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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Tuesday 7 May 2019
Samsung eyeing top spot among logic chipmakers
Samsung Electronics will be making significant efforts to strengthen the competitiveness of its logic IC business, and is also eyeing to become the world's largest logic chipmaker...
Monday 6 May 2019
Semiconductor market to pick up in 2H19, says SPIL chairman
The semiconductor industry is expected to see demand pick up significantly in the second half of 2019 after gradually hitting the bottom, and Taiwan can compete well in the global...
Tuesday 30 April 2019
China smartphone AP shipments – 1Q 2019
Smartphone AP shipments to China slid 29.3% sequentially in first-quarter 2019 under the influence of system integrators' inventory adjustment and fewer working days.
Monday 29 April 2019
ASE, CHPT gearing up production for HiSilicon 7nm EUV chip
IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship...
Monday 29 April 2019
Unisoc releases new mobile SoC to meet pre-5G replacement demand
Tsinghua Unigroup's chipmaking arm Unisoc has recently released a new generation chipset platform, Tiger 310 mobile SoC, for 4G smartphones, seeking to better cash in on pre-5G replacement...
Monday 29 April 2019
TSMC expands OIP cloud alliance
TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...
Friday 26 April 2019
Ansys obtains certification for TSMC SoIC technology
TSMC has certified Ansys' solutions for its SoIC (system-on-integrated chips) 3D chip-stacking technology, according to Ansys, an engineering simulation software provider.
Thursday 25 April 2019
TSMC 12-inch fab capacity still in oversupply
Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...
Wednesday 24 April 2019
PTI remains focused on FOPLP for advanced logic ICs
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Friday 19 April 2019
TSMC 7nm utilization to climb in 2H19, says CEO
TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...
Thursday 18 April 2019
ASE sees significant pickup in orders for customized SiP solutions
ASE Technology has landed more customized SiP (system-in-package) backend orders than expected earlier this year thanks to growing demand for heterogeneous integration of 5G chips,...
Thursday 18 April 2019
Renesas migration to fab-lite model to benefit Taiwan OSAT firms
Renesas is reportedly moving toward a fab-lite business model by temporarily shutting down some frontend and backend fabs, with its Taiwan-based OSAT partners including ASE, Ardentec,...
Thursday 18 April 2019
TSMC expects 6-8% revenue growth in 2Q19
Taiwan Semiconductor Manufacturing Company (TSMC) expects to post consolidated revenues of between US$7.55 billion and US$7.65 billion in the second quarter of 2019, up 6.4-7.8% sequentially...
Thursday 18 April 2019
TSMC, Samsung to compete for 5G modem orders
TSMC and Samsung Foundry have both disclosed more updates on their EUV process technologies, and are gearing up for a pick-up in replacement demand for smartphones driven by 5G con...
Wednesday 17 April 2019
TSMC unveils 6nm process
Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 6nm (N6) process, which provides a significant enhancement from its 7nm (N7) technology and offers customers a...