Last fall, industry analysts predicted there would be an oversupply of manufacturing capacity due to a market correction following the strong revenue posted in 2010, but following the earthquake, tsunami, and now nuclear crisis in Japan, the landscape looks different.

Japanese authorities have raised the severity rating of their nuclear crisis to the highest level, seven. The decision reflects the total release of radiation at the damaged Fukushima Daiichi power plant, which is ongoing, rather than a sudden deterioration.

A Business Insider report cited discussions between Avian Securities and one of Apple's parts manufacturers that suggest we might not see a next generation iPhone until the end of 2011 or even early 2012. And recently, a Japanese-language site, Macotakara.jp, uncovered a report that revealed Apple hasn't yet ordered components for the iPhone 5.

Chinese silicon wafer producer Jiangsu Huantai, a joint venture partner of MEMC Electronic Materials, aims to go public in 2012, according to company chairman Wang Lubao. Huantai expects to begin manufacturing LED materials later in 2011.

Dutch chip maker NXP is not in takeover talks, its chief executive said, although he would consider an offer like the one Texas Instruments made for National Semiconductor.

Toyota announced they would suspend production for five days and slow production over the "next few weeks," because of shortfall in parts availability. Honda meanwhile said it would extend a production slowdown for a week.

LDK Solar has announced a business investment of approximately US$40 million to establish a new manufacturing plant in Nanchang City, Jiangxi Province (China). This new manufacturing facility will have capacity to supply two million 2-inch equivalent pieces of sapphire wafers per year and be positioned to capture the growing opportunities in the LED industry.

NXP Semiconductors is almost an US$8 billion market capitalization company, about twice the size of National Semiconductor. On the company's last earnings call, it predicted that 70 million NFC-enabled phones would ship in 2011 and 150 million next year. NXP is the chip that will power a majority of those phones.

Freescale Semiconductor won't reopen a seriously damaged chip factory in Sendai, northern Japan, the company said on April 6. The plant had been due to close at the end of 2011.

Consumer electronics giant Sony, chipmakers Elpida Memory and Renesas, and electronics firms Panasonic and Toshiba have all said that production at some plants in northern Japan had been halted again due to power cuts triggered by a major aftershock that shook the region on April 7.

Skyworks Solutions will get a lot less revenue from selling parts for the Apple iPhone 5 than it did for the current generation of the phone, according to Charter Equity analyst Edward Snyder. For technical reasons, the company is losing business to both TriQuint and Avago, Snyder said.

The move leaves some to wonder if the silicon foundry giant is gradually moving into the IC-packaging world, thereby competing against Amkor, ASE and other subcontractors. Rick Cassidy, president of TSMC North America, said TSMC remains focused on the foundry market. But "lines are blurring" between some parts of the wafer manufacturing and packaging processes, Cassidy said.

Operating profits for the first quarter of 2011 are estimated at KRW2.7-3.1 trillion (US$2.5-2.8 billion), compared to KRW3.01 trillion in the prior quarter and KRW4.41 trillion a year ago.

Taiwan's UMC will take the "lead role" in making the OMAP 5 device on a foundry basis for TI, said Kevin Ritchie, senior VP and manager of TI's technology and manufacturing group. For the OMAP 5, TI may work with other foundries, but Samsung does not appear to be one of the candidates. With the OMAP 4, TI has been "dissatisfied" with its foundry arrangement with Samsung, Ritchie said.

The worldwide semiconductor equipment market grew 143% in 2010 to nearly US$41 billion as the market recovered from the industry slowdown of the previous two years, according to Gartner.

IM Flash Technologies (IMFT), Intel and Micron's joint venture, released 25 nanometer (nm) circuitry a little over a year ago. In the next few weeks, IMFT plans to annouce 20nm NAND flash chip production.

TowerJazz has signed a non-binding term sheet contemplating its purchase of Micron Technology's fabrication facility in Nishiwaki City, Hyogo, Japan. The proposed purchase would nearly double TowerJazz's current internal manufacturing capacity, increasing production by 60,000 wafers per month.

Rumors, misinformation and speculation are spreading like wildfire across the industry today following recent reports about Android anti-fragmentation efforts and what this means for processor architecture openness. Will Google's anti-fragmentation initiatives for Android code impact providers of microprocessor architectures such as MIPS, Intel and ARM? Does anti-fragmentation mean that Google is standardizing Android for any specific architecture?

Hynix Semiconductor has developed 2Gb DDR4 DRAM and DDR4 DRAM-based 2GB ECC-SODIMM applying its 30nm-class process technology. Hynix plans to start volume production of this high performance DDR4 product in the second half of 2012.

Its top shareholders have sought to sell their stake worth about US$2.6 billion, but failed to find interested investors for a company that requires heavy capital investment to weather the highly volatile memory chip cycle.

Production was suspended at the plant in Iwate Prefecture after suffering damage in the March 11 earthquake. The plant makes microcontrollers and large scale integration chips.

OCI, the world's second-largest polysilicon maker, said it may sell global depositary receipts to raise funds for expansion.

Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, California, to Telefunken Semiconductors. The sale price is approximately US$53 million, and the closing for the sale is planned for May 2, 2011. Telefunken also will enter into a supply agreement with Renesas for manufacturing services at the Roseville factory.

Hynix CEO OC Kwon said that Hynix had around 45 days of wafer inventory and was reassured by quake-hit Japanese raw materials firms that there wouldn't be any major disruptions in wafer supplies.

Firms across the world fear shortages of parts that used to be made in the Japanese factories now shuttered because of power and water shortages, or because of road and port closures, following the quake and the floods. And carmakers, whose products often contain some 20,000 individual parts, are expected to be among those worst hit.

Renesas is in talks to outsource production of auto microcontrollers to Globalfoundries Singapore, and some mobile phone semiconductor production to Taiwan Semiconductor Manufacturing Co. (TSMC), Shino Inokuma, a spokesman for Renesas, said by telephone.

David NK Wang, president and CEO of SMIC, has been elected to a two-year term on the board of directors of the Global Semiconductor Alliance (GSA).

LTX-Credence has terminated plans to buy Verigy after accepting a US$15 million payment to end the agreement. The termination fee was received March 25, LTX-Credence said in a statement.

SanDisk expects tablet sales will increase from 17 million units in 2010 to nearly 205 million units by 2014. The firm also estimates the flash based storage per device (SSD storage) will more than triple during the same period from 31 Gb/unit in 2010 to 96 Gb/unit in 2014.