CONNECT WITH US
Tuesday 22 September 2026
Macronix Secure Memories Build Hardware Defenses for EU CRA
In the fiercely competitive European and global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly stringent requirements for supply chain transparency and device identity recognition. The European Union's Cyber Resilience Act (CRA) mandates that digital product manufacturers implement cybersecurity measures across the entire product service life cycle, from design, development, and production. In addition to secure-by-design principles, manufacturers must also establish mechanisms for vulnerability management, security updates, incident reporting, and supply chain transparency
Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth
Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering key insights into the company's strategic positioning under China's evolving economic framework. Participating in a panel discussion titled "Mapping Out the Future: China's 15th Five-Year Plan," Zhu outlined the opportunities and challenges emerging from the upcoming Five-Year Plan (FYP) and explained how AT&S navigates this dynamic market by executing its "local-for-local" strategy to meet customer needs precisely.Zhu noted that high-tech industries, specifically artificial intelligence (AI), semiconductors, and robotics, are poised to benefit from China's 15th FYP. However, he described the policy landscape as generating challenges for the microelectronics value chain."On one hand, these national priorities will stimulate robust market demand," Zhu stated. "On the other hand, our local peers are aggressively expanding their capacities, making the competitive landscape significantly fierce."In response to these market dynamics, AT&S continues to enable the global AI ecosystem through advanced packaging and IC substrates. The company's production sites in China effectively combine global technological expertise with Chinese manufacturing expertise, creating a world-class microelectronics hub."This strategy, first and foremost, secured our long-term profitable growth and kept us out of the commodity trap," Zhu said. "Because of this focus, we are fully ready to supply our Chinese customers with everything from high-end substrates to advanced PCB modules for optical transceivers, powering high-performance computing, AI, and data-center connectivity."The panel discussion took place at Austria Connect China, the largest Sino-Austrian business conference and the annual flagship event hosted by Advantage Austria. The event coincides with a historic milestone, as Austria and China celebrate the 55th anniversary of their bilateral diplomatic relations in 2026.AT&S stands out as a prime example of this enduring partnership. Operating in China for 25 years, the company continues to bring next-generation solutions to the region, continuously building out its high-end capacity to serve Chinese and global tech pioneers from its state-of-the-art facilities in Shanghai and Chongqing.AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & SolutionsAT&S is a global technology company and leading manufacturer of high-end IC substrates and complex printed circuit boards. AT&S develops and produces leading-edge interconnect technologies for key digital industries: AI infrastructure, high-performance computing, mobile devices, automotive, aerospace, industrial and medical technology. With production sites in Austria (Leoben, Fehring), China (Shanghai, Chongqing), Malaysia (Kulim), India (Nanjangud) and a European competence center for R&D and IC substrate production in Leoben, AT&S is actively shaping the digital transformation - through forward-looking investments in research and development and the responsible use of resources. The company currently employs nearly 15,000 people. Further information can also be found at AT&S official website. 
Tuesday 22 September 2026
AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance and safety management become increasingly urgent. Because unexpected downtime carries enormous financial costs, facilities have traditionally relied on personnel entering energized switchyards, climbing transmission towers, or working in hazardous, confined spaces. However, this conventional approach is constrained by limited efficiency and exposes workers to significant safety risks. As AI-powered drones integrated with thermal imaging modules mature, industrial inspection is transitioning from episodic manual checks toward automated, continuous monitoring and predictive maintenance.Albert Wang, Business Development Manager of Suntek Global, pointed out that industries currently face a chronic shortage of certified thermographers and inspectors. Furthermore, manual inspections are episodic and subjective, with noticeable variance across inspectors evaluating the same anomalies, which often leads to inconsistent inspection accuracy. Consequently, industries are seeking autonomous inspection platforms equipped with thermal modules. Beyond keeping maintenance personnel out of high-risk environments, these systems deliver high repeatability through fixed flight paths, consistent viewpoints, and uniform time-of-day baselines. This enables enterprises to track asset degradation trends over time, upgrading traditional periodic audits into true predictive maintenance.Market research indicates that the global power-inspection drone market across all payloads is projected to expand from $2.8 billion in 2025 to $8.6 billion by 2034. Within this sector, thermal-imaging adoption already exceeds 59%, with the directly thermal-addressable slice expected to reach $5 billion by 2034. With nearly a decade of deep collaboration with Teledyne FLIR, Suntek serves as an ideal partner for