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4 Mar 2003

Handspring, T-Mobile team on Treo 270 (Mar 3)

New 'all-in-one' printers from HP (Mar 3)

HP tries to get 'radically simple' (Mar 3)

Infineon joins IMEC program on reconfigurable systems (Mar 3)

Intel to boost guidance outlook for 1Q

Global chip sales falls by 2.4% in January, says SIA

3 Mar 2003

RIM getting down to business with CDMA (Feb 28)

China develops its own DSP (Feb 28)

Hynix plans to open 12-inch pilot line this year

Micron gets Congressional support in Hynix dispute (Mar 2)

China signs on to receive Windows source code (Mar 3)

Infineon chief says DRAM industry won't improve until 3Q (Feb 27)

Samsung targets net profit of over 7 trillion won in 2003 (Feb 27)

Smart Communications to spend a tenth less on expansion in 2003 (Mar 3)

Brooks automation name change approved by shareholders (Feb 28)

Hutchison may limit role at Global Crossing to win bid approval (Mar 1)

ATI gets design win at expense of Nvidia: Analyst (Feb 28)

1 Mar 2003

Hitachi to strengthen operating framework in China (Feb 28)

Sampo-Grundig deal faltering: report (Mar 1)

Nikon expects to beat sales forecast for digital cameras (Mar 1)

Microsoft agreement sets precedent (Mar 1)

Agreement to offer promotional prices to end investigation by Taiwan's Fair Trade Commission (FTC) will lead other governments to press for lower prices

In-Stat/MDR: PCs, peripherals and consumer electronics getting on the Universal Serial Bus (Feb 26)

Lithography roadmap remains unsettled (Feb 28)

Application processors to drive handset IC growth (Feb 28)

IC Insights: 2002 flash memory supplier rankings (Feb 28)

iSupply 2002 ranking of DRAM suppliers (Feb 28)

Lexmark wins first round in printer suit (Feb 28)

"Case could determine the future of low-cost replacement toner cartridges"

Scott McNealy gets serious (Feb 28)

Court denies Next Level appeal on Motorola bid (Feb 28)

HP says it will announce new media center PC soon (Feb 28)

Sega to cut 20% of US headquarters staff (Feb 28)

Palm cuts jobs at hardware group, stock drops (Feb 28)

28 Feb 2003

Hogan sees silicon explosion as costs drop (Feb 27)

Japan's fab-tool book-to-bill ratios fall back (Feb 27)

Let China's fabs have top technology says Infineon's Schumacher (Feb 27)

Infineon seeks 'divorce' from Mosel, sets March deadline (Feb 27)

Sony unit to support Butterfly.Net gaming grid (Feb 27)

Report: Microsoft, EA mull bid for Sega (Feb 27)

Microsoft to sign pact with China Telecom (Feb 27)

Dell readies full-featured notebook (Feb 26)

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