YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside Technology Platform. Adopting such patented technology along with domestically-made fully automated production lines, YCTek is able to deliver ultra-thin vapor chamber devices with thickness of under 0.25mm in mass production.

Electric vehicles (EV) have been regarded as the mainstream of next-gen automobiles. According to the statistics by DIGITIMES Research, with a global annual growth rate of 19% in 2020, electric vehicles will hit the tens-of-millions scale by 2025. Global environmental awareness and new emerging technologies are the two driving forces behind this rapid growth. When it comes to technology, electric vehicles' power management has been a major industry focus in recent years. Therefore, FTEX's GaNFET powertrain solution, which extends driving range by 30%, has become the center of attention.

In 2020, the COVID-19 pandemic rampaged the world. Many countries were on high alert and prohibited people from going outdoors freely. Such measures effectively controlled the virus, but it took a heavy toll on the economic development around the world. The retail and food services industry was one of the industries that borne the biggest brunt of the pandemic. CEO at DataVan, Kris Hsu, stated that although the restrictions imposed reduced in-store consumption revenue within the retail and food services industry, they also led to new business opportunities.

ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.

Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.