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29 Aug 2003

J-Phone starts selling Nokia's Bluetooth 3G mobile phone handset (Aug 29)

Court affirms 2002 dismissal of NCR suit vs. Palm (Aug 29)

China jostles with global leaders in India's mobile phone market (Aug 29)

28 Aug 2003

Intel, Legend to perform joint R&D, says report (Aug 28)

New, low-end 1100, 2300 handsets from Nokia (Aug 28)

Symantec adds product activation

Philips chips to flip TV displays

Intel's revised Pentium M schedule

Windows AMD 64 OS details escape onto Web

JEDEC announces JEDEX Shanghai

Intel CEO: SARS resurgence could seriously hurt China economy

S Korea minister: Intel to discuss possible investment in South Korea

Elpida, Toppan sign mask supply, development deal

Trial begins in bias suit again AMD, Sanders

Toshiba taps Applied's low-k technology at 90nm

SMIC to place US$1 billion equipment order in Beijing

EMS, OEMs in procurement tug of war

Hitachi to move disk media business to China

Fujitsu merges four IC assembly and test firms

Microsoft: IM party's over

Special 'MEMS' exhibits and program at SEMICON Taiwan 2003 (Aug 26)

ESCA endorses China Sourcing Fair (Aug 27)

Canon printer adds wireless printing via infrared communication from a camera phone (Aug 28)

27 Aug 2003

Despite Europe's hot summer, Sony PS2 sales climb (Aug 26)

Intel plans chip packaging center in China (Aug 26)

Dell gets new storage chief

AMD revives Duron line

Japan's equipment markets hot in July, says report

IBM finds ally for supercomputer-on-a-chip

Intel tricks out 90nm TCP/IP processor

XGI aims graphics ICs at mid to high-end

Shortages, price hikes hit flash, MPUs, DVD chips

Intel commits US$375m to new packaging plant in China

Elpida to assume management of NEC fab in Hiroshima

TCL beats street 48% on overestimated SARS impact (Aug 27)

26 Aug 2003

DVD industry wins suit over posting codes (Aug 26)

MPC makes deal to build PC capacity (Aug 26)

IBM aims to turbocharge storage (Aug 25)

Structured-ASIC debate building in fervor

1415/1505 pages

Interview: Advanced packaging shifts toward system-level co-design for AI
Advanced packaging remains one of the semiconductor...

CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) was held September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors...

Special reports

AI demand reshapes capital allocation and operating models in telecom sector

Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily...

Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components

DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued...

Winning the AI glasses race: Why myopia users and optical retailers hold key to mass adoption

AI glasses are emerging as a key gateway to AI; the market is projected to grow rapidly between 2026 and 2030, with a compound...

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