy efficiency adoption:1.Establishing dedicated budgets or exploring alternative financing models such as equipment-as-a-service to enable access to energy-saving technologies and services without the burden of large upfront capital investments.2.Investing in data infrastructure and real-time analytics to empower organizations with continuous performance monitoring and deeper insights into energy consumption patterns, helping to identify areas for improvement.3.Driving strategic alignment through clear KPIs and ROI modeling, ensuring that energy efficiency initiatives are integrated into broader business objectives and performance metrics.Scaling Up Industrial ImplementationWith around 300 million industrial motor-driven systems in operation worldwide, global energy consumption could be reduced by up to 10% if these systems were replaced with high-efficiency equipment. This is where ABB plays a pivotal role, Umiker noted.As of July 1, 2023, electric motors with power ratings between 75 kW to 200 kW sold within the EU are required to meet the IE4 energy efficiency standard, an upgrade from the previously mandated IE3 level. In response to this, ABB introduced next-generation electric motor systems, including the newly developed IE6 SynRM motors, as part of its Top Industrial Efficiency (TIE) initiative. These systems exceed standard performance benchmarks, helping customers reduce electricity usage, operating costs, and total cost of ownership (TCO), all without compromising performance or adding complexity. Notably, one of ABB's TIE motors, destined for a steel plant in India, achieved a record-breaking efficiency rating of 99.13% during testing, surpassing ABB's previous world record of 99.05% set in 2017.In Taiwan, the Minimum Energy Performance Standards (MEPS) for low-voltage, three-phase, squirrel-cage induction motors with a rated output power of 75kW or greater will require IE4 efficiency levels, starting July 1, 2025, while motors below 75kW will need to meet the IE3 standard. The regulatory shift has prompted proactive investments from the private sectors including several semiconductor manufacturing companies which are now investing in large scale energy efficiency initiatives. New purchase orders have been placed for a total of 122 high-efficiency drives, intended for pump and fan applications. These ABB Variable Speed Drive (VSD) Inverters are designed to save energy, reduce operating costs and minimize unscheduled downtime.According to Vincent Wu, Head of ABB Taiwan's Motion business, these developments are helping to sustain strong momentum for energy efficiency adoption across the country. Taiwan's progress is already notable, with an average annual energy efficiency improvement of 5.4% over the past five years, surpassing the 4% target set at the 28th U.N. Climate Change Conference (COP28).Joining the Energy Efficiency Movement is Simple and SeamlessJoining the Energy Efficiency Movement (EEM) presents a powerful opportunity to advance energy efficiency through shared knowledge, collaboration, and customized training. Movers gain access to practical insights and valuable resources that support the swift and seamless implementation of energy-efficient solutions. By becoming part of a global network of like-minded organizations, companies or organizations can exchange best practices, form strategic partnerships, and accelerate meaningful change.Visit the EEM website today to learn more and take your first step toward a more energy-efficient future. https://www.energyefficiencymovement.com/Mike Umiker, Executive Director of EEM, with Yu-Ren Liu, Sales Manager of GEORDING MACHINERY. ABBMike Umiker, Executive Director of EEM, with Victor Wu, Vice President of SUCOM ELECTRIC. ABBMike Umiker, CEO of EEM, with Vincent Wu, Vice President of ABB Taiwan Motion Business. ABB

Every town has its fixtures. The postman with the half-wink, the dog that sits outside the news agent as if guarding the broadsheets, the elderly gent in the cap who always arrives at the bus stop exactly twelve minutes before the bus is due. In the world of cryptocurrency, Bitcoin has taken that role of the fellow in the shiny jacket who insists on telling you his plans before you've even put your bag down. Litecoin, by contrast, is the shopkeeper you've known for years. The one who doesn't rush to greet you but knows precisely which brand of biscuits you’re after and has them wrapped before you've said a word.And yet, for all its quiet ways, Litecoin has had quite a year. The Litecoin price at this moment stands at $127.69 — a rise of 100.98 percent in twelve months. The market cap is brushing $9.73 billion, with a day's trading volume tipping $1.04 billion. These aren't the shaky figures of a hopeful start-up. This is the sort of balance sheet that would have certain overconfident coins blushing if they could manage the self-awareness.An Old Hand Still Moving BrisklyWhat's notable is that despite its age, Litecoin hasn't become entirely passive. The rise to its current value isn't random—it reflects consistent efficiency, including faster transaction speeds, modest fees, and a reliability that allows users to send it with confidence, rather than anxiously refreshing the screen like they're watching an eBay bid count down.The cryptocurrency market is, by its nature, drawn to novelty. New coins appear with fancy logos and slogans, offering grand visions