China-based BOE Technology has adopted SpringSoft's Laker Custom Layout Automation System as its standard custom chip design platform. SpringSoft said the long-time panel customer is expanding deployment of the Laker software from early 4.5G, 5G and 6G FPD product applications to its latest 8.5G offerings and institutes for advanced technology development.

"We booked EUR 1,297 million worth of systems in the third quarter of 2010 and expect bookings in the fourth quarter to exceed the Q3 level, confirming our potential for 2011 sales growth," said Eric Meurice, president and CEO of ASML.

In addition to the ISO/TS16949 certification, Grace has successfully rolled out its Automotive Zero Defect Program, which offers a set of tighter process control measures during wafer processing.

"I love the Generation Y term 'frenemy,' because today we're partners, tomorrow we're competitors," Sharp Solar senior vice president Eric Hafter said of his rival solar makers.

The Nikkei business daily recently reported that the resistive random access memory chip to be developed by Elpida and Sharp could write data 10,000 times faster than NAND flash memory technology, while consuming less power. The next-generation memory chip is expected to be commercialized around 2013.

"Memory chip prices are expected to continue their downtrend even through the first half of next year, but they will likely bounce back from the middle of the second quarter," said Kwon Oh-hyun, president of Samsung's semiconductor division. Hynix CEO Kwon Oh-chul echoed his view, but said a price rebound may not start until the second half of 2011.

Revenue in the company's core SSD product line totaled US$20.2 million, an increase of 81% from the US$11.1 million posted in the second quarter of fiscal 2010. "The discontinuance of our commodity memory products has allowed us to aggressively reallocate resources towards SSD growth," said Ryan Petersen, CEO of OCZ Technology.

OCZ Technology is teaming up with SandForce to deliver exceptional new SSD products that leverage SATA3 and cost-effective NAND flash components. OCZ is set to begin sample distribution to current and potential clients in the fourth quarter of 2010, with mass production beginning in the first quarter of 2011.

Microinverter maker Enphase Energy announced today that its microinverter technology will power 4.5MW of solar projects developed and operated by Main Street Power and financed by Morgan Stanley.

South Korea's Hyundai Heavy Industries and France's Saint-Gobain will jointly build the largest thin-film solar cell plant in South Korea.

The global dominance of South Korean chipmakers is unlikely to be toppled anytime soon, even as Japanese and Taiwanese rivals consider forging stronger ties, according to a ratings agency. "In the medium term, Elpida's and Taiwanese chipmakers' increased competitiveness is unlikely to unseat the Korean's established advantages in technology and scale..."

LDK said it expects third-quarter revenue of $610 million to $640 million, up from a previous forecast of revenue of $570 million to $600 million. LDK revised higher its wafer shipments outlook to 550MW to 570MW from its prior outlook of 520MW to 550MW.

Few countries in the world face as immediate a threat from climate change as the Republic of Maldives

One analyst says yes, saying that Micron is going it alone in NAND and without Intel. Intel is not commenting, saying the analyst is only speculating without hard data.

"Silicon shipments reflect the tremendous recovery experienced by the semiconductor industry this year," said Stanley Myers, president and CEO of SEMI. "While current data suggest that growth rates are moderating, we expect that the industry will continue to be positive for the next two years."

Micron Technology has disclosed in an SEC filing that Samsung has agreed to pay the company US$275 million under a new 10-year patent cross-licensing agreement.

Elpida Memory plans to issue 60 billion yen (US$730 million) in convertible bonds and use the funds for bond redemption and capital spending, a source familiar with the matter said.

Suntech Power Holdings has struck deals with four companies: Azuray, Enphase, National Semiconductor and Tigo to enable "smart panel" solutions.

Intel is apparently working on a tool that will allow developers to transfer iPhone applications to mobile devices that use Intel processors.

Samsung Electronics, Asia's biggest maker of semiconductors, flat screens and mobile phones, reported profit that missed analysts' estimates, fueling concern the global recovery in demand for electronics is stalling.

The Chinese maker of polysilicon used in solar panels expects to offer 8 million American Depository shares at between $10.50 and $12.50 each. It has given underwriters the right to buy about 1.2 million additional shares if demand exceeds initial supply.

Powerchip Technology, ProMOS Technologies and Winbond Electronics are among possible targets, Elpida President Yukio Sakamoto said in interviews this week.

Adesto Technologies, a memory startup funded by Applied Materials and others, is readying its first conductive-bridging random access memory (CBRAM) product. CBRAM is seen as a potential candidate to replace conventional flash memory. Other candidates include FRAM, MRAM, phase-change and RRAM.

"We're considering various options of outsourcing as well as strengthening our own production capacity because of rising demand," a spokesperson for Sony said. The Nikkei English News recently reported that Sony plans to hire Fujitsu for the bulk of the production process for complementary metal-oxide semiconductor sensors used in digital cameras and camera phones.

"Although discussions are ongoing with Sony and Renesas Electronics to secure their continued access to our semiconductor packaging technology through a licensing relationship with us, these discussions have not sufficiently advanced, thus necessitating this lawsuit," said Henry Nothhaft, chairman and CEO of Tessera.

"In the DRAM sector, Hynix, which focuses its production on 44-nano DRAM products, aims to finish its development of 38-nano products within this year for mass production early next year," a company spokesman said.

Elpida Memory president and CEO Yukio Sakamoto said in an interview that the company is delaying plans to boost production capacity at its Taiwanese unit. "Through the summer, demand for PC memory didn't rise as much I had expected," Sakamoto said. "If there's no demand, there's no point in adding capacity."

The recent dust-up between China and Japan suggested how neighbours can have incompatible interests. But in business, things are often rather different. In one example, China's emergence as a producer of sophisticated technology is helping strengthen one of the few big microchip businesses left in Japan.

Some analysis on China-based solar companies.

Rising competition from Chinese solar companies and high entry costs are likely to limit the number of start-up companies going into the PV manufacturing market, a managing director at private equity firm CMEA Capital said.

For its fiscal third quarter, SMSC expects adjusted earnings of US$0.42-0.43 per share on revenues of US$104-107 million.

China-based Sichuan Changhong Electric has committed to fulfilling purchasing target plans for Fairchild's power and mobile components through December 2015. Fairchild's devices are designed into a broad range of Changhong products including LED TVs, PDP TVs, LCD TVs, CRT TVs, set-top boxes, refrigerators and air conditioners.

Software giant Oracle is keen to make more acquisitions to bolster its technology and a microchip company could be a good fit, according to company CEO Larry Ellison.

Oracle has sued Micron Technology, alleging it overcharged Sun Microsystems, which Oracle acquired, by conspiring to fix prices for computer memory chips.