Qualcomm's proposed acquisition of Autotalks will increase its competitive position in the high-level self-driving IC market against Nvidia and Intel, according to industry observe...

Infineon Technologies and Hon Hai Technology (Foxconn) have signed an agreement to work on silicon carbide (SiC) development for electric vehicles (EV).

TSMC decided to raise its quarterly dividend to NT$3 (US$0.10) a share, up from NT$2.75 that had been in place since 2021.

A new topic has arisen in Chinese media lately: almost 10,000 chip companies were closed and deregistered in 2021 and 2022. Whether that is the result of the U.S. government's export...

ROHM Semiconductor has announced mass production of 650V gallium nitride (GaN) high-electron-mobility transistors (HEMT) optimized for a wide range of power supply systems applications...

China's automotive-grade chip suppliers Horizon Robotics Technology and Black Sesame Technologies are in a position to rival Nvidia and Texas Instruments (TI) in both high- and low-computing...

Neo Semiconductor has announced the release of 3D X-DRAM, the world's first 3D NAND-like DRAM, which the company believes would eliminate DRAM's capacity issue and replace the entire...

Samsung Electronics has been suffering from the memory industry slump. Investment in equipment is expensive and increasingly a burden to the company. Sources from South Korean memory...

VIA Labs, a subsidiary of VIA Technologies specializing in high-speed transmission chips, has expressed uncertainty regarding the demand outlook for the second half of this year.

PCB and IC substrate manufacturer Zhen Ding Technology has expressed caution about its business prospects for the first half of this year, citing ongoing inventory adjustments throughout...

MCU specialist Nuvoton Technology has warned of limited long-term order visibility, claiming the market recovery is not proceeding as fast as expected and the industry's inventory...

Astrus, a Canada-based startup focusing on analog IC design automation, is aspiring to revolutionize the global chip design industry by leveraging recent breakthroughs in artificial...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

Taiwan-based power management IC (PMIC) producers had previously expressed fear that Europe- and US-based IDMs would return to the consumer PMIC segment, and this appears to be the...

The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...