The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting from the finding of trade secret misappropriation to potential remedies affecting access to the U.S. market.On July 23, an ITC Administrative Law Judge (ALJ) issued an Initial Determination finding that IRICO and the remaining respondents had misappropriated Corning trade secrets related to its fusion glass manufacturing technology. The judge followed with a recommended remedy on August 6, and on August 7 the ITC issued a public interest notice disclosing part of that recommendation, including a proposed Limited Exclusion Order (LEO) against IRICO and the remaining respondents.The August 7 notice provided the first meaningful public indication of the remedies being considered. When the Initial Determination was announced in July, only limited information was available publicly. For Corning, the notice marks an important step toward potential enforcement measures following the ALJ's finding that its fusion-draw trade secrets had been misappropriated."Corning welcomes the initial determination and recommended exclusion order by the International Trade Commission. The determination makes clear that IRICO misappropriated Corning's proprietary fusion-draw technology, underscoring the value of Corning's innovations," said Brendan Mosher, International Vice President and General Manager, Corning Display Technologies."Protecting our intellectual property reflects our Values and our commitment to doing what's right for the last 175-years. Through these actions, we are safeguarding our innovations, our people, and our ability to do what we do best: transform industries, support our customers, and improve lives."Ruling Extends to Manufacturing and Downstream ProductsThe July 23 Initial Determination found that IRICO had misappropriated key Corning trade secrets related to fusion glass manufacturing, with the technology at issue broadly used across IRICO's glassmaking operations. The ruling did not narrow its scope based on glass generation size, glass composition, or other product-specific conditions, and applied to the remaining respondents in the case, including TCL, CSOT, and CHOT.That distinction is important because the central issue of misappropriation is not simply which glass formulation is being used, but how the glass is manufactured. If the final determination follows the current direction, changing a glass composition or product specification alone would be unlikely to provide IRICO with a workaround.Exclusion Order Raises the Stakes for Display ManufacturingThe August 7 public interest notice confirmed that the ALJ recommended a Limited Exclusion Order restricting U.S. imports of display products containing IRICO glass. For Corning, the significance of the remedy lies in how a dispute over manufacturing technology can carry through the broader display production chain.Display glass sits near the beginning of that chain. Once produced, the substrate moves through panel fabrication, module integration, and system assembly before ending up in televisions and other finished products. Because the case centers on the fusion manufacturing technology used to make the glass rather than on a single composition, Corning believes the ruling creates significant risk for customers that continue to source IRICO glass for products intended for the U.S. market.Corning is also seeking review of the recommended multi-year exclusion period, arguing that the evidence presented in the case supports a longer duration and that the final Commission determination could ultimately impose a longer restriction.Corning Seeks Review of Limited IssuesCorning has petitioned the full Commission to review several narrowly defined issues. Corning's petition does not challenge the central finding that IRICO misappropriated Corning's fusion technology, nor does it challenge the issuance of an exclusion order. Instead, they focus on clarifying the transparent process Corning has taken to protect intellectual property rights and support the growth of the display industry in China and across the globe."While we appreciate the ALJ's confirmation that IRICO misappropriated Corning's technology, as well as the recommended exclusion order, Corning is seeking review of certain statements in the determination ," said Mosher."We have consistently acted with transparency, integrity, and responsible stewardship of its innovations, while supporting the growth of the display industry, and will continue to take all appropriate steps to protect Corning's intellectual property."Corning maintains that it clearly and consistently communicated its concerns related to IRICO's misappropriation of its trade secrets, preserved its right to seek remedy, and presented substantial evidence in this regard.In addition, Corning maintains its course of action over the years with respect to IRICO and the display industry was reasonable and considerate, and that it had continuously taken measures over the years to protect its trade secrets.Commission Review Comes NextThe case has not yet reached a final ITC determination. Following the ALJ's Initial Determination, the full Commission reviews the decision and ultimately issues the Commission's Final Determination. Corning's current petitions are part of that process and identify the limited issues it wants the Commission to reconsider.Corning is also reiterating that intellectual property protection remains a fundamental part of its long-term research and innovation strategy. The company emphasizes that invention and innovation have been at the core of its business for 175 years and that its intellectual property reflects sustained investments in R&D, technology development, and industry collaboration. When it identifies unauthorized use or misappropriation of its technology, Corning says it will take the necessary steps to protect those investments.As the fusion trade secret case moves through Commission review, Corning will continue taking appropriate steps to protect its intellectual property while supporting the continued growth and development of the display industry.