for the future. Some barely last longer than a summer romance, gone before you’ve even learned to pronounce their names. Litecoin, though, belongs to the group that turns up, does the work, and keeps turning up.It's reminiscent of those actors who never get their name above the title but appear in every film worth seeing. Judi Dench won an Oscar for just eight minutes of screen time, and Litecoin could be seen as playing a similar role for over a decade—not the biggest name on the poster, but often the one holding the scene together.The Gap Between Now and ThenHere's the part that turns the heads of the more thoughtful investors: Litecoin's all-time high was $410.26. That's not yesterday's news; it's a reminder that the coin has been valued far higher and could, given the right conditions, make a return journey. The current price, less than a third of that, offers a sort of measured intrigue. There's room for movement without the pressure-cooker atmosphere that accompanies a coin at peak value.And then there's scarcity. A circulating supply of 76.18 million coins might not sound scarce compared to fine art or vintage wine, but in crypto terms it's a reassuring limit. It means each unit matters, and that matters when so many coins dilute themselves into irrelevance by flooding the market.Why the Overlooked Often Last the LongestThe market often treats coins like Litecoin — or Dash, or Monero — as supporting acts. They're talked about in passing, overshadowed by the ones in the news. But in a sector where hype can burn through a project faster than any security flaw, being under the radar is a kind of shield. Litecoin doesn't have to keep proving its worth with stunts. Its worth is in having survived, adapted, and kept its integrity intact.This is why its one-year chart doesn't look like a heart monitor during a penalty shootout. Even in the months where the price dipped, it did so in a way that suggested recovery was a matter of "when"rather than "if".The Everyday AppealFor newcomers, Litecoin's appeal is often practical. It's more affordable than many household-name coins, and there's a certain satisfaction in owning an entire coin rather than a fractional amount like 0.0043. It's akin to having a whole cake rather than just a sliver on a plate—even if, in practice, it's not consumed all at once.It's also nimble in use. Transactions are fast, fees are modest, and it functions without requiring deep technical expertise. That level of usability is essential if cryptocurrency is to become something accessible to everyday users, rather than feeling like enrollment in a correspondence course.Looking Forward Without the HysteriaWhere Litecoin goes from here will depend on the usual collection of influences: the mood of the market, the pace of blockchain development, the tug-of-war between regulation and freedom, and whether more people start using it in everyday life. It's not a mystery, and the coin's history suggests it won't be left behind.If you put the figures together — billions in market cap, billions in daily volume, and a price comfortably below past highs — it's the sort of picture that would make the cautious optimist nod. Not so low as to be risky in the wrong way, not so high as to be top-heavy. Just the middle ground where sensible progress tends to happen. Of course, as with any investment, it's important to do thorough research and make decisions based on individual risk tolerance and long-term goals.Understanding the Role of Coins Like Litecoin in the Crypto Ecosystem. Pexel

Reuters Events is proud to present Momentum AI Asia 2025, a premier conference that brings together Asia's most influential AI leaders to tackle the region's most pressing challenges in AI adoption.Taking place on September 17, 2025, at the Amara Singapore, Momentum AI Asia 2025 will feature an impressive lineup of 30+ executive speakers, including Tom Lue, Vice President of Frontier AI Global Affairs at Google DeepMind, Mihaela Isac, Chief Information Officer at DHL Supply Chain Asia Pacific, Lee Wan Sie, Cluster Director, AI Governance & Safety at Infocomm Media Development Authority (IMDA), and Guy Sheppard, Head of AI Strategy & Adoption at Standard Chartered Bank.The event is designed to provide a platform for AI stakeholders to discuss the latest developments, trends, and strategies in AI, with a focus on maximizing impact and ROI. Attendees will have the opportunity to engage in interactive sessions, roundtable discussions, and networking opportunities with over 300 senior attendees, 82% of whom hold director-level positions and above.The conference agenda will explore key themes, including Regional Collaboration, AI Value and Scalability, AI for Competitive Advantage, and AI Readiness and Robustness. With a focus on delivering actionable insights and tangible takeaways, Momentum AI Asia 2025 is the perfect platform for business leaders to future-proof their AI strategies and unlock collaboration opportunities with the region's AI ecosystem."We're excited to bring together the region's AI thought leaders to share insights, best practices, and innovative approaches to AI adoption," said Paul Jacinto, Senior Project Director, Momentum AI Asia "Our goal is to provide a platform for meaningful connections, knowledge sharing, and collaboration, ultimately empowering businesses to harness the full potential of AI."Visit the website to learn more.

ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence Revolution." This refers to the driving forces for new chip technologies like AI, smart mobility, and hyperconnectivity. As a leading provider of advanced packaging and semiconductor assembly solutions, ASMPT enables its customers to develop cutting-edge AI technologies, supporting both high-performance AI chips that integrate advanced memory technologies like HBM and efficient components for edge devices. ASMPT will showcase three machines at SEMICON Taiwan: the new ALSI LASER Platform, the fine-pitch wire bonding solution AERO PRO, and the SIPLACE CA2 uniting semiconductor and SMT processes.ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025.ASMPTThe next-generation LASER platform has been specifically developed to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving wafer materials. This new system with ASMPT's patented multi-beam technology expands the company's portfolio with a focus on front-end operations."The new platform combines high-precision laser processing with smart automation to support the next generation of semiconductor manufacturing", says Patrick Huberts, Head of Business and Marketing at ASMPT ALSI. "It's the ideal platform for applications in advanced packaging, AI, and power automotive. We invite you to join us for the official launch and discover the new machine live at our booth during SEMICON Taiwan."High-performance wire bondingASMPT also introduces its latest high-performance wire bonder at SEMICON: the AERO PRO. Developed for high-density semiconductor designs, this machine delivers the highest bonding accuracy and exceptional speed for wires with diameters of 0.5 mil (≈12.7 µm). Thanks to integrated real-time monitoring and preventive maintenance functions, the system is ideally suited for use in intelligent, networked production environments. To accommodate complex designs such as system-in-package (SiP) and multi-chip modules (MCMs), as well as applications like ball grid arrays (BGAs), land grid arrays (LGAs), memory modules, or quad flat packages (QFPs) with external leads. For uniform 22-µm bond balls, it employs the patented X-POWER 2.0 transducer—a lightweight and vibration-optimized ultrasonic transducer that supports mixed-wire and vertical bonding in bond via array (BVA) technology. Optimized for complex interconnects in memory, microcontroller units (MCUs), and more, ideal for advanced applications such as AI edge devices and automotive systems.Bridging Semiconductor and SMTThe hybrid SIPLACE CA2 placement solution from ASMPT SMT Solutions redefines advanced packaging by uniting semiconductor and SMT processes in a single, high-speed platform. Traditionally, die bonding and SMT placement were separate steps — now, they are seamlessly integrated. Designed for advanced packaging applications in smartphones, 5G, AI, high-performance computing (HPC), and IoT devices, the SIPLACE CA2 processes both SMDs from tape and dies taken directly from sawn wafers. This eliminates the need for expensive die taping, saving up to 800 km of tape annually in 24/7 production, reducing both cost and material waste. With up to 76,000 components per hour (cph) for SMT, 54,000 cph for Die Attach, and accuracy of up to 10nm @ 3σ accuracy, the SIPLACE CA2 delivers high-speed and accuracy — even for advanced Die Attach and Flip Chip applications. A breakthrough buffer system decouples die pickup from placement, solving previous speed limitations. Up to 50 wafers can be managed with just 13 seconds of swap time – unmatched in the industry.The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly. ASMPT

As cybersecurity threats continue to evolve, attackers are no longer just targeting applications or operating systems, but are now penetrating deeper into the boot firmware layer of devices, including BIOS, UEFI, and BMC. These firmware components are responsible for initializing and verifying the system integrity during the boot process. Once compromised or embedded with malicious code, they can compromise the entire system.Real-world incidents and attack simulations have shown that firmware attacks are highly stealthy and persistent, often eluding traditional antivirus software and OS-level defenses. The National Institute of Standards and Technology (NIST) addressed this as early as 2018 in the release of NIST SP 800-193: Platform Firmware Resiliency Guidelines, proposing a three-step framework: Detect–Protect–Recover, as the core architecture for platform firmware security.Among these, the"Recover" mechanism has drawn significant attention. It not only mandates that a system halt upon detection of firmware anomalies, but also be capable of restoring original firmware from a secure image (such as a Golden Image)—automatically, without human intervention—thus ensuring the platform can return to a trusted state and cutting off any potential long-term malware residency.