Apple Inc.'s first foldable phone, the iPhone Duo, has exceeded sales expectations since preorders opened on October 16, 2026. Supply constraints have extended delivery times to January 2027, but industry executives said the strength of demand will not become clear until after the first quarter of 2027.
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million). Chairman Jerry Shao said the facility's reservation and contract rate has exceeded 50%, with international cloud service providers (CSPs) and fintech companies making up most of the customers.
Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will primarily support production of HBM base dies, which handle control functions at the bottom of HBM stacks.
Sony's smartphone business continues to struggle amid fierce competition from Apple, Samsung Electronics, and Chinese rivals, with annual shipments falling to just several million units. However, the growing adoption of cinema-grade video capabilities in smartphones could open new opportunities for Sony to leverage its imaging and audio expertise in the mobile accessory market.
Apple announced new and expanded US supplier partnerships on October 20, 2026, including plans to commit up to US$100 million to titanium producer Perryman Company over three years and broaden its camera-technology partnership with Qnity Electronics.
What began as a satellite broadband service is increasingly becoming SpaceX's platform for connecting homes, aircraft, mobile devices, and government networks.
Samsung Electronics is reportedly planning its largest-ever foldable smartphone lineup in 2027, expanding the Galaxy Z series to as many as six models. The broader portfolio, alongside improvements in battery performance, thickness, and weight, could accelerate foldable adoption beyond its current niche-market status.
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing efforts are raising pressure on Samsung to improve application processor (AP) performance, manufacturing yields and cost competitiveness as it seeks to reduce its reliance on Qualcomm and MediaTek.
SpaceX announced on October 8, 2026, that it would acquire US 800MHz low-band spectrum licenses held by Grain Management, covering up to 14MHz of paired bandwidth. The transaction remains subject to approval by the Federal Communications Commission (FCC).
Chunghwa Telecom president Rong-shy Lin said the shift from conversational AI to autonomous AI agents is reshaping enterprise adoption, making data governance, access controls and accountability critical to deployment at scale.
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.
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