With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys IP OEM Program partner, provides cost-effective and flexible ASIC turnkey services to help startups and enterprises overcome the barriers to customized chip development and accelerate their products from concept to mass production.PGC's integrated development path covers IP licensing, IP integration, IC design, physical implementation, tape-out, manufacturing, packaging, testing, and mass production - combining its ASIC design expertise with the TSMC ecosystem and Synopsys IP resources. PGC's website states that the company has taped out more than 1,500 projects at TSMC and supports both CyberShuttle/MPW and mass-production services.As artificial intelligence (AI) and high-performance computing (HPC) applications continue to expand, demand for customized ASICs is increasing across a wide range of applications, including AI acceleration, Edge AI, networking, and other computing applications. However, high non-recurring engineering (NRE) costs, complex IP integration, and lengthy development cycles remain major challenges for companies seeking to develop their own chips.Lowering the Barriers to ASIC DevelopmentASIC development has traditionally been dominated by large enterprises with significant semiconductor resources and engineering capabilities. With the rapid growth of AI applications, however, more startups and enterprises are looking to develop customized chips to achieve better performance, lower power consumption, and improved cost efficiency.PGC addresses these challenges through its one-stop ASIC turnkey service, giving customers access to the expertise and resources required throughout the chip development lifecycle without having to build a complete ASIC development organization internally.Through the Synopsys IP OEM Program, PGC also provides access to cost-competitive IP solutions and supports the integration of high-speed interface and other semiconductor IP, helping customers reduce IP licensing costs, simplify development, and shorten the overall design cycle. PGC's current service portfolio includes high-speed interface IP integration such as PCIe, USB, MIPI, SerDes, DDR, and die-to-die interfaces.Case Study 1: AI Startup Accelerates FPGA-to-ASIC Migration with MPW/Shuttle FlowAn AI startup specializing in image recognition initially used FPGA technology for product development. As market demand grew, the company faced increasing cost and power-consumption challenges, making the FPGA-based solution less suitable for large-scale production.After engaging PGC, the company transitioned from FPGA to ASIC through PGC's FPGA-to-ASIC solution. To reduce the initial development cost and lower the risk of ASIC adoption, the customer adopted an MPW/Shuttle flow for the first silicon implementation. PGC also integrated multiple high-speed interface IPs and managed the ASIC design flow from development through tape-out.The project achieved First Silicon Success on the first tape-out, along with a significant reduction in power consumption, an approximately 10 percentage reduction in overall cost, and an approximately 20 percentage reduction in time-to-market compared with the company's original FPGA-based development timeline.The project demonstrates how PGC's FPGA-to-ASIC solution and MPW/Shuttle flow can help AI startups reduce initial development costs and technical risks while providing a practical path from FPGA prototyping to ASIC implementation and subsequent mass production.PGC's existing service model supports the transition from smaller-volume MPW/CyberShuttle runs to full-mask development and high-volume production, allowing customers to select an appropriate development path as their products mature.Case Study 2: Edge AI Company Develops a Customized SoCAn Edge AI company sought to develop a customized SoC to meet growing demand for intelligent edge applications. Compared with conventional off-the-shelf solutions, a customized chip offered better integration, lower power consumption, improved performance, and greater flexibility for the company's target applications.Developing an ASIC requires expertise across system architecture, IP selection and integration, IC design, physical implementation, manufacturing, and testing. The company therefore sought an experienced ASIC partner to