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Challenges in PFR Adoption: Legacy Architectures and Weak Firmware VerificationAlthough NIST SP 800-193 is widely recognized as a reference for governments and enterprises implementing firmware security, the practical deployment of PFR (Platform Firmware Resiliency) still faces numerous hurdles.First, many embedded systems or server platforms rely on conventional SPI NOR Flash as firmware storage, which lacks support for key-based verification, partition control, and redundancy mechanisms, making it difficult to meet the "Protect" and "Recover" requirements defined by NIST. Even when the platform includes a Root of Trust (e.g., TPM, CPLD, BMC), vulnerabilities remain if the external memory used does not support secure image switching or key-binding mechanisms.Common challenges include:Firstly, firmware regions vulnerable to rollback attacks, where outdated, exploitable images are reintroduced. Secondly, the inability to separate access rights between boot-time and run-time, leading to broken access control. Thirdly, the lack of integrated verification tools and APIs requires extensive engineering effort to build verification workflows.Unnder these conditions, the search for a secure storage component that supports the PFR framework has become a critical entry point for enhancing firmware security.Winbond TrustME Secure Flash — W77Q: A Secure Memory Fully Supporting PFRTo address the above challenges, Winbond's TrustME Secure Flash — W77Q series offers a solution specifically designed for platform firmware security and recovery. It allows for fast deployment of the NIST PFR-required protection and automatic recovery features without altering the main platform architecture.Dual Images with Secure Verification—Seamless Auto-Recovery DeploymentThe W77Q integrates both a Primary Image and a Recovery Image, supporting secure verification mechanisms and auto-switching logic. When the primary firmware image is corrupted or fails verification, the Root of Trust controller (e.g., BMC or CPLD) can trigger a switch to restore the system to the Golden Image. This entire process requires no additional software or CPU intervention, fulfilling the "unattended, automatic recovery" requirements of PFR.Moreover, the mechanism complies with the Detect-Protect-Recover architecture outlined in NIST SP 800-193, and can be integrated with major platform vendors' boot verification logic, establishing a full Chain of Trust from chip initialization to firmware validation.Multi-Level Access Control and Key Binding to Strengthen Firmware IntegrityW77Q supports partitioning and key-based access control, allowing different keys and permissions to be configured for each firmware region (e.g., Bootloader, UEFI, BMC). This prevents unauthorized access and tampering. It also supports rollback prevention and restricts firmware updates to authorized controllers only, significantly reinforcing platform firmware integrity verification.Modular Integration and Development Support—Accelerating PFR ImplementationThe W77Q Secure Flash not only strengthens hardware-based firmware protection but also provides complete software development and validation support to help device manufacturers accelerate PFR deployment:Offers ready-to-integrate verification API interfaces and reference designsProvides boot verification parameters and switching logic in coordination with Root of Trust controllers (e.g., BMC, CPLD)Delivers test reports and certification documents compliant with NIST SP 800-193 and ISO 26262The Winbond W77Q Secure Flash is pin-to-pin compatible with existing SPI Flash devices, requiring no hardware changes, greatly reducing implementation costs.For applications like server motherboards, 5G base stations, industrial control systems, or automotive ECUs, W77Q presents an ideal solution for quickly realizing platform firmware recovery mechanisms and meeting security compliance requirements.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

