Taiwan's III-V semiconductor players have seen demand for GaAs-based power amplifiers for smartphone and Wi-Fi 6 applications remain steady despite a slowdown in 5G rollouts, according...

Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...

Taiwan PCB and CCL makers in the supply chain of Apple smartphones are gearing up production for new iPhones, with delivery schedules returning to pre-pandemic timeframes, according...

Server ODMs have seen their shipments disrupted by the shortages of power management ICs, network switches, and other chips and components, which are unlikely to ease until the end...

Chip inventory may have returned to reasonable levels in upstream and downstream sectors, thanks in part to a slowdown in demand for chips from the end-market device vendors, according...

Apple is expected to unseat Samsung Electronics as the largest buyer of AMOLED displays for smartphones in 2021, as new iPhones for the year reportedly will all adopt flexible AMOLED...

TSMC has kicked off production for Apple's next-generation iPhone processor dubbed A15, and will see demand for the chip surpass that for its predecessor last year in scale, according...

The world's top-15 semiconductor companies saw their combined sales surge 21% from a year earlier in the first quarter of 2021, 3pp greater than the 18% growth the total worldwide...

Pure-play foundry houses are requiring fabless chip vendors to prepay for the capacity bookings or to co-fund their capacity...

Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.

Ever-rising prices for raw materials are heaping great pressure on business operations of China-based PCB makers, with smaller ones even turning hesitant to take orders lest they...

Billings among North American manufacturers of semiconductor production equipment topped US$3 billion for the fourth consecutive month in April 2021, which also marked the fifth consecutive...

Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...

Microsoft is poised to open its datacenter in Taiwan at the end of this year or early 2022, according to industry sources.

The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...