accelerate development while managing overall project cost and risk.PGC provided a comprehensive turnkey solution covering system architecture planning, IP integration, IC design, physical implementation, tape-out, manufacturing, packaging, and testing. By integrating the required IP and managing the development flow end to end, PGC helped the customer move efficiently from system requirements to a finished customized SoC.The result was improved system integration and performance, reduced overall system cost, and better power efficiency, giving the customer greater flexibility to optimize its chip for specific Edge AI applications.This case demonstrates PGC's ability to support not only AI startups but also companies developing next-generation Edge AI solutions, helping them build in-house customized chip capabilities and strengthen long-term product competitiveness.PGC has specifically highlighted FPGA-to-ASIC migration and Edge AI SoC development as important application areas, with its turnkey platform covering front-end design, back-end APR, tape-out, MPW/CyberShuttle runs, and subsequent production.Flexible ASIC Turnkey Services for Different Development NeedsPGC offers a flexible development model designed to support projects of different sizes and stages. Customers can choose from multiple development and manufacturing models, including MPW/Shuttle services, mass production (MP), and Customer-Owned Tooling (COT), allowing them to select an approach that matches their budget, production requirements, and long-term business strategy.For startups and companies entering ASIC development for the first time, an MPW/Shuttle flow can provide a practical and cost-effective approach for initial silicon development and validation. By sharing wafer costs across multiple projects, MPW can help reduce the upfront cost of producing prototype silicon compared with a dedicated full-mask approach.As products mature and production volumes increase, PGC can support customers in transitioning from prototype silicon to mass production. Its turnkey service covers the broader supply chain, including wafer fabrication, CP/FT testing, packaging, and production support.Through its one-stop turnkey model, PGC can coordinate IP, design, foundry, packaging, and testing resources, helping customers reduce project complexity and focus on their core product and application development.Combining TSMC, Synopsys and OSAT Ecosystem ResourcesPGC's turnkey model is built around close collaboration with major semiconductor ecosystem partners. As a certified member of the TSMC Design Center Alliance, PGC provides TSMC ASIC design and CyberShuttle services. The company also works with Synopsys through the IP OEM Program and collaborates with ASE and other OSAT partners for packaging and testing.This ecosystem-based approach allows PGC to integrate design, IP, manufacturing, packaging, and testing resources into a coordinated development flow. For startups and small and medium-sized companies, this can reduce the need to independently manage multiple semiconductor suppliers and technical interfaces throughout the ASIC development process.PGC also supports advanced-node ASIC development. Its current service portfolio includes TSMC 6nm, 5nm, 4nm, and 3nm FinFET processes, as well as advanced packaging services such as CoWoS.Looking AheadPGC plans to deepen its collaboration with ecosystem partners while expanding IP integration and advanced-process design capabilities, including support for more advanced TSMC process nodes and continued growth of its Synopsys IP OEM offerings.The company will continue to focus on helping startups and enterprises move from FPGA or off-the-shelf solutions toward customized ASIC architectures, particularly for AI, Edge AI, HPC, networking, and other high-growth applications.By combining ASIC design expertise, TSMC ecosystem resources, Synopsys IP access, and flexible MPW/Shuttle, MP, and COT models, PGC aims to help more companies overcome the traditional barriers to ASIC development.The goal is to lower development risk and cost, accelerate time-to-market, and provide a practical path from initial silicon development to mass production - enabling more startups and enterprises to build customized AI and Edge AI chips and strengthen their long-term product competitiveness.

