Around the web news tagged Semiconductors

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Displaying links tagged Semiconductors [back to index]

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18 Jan 2008

Fujifilm invests in next-gen 45/32 nm lithographic tool (Jan 18)

17 Jan 2008

ASML posts surprise increase in 4Q profit (Jan 16)

16 Jan 2008

Leadis Technology acquires Acutechnology Semiconductor (Jan 16)

Samsung chairman's home raided in corruption probe (Jan 15)

Applied Materials reduces workforce (Jan 15)

15 Jan 2008

X-FAB achievesmajor milestone while transforming its Malaysian operation into analog/mixed-signal fab (Jan 15)

Samsung profit falls 6.6% on lower chip prices (Jan 15)

Samsung must take a long, hard look at itself (Jan 15)

Marvell transitions XScale based processors to customary fabrication facilities (Jan 8)

14 Jan 2008

Solargiga plans up to $292 mln HK IPO (Jan 14)

UMC disputes EE Times report on wafer pricing (Jan 10)

Samsung sees DRAM price near bottom (Jan 11)

STATS ChipPAC proposes to undertake capital reduction(Jan 10)

CES 2008: Toshiba builds HDTV around PS3's Cell chip (Jan 11)

11 Jan 2008

Prosecutors launch probe into Samsung bribery scandal (Jan 10)

GSA: Chip revenues reached US$71.9bn in 3Q07 (Jan 10)

Renesas to bolster analog and discrete semiconductor business by expanding back-end process plant and establishing new design company in Malaysia (Jan 11)

10 Jan 2008

TSMC 2007 sales flat on year (Jan 10)

Cell base station chip sales on slow decline according to In-Stat (Jan 9)

Hynix says sees DRAM rebound in 2Q (Jan 8)

"...Since the current downturn started in January 2007, we are thinking there may be a likelihood of a rebound in 2Q...iSuppli analyst said from what he has seen on the floor of the CES, there is a huge number of new products that are going to require memory..."

Ambitious NXP sees mobile chip consolidation (Jan 8)

9 Jan 2008

Court denies Silicon Image's request to preliminarily enjoin sales of Analogix Semiconductor's HDMI chips (Jan 8)

Behind the Intel/OLPC breakup (Jan 8)

STATS ChipPAC reaches package-in-package milestone with over 25 million units shipped (Jan 8)

The best gadgets of CES 2008 (Jan 8)

Winbond selects ESI’s 70nm link processing solution for advanced DRAM production (Jan 8)

8 Jan 2008

Spire JV wins largest solar PV installation for a manufacturer in Connecticut (Jan 7)

CES product news briefs from SanDisk (Jan 7)

Intel says responds to EU antitrust charges (Jan 7)

7 Jan 2008

Broadcom and Microsoft collaborate on next-generation IPTV system-on-a-chip (Jan 6)

DRAM makers cut cost by 30% a year to 2011 (Jan)

Spansion begins sampling 65nm MirrorBit quad flash memory for removable memory cards (Jan 3)

Sunplus offers single chip DVB Terrestrial solution for STB and portable DTV applications (Jan 4)

Realtek and Intel to demonstrate interoperable wireless USB single-chip solutions at CES 2008 (Jan 3)

4 Jan 2008

PSC posts mild sequential sales growth in December (Jan 4)

3 Jan 2008

AMD licenses NAND flash solution from Denali for next-generation handset processors (Jan 2)

2 Jan 2008

Qualcomm says new court-compliant chipsets ready (Jan 2)

Samsung Group undecided on 2008 investment plan amid slush fund probe (Jan 2)

Boost chip powers OLED and backlight (Jan 1)

Dual-output boost convertor combines a 2.3MHz PWM LED driver with a low-noise OLED driver

Toshiba eyes quadrupling flash memory output-Nikkei (Dec 29)

254/506 pages

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