Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging and testing firms are showing surprising resilience. Strong demand for high-performance computing (HPC) chips—driven by the global boom in artificial intelligence (AI)—is helping Taiwan's outsourced semiconductor assembly and test (OSAT) giants maintain steady growth into the second half of 2025.

Founded in 2016 by former Tokyo Seimitsu (Accretech) engineer Sheng Jinghao, Jian Wen Lu (Zhejiang) Semiconductor was once considered a standout contender in China's push for 5G RF chip independence. Its mission: to bypass foreign patent restrictions and develop high-frequency filters, long viewed as a chokepoint in RF front-end design.

Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea on July 14 following a whirlwind trip to the exclusive Sun Valley Conference in Idaho, marking his fourth publicly disclosed overseas trip of 2025. With each of his international visits increasingly tied to strategic business talks and next-generation growth sectors, industry watchers are closely tracking what may emerge from his latest excursion.

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.