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications.As AI, HPC, and next-generation communications drive higher chip frequencies, greater thermal design power, and more complex package architectures, efficient heat dissipation and stress control have become critical to device performance and reliability. Loctite ABLESTIK CDF900 addresses these challenges by combining high thermal conductivity with the precision and process consistency of a film-based die attach format.Technical Breakthrough for High-Performance AI Packaging"Henkel is a global leader in conductive die attach film, with technology widely adopted in Wi-Fi communications, automotive electronics, and power devices. Today, Loctite ABLESTIK CDF900 pushes thermal performance to new heights while expanding applications into large-die packaging scenarios such as processors and AI chips. This offers customers broader design flexibility and superior thermal management solutions," said Kaihua Zhou, Head of Market Strategy for Semiconductor at Henkel Adhesive Technologies Electronics.The core breakthrough of Loctite ABLESTIK CDF900 lies in its proprietary thermal filler technology, which substantially increases thermal conductivity to more than 8 W/m-K. This enables high-power components in mobile phones, processors, and Wi-Fi equipment to dissipate heat efficiently and maintain stable performance in demanding operating environments.Compared with competing liquid die attach adhesives, Loctite ABLESTIK CDF900's film-based format helps eliminate the risks of material bleed-out and non-uniform bondline thickness. This enables chip designers to achieve smaller, more precise die footprints within constrained spaces while enhancing overall package reliability and robustness.Complete Material Solutions to Address Stress Challenges in AI Advanced PackagingTo address warpage during processing and component stress issues inherent in large-die advanced packaging, Henkel continues to expand its material portfolio. The company has developed high-thermal-conductivity liquid molding compounds, high-performance capillary underfills, and diverse packaging material platforms to meet requirements for efficient heat dissipation, high reliability, and process flexibility. By reinforcing structural strength, toughness, and adhesion, Henkel's materials help mitigate stress imbalances while meeting the stringent reliability and high-volume manufacturing stability requirements of high-end AI packaging.At SEMICON Taiwan 2026, Henkel will present its complete portfolio for critical advanced packaging applications, including underfill, conductive die attach film, liquid molded underfill, and non-conductive liquid adhesive technologies.Kevin Becker, Senior Vice President of Product Development and Engineering, added, "These solutions support board-level to wafer-level packaging, low to high thermal conductivity applications, and small to large die footprints. Leveraging its comprehensive product portfolio, global R&D resources, and localized technical support, Henkel empowers customers to improve thermal performance, package reliability, and mass-production readiness in advanced package designs, while providing vital material support for the next generation of AI development."Global Footprint and Multi-Site Support Deliver Supply Chain ResilienceAmid geopolitical shifts and global expansion, semiconductor supply chain resilience has become a priority in international procurement decisions. Henkel has established a robust multi-site support network and operates manufacturing facilities across North America, Europe, and Asia, with established production and technical support hubs in Taiwan, South Korea, China, Japan, and Southeast Asia. Flexible backup production sites enable localized, real-time support to meet global customers’ capacity expansion and procurement flexibility needs.Sustainability Commitment: Advancing Circularity in Semiconductor MaterialsSustainability is a core value at Henkel. In material R&D, the company has pioneered the integration of eco-friendly product design methodologies. For example, Henkel is collaborating with partners to advance circular economy practices, including the use of silver powder from recycled silver, a precious metal widely used in semiconductor packaging. Henkel is committed to working hand in hand with industry partners to reduce carbon emissions and minimize resource waste.Visit Henkel at SEMICON Taiwan 2026During SEMICON Taiwan in September, Henkel will present its full suite of material solutions for advanced packaging and high-performance semiconductor applications in Room 404, Hall 1 of the Taipei Nangang Exhibition Center. The company will showcase its technical capabilities across AI infrastructure, HPC, next-generation communications, and Edge AI.The hospitality suite will feature a variety of interactive experiences, creating opportunities for customers and industry partners to engage directly with Henkel's technical experts. Together, participants will explore innovative solutions for advanced packaging, including thermal management, reliability enhancement, stress mitigation, and readiness for high-volume manufacturing. Through collaboration and knowledge exchange, Henkel continues to support the semiconductor industry's progress toward higher performance, greater reliability, and enhanced resilience.Details about Henkel consumer electronics materials are available here, and information about its semiconductor solutions can be found here.LOCTITE is a registered trademark of Henkel and/or its affiliates in the USA, Germany and elsewhere.