
Google's unveiling of its eighth-generation tensor processing unit (TPU) at Cloud Next 2026 is expected to drive the next wave of growth in the application-specific integrated circuit (ASIC) server supply chain, with Taiwanese manufacturers expanding their role, according to supply chain sources.
The artificial intelligence boom continues to drive demand for related hardware, particularly as server power delivery and high-speed data transmission requirements increase. Against this backdrop, BizLink has shifted its business mix toward high-performance computing and semiconductor applications, which now account for more than 50% of revenue, transforming the company from a traditional cable supplier into a provider of integrated power and high-speed connectivity solutions for AI data centers.
Chinese artificial intelligence companies are reshaping global AI deployment strategies, accelerating a shift toward inference-driven, commercially viable applications at GITEX Asia 2026.
Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing human-machine co-creation and real-world industrial deployment.