SK hynix Inc. announced today that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world’s first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year following completion of global customer validation.1NAND flash is categorized as single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), QLC, and penta-level cell (PLC) depending on how many data bits can be stored in one cell. As the amount of information storage increases, more data can be stored in the same volume.To maximize the cost competitiveness of its new product, SK hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the company increased the number of planes, independent operation units within a chip, from 4 to 6. This enables greater parallel processing and significantly enhances simultaneous read performance.2A plane refers to a cell and its peripheral circuitry that can operate independently within a single chip. By increasing the number of planes from 4 to 6, the simultaneous read performance of the chip—a key factor in data processing—is significantly improved.As a result, the 321-layer QLC NAND delivers both higher capacity and improved performance compared to previous QLC products. Data transfer speed has doubled, write performance has improved by up to 56%, and read performance has improved by 18%. In addition, write power efficiency has increased by more than 23%, strengthening competitiveness in AI data centers where low power consumption is critical.The company plans to apply its 321-layer NAND first to PC SSDs, before expanding to enterprise SSDs (eSSD) for data centers and UFS for smartphones. Leveraging its proprietary 32DP3 technology, which enables the simultaneous stacking of 32 NAND dies in a single package, SK hynix aims to enter the ultra-high-capacity eSSD market for AI servers by achieving twice the integration density.332DP (32 Die Package): A method of simultaneously packaging 32 dies in one package to increase chip capacity.“With the start of mass production, we have significantly strengthened our high-capacity product portfolio and secured cost competitiveness,” said Jeong Woopyo, Head of NAND Development at SK hynix. “We will make a major leap forward as a full-stack AI memory provider, in line with the explosive growth in AI demand and high-performance requirements in the data center market.”SK hynix begins mass production of the world’s first 321-layer QLC NAND flash chip with 2Tb capacity. SK hynix

DEKRA's Automotive EMC Laboratory in Taiwan has been officially approved by Stellantis, making it the third DEKRA site worldwide alongside Italy and Korea. This milestone underscores DEKRA's pivotal role in the global automotive EMC testing landscape.Stellantis, one of the world's largest automotive groups, operates a rigorous laboratory approval program to ensure partners meet the highest technical standards. With this approval, DEKRA Taiwan is now authorized to provide EMC testing for 16 Stellantis brands, including Chrysler, Citroen, Fiat, Opel, and Peugeot. The recognition allows DEKRA to deliver reliable EMC testing support to the global supply chain, helping OEMs and suppliers accelerate product validation, reduce time-to-market, and benefit from localized expertise in the Asia-Pacific region.The Stellantis approval adds to DEKRA's extensive portfolio of OEM recognitions worldwide. In Taiwan, DEKRA's Automotive EMC Laboratory is also approved to provide testing services for GM, Volkswagen, and Jaguar & Land Rover. Meanwhile, DEKRA Korea's EMC Laboratory is recognized by Ford, GM, and Stellantis. Together, these approvals highlight DEKRA's breadth and depth in serving global automotive manufacturers, and reinforce the group's ability to combine its worldwide laboratory network with regional expertise to provide comprehensive local support."We are honored to receive Stellantis' recognition. This approval is a strong endorsement of our team's expertise and commitment, and it empowers DEKRA Taiwan to better support customers in automotive electronics, intelligent mobility, and electric vehicles. Our focus is on helping supply chain partners speed up validation, shorten time-to-market, and strengthen their global competitiveness," said Aaron Lee, Managing Director of DEKRA Taiwan.DEKRA Taiwan's Automotive EMC laboratory has developed a strong reputation for serving international OEMs, with capabilities spanning intelligent transportation systems, wireless communication, and electric vehicles. The new Stellantis approval further strengthens its strategic role within DEKRA's global laboratory network and ensures full alignment with international technical standards.Beyond individual testing projects, DEKRA delivers comprehensive one-stop EMC services. These include EMC testing, wireless certification, OEM specification verification, and Global Market Access (GMA) support. With combined automotive and military EMC testing capabilities, DEKRA helps clients efficiently meet OEM requirements, streamline validation, and accelerate entry into global markets.DEKRA Taiwan's Automotive EMC Laboratory, approved by Stellantis, supporting EMC testing for global automotive OEMs.

