AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.
Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip stage at Samsung Foundry, adding a manufacturing dimension to Samsung's recent investment in the two-year-old company.
GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium (SiGe) technology at GF's facility in Burlington, Vermont, as demand grows for optical connectivity used in AI and cloud data centers.
If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed toward chip manufacturing rather than the energy and industrial-materials projects announced so far — and the clearest sign yet that the two countries that once dominated chipmaking could rebuild some of that capacity jointly.
Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.
In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit (IC) substrate zone within Phase 1 of the Taoyuan Aerotropolis Industrial Area. Utilizing a phased construction and staggered site handover model to accelerate tenant entry, the city aims to begin joint land preparation with manufacturers in 2028, with options to scale the zone up to nearly 100 hectares based on industry demand.
Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster AI chip refresh cycles push customers to demand stronger process competitiveness, faster development, and better-prepared infrastructure including IP. Samsung is responding by expanding memory design options, IP, and development tools through its Samsung Advanced Foundry Ecosystem (SAFE) program.
Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.
Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor and technology manufacturers align with international systems. Ministry of Environment adviser and former deputy environment minister Wen-Chen Shih said the ETS design must address three key areas.
Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving the US fab into 2nm wafer production and yield verification ahead of full-scale operations.
Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion (US$73.1 million) production plant in the Poseung District of Pyeongtaek, Gyeonggi Province.
