In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration,...
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Chinese customs statistics indicate that Electric Vehicle (EV) exports from China to Europe and the US decreased by 20% and over 40%, respectively, year-on-year during the first two...
TSMC has revised its new fab project in Kaohsiung, southern Taiwan, by adding two more phases of expansion for 1.4nm (A14) process manufacturing, according to sources at fab tool...
SEMICON China 2024, which was held in Shanghai on March 20-22, attracted many Japanese semiconductor equipment manufacturers to showcase their front-end and backend mature node process...
Japan's semiconductor chemicals vendor Tokyo Ohka Kogyo (TOK) has stated that the increasing demand for AI chips will drive up sales and market shares of its extreme ultraviolet (EUV)...
In 2020, the rapid growth of EV sales, especially Battery EVs (BEVs), and market share prompted European automakers to develop chassis dedicated to BEVs.
Samsung Galaxy Ring, slated for potential release in the latter half of 2024, is expected to integrate with the company's AI-powered custom recipe platform, Samsung Food.
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
The president of the Japanese semiconductor manufacturer Renesas, Hidetoshi Shibata, pointed out at the shareholders' meeting that the customary practice of uniformly raising salaries...
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