With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart cities, infrastructure and defense systems—the reliance of digital devices on flash memory for code storage has rapidly expanded. Memory is no longer just a medium for data storage; it now serves as the carrier for firmware, the repository for AI models, and the guardian of identity and authorization data. Ensuring security of flash memory directly determines the trustworthiness of the devices themselves.Risks from Real World Applications-A smart doorbell was compromised and used for remote surveillance of households by hackers.-A smart camera product line was infected with malware due to poor memory protection, causing large-scale corporate network breaches.-A battlefield drone was hijacked. Investigation revealed its unprotected flash memory exposed flight parameters and credentials.When memory becomes the convergence point for both data and instructions, a single breach can collapse all layers of defense.The Changing Role of Memory in AI SystemsThe introduction of AI, especially in edge devices, has made the role of memory even more critical. Today, memory not only stores data but also holds AI model parameters and behavioral decision logic. The requirements for memory integrity and non-repudiation have increased significantly. If AI models are tampered with, it can lead to erroneous decisions or even malicious behavior.Moreover, AI-driven real-time responses demand that memory supports lower latency and higher confidentiality. Traditional security designs focused solely on data protection can no longer meet the needs of modern devices.The Challenge of Compliance and the Surge of StandardsGlobal regulations around IoT and industrial device cybersecurity are intensifying. The EU's Cyber Resilience Act, the U.S. IoT Cybersecurity Improvement Act, ISO 21434 for automotive systems, and IEC 62443 for industrial control systems all require strong confidentiality and data integrity—even at the memory level. Flash memory must now address both functional safety and cybersecurity challenges.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Rethinking Memory Security AssumptionsHistorically, memory was treated as a peripheral component, with security left to the main controller. But today's attackers use physical access tools, firmware injections, and interface-level attacks to exploit memory. Flash memory must now adopt active defense mechanisms, including:- Hardware-level access control- Data encryption and firmware authentication- Event logging and anomaly detection- Logic-level separation and multi-factor verificationRedefining the Role of Secure Flash MemoryTo truly counter next-generation risks, flash memory should integrate secure logic circuits, providing secure boot, firmware authentication, key management, encryption engines, and access control. Such designs greatly reduce the risk of edge devices being compromised, controlled, or having their data stolen.In product design, special emphasis shall be placed on the concept of 'establishing a root of trust' through Secure Boot and key storage mechanisms. This ensures that every device boot starts from trusted code, preventing malicious firmware implants. Key storage shall be implemented in a pure hardware architecture, isolating sensitive information in inaccessible secure zones, significantly enhancing both physical and logical security.For firmware security, compliance to firmware authentication and resilience design standards such as NIST SP 800-193. This means not only verifying firmware integrity at boot, but also automatically recovering to a safe state in the event of an attack or anomaly, ensuring continuous device operation and protection from malicious software.Furthermore, secure storage solutions shall use a pure hardware architecture, requiring no external software or controller assistance, maintaining high security and performance even in harsh environments.To address supply chain security challenges, advanced digital signature technology is needed, ensuring that every firmware and software update from the manufacturer to the end device can be verified for source and integrity, providing comprehensive secure supply chain support.To meet post-quantum threats, advanced encryption standards such as CNSA 2.0 (Commercial National Security Algorithm Suite 2.0) compliance is necessary, ensuring that the software update architecture complies with the latest international cybersecurity regulations and meets the needs of high-security applications in government, defense, and automotive sectors.Winbond W77Q / W77T Secure Solutions and Industry PracticeAs a provider of secure logic circuit flash memory solutions, our products have been successfully adopted across diverse applications, including computer peripherals, video conferencing equipment, servers, AI edge servers, and automotive modules. Our designs maintain logical compatibility with existing market architectures to ensure smooth integration and low migration cost.Our solutions integrate LMS (Leighton-Micali Signature) advanced digital signature technology for PQC (post-quantum cryptography) needs.Our security architecture is also certified under leading global standards including Common Criteria (CC), FIPS 140-3, SESIP, PSA, IEC 62443, ISO 21434, and ISO 26262—offering customers a reliable and future-ready foundation.Safeguarding Human-Centered Trust at the Technological EdgeIn the AIoT era, memory security is no longer just about storage—it is the foundation of system-wide trust. From household devices to tactical drones, memory holds more than data; it protects privacy, drives enterprises, and underpins societal resilience.As a Secure Flash Memory solution provider with dedicated logic design, we understand the profound responsibility behind technology. Our solutions offer downward compatibility with mainstream architectures, while meeting stringent global security standards.True innovation is not just about what we can do—but what we can trust. We are committed to embedding security into every smart node and collaborating with partners, developers, and standards bodies to ensure technology continues to serve human values.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.