Intel has announced the first Optane-branded product using its new 3D XPoint memory: the catchily named Intel Optane SSD DC P4800X.

Samsung Electronics will invest about KRW10 trillion (US$8.7 billion) in Hwaseong Campus in Gyeonggi Province, South Korea to build a new line to produce memory DRAMs.

Qualcomm no longer refers to Snapdragons as processors, but rather as a platform. It says it is changing the terminology because "Snapdragon is more than a single component, a piece of silicon, or what many would misinterpret as the CPU."

Trying to cover the waterfront, TSMC disclosed plans for new high-, mid- and low-end processes at an annual event here. They included an enhanced 7nm FinFET node using extreme ultraviolet lithography, a 12nm upgrade of its 16nm process and a 22nm planar technology - its answer to fully depleted silicon-on-insulator (FD-SOI).

Executives at Chinese tech companies say that China's acquisitive forays into foreign chip sectors are now meeting resistance due to increasing wariness of overseas authorities and companies.

Japan's crisis-racked Toshiba has offered shares in its memory chip unit to creditors as collateral to secure debt refinancing, people briefed on the matter said on Wednesday.

Samsung is going to make supplemental investments into its 10nm production lines in March 2017 and construct new 7nm semiconductor facilities in 2018. Its strategy is to secure ultra-fine processing technologies faster than its competitors.

The Japanese government, fretting over the future of Toshiba's flagship memory chips unit, is prepared to block a sale to bidders it deems a risk to national security, sources said, a stance that gives US suitors a major advantage.

Shares in Toshiba Tec rose more than 6% in early Monday trading after a report that Toshiba, the parent, is considering selling shares in the company.

As major player Toshiba's flash memory business is up for sale, global chipmakers are weighing their chances of competing against Samsung, which has a runaway lead in 3D NAND flash technology.

Intel is extending its technology roadmap as cost and complexity increase with advanced nodes. Steve Mullane, a BlueFin Research Partners analyst, said that Intel's 10nm process could be delayed two to three months.

Microsoft is committing to use chips based on ARM Holdings technology in the machines that run its cloud services, potentially imperiling Intel's longtime dominance in the profitable market for data-center processors.

Taiwan's Foxconn, the world's largest contract electronics maker, is not a favored bidder for Toshiba's memory chip business due to its close ties with China, sources with direct knowledge of the deal said.

Unigroup mobile-design subsidiary Spreadtrum & RDA and the British supplier of chips to Apple's iPhones and iPads are considering a joint venture in eastern China, through which the pair will jointly design communications components.

China has reported its first monthly trade deficit in three years, after imports surged and a slowdown during the Lunar New Year holidays hit output.

Hewlett Packard Enterprise said it would buy data storage provider Nimble Storage Inc for $1.09 billion in cash, to expand its presence in the fast-growing flash storage business.

German-based chipmaker X-Fab Silicon Foundries SE expects to raise about EUR500 million ($530 million) via an initial public offering in order to fund its global production expansion.

Japan's SoftBank is set to sell a roughly $8bn stake in Arm, the UK chip designer it purchased only six months ago, placing 25% of Britain's largest technology company into a new, Saudi-backed $100bn investment fund.

There's a lot of pressure on Apple's next iPhone to deliver, both in product quality and sales.

A Donald Trump campaign sign remains atop a pile of gravel in Harrisburg, Penn, where Foxconn said in 2013 it'd build a $30 million factory. It didn't happen, but more promises have returned. "Foxconn is going to spend a tremendous amount of money on building a massive plant," Trump said, "and probably more than one."

One of a handful of startups aiming to attack Broadcom's dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan's Mediatek and will push packaging technology from TSMC to a new level.

In an attempt to regain its mojo, Toshiba will double down on traditional products that are seen as part of promising growth segments.

Evan Blass is back with information on the Galaxy S8. According to Blass, the device will now release on April 28th. This sets the date back by one week. Reasons for the delay include alleged quality control and production delays for the Snapdragon 835, on both Samsung and Qualcomm's ends. Blass isn't sure about the exact reason though, only that the rumored release will now take place a week later.

Industry watchers predicted SK Hynix may join hands with Taiwanese company Foxconn, also known as Hon Hai Precision Industry, to acquire Toshiba's chip business. Foxconn's Chairman Terry Gou has been "very serious" about bidding for Toshiba's memory chip business.

Under the terms of the deal, Cypress will sell a subsidiary that owns the fab to a startup foundry, SkyWater Technology Foundry, backed by a Minnesota-based holding company. SkyWater will operate the fab, manufacturing wafers for Cypress and for other chip firms, Cypress said.

Apple is developing a new camera with "3D sensing and modeling capabilities" that could "reinvent the user experience" to be included in a redesigned iPhone expected to launch later this year, according to new research from KGI Securities analyst Ming-Chi Kuo seen by Business Insider.

We are hearing that Intel is still struggling with defect/yield issues with this advanced process for High Volume Manufacturing (HVM) release and have not locked down the complete process of records (PORs) to date. While the production ramp target at Fab 28 is 2H17, there are concerns that this ramp could be delayed by 2-3 months.

"We don't expect many projects on our latest high-end chip," Mediatek Co-Chief Operating Officer Jeffrey Ju told reporters in a press briefing Monday at the Mobile World Congress here. "For now, we think less than 10 smartphone models will adopt this high-end X30 chip."

Despite a turbulent past, Windows PCs with ARM are making a grand return later this year, but only with Qualcomm chips. Another big ARM chipmaker, MediaTek, is sitting out the opportunity to put its ARM-based chips in Windows PCs because the company sees it as a limited opportunity.

Lattice Semiconductor has moved a step closer to being acquired by an investment firm backed by China's central government, announcing Tuesday (Feb. 28) that its shareholders have approved the terms of the $1.3 billion deal.

Nexperia has been officially launched as an independent supplier of discrete, logic, and MOSFET devices.

Xiaomi has managed to secure itself a decent shipment of Snapdragon 835 chipsets for use in the company's upcoming high-end smartphone, Mi6.

Intel split the Cyclone 10 into the performance-oriented GX and low-power optimized LP series. The GX series uses TSMC's 20nm process and is geared for a number of uses in the industrial, automotive, and broadcast markets. These include machine vision, robotics, infotainment, Advanced Driver Assistance Systems, and audiovisual applications.

Despite the rumors that Samsung was hogging all the Snapdragon 835s for itself, Sony has brought a device with Qualcomm's top-of-the-line 2017 SoC to MWC.

According to industry sources, SK Hynix is planning to triple its investment in foundry business this year. To this end, SK Hynix recently organized a task force at its M8 foundry plant located in Cheongju, North Chungcheong Province.

Samsung will sell modified versions of the Galaxy Note 7 in emerging markets, including India and Vietnam, according to Hankyung, which claims the move is designed to help Samsung minimise losses and avoid a potential environmental fine.

Intel's modems aren't as good as Qualcomm's, but the company scored a major victory last year when some of its modems began shipping in some models of Apple's iPhone 7.

China's state-backed Tsinghua Unigroup is pushing for an initial public offering of its mobile chip unit, Unigroup Spreadtrum RDA, in 2018, sources told Nikkei Asian Review.