Taiwan and global industry players looking to seize this substantial market opportunity.Detecting Subtle Thermal Signatures to Identify Faults Before FailureBefore catastrophic failure occurs, equipment typically exhibits electrical faults, mechanical wear, or process anomalies, accompanied by subtle hotspots invisible to the naked eye. Utilizing thermal imaging allows operators to detect temperature anomalies early and schedule repairs proactively, minimizing downtime impacts. In particular, significant advances in uncooled long-wave infrared (LWIR) sensitivity now resolve fine temperature differentials into quantifiable data for actionable asset health analysis.Among key verticals, power and renewables represent prime deployment grounds for drone inspection. In solar operations, traditional manual thermography is labor-intensive; a single thermal-imaging drone can survey 1–2 MW of installed capacity per flight hour, compared with under 50 kW per hour using manual methods—delivering an order-of-magnitude leap in productivity.Mr. Wang further explained that when thermal imaging combines with edge AI, the system advances from basic imaging to intelligent automated interpretation—classifying defects, detecting anomalies at scale, and fusing multi-modal visible, thermal, and LiDAR inputs to alleviate the burden of manual image review. However, the core challenge lies in integrating sensors, calibration pipelines, drivers, edge computing, and AI models. Because thermal measurements are sensitive to ambient temperatures and optical characteristics, systems must ensure rock-solid radiometric stability. Currently, Teledyne FLIR provides radiometric variants including Boson+, Hadron 640R+, and the Lepton family, supplying system integrators with factory-calibrated, reliable thermal data.Nonetheless, integrating thermal cores into edge platforms involves complex hardware plumbing, such as MIPI CSI-2, USB, VoSPI, and V4L2 driver development, as well as frame synchronization between thermal and visible sensors—roadblocks that often stall OEM engineering teams for 6 to 12 months. To eliminate these hurdles, Suntek provides pre-integrated Reference Designs and validated drivers, helping equipment builders bypass tedious bottom-layer troubleshooting and compressing development timelines from quarters down to weeks.Eliminating Integration Hurdles from Core Components to DeploymentWith nearly a decade of continuous partnership with Teledyne FLIR, Suntek possesses deep tribal knowledge of Lepton and Boson architectures, addressing real-world calibration, driver, and manufacturing variations. Suntek provides dedicated carrier boards, driver integration, system engineering, and production support, significantly lowering the technical barrier for OEMs bringing thermal products to market.Suntek offers proven reference platforms across Boson+ and Lepton. Its compact MicroIR+ modular platform integrates a direct-mount Lepton socket, a quad-core RISC-V compute core, secure networking, and industrial production I/O onto a single validated board. Crucially, the platform utilizes an NDAA-compliant and ITAR-free BOM, meeting stringent cybersecurity and regulatory mandates for overseas critical infrastructure. In addition, addressing the reality that many innovators and startups begin with high-mix, low-volume (HMLV) runs of 100 to 5,000 units annually, Suntek provides comprehensive supply chain management and manufacturing support to bridge the gap from concept to commercial volume production.On October 28, 2026, Teledyne FLIR will host the "2026 Thermal Imaging AI Developer Forum," unveiling the next-generation Boson SX8 ultra-high-resolution thermal module and breakthrough solutions, empowering industry partners to accelerate deployment across autonomous drone inspection, smart manufacturing, critical infrastructure monitoring, and autonomous systems.
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-Ladvanced packaging technology.Building on GUC's silicon-proven 12 Gbps HBM4 IP on TSMC's N3P process, the new HBM4E IP pushes data transfer speeds up to 16 Gbps across all signed-off operating conditions while delivering industry-leading power efficiency and an ultra-compact area footprint. Leveraging GUC's proprietary interposer layout technology, the IP is fully optimized for signal integrity (SI) and power integrity (PI) across various TSMC CoWoS packaging configurations.To power 3D SoIC architectures, GUC's HBM4E IP includes a face-up variant engineered for use as a bottom die in TSMC SoIC-X technology. It integrates dedicated Through-Silicon Vias (TSVs) for signal pull-out and feedthrough power delivery to top dies, establishing a seamless path for complex 3D integration.In line with GUC's proven HBM, GLink, and UCIe portfolios, the HBM4E IP incorporates proteanTecs' interconnect monitoring technology. This integration enhances visibility during PHY testing and characterization while maximizing in-field performance and system reliability."HBM4E marks a major leap forward in bandwidth and system-level performance for next-generation AI accelerators. Reaching 16 Gbps on TSMC's N2P process underscores GUC's ability to quickly turn leading-edge process and packaging technology into production-ready HBM solutions," said Igor Elkanovich, CTO of GUC."By uniting our face-up HBM, face-up UCIe, and GLink-3D IPs, GUC delivers a complete interface IP portfolio for 3D SoIC architectures—the foundation for modern AI ASICs—enabling customers to seamlessly connect HBM, chiplets, and 3D dies that leverage the most advanced process technology."To learn more about GUC's UCIe IP portfolio and total solutions using TSMC's CoWoS and SoIC technologies, please contact GUC sales representative via email.