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Monday 15 September 2025
Google eyes Nvidia's turf with new TPU-as-a-service model

In a significant strategic pivot, Google is preparing to move its custom-built Tensor Processing Units (TPUs) beyond its own cloud infrastructure—marking...

Monday 15 September 2025
Weekly news roundup: Tech giants pivot and partner as AI demand collides with geopolitical reality
Below are the most-read DIGITIMES Asia stories from the week of September 8–September 14.
Monday 15 September 2025
US adds 23 Chinese firms to entity list as China launches anti-dumping probe on US chip imports
The technological rivalry between China and the US escalated further on September 12, when the US Department of Commerce's Bureau of Industry and Security (BIS) added 23 Chinese companies,...
Monday 15 September 2025
What Huawei’s shake-up at HiSilicon means
On September 11, Chinese media reported that Huawei's semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the...
Sunday 14 September 2025
Beyond the data center: Nvidia’s GB10 and DGX Spark mark a new phase in its AI strategy
At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
Friday 12 September 2025
Yageo to acquire up to 28.5% stake in Anpec Electronics through public tender offer
Taiwan-based passive components manufacturer Yageo Corporation announced on September 11 that it plans to acquire up to 28.5% of power IC designer Anpec Electronics via a public tender...
Friday 12 September 2025
Infineon targets 2028 for RISC-V automotive chip rollout
At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
Friday 12 September 2025
SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Friday 12 September 2025
SEMICON Taiwan 2025: Broadcom eyes CPO expansion beyond AI scale-out data centers
Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
Friday 12 September 2025
Huawei, Cambricon AI chip production set to top one million units by 2026
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Friday 12 September 2025
Huawei’s HiSilicon appoints new chairman after Eric Xu exit
Huawei Technologies senior executive Eric Xu has stepped down as the legal representative and chairman of subsidiary HiSilicon Semiconductor. He will be succeeded by Jeffrey Gao.
Friday 12 September 2025
Intel to continue semiconductor glass substrate commercialization despite market rumors
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Friday 12 September 2025
TV brand vendors boost short-term panel demand
After order adjustments in the second quarter of 2024, inventory levels among LCD TV brand vendors have declined. At the same time, panel prices remain at low points, further encouraging...
Thursday 11 September 2025
Taiwan govt suggests AI boom as leverage in US Section 232 investigation
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
Thursday 11 September 2025
Advanced vapor chamber design positions Apple for ultra-thin iPhones and wearable devices
Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...