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Monday 9 June 2025

Shibaura takeover heats up as Yageo moves closer to Japan's regulatory green light

Taiwan-based Yageo Corporation has refiled its foreign investment application under Japan's Foreign Exchange and Foreign Trade Act (FEFTA) as of June 2, in a renewed bid to acquire Shibaura Electronics. The move signals Yageo's growing confidence in clearing regulatory scrutiny—a key barrier that has held back its unsolicited tender offer since February.

Monday 9 June 2025

First Hi-tec targets NT$10 billion revenue in 2025 on AI server boom

Taiwan-based niche PCB maker First Hi-tec Enterprise is riding strong momentum from the AI server sector and expects its 2025 revenue to surpass NT$10 billion (US$307 million), according to CFO Chiu-Hsiung Chang. Fueled by robust AI-related orders in the first quarter of 2025 and continued product mix optimization, the company forecasts sequential quarterly growth throughout the year. Server-related sales are expected to account for over 50% of total revenue in the second half of 2025.

Saturday 7 June 2025

GBM's acquisition of Lincstech: GM says benefits will be gradual

Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB manufacturer Lincstech will become apparent was a key focal point.

Thursday 5 June 2025

LPKF reportedly enforces glass substrate patents amid intensifying industry competition

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture as competition in the emerging field intensifies. Industry observers see this move as a strategic effort to raise barriers to entry as global interest in glass-based substrates grows.

Wednesday 4 June 2025

Semco reportedly expanding semiconductor-use glass substrate ecosystem

Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics serving as a major partner.

Wednesday 4 June 2025

CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access

As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical giant Asahi Kasei is planning to cut off supplies of its advanced packaging key material, photosensitive polyimide (PSPI), to some customers due to capacity constraints.

Tuesday 3 June 2025

Nittobo announces 20% price increase on fiberglass products

Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business by 20% starting August 1, 2025. Products affected include roving, chopped strands, chopped strand mats, roving cloths, cut fibers, and surface mats.

Tuesday 3 June 2025

Chip packaging material shortage deepens as top supplier raises prices 20%

Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of as much as 20% starting August 2025 amid persistent shortages.

Tuesday 3 June 2025

Flexium Interconnect pushes forward in AI server while rejoining Apple suply chain amid transformation challenges

Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While the company has made strides in the AI server sector, particularly in liquid cooling sensor modules, it is grappling with yield issues and delayed customer production timelines, which have kept shipment volumes and capacity utilization below previous levels.

Tuesday 3 June 2025

Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships

Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and dissolved the dedicated development team. Citing Nikkei, Nikkan, and Jiji, industry sources note that Renesas has long focused on automotive logic ICs and insulated-gate bipolar transistors (IGBTs). Its expansion into SiC and gallium nitride (GaN) power components was a response to growing demand from the EV industry.

Tuesday 3 June 2025

Zhen Ding sees tariff risk as minimal, but braces for forex losses

Zhen Ding Technology, the world's leading printed circuit board (PCB) manufacturer, held its 2025 annual shareholders' meeting on May 29, with Chairman Charles Shen outlining both the opportunities and risks facing the company in the year ahead.

Monday 2 June 2025

Trump holds reins on Wolfspeed's future as foreign buyers balk at 'Made in USA' cost burden

Wolfspeed, the US leader in silicon carbide (SiC) materials and a key player in the power semiconductor supply chain, has denied recent bankruptcy rumors. However, delays in receiving US$750 million from the CHIPS and Science Act have deepened the company's financial strain.

Monday 2 June 2025

Applied Materials reportedly partners with Absolics in glass substrate

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment. According to South Korea's ET News, the tools will be first supplied to Absolics, a subsidiary of SKC, for its upcoming facility in Georgia, US.

Monday 2 June 2025

Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead

Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three major US technology firms in 2025, according to ET News. The company is also deepening strategic collaboration with Samsung Electronics, particularly in areas related to the construction of a glass interposer supply chain.

Monday 2 June 2025

Wolfspeed's missteps fuel decline as China closes silicon carbide gap

Wolfspeed, once the dominant supplier of silicon carbide (SiC) materials, is now grappling with financial distress as its market lead continues to erode. Just five years ago, the company was a prized partner in the global semiconductor supply chain, especially during the peak shortage of SiC materials driven by the electric vehicle (EV) boom.

Monday 2 June 2025

Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold

These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's looming bankruptcy threatening Renesas' US$2 billion SiC deal, China's EUV-free 5nm efforts, mounting export control risks, Samsung Electronics' delayed entry into Nvidia's HBM3E supply chain, and Malaysia's US$270 billion pivot to IC design and advanced packaging.

Saturday 31 May 2025

Samyang eyes Japan acquisitions to diversify beyond food and chemicals

South Korea's Samyang Holdings, a conglomerate traditionally rooted in food and chemicals, is setting its sights on Japan's semiconductor supply chain as part of a strategic pivot into high-growth industries.

Thursday 29 May 2025

WPG marks 20 years by doubling down on AI and tariff strategy amid global disruptions

As it marks its 20th anniversary in 2025, WPG Holdings, Asia's largest semiconductor distributor, finds itself at the intersection of two disruptive forces: the generative AI boom and renewed tariff uncertainty stemming from US President Donald Trump's trade agenda. WPG chairman Simon Huang said these dual pressures are creating a ripple effect across the industry and reshaping business fundamentals. Despite an unpredictable macroeconomic outlook for 2025, the company is proactively recalibrating its strategy to maintain competitiveness.

Thursday 29 May 2025

Leadframe maker CWTC upbeat about market, with capacity expansion on track in Malaysia

Taiwan-based leadframe maker Chang Wah Technology (CWTC) is upbeat about 2025 as demand recovers, and will continue to expand its production capacity in Malaysia, according to company chairman Chuen-Sing Hung.

Thursday 29 May 2025

Currency crunch stalls Nanya PCB, yet cloud and edge AI bets are just getting started

Nan Ya Printed Circuit Board Corporation (Nanya PCB), a top Taiwanese IC substrate maker, cautioned that second-quarter earnings may miss forecasts, citing the sharp rise of the New Taiwan dollar and policy uncertainty surrounding President Trump's proposed reciprocal tariffs. At the May 27 shareholders meeting, Chairman Chia-chau Wu noted that AI-related substrate demand has kept Taiwan's capacity running at high levels, outperforming China, but rising currency pressures and trade tensions are now dragging on export sales.

Wednesday 28 May 2025

Foxconn taps NTU, KAUST in μ-LED leap for next-gen optical and AI interconnects

With artificial intelligence driving explosive demand for high-speed data transfer, optical communication technologies are advancing in lockstep. Foxconn's Hon Hai Research Institute (HHRI), in partnership with National Taiwan University (NTU) and King Abdullah University of Science and Technology (KAUST), has unveiled a breakthrough in multi-wavelength micro-LED (μ-LED) technology.

Wednesday 28 May 2025

Flexium charts new growth path with leadership reshuffle, strategic focus on AI and robotics

On May 28, 2025, flexible printed circuit board (PCB) maker Flexium Interconnect held its annual shareholders meeting at its Kaohsiung facility, with chairman Ming-Chih Cheng presiding over the event. Marking a new chapter for the company, newly appointed president David Cheng—a United States-based executive—made his formal debut, outlining Flexium's strategic roadmap for the years ahead.

Wednesday 28 May 2025

China's AMEC races to build 20+ chipmaking tools in bid to shed US tech ties

As US-China tech decoupling deepens, Advanced Micro-Fabrication Equipment (AMEC), a top Chinese semiconductor equipment maker, is ramping up efforts to localize its supply chain and boost technological independence. On May 27, 2025, Chairman and CEO Gerald Yin said the firm is developing over 20 next-generation chipmaking tools to reduce reliance on US-sourced technologies.

Wednesday 28 May 2025

Yageo chairman optimistic about 2H25 outlook, reaffirms commitment to Shibaura acquisition

Yageo chairman Pierre Chen has expressed an optimistic outlook for the second half of 2025, despite global uncertainties surrounding tariffs and exchange rate fluctuations. Speaking at the company's recent shareholders' meeting, Chen reassured investors that the company is in a strong position to navigate these challenges, with controllable risks tied to the impact of currency fluctuations and tariffs. Chen also reaffirmed Yageo's unwavering commitment to acquiring Shibaura Electronics, stressing that while the company may adjust the timeline and specifics of the acquisition strategy, its long-term objective remains unchanged: to fully integrate Shibaura Electronics into the Yageo Group and eventually delist the Japanese company.

Wednesday 28 May 2025

CMMT pursues dual strategy: high-value products and semiconductor expansion

Polarizer manufacturer CMMT held its shareholders meeting on May 27, where chairperson Grace Sung stated that in 2025, the company will continue to strengthen operations in polarizers while developing semiconductor products.

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